CN203633041U - Electronic element heat dissipation apparatus - Google Patents
Electronic element heat dissipation apparatus Download PDFInfo
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- CN203633041U CN203633041U CN201320787352.7U CN201320787352U CN203633041U CN 203633041 U CN203633041 U CN 203633041U CN 201320787352 U CN201320787352 U CN 201320787352U CN 203633041 U CN203633041 U CN 203633041U
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- heat
- heat radiator
- electronic element
- radiation coating
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Abstract
The utility model discloses an electronic element heat dissipation apparatus. The apparatus comprises an isolation layer, a heat-conducting glue bonding layer, a heat dissipation body, a flexible heat radiation coating layer, and isolation parts. The isolation layer, the heat-conducting glue bonding layer, the heat dissipation body, and the flexible heat radiation coating layer are sequentially stacked on a heat source part of an electronic element or at a place close to the heat source part. The heat dissipation body at least comprises a heat conduction part. The heat conduction part and the isolation layer are bonded via the heat-conducting glue bonding layer. The isolation parts are arranged on the surface of the heat dissipation body, and the surfaces of the isolation parts are coated with the flexible heat radiation coating layer. According to the utility model, the heat dissipation area is enlarged by employing the isolation parts arranged on the surface of the heat dissipation body; and at the same time, the local air circulation is improved and the heat conduction effect of the heat dissipation apparatus is increased.
Description
Technical field
The utility model relates to heat abstractor, relates in particular to the fin of the cooling use of the multiple electronic components such as a kind of optical element or power semiconductor or electronics, electrical apparatus product.
Background technology
Along with height is integrated and the fast development of high-performance electric subset, electronic devices and components volume is more and more less, the speed of work and efficiency require more and more higher, accordingly, the caloric value of electronic devices and components is also increasing, known metal species heat conduction and heat radiation assembly has been subjected to the restriction of its material and self heat conduction and heat radiation limit at present, must adopt the heat conduction and heat radiation material of advanced heat conduction and heat radiation technique and excellent performance effectively to take away heat, and assurance electronic product is effectively worked.
In equal backing or fin technology, be to accelerate heat-conducting effect, adopt high-thermal conductive metal material to make.Current fin is many by aluminium alloy, and brass or bronze are made sheet material, sheet, splintery etc.Although reach the effect of quick heat radiating, have in electronic devices and components or can have comparatively significantly hot spot region.
Existing soaking shape mostly is a full wafer plane, but need to expand to surrounding as strengthened radiating surface, easily IC edge member is had to interference.Also having equal backing is that groove shape is zigzag, and fin is expanded to surrounding like this, and only needing increases groove shape profile of tooth paster on face again, but the fin of this type can be subject to the restriction in mechanism space.
In order better to dispel the heat, conventionally adopt graphite heat conducting heat sink material, because of its distinctive low-density (saying with respect to metal) and high heat conduction and heat radiation coefficient and low thermal resistance, graphite has excellent soaking heat conduction and heat radiation effect.The general body surface that needs heat radiation that normally graphite heat conducting and heat radiating fin is bonded in.Tradition bonding mode is with glue, graphite flake to be bondd, this bonding mode operation more complicated, and concrete operation need to bond again time, because graphite has frangible and sheet peel property, not only easily there is the graphite flake powder unstable phenomenon that drops and bond, also can greatly slow down service speed, reduce production efficiency and very easily occur graphite flake distortion or fracture phenomena, be difficult to guaranteed quality.In addition, also have graphite flake surface binding metal sheet, this brings the problems such as complicated operation, bonding be not firm equally.
Utility model content
The utility model proposes in order to solve above-mentioned each problem, and object is to provide the restriction such as parts shape and preparation and the easy equal backing of one of manufacturing that are not subject to cooling object.
In order to realize above-mentioned purpose of design, heat radiator of electronic element of the present utility model comprises separator, heat-conducting glue tack coat, heat radiator body, around radiation coating hot in nature and isolation part; Described separator, heat-conducting glue tack coat, heat radiator body and stack gradually at the thermal source position of electronic component or the position close with thermal source position around radiation coating hot in nature; Described heat radiator body at least comprises heat-conducting part; Described heat-conducting part and described separator are bonding by described heat-conducting glue tack coat; Described isolation part is arranged on the surface of described heat radiator body and the surface-coated of described isolation part around radiation coating hot in nature.
Preferably, described heat-conducting part comprises the matsurface of at least one curved shape; Describedly be coated on described matsurface around radiation coating hot in nature, described isolation part is arranged on described on radiation coating hot in nature.
Preferably, described isolation part is protruding rib.
Preferably, the thickness of described rib is 1mm～3mm, and described rib is parallel to each other.
Preferably, described isolation part is line style groove.
