CN106847765B - A kind of heat-radiating substrate with micro-structure - Google Patents
A kind of heat-radiating substrate with micro-structure Download PDFInfo
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- CN106847765B CN106847765B CN201710018326.0A CN201710018326A CN106847765B CN 106847765 B CN106847765 B CN 106847765B CN 201710018326 A CN201710018326 A CN 201710018326A CN 106847765 B CN106847765 B CN 106847765B
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
The invention discloses a kind of heat-radiating substrate with micro-structure, heat-radiating substrate upper end is provided with multiple grooves, and the cell wall and groove top of groove are provided with the micro-structure of multiple protrusions；The present invention on heat-radiating substrate by being arranged multiple grooves, and the micro-structure of multiple protrusions is set on groove, increase the contact area between heat-radiating substrate and heat-conducting glue, keep heat flow fast, improve the radiating efficiency of electronic device, electronic device service performance is excellent, and extends the service life of electronic device.
Description
Technical field
The present invention relates to Cooling Technology of Electronic Device field, more particularly to a kind of heat-radiating substrate with micro-structure.
Background technique
In recent years, electronics field rapid technological improvement and market is light to product, thin, short, small and high standard, height
The demand of efficiency, so that electronic product is gradually toward miniaturization, powerful trend development, incident high fever metric density becomes
An important factor for influencing electronic product service life and performance；Radiating efficiency becomes the emphasis of many electronic products exploitation therewith；Electronics
Heat-conducting glue in device is set between heat-radiating substrate and chip, and heat-conducting glue has the shortcomings that heat transfer efficiency is low, in the prior art
Heat-conducting glue and heat-radiating substrate between heat dissipation area it is small, make existing electronic device have radiating efficiency it is low, seriously affect electricity
The service performance and service life of sub- product.
To sum up, heat dissipation area is small between existing heat-radiating substrate and heat-conducting glue, makes electronic product there are radiating efficiencys low, makes
It is poor with performance, and the problem that the service life is short.
Summary of the invention
The object of the present invention is to provide a kind of heat-radiating substrate with micro-structure, to solve above-mentioned of the existing technology ask
Topic, can effectively increase the heat dissipation area between heat-conducting glue and heat-radiating substrate, and heat flow is fast, improve the heat dissipation effect of device
Rate, service performance is excellent, and extends the service life of electronic device.
To achieve the above object, the present invention provides following schemes:
The present invention provides a kind of heat-radiating substrate with micro-structure, and the heat-radiating substrate upper end is provided with multiple grooves, institute
The cell wall and the groove top of stating groove are provided with the micro-structure of multiple protrusions.
Optionally, the groove is V-groove, and the depth of the V-groove is 0.1mm.
Optionally, it is equidistantly arranged between the V-groove, the center distance between axles between the V-groove is
0.1mm-0.5mm。
Optionally, the micro-structure is micro- wing structure that top has acute angle.
Optionally, the axial height of micro- wing structure and radial width are 0.01mm-0.03mm.
Optionally, it is equidistantly arranged between micro- wing structure, the center between micro- wing structure
Distance between axles is 0.01mm-0.05mm.
Optionally, the groove is process with the micro-structure using the processing method that pears cut extruding.
Optionally, the heat-radiating substrate is copper heat-radiating substrate.
The present invention achieve following technology compared with the existing technology the utility model has the advantages that
Heat-radiating substrate provided by the invention with micro-structure, by being arranged multiple grooves on heat-radiating substrate, and
The micro-structure of multiple protrusions is set on groove, increases the contact area between heat-radiating substrate and heat-conducting glue, keeps heat flow fast, mention
The radiating efficiency of high electronic device has service performance excellent using the electronic device of this heat-radiating substrate, with long service life
Advantage.
Detailed description of the invention
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the schematic view of the front view of the heat-radiating substrate application site in the present invention with micro-structure；
Fig. 2 is the overlooking structure diagram of the heat-radiating substrate application site in the present invention with micro-structure；
Fig. 3 is the structural schematic diagram of the heat-radiating substrate in the present invention with micro-structure；
Fig. 4 is the process schematic diagram of the heat-radiating substrate in the present invention with micro-structure；
In figure: 1- heat-radiating substrate, 2- heat-conducting glue, 3- chip, 4-V type groove, 5- micro-structure, 6- cutter, the distribution of 7-V type groove
Area.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It is of the existing technology to solve the problems, such as the object of the present invention is to provide a kind of heat-radiating substrate with micro-structure.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
The present invention provides a kind of heat-radiating substrate with micro-structure, as shown in figure 3, being provided on heat-radiating substrate 1 multiple etc.
