CN202993946U - Micro conical tower array heat exchange plate - Google Patents
Micro conical tower array heat exchange plate Download PDFInfo
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- CN202993946U CN202993946U CN 201220678249 CN201220678249U CN202993946U CN 202993946 U CN202993946 U CN 202993946U CN 201220678249 CN201220678249 CN 201220678249 CN 201220678249 U CN201220678249 U CN 201220678249U CN 202993946 U CN202993946 U CN 202993946U
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Abstract
The utility model discloses a micro conical tower array heat exchange plate, and belongs to the field of heat dissipation. Two sides of the heat exchange plate are provided with multi-height micro conical tower array structures, and each structure is formed by mixing linear arrays of regular triangular pyramids and regular hexagonal pyramids with two heights, or is formed by mixing linear or circumferential arrays of pyramids and conoids with multiple heights. The micro conical tower array heat exchange plate adopts an incision milling cutter provided with a V-shaped cutting tip, or a diamond grinding wheel for milling or grinding a sheet; during processing, a V-shaped groove array in a first direction is processed in one surface of the sheet, then the sheet is rotated for theta sequentially, residual V-shaped groove arrays are processed respectively, and then the other surface of the sheet is processed with the same method. The heat exchange plate provided by the utility model enables the specific surface area of the sheet to be increased, recessed joints in the V-shaped grooves facilitate nucleation, and a flow passage formed by the multi-height micro conical tower array structures facilitates complication of the fluid flow conditions, so that the heat transmission effect of the heat exchange plate is enhanced.
Description
Technical field
The utility model relates to the heat exchanger plates technology, belongs to field of radiating, is specifically related to a kind of micro-cone tower array heat exchanger plates.
Background technology
Along with the development of the technology such as super large module integration (VLSI) circuit, electronics technology is just towards high-speed, high-power, microminiaturized direction fast development.But because the heat flow density of microelectronic component unit are is more and more higher, high integration has determined that again its heat-dissipating space is narrow and small simultaneously, make electronics technology a large technical barrier at the thermal control field face at present, this forces microelectronic component to propose requirements at the higher level to heat dissipation technology.
1981, at first the Tuckerman of the U.S. and Pease proposed the concept of " microflute radiator ", and microchannel is applied to the heat exchange field, thereby have opened microchannel new era for passive augmentation of heat transfer technology, have promoted greatly the development of heat dissipation technology.In prior art, by the microchannel of the various shapes of processing on thin plate, such as: rectangle, " V " shape, circle etc., can expand the heat exchanger plates surface, thereby improve the specific area of heat exchange; And having of microchannel be beneficial to strengthening boiling, the heat transfer property of heat exchanger plates is improved.But because of not connected between microchannel, and the runner internal morphology is single, make the flow condition of fluid simple, limited the heat transfer property of Thermal Performance of Micro Channels plate.Micro-cone tower array structure pattern is various, highly differ, and can be staggered to form the microchannel of Correspondent, significant to the heat transfer property that improves heat exchanger plates.At present many height micro-structurals processing mainly depends on the corrosion processing technology such as photochemistry, and its working (machining) efficiency is low, cost is higher, contaminated environment, be subject to processing materials limitations again.For example, the size of surface many elevational dimension micro-structural of wet etching fabrication techniques is usually at nanoscale, but has sideetching and produce the undercutting phenomenon; Electron beam (EB) can process nano level circular cone array on the quartz glass interface, but, when processing yardstick to submicron order, its form accuracy is uncontrollable.Although the machining mode also can be used for processing the micro-structural of many height, needs to adopt the baroque forming tool in cutting end, thereby the cost of manufacture of cutter is increased; Perhaps adopt conventional tool to carry out multiple deep processing, but can produce error in adjusting the cutting depth process, also make complicated operation, increased labour intensity simultaneously.
The utility model content
The purpose of this utility model is for the deficiency that in current Thermal Performance of Micro Channels plate, the runner internal morphology is single, Thermal Performance of Micro Channels plate heat transfer property is restricted, and proposes micro-cone tower array heat exchanger plates that a kind of runner internal morphology is complicated, have many elevational dimension of good heat exchange property.
