CN112176369A - High-efficiency boiling heat transfer copper material and preparation method thereof - Google Patents
High-efficiency boiling heat transfer copper material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a high-efficiency boiling heat transfer copper material and a preparation method thereof. The surface of the high-efficiency boiling heat transfer copper material is covered with a porous copper film, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure. The preparation method comprises the following steps: the base material used as the working electrode is assembled with the counter electrode and the weak alkaline copper salt electrolyte to form an electrochemical working system, a reduction current is applied between the working electrode and the counter electrode, and a porous copper film is formed on the surface of the base material through electrodeposition reaction. The high-efficiency boiling heat transfer copper material has the advantages of higher heat transfer area, far more nucleation sites, more excellent boiling heat transfer performance, higher boiling heat transfer coefficient and critical heat flux density, lower superheat degree of a nucleation boiling starting point, simple and convenient preparation process, easy regulation and control of reaction, low cost and suitability for industrial scale application.
Description
Technical Field
The invention relates to a structure and a method for enhancing surface heat transfer, in particular to a high-efficiency boiling heat transfer micro-nano porous copper material and a preparation method thereof.
Background
With the development of miniaturization, integration and high power of electronic devices, a severe test is provided for high heat flow heat dissipation. The research on the micro-nano copper material with more excellent boiling heat transfer performance by utilizing the existing or developing new micro-nano processing technology has become the current research focus. In 2008, the university of colorado, Peterson, in the united states, utilized a glancing angle deposition technique to grow a copper nanorod array structure in situ on the surface of copper material and confirmed that the structure has high boiling heat transfer performance (Small,2008,4, 1084-1088). Countless micron defect points are distributed on the surface of the copper nanorod prepared by the method and can be used as effective nucleation sites to reduce the superheat degree of the nucleation boiling starting point and increase the heat exchange coefficient; compared with a smooth copper surface, the nano structure has a higher heat exchange area and better wettability, and the effects also contribute to improving the boiling heat exchange performance. However, this method is time consuming, material consuming, energy consuming, and difficult to process in large areas. Compared with a physical deposition technology, the electroplating technology has more advantages in the aspect of low-cost large-area processing of the metal micro-nano structure. In 2009, the professor group Majumdar, university of california, usa, prepared copper nanowire array structures based on porous anodized aluminum template assisted electrochemical deposition techniques and also demonstrated that this configuration has efficient boiling heat transfer properties (Nano lett, 2009,9, 548-. The copper nanowire structure developed by the method can only be welded on the surface of a material, and the processing mode can greatly increase the thermal contact resistance between the nanostructure and a base material, so that the method is unfavorable for efficient heat exchange. To solve the problem, the university of Nanjing aerospace Shi professor team uses a clamp to mechanically fix an alumina template on the surface of a copper material in 2015, and then realizes the in-situ growth of a copper nanowire array structure through an electroplating process (appl.therm.Eng.,2015,75, 115-one 121). Although this improved process enables in-situ growth of copper wire and has excellent boiling heat transfer properties, this process suffers from the following inevitable problems: large-area processing cannot be realized due to the limitation of the template, and the processing cost is increased sharply along with the increase of the area of the template; the template is easy to break due to mechanical tight fit, so that the processing quality of the nanowire is uncontrollable; the formed nanowires can randomly form clusters under the action of capillary action, and although micro-cavities formed by the clusters are beneficial to nucleation, the forming process is not controllable. Therefore, how to develop the high-efficiency boiling heat transfer micro-nano copper material with real commercial value and the processing technology thereof still faces huge challenges.
Disclosure of Invention
The invention mainly aims to provide a high-efficiency boiling heat transfer copper material and a preparation method thereof, so as to overcome the defects in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention comprises the following steps:
the embodiment of the invention provides a high-efficiency boiling heat transfer copper material, wherein a porous copper film is coated on the surface of the copper material, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
and the copper nanocones are in a shape of a needle cone, the average height is 3-8 μm, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm.