V-groove 4 is arranged in spacing arrangement, and center distance between axles is 0.01mm-0.05mm to V-groove 4 each other, and the setting depth of V-groove 4 is
0.1mm；The present invention is provided with multiple convex in the structure basis of above-mentioned V-groove 4 in the cell wall of V-groove 4 and the top of V-groove 4
The micro-structure 5 risen, micro-structure 5 are set as micro- wing structure that top has acute angle, the specific axial height and radial direction of micro-structure 5
The size range of width is 0.01mm-0.03mm；Heat-radiating substrate 1 selects copper heat-radiating substrate, V-groove 4 and micro-structure 5 in the present invention
It is process using the processing method that pears cut extruding.
The processing method of specific V-groove and micro- wing structure is as follows in the present invention:
Step 1: select as high-speed tool steel lathe tool bit sharpening made of cutter 6,6 section of cutter is a wedge, most before
End is plough cutting blade, and effect is that metal is rived, and shunts metal to main and auxiliary two compressive planes；Two sides are extrusion molding face, are squeezed
The metal that pressure plough cutting blade shunts, makes it stable grooving；Formed fin is modified in assisted extrusion face further increases its height.
Step 2: fixed copper heat-radiating substrate, cutter is cut along the copper-based plate surface of Y-axis negative direction plow in copper-based plate surface plough
V-groove out, plow depth are 0.1mm；
Step 3: copper heat-radiating substrate pushes ahead 0.1mm~0.5mm in X direction, continue plow, and so on into
Row plow forms multiple rows of V-groove equidistantly arranged；
Step 4: cut by dedicated plough-squeezing knife tool (high-speed tool steel W18Cr4V) is along Y-direction plow copper heat-radiating substrate
Surface and V-groove side wall make copper heat-radiating substrate generate micro- wing structure under the action of plough is cut-squeezed；
Step 5: copper heat-radiating substrate promotes once outward along Y-direction, distance after the plow of one micro- wing structure of completion
About 0.01mm~0.05mm, the plough for carrying out next micro- wing cut-extrusion forming；
Step 6: copper heat-radiating substrate promotes outward in X direction after the micro- fin structure production of the interval for completing a V-groove
To next V-groove, continue plough and cut-squeeze, generate micro- fin structure, so circulation is up to micro- wing structure distribution is in entire
V-groove region.
Heat-radiating substrate provided by the invention with micro-structure, in the specific application process, as shown in Figs. 1-2, chip 3 is set
It is placed in the top of heat-radiating substrate 1, heat-conducting glue 2 is set between heat-radiating substrate 1 and chip 3, and V-groove 4 is provided on heat-radiating substrate 1
Contacted with the region of micro-structure 5 with heat-conducting glue 2, and the area in V-groove distributed area 7 of the V-groove on heat-radiating substrate be greater than lead
The distribution area of hot glue 2；The present invention increases the contact between heat-radiating substrate 1 and heat-conducting glue 2 by the design to heat-radiating substrate 1
Area keeps heat flow fast, improves the radiating efficiency of electronic device, using the electronic device service performance of this heat-radiating substrate
It is good, and the long service life of electronic device can be extended.
It should be noted that the groove being arranged on heat-radiating substrate in the present invention is preferably V-groove, but the present invention plants groove
Shape is not limited only to V-structure, is also possible to the other structures such as U-shaped, the structure of groove can be in the processing to micro-structure
In be adjusted flexibly；Heat-radiating substrate in the present invention is not limited only to copper base, selects other alloys or dissipates with microfluid
Other metals of heat function all may be used；The processing method of micro-structure is not limited to go cutting to generate using cutter, as long as can prepare
Micro-structure, using other methods, for example taking wet etching method to generate micro-structure can also.
Invention applies a specific example illustrates the principle and implementation of the invention, above embodiments are said
It is bright to be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art, foundation
Thought of the invention, there will be changes in the specific implementation manner and application range.To sum up, the content of the present specification should not manage
Solution is limitation of the present invention.
Claims (8)
1. a kind of heat-radiating substrate with micro-structure, it is characterised in that: the heat-radiating substrate upper end is provided with multiple grooves, described
The cell wall of groove and the groove top are provided with the micro-structure of multiple protrusions；Chip is set to the top of the heat-radiating substrate,
Heat-conducting glue is set between the heat-radiating substrate and the chip, and the groove and micro- knot are provided on the heat-radiating substrate
The region of structure is contacted with the heat-conducting glue.