For realizing that the technical scheme that the purpose of this utility model adopts is: a kind of micro-cone tower array heat exchanger plates, the two sides of heat exchanger plates all is processed with " V " shape groove array, and " V " shape groove array of every processing of heat exchanger plates is n
1individual, n wherein
1>=3; " V " shape groove with an array is parallel to each other, and " V " shape groove of different arrays is interlaced, and the two adjacent interlaced angles of " V " shape groove array are θ,
the degree of depth of " V " shape groove is 3/7ths to 3/5ths of heat exchanger plates thickness, and " V " shape groove both sides angle is 30 °～120 °, and " V " shape groove depth is 0.05mm～1mm; A plurality of micro-cone tower arrays of the interlaced formation of described " V " shape groove array, micro-cone tower height degree of same micro-cone tower array is identical, micro-cone tower height degree difference of different micro-cone tower arrays.
Preferably, described micro-cone tower array is comprised of the array of pyramid and/or conoid, and described array comprises linear array and circumference array.
Preferably, described micro-cone tower array is comprised of positive triangular pyramid linear array and positive hexagonal pyramid linear array.
Described " V " shape groove array is staggered to form the micro-cone tower array with a plurality of height, this micro-cone tower array is mixed by the linear array of the positive triangular pyramid with two height and positive hexagonal pyramid, or is mixed by linearity or the circumference array of the pyramid with a plurality of height and conoid.
Preferably, with two " V " shape separation in an array, be 1 times of groove width.
Preferably, the degree of depth of described " V " shape groove is 3/1/2nds to five o'clock of heat exchanger plates thickness, and the angle between first direction of upper and lower faces (being first processing) array is α, α ≠ n
2* θ, described n
2be zero or positive integer.
Preferably, the degree of depth of described " V " shape groove is 3/7ths to two/for the moment of heat exchanger plates thickness, and the angle between first direction of upper and lower faces (being first processing) array is β, β >=0 °.
Preferably, every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, the array of one of them direction is a with respect to the side-play amount of the array intersection point of another both direction, a ≠ n
2* L, wherein n
2be zero or positive integer, L means the width of " V " shape groove, forms a kind of micro-cone tower array structures that two or three height are arranged.
Preferably, every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, wherein the array of a direction is b with respect to the side-play amount of the array intersection point of another both direction,
n wherein
2be zero or positive integer, L means the width of " V " shape groove, forms a kind of the have positive triangular pyramid of two height and micro-cone tower array structure that positive hexagonal pyramid linear array mixes mutually.
Preferably, every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, wherein the array of a direction is c with respect to the side-play amount of the array intersection point of another both direction, c ≠ a& C ≠ b, wherein a ≠ n
2* L,
n
2be zero or positive integer, L means the width of " V " shape groove, forms a kind of micro-cone tower array structure that has two or three positive triangular pyramids highly to mix mutually with the conoid linear array.
Preferably, every upper " V " shape groove array of described heat exchanger plates is n
13 o'clock, all directions array is d with respect to the side-play amount at thin plate center, and d>=0mm forms micro-cone tower array structure that a kind of pyramid that a plurality of height are arranged mixes mutually with the conoid circumference array.
Preferably, described thin plate can be rectangle, circle or triangle.
The manufacture method of heat exchanger plates of the present utility model, the method has following steps:
(1) thin plate to be processed is removed to burr and processed, then be fixed on the dividing head of milling machine with fixture, and make the thin plate sideline become arbitrarily angled with main shaft by regulating dividing head, then smoothed and start the milling machine tool setting;
(2) simultaneously with the slotting cutter upmilling, go out " V " shape groove array of first direction at thin plate, the θ that then thin plate rotated to an angle, mill out " V " shape groove array of second direction, afterwards according to this mode respectively upmilling go out remaining " V " shape groove array; In process, control the degree of depth of " V " shape groove by the milling depth of regulating slotting cutter, adopt mode manually or automatically to control two " V " shape separation in same array by workbench.
(3), after processing the one side of thin plate, adjust the another side of thin plate the employing method processing sheet identical with step (2);
(4) deburring, clear up, and obtains having micro-cone tower array heat exchanger plates of a plurality of height.
Preferably, adopting to have " V " shape and cut most advanced and sophisticated slotting cutter and carry out Milling Process, is the HSS slotting cutter.
Preferably, the thin plate of described Milling Process is steel plate, aluminium sheet or copper coin.
