CN113782452A - Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface - Google Patents
Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
The invention relates to a micro-channel structure design for efficiently strengthening a boiling heat transfer surface and a preparation method thereof. According to the invention, a micro-channel structure is firstly cut on the surface of the high-thermal-conductivity metal copper by adopting laser, and then a copper nano-layer is deposited on the micro-channel structure by utilizing a magnetron sputtering method, so that the critical heat flux density of the surface of the high-thermal-conductivity metal is improved, and the surface overheat temperature of the high-thermal-conductivity metal is reduced, and the simultaneous enhancement of the critical heat flux density and the heat exchange coefficient is realized. The number of nucleation sites of the microchannel structure is increased, the critical heat flux density is improved by 1.61 times compared with the surface of a copper material, meanwhile, the heat exchange coefficient is improved by 2.26 times, and the superheat degree of a metal heat exchange surface in contact with liquid is greatly reduced. The micro-scale of the present inventionThe surface of the channel structure is provided with a closely-packed nano-column layer, the diameter of bubble separation is smaller, and the bubble separation frequency is higher. The high-efficiency enhanced boiling heat transfer surface with the multi-stage micro-channel structure is prepared by the method, and the critical heat flux density of the high-efficiency enhanced boiling heat transfer surface is up to 141.3W/cm2The degree of superheat of the wall surface was only 8.9K.
Description
The invention belongs to the technical field of phase change heat transfer, and particularly relates to a micro-channel structure design for efficiently strengthening a boiling heat transfer surface and a preparation method thereof.
Background
The rapid development of high and new technology fields such as integrated circuits, high-performance computers, laser precision machining, aerospace and the like leads to the continuous violent increase of the heat flux density of electronic components, so that if the high-intensity heat productivity cannot be effectively removed, the temperature of the components is rapidly increased, and the performance, stability and safety of the components and systems are seriously reduced. The heat dissipation problem of the device has become a key bottleneck problem affecting the development of the electronic industry at present. Boiling heat transfer is a heat transfer mode in which a working medium takes away heat of a heating surface through bubble movement and cools the heating surface, and a great heat transfer coefficient can be obtained under a condition of a small superheat degree, so that a boiling heat transfer technology is widely applied to key processes in important industrial fields of thermal power, nuclear power, geothermal energy, solar energy, petrochemical engineering, food engineering, low-temperature engineering and the like.
Recent studies have found that the boiling heat transfer performance of heat exchange surfaces can be improved by processing micro-or nanostructures on common heat exchange planes. The boiling heat exchange effect is enhanced by the micro-nano porous structure processed on the heat exchange surface by the micro-nano processing technology, so that the effect is remarkable. Compared with the structure with the conventional scale, the micro-nano porous structures can greatly improve the heat exchange area, improve the surface wetting characteristic, improve the capillary suction force, improve the bubble nucleation density and reduce the vapor-liquid flow resistance, thereby enhancing the dynamic process of boiling phase change and finally improving the heat exchange capability of the boiling surface. Previous research has focused primarily on developing new structures with different processing techniques, such as milling, polishing, electrical discharge machining, and electrochemical deposition, involving multiple manufacturing steps, thus inhibiting cost competitiveness.
The conventional heat transfer system is limited by Critical Heat Flow (CHF) in which the boiling process is changed from nucleate boiling to film boiling, resulting in a sudden increase in the surface temperature of the heat exchanger and a still large degree of superheat of the wall surface. In addition, the processing means for improving the boiling heat transfer performance in the prior art is high in cost (such as a template method), cannot be commercialized in a large scale, and cannot significantly change the growth characteristics of bubbles in a micro-channel structure, so that the surface boiling heat transfer performance cannot be greatly improved.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a micro-channel structure for efficiently strengthening a boiling heat transfer surface and a preparation method thereof. The micro-channel structure of the high-efficiency enhanced boiling heat transfer surface is a plurality of multi-stage micro-channels which are mutually communicated.
The preparation method of the invention comprises the steps of firstly adopting a laser technology to cut a micro-channel structure on the surface of the metal copper with high thermal conductivity, then depositing a copper nano-layer on the micro-channel structure by magnetron sputtering, the micro-channel structure of the high-efficiency reinforced boiling heat transfer surface has lower wall surface superheat degree, higher critical heat flux density and boiling heat exchange coefficient far exceeding that of a common reinforced surface, and can reduce the surface temperature while improving the critical heat flux density of a high-heat-conductivity metal surface; the method has simple preparation process and low cost, and is easy for commercial large-scale production and application.