The embodiment of the invention also provides a preparation method of the high-efficiency boiling heat transfer copper material, which comprises the following steps: a base material used as a working electrode is assembled with a counter electrode and a weakly alkaline copper salt electrolyte to form an electrochemical working system, a reduction current is applied between the working electrode and the counter electrode, a porous copper film is formed on the surface of the base material through electrodeposition reaction, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
and the copper nanocones are in a shape of a needle cone, the average height is 3-8 μm, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm.
The embodiment of the invention also provides the high-efficiency boiling heat transfer copper material prepared by the method.
Compared with the prior art, the invention has the beneficial effects that:
1) compared with the surface of a common copper material, the porous high-efficiency boiling heat transfer copper material has a higher heat exchange area and far more nucleation sites, the gradually-changed micro-channel structure is favorable for transporting bubbles, and the nano needle with the tip diameter can reduce the surface adhesion and is favorable for the bubbles to be separated from the surface. Therefore, the prepared porous copper material structure has more excellent boiling heat exchange performance, higher boiling heat transfer coefficient and critical heat flux density and lower superheat degree of a nucleation boiling starting point;
2) the invention adopts metal materials such as copper and the like, and has high heat conductivity. Compared with inorganic substances such as silicon and oxides such as zinc oxide used by other researchers, the material is more beneficial to enhancing boiling heat transfer and is more expected to be applied to actual production;
3) the invention adopts copper material as substrate, which is matched with the thermal expansion coefficient of the prepared porous copper nano-cone structure;
4) the preparation method can directly electrodeposit on the surface of the required copper material to obtain the porous copper nanocone without the assistance of a template, and has the characteristics of simple and convenient process, cheap and easily obtained raw materials, easy regulation and control of reaction, low cost and the like. The required electrolyte formula is economical and easy to obtain, the operation process is simple, and the method is suitable for industrial scale application;
5) the copper nanocone adopted by the invention is used for enhancing boiling heat transfer, has a larger effective heat transfer area and far more nucleation sites, and is an efficient boiling heat transfer interface.
Drawings
FIG. 1a and FIG. 1b are the front view and the cross-sectional view of the SEM photo of the porous Cu nanocone on the surface of the copper material in example 1 of the present invention;
FIG. 2 is a graph of boiling heat transfer performance of various porous copper nanocones in an example of the present invention;
FIGS. 3a and 3b are the front and cross-sectional views of the SEM photo of the porous Cu nanocone on the surface of the Cu material in example 2 of the present invention;
FIGS. 4a and 4b are the front and cross-sectional views of the SEM photo of the porous Cu nanocone on the surface of the Cu material in example 3 of the present invention;
fig. 5a and 5b are a front view and a cross-sectional view of a scanning electron micrograph of a porous copper nanocone on the surface of a copper material in example 4 of the present invention.
Detailed Description
In view of the deficiencies in the prior art, the inventors of the present invention have made extensive studies and extensive practices to propose the technical solution of the present invention, and further explain the technical solution, the implementation process and the principle thereof, etc.
In one aspect of the embodiment of the invention, the surface of the copper material is covered with a porous copper film, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
and the copper nanocones are in a shape of a needle cone, the average height is 3-8 μm, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm.
Further, the distribution density of the copper nanocones is 1.0 × 105～1.0×107Per mm2。
Further, the size of the porous micro-cavity structure is 1-12 μm.
Further, the porous copper film comprises a copper nanocone and a microcavity formed by the copper nanocone; the irregular open micro-cavities are communicated with each other to form a unique porous micro-cavity structure.
Another aspect of the embodiments of the present invention provides a method for preparing a high-efficiency boiling heat transfer copper material, including: a base material used as a working electrode is assembled with a counter electrode and a weakly alkaline copper salt electrolyte to form an electrochemical working system, a reduction current is applied between the working electrode and the counter electrode, a porous copper film is formed on the surface of the base material through electrodeposition reaction, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
and the copper nanocones are in a shape of a needle cone, the average height is 3-8 μm, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm.