The manufacture method of heat exchanger plates of the present utility model, the method has following steps:
(1) thin plate to be processed is removed to burr and processed, then be fixed on Grinder bench with fixture, utilize lever indicator to be smoothed work surface, start grinding machine and utilize bit microscope for NC to carry out the tool setting of emery wheel and surface to be machined;
(2) go out " V " shape groove array of first direction with diamond wheel grinding in the thin plate one side; Then the θ that thin plate rotated to an angle, grinding goes out " V " shape groove array of second direction, afterwards according to this mode respectively grinding go out remaining " V " shape groove array; In process, by the movement of grinding machine three axles, control the degree of depth of " V " shape groove and, with two " V " shape separation in array, need out cooling fluid in process.
(3), after processing the one side of thin plate, adjust the another side of thin plate the employing method processing sheet identical with step (2);
(4) deburring, clear up, and obtains having micro-cone tower array heat exchanger plates of a plurality of height.
Preferably, adopt to have " V " shape and cut most advanced and sophisticated skive and carry out grinding, the radius at " V " shape tip is less than 0.02mm, and the skive granularity is 30#～120#.
Preferably, the thin plate of described grinding is steel plate or aluminium sheet.
Compared to prior art, the utlity model has following advantage and outstanding effect:
(1) how highly micro-cone tower array heat exchanger plates that the utility model provides, its " V " shape groove depth is 0.05mm～1mm, with two " V " shape separation in array, be 1 times of groove width, and array direction is n
1(n
1>=3) individual, increased greatly the specific area of heat exchanger plates; The groove that provides be shaped as " V " shape, its recessed joint is conducive to nucleation; In the how highly micro-cone tower array structure had, between microchannel, communicate, the runner internal morphology is very abundant, makes the flow condition of fluid complicated.How highly micro-cone tower array heat exchanger plates applications are extensive, can be directly used in the devices such as capillary pump ring, loop circuit heat pipe evaporimeter, not only at microelectronic high heat flux field of radiating, there is larger application prospect and use value, more in fields such as large-scale metallurgy, oil and chemical industry, there is great application prospect and value.
(2) mechanical manufacturing method provided by the utility model, the high and Environmental Safety of working (machining) efficiency.Existing processing many height micro-structural corrosion processing technology such as photochemistry used, working (machining) efficiency is low, cost is higher, contaminated environment, be subject to processing materials limitations again.And the processing method that the utility model provides is traditional machining mode, only need common milling machine or grinding machine just can process required many height micro-structural, there is equipment cost and drop into low, the advantages such as working (machining) efficiency is high, operation is simple and reliable, environmental protection.
(3) required cutter in the utility model manufacture method, for traditional having " V " shape is cut most advanced and sophisticated cutter, with respect to the many height of current processing cutting ends that micro-structural adopts for baroque forming tool, reduced the production cost of cutter, improved the reliability of cutter pattern, made the shaping of many height micro-structurals more guaranteed; In the utility model manufacture method, the cutting depth of whole process is fixed, for use conventional tool in the process of the many height of current processing micro-structural is carried out multiple deep processing, reduced the error produced because repeatedly adjusting cutting depth, reduced the specification requirement to operating personnel, labour intensity is reduced.
The accompanying drawing explanation
Fig. 1 has " V " shape to cut most advanced and sophisticated slotting cutter front view in prior art
Fig. 2 has " V " shape to cut most advanced and sophisticated skive front view in prior art
Fig. 3 is the three-dimensional view of the utility model embodiment mono-heat exchanger plates
Fig. 4 is the top view on the utility model embodiment mono-heat exchanger plates surface
Fig. 5 is Fig. 4 " V " shape groove array direction distribution schematic diagram
Fig. 6 is the three-dimensional view of the utility model embodiment bis-heat exchanger plates
Fig. 7 is the top view on the utility model embodiment bis-heat exchanger plates surfaces
Fig. 8 is Fig. 7 " V " shape groove array direction distribution schematic diagram
Fig. 9 is the three-dimensional view of the utility model embodiment tri-heat exchanger plates
Figure 10 is the top view on the utility model embodiment tri-heat exchanger plates surfaces
Figure 11 is Figure 10 " V " shape groove array direction distribution schematic diagram
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited to this.
Embodiment 1:
As shown in Figures 3 to 5, the thin plate that the Milling Process thickness of take is 0.17mm is example, and the direction number of every upper " V " shape groove array of thin plate is n
1=3, " V " shape groove with array is parallel to each other, " V " shape groove of different arrays has angle each other, the angle of two adjacent " V " shape groove array is θ=60 °, " V " shape groove both sides angle is 60 ° (gradient that refers to " V " shape groove is 60 °), " V " shape groove depth is 0.087mm, with two " V " shape separation in array, be 0.1mm, on upper and lower surface, the angle of two first direction arrays is α=90 °, one direction array is b=0.05mm with respect to the side-play amount of another two direction array intersection points, substrate is copper coin, a kind of heat exchanger plates that the positive triangular pyramid of two height and micro-cone tower array structure that just the hexagonal pyramid linear array is mixing are mutually arranged of final formation.