2. a kind of heat-radiating substrate with micro-structure according to claim 1, it is characterised in that: the groove is V-groove,
The depth of the V-groove is 0.1mm.
3. a kind of heat-radiating substrate with micro-structure according to claim 2, it is characterised in that: between the V-groove etc.
Spacing arrangement is arranged, and the center distance between axles between the V-groove is 0.1mm-0.5mm.
4. a kind of heat-radiating substrate with micro-structure according to claim 1, it is characterised in that: the micro-structure is top
Micro- wing structure with acute angle.
5. a kind of heat-radiating substrate with micro-structure according to claim 4, it is characterised in that: micro- wing structure
Axial height and radial width are 0.01mm-0.03mm.
6. a kind of heat-radiating substrate with micro-structure according to claim 5, it is characterised in that: micro- wing structure it
Between be equidistantly arranged, the center distance between axles between micro- wing structure be 0.01mm-0.05mm.
7. a kind of heat-radiating substrate with micro-structure according to claim 1, it is characterised in that: the groove with it is described micro-
Structure is process using the processing method that pears cut extruding.
8. a kind of heat-radiating substrate with micro-structure according to claim 1, it is characterised in that: the heat-radiating substrate is copper
Heat-radiating substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710018326.0A CN106847765B (en) | 2017-01-11 | 2017-01-11 | A kind of heat-radiating substrate with micro-structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710018326.0A CN106847765B (en) | 2017-01-11 | 2017-01-11 | A kind of heat-radiating substrate with micro-structure |
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| CN106847765A CN106847765A (en) | 2017-06-13 |
| CN106847765B true CN106847765B (en) | 2019-05-31 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109735826B (en) * | 2019-02-14 | 2021-08-27 | 中车工业研究院有限公司 | Graphene/copper composite material and preparation method and application thereof |
| CN111696939A (en) * | 2020-06-22 | 2020-09-22 | 格力电器（芜湖）有限公司 | Radiator for power device and power device |
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| CN2833887Y (en) * | 2005-05-16 | 2006-11-01 | 杨开艳 | Fin structure improvement of radiator |
| CN202733843U (en) * | 2012-07-11 | 2013-02-13 | 昆山康佳电子有限公司 | LED (Light-emitting Diode) aluminum substrate with micro heat dissipation structure |
| CN203590662U (en) * | 2013-11-13 | 2014-05-07 | 昆山立茂国际贸易有限公司 | Electronic component cooling device |
| CN203633041U (en) * | 2013-12-03 | 2014-06-04 | 昆山立茂国际贸易有限公司 | Electronic element heat dissipation apparatus |
| CN204697461U (en) * | 2015-05-25 | 2015-10-07 | 浙江华铝铝业股份有限公司 | A kind of excellent heat radiator aluminium profile that dispels the heat |
| CN205667070U (en) * | 2016-06-03 | 2016-10-26 | 夏怡 | Novel cooler |
| CN205681745U (en) * | 2016-06-03 | 2016-11-09 | 夏怡 | A kind of radiator |
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2017
- 2017-01-11 CN CN201710018326.0A patent/CN106847765B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2833887Y (en) * | 2005-05-16 | 2006-11-01 | 杨开艳 | Fin structure improvement of radiator |
| CN202733843U (en) * | 2012-07-11 | 2013-02-13 | 昆山康佳电子有限公司 | LED (Light-emitting Diode) aluminum substrate with micro heat dissipation structure |
| CN203590662U (en) * | 2013-11-13 | 2014-05-07 | 昆山立茂国际贸易有限公司 | Electronic component cooling device |
| CN203633041U (en) * | 2013-12-03 | 2014-06-04 | 昆山立茂国际贸易有限公司 | Electronic element heat dissipation apparatus |
| CN204697461U (en) * | 2015-05-25 | 2015-10-07 | 浙江华铝铝业股份有限公司 | A kind of excellent heat radiator aluminium profile that dispels the heat |
| CN205667070U (en) * | 2016-06-03 | 2016-10-26 | 夏怡 | Novel cooler |
| CN205681745U (en) * | 2016-06-03 | 2016-11-09 | 夏怡 | A kind of radiator |
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| CN106847765A (en) | 2017-06-13 |
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