Preferably, the degree of depth of described line style groove is 1mm～3mm, and described groove is parallel to each other.
The beneficial effect of the equal backing that the utility model provides is: because do not relate to the shape that changes fin or equal backing entirety, therefore can not be limited to the mechanism space of electronic product, thereby can design flexibly fin, can need to adjust according to practicality thickness and the shape etc. of fin; Gum, curing of coatings, moulding is easy, reduces the cost that processing is scrapped.Because product has reelability, get rid of the frangible and sheet of graphite flake and peeled off problem, strengthen execute-in-place and reduce on-the-spot scrappage.Heat-radiating substrate surface roughness has increased cooling surface area under identical length and width, has better surface emissivity performance.In addition, described in the utility model is to have infrared radiation effect around radiation coating hot in nature, can increase heat conduction and thermal-radiating effect.
The equal backing that the utility model provides is owing to being provided with isolation part on thermal radiation coating, can increase on the one hand the integral heat sink area of equal backing, having formed on the surface of equal backing on the other hand can be for the space of circulation of air, in the structure of equal backing and thermal source close contact, can play the effect of microcosmic ventilation hole, improve the circulation of air condition of local space, improve the heat-conductive characteristic of equal backing.
Accompanying drawing explanation
Fig. 1 is the structural representation of first embodiment of heat radiator of electronic element of the present utility model.
Fig. 2 is the structural representation of second embodiment of heat radiator of electronic element of the present utility model
Fig. 3 is the structural representation of the 3rd embodiment of heat radiator of electronic element of the present utility model.
Fig. 4 is first of heat radiator of electronic element of the present utility model, the appearance schematic diagram of second and the 3rd embodiment.
Fig. 5 is the structural representation of the 4th embodiment of heat radiator of electronic element of the present utility model.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 1 is the structural representation of first embodiment of heat radiator of electronic element of the present utility model.As shown in Figure 1, heat radiator of electronic element of the present utility model comprise separator 11, heat-conducting glue tack coat 12, heat radiator body 13, around radiation coating 14 hot in nature and isolation part 15; Described separator 11, heat-conducting glue tack coat 12, heat radiator body 13 and stack gradually at the thermal source position of electronic component or the position close with thermal source position around radiation coating 14 hot in nature; Described heat radiator body 13 at least comprises heat-conducting part; Described heat-conducting part and described separator 11 are bonding by described heat-conducting glue tack coat 12; Described isolation part 15 is arranged on the surface of described heat radiator body 13 and the surface-coated of described isolation part 15 around radiation coating 14 hot in nature.The present embodiment arranges isolation part 15 on the surface of heat radiator body, increase on the one hand the area of heat radiator body, strengthen the heat dispersion of heat radiator body, the opposing party is by the isolation part 15 reserved certain air communication channel in heat radiator body surface, improve the cross-ventilation situation of heat radiator body 13 peripheries, especially, when heat abstractor of the present utility model and other electronic devices and components are in the time that narrow space fits tightly, can keep the convection current of heat radiator body ambient air, accelerate Air Flow, improve the heat-conductive characteristic of heat radiator body.It should be noted that, as shown in Figure 1, described isolation part 15 is protruding rib.Preferably, the thickness of described rib is 1mm～3mm, and described rib is parallel to each other.Such structure can make heat abstractor keep on the whole smooth on the one hand, and has increased the area of dissipation of heat radiator body, leaves relatively unobstructed air communication channel on the one hand, can obtain better radiating effect.In addition, isolation part 15 also can be chosen as the line style groove that is arranged on heat radiator body surface.The degree of depth of line style groove is 1mm～3mm, and described groove is parallel to each other.Such structure can make heat abstractor keep on the whole smooth on the one hand, and has increased the area of dissipation of heat radiator body, leaves relatively unobstructed air communication channel on the one hand, can better promote thermal conduction effect.
Fig. 2 is the structural representation of second embodiment of heat radiator of electronic element of the present utility model.As shown in Figure 2, heat radiator of electronic element of the present utility model comprise separator 11, heat-conducting glue tack coat 12, heat radiator body 13, around radiation coating 14 hot in nature and isolation part 15; Described separator 11, heat-conducting glue tack coat 12, heat radiator body 13 and stack gradually at the thermal source position of electronic component or the position close with thermal source position around radiation coating 14 hot in nature; Described heat radiator body 13 at least comprises heat-conducting part; Described heat-conducting part and described separator 11 are bonding by described heat-conducting glue tack coat 12; Described heat-conducting part comprises the matsurface of at least one curved shape; Describedly apply 14 on described matsurface around radiation coating hot in nature, described isolation part 15 is arranged on described on radiation coating 14 hot in nature.