The technical scheme adopted by the invention is as follows:
a method for designing and preparing a micro-channel structure of a high-efficiency enhanced boiling heat transfer surface comprises the following steps:
(1) forming a micro-channel structure on the surface of the copper material by laser processing;
(2) and (3) depositing a copper nano layer on the micro-channel structure obtained in the step (1) to obtain the micro-channel structure with the efficient enhanced boiling heat transfer surface.
In the step (1), the copper material is a copper cylinder or other shapes.
The specific conditions of the laser processing are as follows:
designing a micro-channel structure on a laser platform, wherein the interval between two laser processing lines closest to each other is 0.03-0.2mm during pattern design; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
the copper material is placed on a laser platform and adjusted to the focus position, the power is adjusted to 60-90%, the frequency is 500kHz, the speed is 400mm/s, and the scanning times are 2000-3500.
In the step (1), the cross section of the micro-channel structure is rectangular, trapezoidal or triangular.
The cross section of the micro-channel structure is rectangular, and the width of the rectangle is 0.03-0.2 mm.
The channel width of the micro-channel structure is 0.03-0.2mm, and the depth is 256-367 mu m.
And (2) depositing the copper nano layer by adopting a magnetron sputtering process.
The vacuum degree is 4.0 x 10 when the copper nano-layer is deposited-4Pa, sputtering pressure of 2.0Pa, substrate temperature of room temperature to 300 ℃, sputtering power of 10 to 30W and deposition time of 6 to 14 hours.
The copper nano-layer is a copper nano-wire layer, the diameter of the copper nano-wire is 260-350nm, the height of the copper nano-wire is 5-12 mu m, and the porosity of the copper nano-wire layer is 60-80%.
The multistage micro-channel structure with the efficient enhanced boiling heat transfer surface is prepared by the method.
The invention has the beneficial effects that:
(1) according to the design and preparation method of the micro-channel structure for efficiently strengthening the boiling heat transfer surface, the micro-channel structure is cut on the surface of a copper material with high heat conductivity by adopting a laser technology, and the copper nano-layer is deposited on the micro-channel structure by magnetron sputtering, so that the critical heat flow density of the surface of the metal with high heat conductivity can be improved, and the surface temperature of the metal can be reduced. The reason is that the inventor of the present application finds that, because the copper material has high thermal conductivity, and the copper nanolayer is deposited on the surface of the copper material with the microchannel structure, the copper nanolayer and the copper material of the substrate are made of the same material, the mismatch of thermal expansion coefficients and the heat transfer loss among the materials can be effectively reduced, and finally, the critical heat flow density of the surface of the metal with high thermal conductivity can be improved while the surface temperature of the metal is reduced.
(2) According to the design and preparation method of the micro-channel structure for efficiently strengthening the boiling heat transfer surface, the wettability and the surface nucleation of the surface of the copper microstructure prepared by laser are adjusted by introducing the copper nanowires, so that the critical heat flow density and the heat exchange coefficient are simultaneously enhanced. This is because the inventors of the present application found in long-term research that the copper nanowire arrays introduced by the present invention are orderly controllable, compared with the irregular randomness of other nanolayers, the copper nanowire array structure of the present invention has more favorable conditions for the bubble escape and liquid replenishment during the boiling heat transfer process, and the size of the porosity influences the bubble nucleation size and the escape rate. The data show that the number of nucleation sites of the microchannel structure is increased, the critical heat flow density is improved by 1.61 times compared with the surface of a copper material, meanwhile, the heat exchange coefficient is improved by 2.26 times, and the temperature of the surface contacting with liquid is greatly reduced. The improvement of the heat transfer coefficient is related to the specific surface area, the structure height and the density of active nucleation sites, and the higher the specific surface area is, the higher the heat transfer coefficient is. The copper nanowire in the microchannel structure can effectively improve the surface wettability and the wicking capability. According to the bubble dynamics, the diameter of the bubble drop-out of the surface of the structure with the close packing structure of the microchannel structure is smaller, and the frequency of the bubble drop-out is higher. The critical heat flux density of the micro-channel structure of the high-efficiency enhanced boiling heat transfer surface prepared by the method is as high as 141.3W/cm2Meanwhile, the degree of superheat of the wall surface is only 8.9K.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIGS. 1a, 1b, 1c and 1d are the surface topography and channel structure diagrams of the micro-channel structures obtained in comparative example 1, example 2 and example 3, respectively;
FIG. 1e is a cross-sectional view of a copper nanowire layer deposited according to example 3;
FIGS. 2a-2c are schematic diagrams of the static contact angles of 5 μm sessile drops on the surface of copper materials treated by the methods of comparative examples 2-4, respectively;