Further, the distribution density of the copper nanocones is 1.0 × 105～1.0×107Per mm2。
Further, the size of the porous micro-cavity structure is 1-12 μm.
In some embodiments, the voltage applied between the working electrode and the counter electrode in the electrodeposition reaction is controlled to be-0.5 to-1.0V, preferably-0.88 to-0.92V, and the distance between the counter electrode and the working electrode is 20mm to 60 mm.
In some embodiments, the time of the electrodeposition reaction is controlled to be 10 to 80 min.
In some embodiments, the weakly basic copper salt electrolyte comprises 0.01 to 0.04mol/L copper sulfate, 0.10 to 0.30mol/L sodium hypophosphite, 0.0010 to 0.030mol/L nickel sulfate, 0.4 to 0.7mol/L trisodium citrate, 0.05 to 0.08mol/L boric acid and 4 to 8g/L polyethylene glycol. The electrolyte formula required by the invention is economical and easy to obtain, and the operation process is simple, so that the electrolyte is suitable for industrial scale application.
Further, the temperature of the weak alkaline copper salt electrolyte is 50-80 ℃, and the pH value is 7.0-9.0.
Furthermore, the material of the substrate includes copper, copper alloy and other metal materials, and the shape of the substrate is not limited, and may be, for example, a flat copper sheet, a copper sheet, or a curved surface, such as the inner and outer surfaces of a copper tube.
Furthermore, the copper material is adopted as a substrate, and the thermal expansion coefficient of the copper material is matched with that of the prepared porous copper nanocone structure.
The invention adopts metal materials such as copper and the like, and has high heat conductivity. Compared with inorganic substances such as silicon and oxides such as zinc oxide used by other researchers, the material is more beneficial to enhancing boiling heat transfer, and is more expected to be applied to actual production.
Further, the material of the counter electrode may be selected from metal or semiconductor materials, such as platinum sheet, graphite, etc., but is not limited thereto.
Further, the electrochemical working system further comprises a reference electrode, and the reference electrode comprises a silver/silver chloride electrode, but is not limited thereto.
In another aspect, the embodiment of the invention also provides a high-efficiency boiling heat transfer copper material prepared by any one of the methods.
Further, the distribution density of the copper nanocones is 1.0 × 105～1.0×107Is/aremm2。
Further, the size of the porous micro-cavity structure is 1-12 μm.
In conclusion, the porous high-efficiency boiling heat transfer copper material has a higher heat exchange area and far more nucleation sites, the gradually-changed micro-channel structure is favorable for transporting bubbles, and the nano-needle with the tip diameter can reduce the surface adhesion and is favorable for the bubbles to separate from the surface. Therefore, the prepared porous copper material structure has more excellent boiling heat exchange performance, higher boiling heat transfer coefficient and critical heat flux density and lower superheat degree of a nucleation boiling starting point.
Furthermore, the preparation method can directly electrodeposit on the surface of the required copper material to obtain the porous copper nanocone without the assistance of a template, and has the characteristics of simple and convenient process, cheap and easily obtained raw materials, easy regulation and control of reaction, low cost and the like. The required electrolyte formula is economical and easy to obtain, the operation process is simple, and the method is suitable for industrial scale application.
The invention is described in detail below with reference to the figures and specific embodiments. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be apparent to those skilled in the art that several modifications and improvements can be made without departing from the inventive concept. All falling within the scope of the present invention.
Example 1
The embodiment relates to a nano-cone structure high-efficiency boiling heat transfer copper material prepared by electrochemical deposition, which is used for enhancing boiling heat transfer. The method comprises the following specific steps:
(1) and (3) polishing the surface of the copper test piece, washing the surface by using ultrapure water, and drying the surface by using high-purity nitrogen. This step is to remove the surface oxide layer.