Select HSS (HSS is writing a Chinese character in simplified form of the high-speed steel English) slotting cutter of the most advanced and sophisticated both sides angle γ of " V " shape as shown in Figure 1=60 °.The preparation method of the present embodiment heat exchanger plates is:
(1) thin plate that is 0.17mm by thickness to be processed is removed burr and is processed, then it is fixed on special fixture on the dividing head of horizontal kneeand-column type milling machine and by regulating dividing head and makes the thin plate sideline become 90 ° with main shaft, smoothed and start the milling machine tool setting;
(2) at thin plate, simultaneously use the most advanced and sophisticated both sides angle γ of " V " shape=HSS slotting cutter upmilling of 60 ° to go out " V " shape groove of first direction, " V " shape groove array that the both sides angle is 60 °.In process, it is 0.087mm that the milling depth of controlling slotting cutter by regulating the lifting platform height makes the degree of depth of " V " shape groove, and adopting mode manually or automatically to control two " V " shape separation in same array by workbench is 0.1mm; Then by 60 ° of thin plate rotations, use the method upmilling identical with milling first direction " V " shape groove array to go out " V " shape groove array of second direction; Then, again by 60 ° of thin plate rotations, after point of a knife is offset to b=0.05mm with respect to front two direction array intersection points, use the method upmilling identical with milling first direction " V " shape groove array to go out " V " shape groove array of the 3rd direction.As shown in Figure 5, in figure, solid arrow means the array direction of the positive processing of thin plate, and dotted arrow means the array direction of thin plate reverse side processing.
(3) after processing the one side of thin plate, adjust thin plate, by regulating dividing head, make the thin plate sideline become 0 ° with main shaft, now on upper and lower surface, the angle of two first direction arrays is α=90 °; Adopt the another side of the method processing sheet identical with step (2), as shown in Figure 4 and Figure 5.
(4) deburring, cleaning, obtain a kind of heat exchanger plates that the positive triangular pyramid of two height and micro-cone tower array structure that just the hexagonal pyramid linear array mixes are mutually arranged, as shown in Figure 3.
Embodiment 2:
As shown in Figure 6 to 8, the thin plate that the grinding thickness of take is 0.22mm is example, and the direction number of every upper " V " shape groove array of thin plate is n
1=3, " V " shape groove with array is parallel to each other, " V " shape groove of different arrays has angle each other, the angle of two adjacent " V " shape groove array is θ=60 °, " V " shape groove both sides angle is 90 ° (the gradient of " V " shape groove is 45 °), " V " shape groove depth is 0.1mm, with two " V " shape separation in array, be 0.2mm, on upper and lower surface, the angle of two first direction arrays is β=0 °, one direction array is c=0.05mm with respect to the side-play amount of another two direction array intersection points, substrate is aluminium sheet, the final heat exchanger plates that forms micro-cone tower array structure that a kind of positive triangular pyramid that three height are arranged mixes mutually with the conoid linear array.
Select the most advanced and sophisticated both sides angle γ of " V " shape as shown in Figure 2=90 °, " V " shape tip radius is less than 0.02mm, the skive that granularity is 30#～120#." # " is that (granularity: the grain size number abrasive grain size dimension) is definition known in this field to the skive granularity.In the present embodiment, preferred size is 90#.
(1) thin plate that is 0.22mm by thickness to be processed is removed burr and is processed, then it is fixed on the common horizontal Grinder bench with special fixture, utilize lever indicator to be smoothed work surface, start grinding machine and utilize bit microscope for NC to carry out the most advanced and sophisticated both sides angle γ of " V " shape=90 °, " V " shape tip radius to be less than skive that 0.02mm, granularity are 30#～120# and the tool setting of surface to be machined;
(2) simultaneously with skive, along the direction grinding vertical with thin plate one sideline, go out " V " shape groove of first direction, " V " shape groove array that the both sides angle is 90 ° at thin plate.In process, the degree of depth of controlling " V " shape groove by the movement of grinding machine three axles is 0.1mm and is 0.2mm with two " V " shape separation in array, needs out cooling fluid in process; Then thin plate is rotated to 60 ° successively, the smoothing work of repeating step (1), use the method grinding identical with grinding first direction " V " shape groove array to go out the array of second direction; Then again thin plate is rotated to 60 ° successively, the smoothing work of repeating step (1), after point of a knife is offset to c=0.05mm with respect to front two direction array intersection points, use the method grinding identical with grinding first direction " V " shape groove array to go out the array of the 3rd direction.As shown in Figure 8, in figure, solid arrow means the array direction of the positive processing of thin plate, and dotted arrow means the array direction of thin plate reverse side processing.