FIGS. 2d-2f are schematic diagrams of the static contact angles of 5 μm sessile drops on the surface of copper materials treated by the methods of examples 1-3, respectively;
FIG. 3a is a graph of superheat versus critical heat flux density for the surfaces of various microchannel structures of examples 1-3;
FIG. 3b is a graph of critical heat flux density versus boiling heat transfer coefficient for the surfaces of various microchannel structures of examples 1-3;
FIG. 4 is a cross-sectional view of the copper nanowire layer obtained in example 4;
FIG. 5 is a cross-sectional view of the copper nanowire layer obtained in example 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Example 1
The embodiment provides a method for designing and preparing a micro-channel structure of an efficient enhanced boiling heat transfer surface, which comprises the following steps:
(1) taking a copper cylinder with the diameter of 10mm and the height of 20mm, and forming a micro-channel structure on the surface of the copper cylinder by utilizing laser processing;
the specific conditions of the laser processing are as follows:
designing a structure in a shape like a Chinese character 'jing' on a laser platform (Wuhan Anyang laser, model Picoyl-15), wherein the interval between two laser processing lines closest to each other is 0.2 mm; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
the cross section of the micro-channel structure is rectangular, the width of the rectangle is 0.2mm (corresponding to the interval of two lines of the structure shaped like a Chinese character 'jing'), the width of a channel (groove) of the micro-channel structure is 0.2mm, and the depth of the channel (groove) is 312 mu m;
(2) depositing a copper nanowire layer on the micro-channel structure obtained in the step (1) by adopting a magnetron sputtering process, wherein the instrument is a JGP-450a type magnetron sputtering deposition system of Shenyang scientific instrument development center Limited company of Chinese academy of sciences; the specific conditions of the magnetron sputtering technology are as follows: the target material is high-purity copper target, the target base distance is 14cm, and the vacuum degree is 4.0 × 10-4Opening the sample table to rotate when the pressure is about Pa; starting to introduce high-purity argon, fixing the flow of the argon to be 25sccm, adjusting the air pressure to a preset working air pressure of 2.0Pa, adjusting the sputtering power to be 20W, pre-sputtering for 10 minutes, and opening a baffle to start sputtering after glow is stable; the sputtering time is 10h, after the sputtering is finished, the sputtering power supply is turned off, the autorotation of the sample table and other power supplies are turned off, and the sample is taken out, so that the micro-channel structure of the efficient enhanced boiling heat transfer surface is obtained.
Example 2
Example 2 differs from example 1 only in that: in the step (1), the interval between two lines of the structure shaped like a Chinese character 'jing' is 0.1mm when laser processing is adopted, and the rest is the same as that of the embodiment 1; accordingly, the cross section of the microchannel structure obtained in this example was rectangular, the width of the rectangle was 0.1mm, and the width of the channel (groove) of the microchannel structure was 0.1mm and the depth was 367 μm.
Example 3
This example 3 differs from example 1 only in that: in the step (1), the interval between two lines of the structure of the shape of a Chinese character 'jing' is 0.03mm in the laser processing, and the rest is the same as that of the embodiment 1. Accordingly, the cross section of the microchannel structure obtained in this example was rectangular, the width of the rectangle was 0.03mm, and the width of the channel (groove) of the microchannel structure was 0.03mm and the depth was 256 μm.
Example 4
This example differs from example 3 only in that: the deposition conditions in the step (2) are different, and specifically comprise the following steps:
the target base distance is 14cm, the vacuum degree is 4.0 × 10-4Opening the sample table to rotate when the pressure is about Pa(ii) a Starting to introduce high-purity argon, fixing the flow of the argon to be 25sccm, adjusting the air pressure to a preset working air pressure of 2.0Pa, adjusting the sputtering power to be 20W, pre-sputtering for 10 minutes, and opening a baffle to start sputtering after glow is stable; the sputtering time is 4h, after the sputtering is finished, the sputtering power supply is turned off, the autorotation of the sample table and other power supplies are turned off, and the sample is taken out, so that the micro-channel structure of the efficient enhanced boiling heat transfer surface is obtained.
Example 5
This example differs from example 3 only in that: the deposition conditions in the step (2) are different, and specifically comprise the following steps:
the target base distance is 14cm, the vacuum degree is 4.0 × 10-4Opening the sample table to rotate when the pressure is about Pa; starting to introduce high-purity argon, fixing the flow of the argon to be 25sccm, adjusting the air pressure to a preset working air pressure of 2.0Pa, adjusting the sputtering power to be 20W, pre-sputtering for 10 minutes, and opening a baffle to start sputtering after glow is stable; the sputtering time is 6h, after the sputtering is finished, the sputtering power supply is turned off, the autorotation of the sample table and other power supplies are turned off, and the sample is taken out, so that the micro-channel structure of the efficient enhanced boiling heat transfer surface is obtained.