As shown in Figure 2, describedly rise and fall along with the fluctuating of matsurface around spoke coating 14 hot in nature, described in the detour thickness of thermal radiation coating 14 substantially keep even.Described separator 11 can select separator paper layer to make, and is stacked on whole or in part on the thermal source of electronic component, makes to keep between heat radiator body 13 and electronic component electrical insulating property and electronic component is played to certain protective action.
In addition, as shown in Figure 2, described isolation part 15 can be chosen as protruding rib.Described rib is arranged on described on radiation coating 14 hot in nature, makes the surface (refer to the surface of heat abstractor entirety, also may comprise around radiation coating 14 hot in nature) of heat radiator body 13 present on the whole curved surface shape.Described rib 15 has increased heat abstractor area of dissipation on the whole on the one hand, make on the other hand heat radiator of electronic element of the present utility model when with thermal source or other electronic device close contacts, can keep the circulation of air condition of local space, the conduction of accelerated heat and circulation of air, can bring better radiating effect.Described rib is preferably and is parallel to each other in addition, and its thickness is 1mm～3mm.Select the beneficial effect of 1mm～3mm to be, can still make this practical heat radiator of electronic element keep on the whole smooth on the one hand, but can make circulation of air at local space, improve radiating effect.
In addition, the roughness of described matsurface is 2 μ m～10 μ m.The benefit of selecting this roughness interval is in the situation that keeping heat radiator body 13 macrostructures and shape, increases the surface area on heat radiator body 13 microcosmic, i.e. area of dissipation, to reach better radiating effect.
In addition, preferably, can on described matsurface, be coated with and cover radiation coating 14 hot in nature, to increase the radiating effect of heat radiator body 13.Describedly can be stacked on described matsurface with uniform thickness around radiation coating hot in nature, can make like this heat radiator body 13 keep area of dissipation constant, reach better radiating effect.
Described heat radiator body 13 has the metal or alloy of low specific heat to make.Adopt the benefit of low specific heat metal or alloy to be, under equal conditions, the absorption heat of low specific heat metal or alloy or the speed ratio of distribute heat are very fast, are conducive to the quick conduction of heat and distribute.The utility model adopt under common experimental conditions (for example 25 degrees Celsius of normal temperature, an atmospheric pressure, normal air humidity etc., after do not repeat) the specific heat capacity metal or alloy material composition that is 0.3J/g/C～0.9J/g/C.Preferably, the utility model adopts the mixture of copper or alloyed copper or copper as the material of preparation heat radiator body 13.Adopt copper as other benefits of preparing material of heat radiator body 13 to be, under equal conditions, copper has lower specific heat capacity, in addition, and the also reasonable ductility of tool.In addition, utilize aluminum to be also fine for heat radiator body 13.
Fig. 3 is the structural representation of the 3rd embodiment of heat radiator of electronic element of the present utility model.As shown in Figure 3, the structure of the present embodiment and the structure of first embodiment are similar substantially.Difference is, the heat radiator body 13 of heat radiator of electronic element of the present utility model comprises heat-conducting part; Described heat-conducting part and described separator 11 are bonding by described heat-conducting glue tack coat 12; Described heat-conducting part comprises the matsurface of two curved shapes; On described two matsurfaces, be coated with and cover radiation coating 14 hot in nature, and described heat-conducting glue tack coat 12 and described heat-conducting part one of them be coated with around the matsurface of radiation coating 14 hot in nature mutually chimeric.This structure makes heat radiator body 13 of the present utility model have larger area of dissipation, and (heat-conducting glue tack coat contacts with separator with thermal source to make heat radiator body 13, be equivalent to thermal source) heat transfer area larger, be more conducive to the quick conduction of heat and distribute.
Fig. 4 is first of heat radiator of electronic element of the present utility model, schematic appearance or the vertical view of second and the 3rd embodiment.As shown in Figure 4, in the heat radiator body 13 of heat radiator of electronic element of the present utility model, comprise isolation part 15, described isolation part is parallel to each other substantially.Described isolation part 15 can be protruding rib, can be also the groove of line style, designs according to actual needs.
Fig. 5 is the structural representation of the 4th embodiment of heat radiator of electronic element of the present utility model.As shown in Figure 5, heat radiator of electronic element of the present utility model comprise separator 11, heat-conducting glue tack coat 12, heat radiator body 13, around radiation coating 14 hot in nature and isolation part; Described separator 11, heat-conducting glue tack coat 12, heat radiator body 13 and stack gradually at the thermal source position of electronic component or the position close with thermal source position around radiation coating 14 hot in nature; Described heat radiator body 13 at least comprises heat-conducting part; Described heat-conducting part and described separator 11 are bonding by described heat-conducting glue tack coat 12; Described heat-conducting part comprises the matsurface of at least one curved shape; Describedly be coated on described matsurface around radiation coating 14 hot in nature, described isolation part 15 is arranged on described on radiation coating 14 hot in nature.It should be noted that the line style groove that the isolation part 15 in the present embodiment is heat radiator body 13 surfaces; Preferably, the degree of depth of described line style groove is 1mm～3mm, and described line style groove is parallel to each other.The surface of line style groove can be coated with and cover radiation coating 14 hot in nature, to increase the effect of heat radiation.