(3) after processing the one side of thin plate, adjust thin plate, and the thin plate sideline vertical with skive initial manufacture direction in step (2), the vertical thin plate sideline of the initial manufacture direction that makes skive is identical, on upper and lower surface, the angle of two first direction arrays is β=0 °; Adopt the another side of the method processing sheet identical with step (2), as shown in Figure 7 and Figure 8.
(4) deburring, cleaning, obtain the heat exchanger plates of micro-cone tower array structure that a kind of positive triangular pyramid that three height are arranged mixes mutually with the conoid linear array, as shown in Figure 6.
Embodiment 3:
As shown in Figures 9 to 11, the thin plate that the Milling Process thickness of take is 0.38mm is example, and the direction number of every upper " V " shape groove array of thin plate is n
1=5, " V " shape groove with array is parallel to each other, " V " shape groove of different arrays has angle each other, the angle of two adjacent " V " shape groove array is θ=36 °, " V " shape groove both sides angle is 90 ° (the gradient of " V " shape groove is 45 °), " V " shape groove depth is 0.1mm, with two " V " shape separation in array, be 0.2mm, on, angle between first direction array on lower two sides is β=0 °, five direction arrays are d=0.1mm with respect to the side-play amount at thin plate center, substrate is copper coin, the final heat exchanger plates that forms micro-cone tower array structure that a kind of pyramid that differing heights arranged mixes mutually with the conoid circumference array.
Select the HSS slotting cutter of the most advanced and sophisticated both sides angle γ of " V " shape as shown in Figure 1=90 °.
(1) thin plate that is 0.38mm by thickness to be processed is removed burr and is processed, then it is fixed on special fixture on the dividing head of horizontal kneeand-column type milling machine and by regulating dividing head and makes thin plate one sideline become 90 ° with main shaft, smoothed and start the milling machine tool setting;
(2) point of a knife with respect to thin plate off-centring d=0.1mm after, at thin plate, simultaneously use the most advanced and sophisticated both sides angle γ of " V " shape=HSS slotting cutter upmilling of 90 ° to go out " V " shape groove of first direction, " V " shape groove array that the both sides angle is 90 °.In process, it is 0.1mm that the milling depth of controlling slotting cutter by regulating the lifting platform height makes the degree of depth of " V " shape groove, and adopting mode manually or automatically to control two " V " shape separation in same array by workbench is 0.2mm; Then by 36 ° of thin plate rotations, use the method upmilling identical with milling first direction " V " shape groove array to go out " V " shape groove array of second direction; Then more successively by 36 ° of thin plate rotations, use the method upmilling identical with milling first direction " V " shape groove array go out third and fourth, " V " shape groove array of five directions.As shown in figure 11, in figure, solid arrow means the array direction of the positive processing of thin plate, and dotted arrow means the array direction of thin plate reverse side processing.
(3) after processing the one side of thin plate, adjust thin plate, regulate dividing head and make same thin edges of boards line in step (1) become 90 ° with main shaft, now on upper and lower surface, the angle of two first direction arrays is β=0 °; Adopt the another side of the method processing sheet identical with step (2), as shown in Figure 10 and Figure 11.
(4) deburring, cleaning, obtain the heat exchanger plates of micro-cone tower array structure that a kind of pyramid that differing heights arranged mixes mutually with the conoid circumference array, as Fig. 9.
Micro-cone tower body of single structure of the present invention amasss as 0.006mm
3～1.968mm
3.
Heat exchanger plates provided by the utility model can make the thin plate specific area increase, and the recessed joint in " V " shape groove is conducive to nucleation, and it is complicated how the formed runner of highly micro-cone tower array structure is conducive to the fluid mobility status, and the heat-transfer effect of heat exchanger plates is strengthened; Its manufacture method only adopts traditional having " V " shape to cut the processing that most advanced and sophisticated slotting cutter or skive are fixed the degree of depth, and process is simply efficient, controls precisely and with low cost, has the using value of production in enormous quantities.