Comparative example 1
This comparative example differs from example 3 in that a copper nanowire layer was directly deposited on the surface of a copper cylinder without the laser cutting treatment of step (1).
Comparative example 2
The comparative example is different from example 1 in that only the laser cutting treatment of step (1) is performed to obtain the micro-channel structure, and no copper nanowire layer is further deposited on the surface of the micro-channel structure.
Comparative example 3
The comparative example is different from example 2 in that only the laser cutting treatment of step (1) is performed to obtain the micro-channel structure, and no copper nanowire layer is further deposited on the surface of the micro-channel structure.
Comparative example 4
The comparative example is different from example 3 in that only the laser cutting treatment of step (1) is performed to obtain the micro-channel structure, and no copper nanowire layer is further deposited on the surface of the micro-channel structure.
Comparative example 5
This comparative example differs from example 3 only in that: the treatment modes of the step (2) are different, the copper oxide nanometer conical layer is prepared on the surface of the copper column in the comparative example, and the specific process comprises the following steps:
immersing copper cylinder in the solution at room temperature, wherein the raw material of the solution is NaClO2、NaOH、Na3PO4·12H2O and deionized water, and the mass ratio of the substances is 3.75: 5: 10: and (5) oxidizing for 15min, taking out the copper column, washing with deionized water and ethanol for 3 times, and drying.
Comparative example 6
This comparative example differs from example 3 only in that: the deposition in the step (2) is a metallic nickel nano-layer, and the specific process is as follows:
the target material is high-purity nickel target, the target base distance is 14cm, and the vacuum degree is 4.0 x 10-4Opening the sample table to rotate when the pressure is about Pa; starting to introduce high-purity argon, fixing the flow of the argon to be 25sccm, adjusting the air pressure to a preset working air pressure of 2.0Pa, adjusting the sputtering power to be 20W, pre-sputtering for 10 minutes, and opening a baffle to start sputtering after glow is stable; the sputtering time is 10h, after the sputtering is finished, the sputtering power supply is turned off, the autorotation of the sample table and other power supplies are turned off, and the sample is taken out, so that the micro-channel structure of the efficient enhanced boiling heat transfer surface is obtained.
Examples of the experiments
Fig. 1 shows the structure diagrams of the surface topography and the channel observed under a 3D laser scanning confocal microscope, wherein fig. 1a, 1b, 1c, and 1D respectively show the structure diagrams of the surface topography and the channel of the micro-channel structure obtained in comparative example 1, example 2, and example 3, and it can be seen from the figures that the center of the micro-channel structure described in examples 1-3 is a square cylinder obtained by laser processing, and the channel is a depth groove left after the laser is swept and is the width of the laser spot diameter. In example 3, the scanning width of the laser ("the interval between two lines of the # -shaped structure") was set to 0.03mm, the scanning width was close to the spot diameter (50 μm), and the surface was tiled (as shown in fig. 1 d).
Fig. 2 is a schematic diagram showing the static contact angle of 5 μ L sessile drop on the surface of different copper materials. Wherein, fig. 2a-2c are schematic diagrams of the static contact angles of 5 μ L sessile drops on the surface of the copper material treated by the methods of comparative examples 2-4, respectively; fig. 2d-2f are schematic diagrams of the static contact angles of 5 μ L sessile drops on the surface of copper material treated by the methods of examples 1-3, respectively. As can be seen from the figure, compared with the copper material processed by laser cutting only, the copper material prepared by performing laser cutting and then sputtering the copper nanowire layer by the methods of embodiments 1 to 3 of the present invention has obviously enhanced surface hydrophobicity of 2d and 2f, so that the processing method of sputtering the copper nanowire layer improves the surface wettability and increases the surface nucleation sites.
As shown in fig. 3, a comparison of the pool boiling curves for the surfaces of different microchannel structures (examples 1-3) with water at atmospheric pressure is shown. The criterion for judging the boiling performance is that the lower the Superheat degree (Wall super Heat), the higher the critical Heat flow (Heat Flux), and the higher the boiling Heat Transfer Coefficient (Heat Transfer Coefficient), the better the Heat Transfer performance. As can be seen from the figure, the heat transfer performance of the micro-channel structure (channel width 0.03mm) obtained in example 3 is optimal, and the critical heat flow density of the micro-channel structure obtained in example 3 is 141.3W/cm2And the degree of superheat of the wall surface is 8.9K. As shown in fig. 1e, which is a cross-sectional view of the copper nanowire layer deposited in example 3, it can be seen that the copper nanowires in the copper nanowire layer deposited in example 3 have a diameter of 310nm and a height of 8.16 μm, and the porosity (ratio of the total volume of the micro-voids in the material to the total volume) of 75.3%.