It should be noted that in addition, first, second and the 3rd in embodiment, being shaped as of heat radiator body 13 has an even surface, and (heat radiator body is substantially smooth substrate, or there is certain roughness on surface), in other embodiments, heat radiator body 13 can be designed to other shapes according to actual needs, and the utility model does not limit the shape of heat radiator body 13.
The structure of describing in the first embodiment and the second embodiment or technical characterictic can be applied in the 3rd embodiment, for example matsurface on heat radiator body surface and roughness, the material of heat radiator body etc.Those skilled in the art it should be understood that these explanations are to illustrate, and its concrete technical characterictic can be adjusted according to actual needs, combination.
The beneficial effect of the equal backing that the utility model provides is: because do not relate to the shape that changes fin or equal backing entirety, therefore can not be limited to the mechanism space of electronic product, thereby can design flexibly fin, can need to adjust according to practicality thickness and the shape etc. of fin; Gum, curing of coatings, moulding is easy, reduces the cost that processing is scrapped.Because product has reelability, get rid of the frangible and sheet of graphite flake and peeled off problem, strengthen execute-in-place and reduce on-the-spot scrappage.Heat-radiating substrate surface roughness has increased cooling surface area under identical length and width, has better surface emissivity performance.
The equal backing that the utility model provides is owing to being provided with isolation part on thermal radiation coating, can increase on the one hand the integral heat sink area of equal backing, having formed on the surface of equal backing on the other hand can be for the space of circulation of air, in the structure of equal backing and thermal source close contact, can play the effect in local ventilation hole, improve the circulation of air condition of local space, improve the heat-conductive characteristic of equal backing.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in limit protection range of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. a heat radiator of electronic element, comprises separator (11), heat-conducting glue tack coat (12), heat radiator body (13), around radiation coating hot in nature (14) and isolation part (15); Described separator (11), heat-conducting glue tack coat (12), heat radiator body (13) and stack gradually at the thermal source position of electronic component or the position close with thermal source position around radiation coating hot in nature (14); Described heat radiator body (13) at least comprises heat-conducting part; Described heat-conducting part and described separator (11) are bonding by described heat-conducting glue tack coat (12); Described isolation part (15) is arranged on the surface of described heat radiator body (13) and the surface-coated of described isolation part (15) around radiation coating hot in nature (14).
2. heat radiator of electronic element according to claim 1, is characterized in that, described heat-conducting part comprises the matsurface of at least one curved shape; Describedly be coated on described matsurface around radiation coating hot in nature (14), described isolation part (15) are arranged on described on radiation coating hot in nature (14).
3. heat radiator of electronic element according to claim 1 and 2, is characterized in that, described isolation part is protruding rib.
4. heat radiator of electronic element according to claim 3, is characterized in that, the thickness of described rib is 1mm～3mm, and described rib is parallel to each other.
5. heat radiator of electronic element according to claim 1 and 2, is characterized in that, described isolation part is line style groove.
6. heat radiator of electronic element according to claim 5, is characterized in that, the degree of depth of described line style groove is 1mm～3mm, and described groove is parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320787352.7U CN203633041U (en) | 2013-12-03 | 2013-12-03 | Electronic element heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320787352.7U CN203633041U (en) | 2013-12-03 | 2013-12-03 | Electronic element heat dissipation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203633041U true CN203633041U (en) | 2014-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320787352.7U Expired - Fee Related CN203633041U (en) | 2013-12-03 | 2013-12-03 | Electronic element heat dissipation apparatus |
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| Country | Link |
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| CN (1) | CN203633041U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847765A (en) * | 2017-01-11 | 2017-06-13 | 上海大学 | A kind of heat-radiating substrate with micro-structural |
| CN108811433A (en) * | 2017-05-04 | 2018-11-13 | 志宝富生物科技有限公司 | Heat sink |
-
2013
- 2013-12-03 CN CN201320787352.7U patent/CN203633041U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106847765A (en) * | 2017-01-11 | 2017-06-13 | 上海大学 | A kind of heat-radiating substrate with micro-structural |
| CN106847765B (en) * | 2017-01-11 | 2019-05-31 | 上海大学 | A kind of heat-radiating substrate with micro-structure |
| CN108811433A (en) * | 2017-05-04 | 2018-11-13 | 志宝富生物科技有限公司 | Heat sink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20211203 |
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| CF01 | Termination of patent right due to non-payment of annual fee |