Above-described embodiment is preferably embodiment of the utility model; but embodiment of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection domain of the present utility model.
Claims (9)
1. a micro-cone tower array heat exchanger plates, it is characterized in that: the two sides of heat exchanger plates all is processed with " V " shape groove array, and " V " shape groove array of every processing of heat exchanger plates is n
1individual, n wherein
1>=3; " V " shape groove with an array is parallel to each other, and " V " shape groove of different arrays is interlaced, and the two adjacent interlaced angles of " V " shape groove array are θ,
the degree of depth of " V " shape groove is 3/7ths to 3/5ths of heat exchanger plates thickness, and " V " shape groove both sides angle is 30 °～120 °, and " V " shape groove depth is 0.05mm～1mm; A plurality of micro-cone tower arrays of the interlaced formation of described " V " shape groove array, micro-cone tower height degree of same micro-cone tower array is identical, micro-cone tower height degree difference of different micro-cone tower arrays.
2. micro-cone tower array heat exchanger plates according to claim 1, it is characterized in that: described micro-cone tower array is comprised of the array of pyramid and/or conoid, and described array comprises linear array and circumference array.
3. micro-cone tower array heat exchanger plates according to claim 2 is characterized in that: described micro-cone tower array is comprised of positive triangular pyramid linear array and positive hexagonal pyramid linear array.
4. micro-cone tower array heat exchanger plates according to claim 1, it is characterized in that: the degree of depth of described " V " shape groove is 3/1/2nds to five o'clock of heat exchanger plates thickness, and the angle between the array of first processing of upper and lower faces is α, α ≠ n
2* θ, described n
2be zero or positive integer.
5. micro-cone tower array heat exchanger plates according to claim 1, it is characterized in that: the degree of depth of described " V " shape groove is 3/7ths to two/for the moment of heat exchanger plates thickness, and the angle between the array of first processing of upper and lower faces is β, β >=0 °.
6. micro-cone tower array heat exchanger plates according to claim 1 is characterized in that: every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, the array of one of them direction is a with respect to the side-play amount of the array intersection point of another both direction, a ≠ n
2* L, wherein n
2be zero or positive integer, L means the width of " V " shape groove.
7. micro-cone tower array heat exchanger plates according to claim 1 is characterized in that: every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, wherein the array of a direction is b with respect to the side-play amount of the array intersection point of another both direction,
n wherein
2be zero or positive integer, L means the width of " V " shape groove.
8. micro-cone tower array heat exchanger plates according to claim 1 is characterized in that: every upper " V " shape groove array of described heat exchanger plates is n
1in the time of=3, wherein the array of a direction is c with respect to the side-play amount of the array intersection point of another both direction, c ≠ a& C ≠ b, wherein a ≠ n
2* L,
n
2be zero or positive integer, L means the width of " V " shape groove.
9. micro-cone tower array heat exchanger plates according to claim 1 is characterized in that: every upper " V " shape groove array of described heat exchanger plates is n
13 o'clock, all directions array is d with respect to the side-play amount at thin plate center, d>=0mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220678249 CN202993946U (en) | 2012-12-10 | 2012-12-10 | Micro conical tower array heat exchange plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220678249 CN202993946U (en) | 2012-12-10 | 2012-12-10 | Micro conical tower array heat exchange plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103047893A (en) * | 2012-12-10 | 2013-04-17 | 华南理工大学 | Micro cone tower array heat exchanging plate and manufacture method thereof |
| CN113732638A (en) * | 2021-09-16 | 2021-12-03 | 浙江道明光电科技有限公司 | Machining method of mold core with micro truncated pyramid array on surface |
-
2012
- 2012-12-10 CN CN 201220678249 patent/CN202993946U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103047893A (en) * | 2012-12-10 | 2013-04-17 | 华南理工大学 | Micro cone tower array heat exchanging plate and manufacture method thereof |
| CN113732638A (en) * | 2021-09-16 | 2021-12-03 | 浙江道明光电科技有限公司 | Machining method of mold core with micro truncated pyramid array on surface |
| CN113732638B (en) * | 2021-09-16 | 2022-09-06 | 浙江道明光电科技有限公司 | Machining method of mold core with micro truncated pyramid array on surface |
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