(2) And (2) placing the copper test piece treated in the step (1) as a working electrode in a weak alkaline copper salt electrolyte solution, wherein a platinum electrode is used as a counter electrode, and silver/silver chloride is used as a reference electrode. The working electrode is connected through a lead, and the counter electrode and the reference electrode form a loop. Controlling the distance between the counter electrode and the working electrode to be 60mm, and carrying out constant-voltage electrodeposition reaction in a constant-temperature water bath at 75 ℃, wherein the voltage is controlled to be-0.92V, and the electrodeposition time lasts for 20 min. The electrolyte temperature used in this example was 75 ℃, and the composition was: 0.03mol/L of copper sulfate, 0.24mol/L of sodium hypophosphite, 0.0024mol/L of nickel sulfate, 0.5mol/L of trisodium citrate, 0.05mol/L of boric acid and 6g/L of polyethylene glycol, and the pH value of the solution is controlled to be 8.0. The front view and the cross-sectional view of the scanning electron micrograph of the target sample are shown in fig. 1a and 1b, and the coniform size of the structure surface is as follows: the average height was 4.5. + -. 0.2. mu.m, the diameter of the base was 0.8. + -. 0.1. mu.m, and the diameter of the tip was 14.4. + -. 0.3 nm.
(3) After the electroplating is finished, the electroplating solution is washed clean by ultrapure water and dried by high-purity nitrogen.
(4) The boiling heat transfer performance test shows that compared with the common copper surface, the nucleation boiling starting point of the porous copper film structure is advanced by 31.9%, the maximum heat transfer efficiency is improved by 147.3%, the critical heat flow density value is improved by 64.0%, as shown in fig. 2, the superheat degree corresponding to the nucleation boiling starting point is 8.1K, and the maximum heat transfer coefficient is 104.6kW m-2K-1The critical heat flux density was 272W cm-2。
Example 2
The embodiment relates to a nano-cone structure high-efficiency boiling heat transfer copper material prepared by electrochemical deposition, which is used for enhancing boiling heat transfer. The method comprises the following specific steps:
(1) and (3) polishing the surface of the copper test piece, washing the surface by using ultrapure water, and drying the surface by using high-purity nitrogen. This step is to remove the surface oxide layer.
(2) And (2) placing the copper test piece treated in the step (1) as a working electrode in a weak alkaline copper salt electrolyte solution, wherein a platinum electrode is used as a counter electrode, and silver/silver chloride is used as a reference electrode. The working electrode is connected through a lead, and the counter electrode and the reference electrode form a loop. Controlling the distance between the counter electrode and the working electrode to be 40mm, and carrying out constant-voltage electrodeposition reaction in a constant-temperature water bath at 80 ℃, wherein the voltage is controlled to be-0.88V, and the electrodeposition time lasts for 10 min. The electrolyte temperature used in this example was 80 ℃, and the composition was: 0.04mol/L of copper sulfate, 0.30mol/L of sodium hypophosphite, 0.030mol/L of nickel sulfate, 0.7mol/L of trisodium citrate, 0.06mol/L of boric acid and 4g/L of polyethylene glycol, and the pH value of the solution is controlled at 9.0. The front view and the cross-sectional view of the scanning electron micrograph of the target sample are shown in fig. 3a and 3b, and the coniform size of the structure surface is as follows: the average height was 6.6. + -. 0.2. mu.m, the diameter of the base was 1.2. + -. 0.1. mu.m, and the diameter of the tip was 16.2. + -. 0.2 nm.
(3) After the electroplating is finished, the electroplating solution is washed clean by ultrapure water and dried by high-purity nitrogen.