As shown in fig. 4, which is a cross-sectional view of the copper nanowire layer obtained in example 4, it can be seen that the copper nanowires in the copper nanowire layer deposited in example 4 have a diameter of 170nm and a height of 3.63 μm, and the porosity of the copper nanowire layer is 87.1%.
As shown in fig. 5, which is a cross-sectional view of the copper nanowire layer obtained in example 5, it can be seen that the copper nanowires in the copper nanowire layer deposited in example 5 have a diameter of 180nm and a height of 4.98 μm, and the porosity of the copper nanowire layer is 80.7%.
The critical heat flux density and wall surface superheat of the microchannel structures prepared in examples 1 to 5, comparative example 5 and comparative example 6 were measured, and the results are shown in table 1.
TABLE 1
As can be seen from table 1, the method of the present invention can significantly increase the critical heat flux density of the copper material and reduce the surface temperature of the copper material by cutting the microchannel structure on the surface of the copper material by using the laser technology and depositing the copper nanowire layer on the microchannel structure. Wherein the performance of the microchannel structure obtained by the method of example 3 is optimal, and the critical heat flux density is as high as 141.3W/cm2The degree of superheat of the wall surface was only 8.9K. Compared with the schemes of depositing the copper oxide nanocone layer (comparative example 5) and depositing the metal nickel nanocone layer (comparative example 6), the method of the embodiment 3 of the invention has the advantages that when the diameter of the deposited copper nanowire layer in the microchannel structure is 310nm, the critical heat flux density is higher, and meanwhile, the wall surface superheat degree is lower, so that the copper nanowires with different deposition diameters have different effects on the enhancement of the boiling heat transfer performance, wherein the copper nanowire with the diameter of 310nm has the best enhancement of the boiling heat transfer performance.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A method for designing and preparing a micro-channel structure of a high-efficiency enhanced boiling heat transfer surface is characterized by comprising the following steps:
(1) forming a micro-channel structure on the surface of the copper material by laser processing;
(2) and (3) depositing a copper nano layer on the micro-channel structure obtained in the step (1) to obtain the multistage micro-channel structure with the efficient enhanced boiling heat transfer surface.
2. The method for designing and preparing a microchannel structure with a high efficiency and an enhanced boiling heat transfer surface according to claim 1, wherein in the step (1), the copper material is a copper cylinder or other shapes.
3. The method for designing and preparing the microchannel structure of the efficient enhanced boiling heat transfer surface according to the claim 1, wherein the specific conditions of the laser processing in the step (1) are set as follows:
designing a micro-channel structure on a laser platform, wherein the interval between two laser processing lines closest to each other is 0.03-0.2mm during pattern design; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
the copper material is placed on a laser platform and adjusted to the focus position, the power is adjusted to 60-90%, the frequency is 500kHz, the speed is 400mm/s, and the scanning times are 2000-3500.
4. The method for designing and preparing a microchannel structure with a high efficiency and an enhanced boiling heat transfer surface according to claim 1, wherein in the step (1), the microchannel structure has a channel cross section of a rectangle, a trapezoid or a triangle.
5. The method as claimed in claim 4, wherein the width of the cross-sectional grooves of the microchannel structure is 0.03-0.2mm and the depth is 256-367 μm.
6. The method for designing and preparing a microchannel structure with a high efficiency and an enhanced boiling heat transfer surface according to claim 1, wherein in the step (2), the copper nanolayer is deposited by a magnetron sputtering process.
7. The method for designing and preparing a microchannel structure with a high-efficiency enhanced boiling heat transfer surface according to claim 6, wherein during the magnetron sputtering deposition of the copper nanolayer, the sputtering pressure is 2.0Pa, the substrate temperature is between room temperature and 300 ℃, the sputtering power is 10-30W, and the deposition time is 6-14 h.
8. The method as claimed in claim 6, wherein the copper nanowire layer is a copper nanowire layer, the diameter of the copper nanowire layer is 260-350nm, the height of the copper nanowire layer is 5-12 μm, and the porosity of the copper nanowire layer is 60-80%.
9. The multi-stage microchannel structure with high-efficiency enhanced boiling heat transfer surface prepared by the method of any one of claims 1 to 8.
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