(4) Through boiling heat transfer performance tests, the result shows that compared with the surface of common copper, the nucleation boiling starting point of the porous copper film structure is advanced by 24.4%, the maximum heat transfer efficiency is improved by 70.4%, the critical heat flow density value is improved by 40.4%, as shown in fig. 2, specifically, the superheat degree corresponding to the nucleation boiling starting point is 9.0K, and the maximum heat transfer coefficient is 72.1kW m-2K-1The critical heat flux density was 232.9W cm-2。
Example 3
The embodiment relates to a nano-cone structure high-efficiency boiling heat transfer copper material prepared by electrochemical deposition, which is used for enhancing boiling heat transfer. The method comprises the following specific steps:
(1) and (3) polishing the surface of the copper test piece, washing the surface by using ultrapure water, and drying the surface by using high-purity nitrogen. This step is to remove the surface oxide layer.
(2) And (2) placing the copper test piece treated in the step (1) as a working electrode in a weak alkaline copper salt electrolyte solution, wherein a platinum electrode is used as a counter electrode, and silver/silver chloride is used as a reference electrode. The working electrode is connected through a lead, and the counter electrode and the reference electrode form a loop. Controlling the distance between the counter electrode and the working electrode to be 40mm, and carrying out constant-voltage electrodeposition reaction in a constant-temperature water bath at 80 ℃, wherein the voltage is controlled to be-1.0V, and the electrodeposition time lasts for 80 min. The electrolyte temperature used in this example was 50 ℃ and consisted of: 0.01mol/L copper sulfate, 0.10mol/L sodium hypophosphite, 0.0010mol/L nickel sulfate, 0.4mol/L trisodium citrate, 0.08mol/L boric acid and 8g/L polyethylene glycol, and the pH value of the solution is controlled at 7.0. The front view and the cross-sectional view of the scanning electron micrograph of the target sample are shown in fig. 4a and 4b, and the coniform size of the structure surface is as follows: the average height was 8.3. + -. 0.1. mu.m, the average diameter of the bottom was 2.0. + -. 0.1. mu.m, and the average diameter of the tip was 19.6. + -. 0.3 nm.
(3) After the electroplating is finished, the electroplating solution is washed clean by ultrapure water and dried by high-purity nitrogen.
(4) The boiling heat transfer performance test shows that compared with the common copper surface, the nucleation boiling starting point of the porous copper film structure is advanced by 18.5%, the maximum heat transfer efficiency is improved by 58.9%, the critical heat flow density value is improved by 33.8%, as shown in fig. 2, the superheat degree corresponding to the nucleation boiling starting point is 9.7K, and the maximum heat transfer coefficient is 67.2kW m-2K-1The critical heat flux density was 222.0W cm-2。
Example 4
The embodiment relates to a nano-cone structure high-efficiency boiling heat transfer copper material prepared by electrochemical deposition, which is used for enhancing boiling heat transfer. The method comprises the following specific steps:
(1) and (3) polishing the surface of the copper test piece, washing the surface by using ultrapure water, and drying the surface by using high-purity nitrogen. This step is to remove the surface oxide layer.
(2) And (2) placing the copper test piece treated in the step (1) as a working electrode in a weak alkaline copper salt electrolyte solution, wherein a platinum electrode is used as a counter electrode, and silver/silver chloride is used as a reference electrode. The working electrode is connected through a lead, and the counter electrode and the reference electrode form a loop. Controlling the distance between the counter electrode and the working electrode to be 40mm, and carrying out constant-voltage electrodeposition reaction in a constant-temperature water bath at 75 ℃, wherein the voltage is controlled to be-0.5V, and the electrodeposition time lasts for 20 min. The electrolyte temperature used in this example was 75 ℃, and the composition was: 0.01mol/L copper sulfate, 0.10mol/L sodium hypophosphite, 0.0010mol/L nickel sulfate, 0.4mol/L trisodium citrate, 0.08mol/L boric acid and 8g/L polyethylene glycol, and the pH value of the solution is controlled at 8.5. As shown in fig. 5a and 5b, the front view and the cross-sectional view of the scanning electron micrograph of the target sample are obtained, and the coniform size of the structure surface is as follows: the average height was 5.1. + -. 0.3. mu.m, the average diameter of the bottom was 1.2. + -. 0.1. mu.m, and the average diameter of the tip was 0.12. + -. 0.01. mu.m.
(3) After the electroplating is finished, the electroplating solution is washed clean by ultrapure water and dried by high-purity nitrogen.
(4) The boiling heat transfer performance test shows that compared with the common copper surface, the nucleation boiling starting point of the porous copper film structure is advanced by 25.2%, the maximum heat transfer efficiency is improved by 114.1%, the critical heat flow density value is improved by 45.7%, as shown in figure 2, the superheat degree corresponding to the nucleation boiling starting point is 8.9K, and the maximum heat transfer coefficient is 90.6kW m-2K-1The critical heat flux density was 242.0W cm-2。
By the results of the embodiments 1 to 4, the porous high-efficiency boiling heat transfer copper material has a higher heat exchange area and far more nucleation sites, the gradually-changed micro-channel structure is favorable for bubble transportation, and the nano-needle with the tip diameter can reduce the surface adhesion and is favorable for bubbles to separate from the surface. Therefore, the prepared porous copper material structure has more excellent boiling heat exchange performance, higher boiling heat transfer coefficient and critical heat flux density and lower superheat degree of a nucleation boiling starting point.
In addition, the inventor also carries out corresponding experiments by using other raw materials listed above and other process conditions to replace various raw materials and corresponding process conditions in the embodiments 1 to 4, and also prepares the nano-cone structure high-efficiency boiling heat transfer copper material with higher heat exchange area, more excellent boiling heat exchange performance, higher boiling heat transfer coefficient and critical heat flux density, and lower superheat degree of a nuclear boiling starting point.
It should be understood that the above describes only some embodiments of the present invention and that various other changes and modifications may be affected therein by one of ordinary skill in the related art without departing from the scope or spirit of the invention.
Claims (10)
1. An efficient boiling heat transfer copper material is characterized in that: the surface of the copper material is covered with a porous copper film, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
the copper nanocones are in a needle cone shape, the average height is 3-8 mu m, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm;
preferably, the distribution density of the copper nanocones is 1.0 × 105～1.0×107Per mm2(ii) a Preferably, the size of the porous micro-cavity structure is 1-12 μm.
2. A preparation method of a high-efficiency boiling heat transfer copper material is characterized by comprising the following steps: a base material used as a working electrode is assembled with a counter electrode and a weakly alkaline copper salt electrolyte to form an electrochemical working system, a reduction current is applied between the working electrode and the counter electrode, a porous copper film is formed on the surface of the base material through electrodeposition reaction, the porous copper film comprises a plurality of copper nanocones, and irregular open microcavities distributed among the plurality of copper nanocones are communicated with one another to form a porous microcavity structure;
and the copper nanocones are in a shape of a needle cone, the average height is 3-8 μm, the diameter of the bottom is 500-2200 nm, and the diameter of the tip is 0-50 nm.
3. The method of claim 2, wherein: in the electrodeposition reaction, a constant voltage condition is used, the voltage applied between the working electrode and the counter electrode is-0.5 to-1.0V, preferably-0.88 to-0.92V, and the distance between the counter electrode and the working electrode is 20mm to 60 mm.
4. The method of claim 2, wherein: the time of the electrodeposition reaction is 10-80 min.
5. The method of claim 2, wherein: the weak alkaline copper salt electrolyte comprises 0.01-0.04 mol/L copper sulfate, 0.10-0.30 mol/L sodium hypophosphite, 0.0010-0.030 mol/L nickel sulfate, 0.4-0.7 mol/L trisodium citrate, 0.05-0.08 mol/L boric acid and 4-8 g/L polyethylene glycol.
6. The method of claim 2, wherein: the temperature of the weak alkaline copper salt electrolyte is 50-80 ℃, and the pH value is 7.0-9.0.
7. The method of claim 2, wherein: the material of the base material comprises copper and/or copper alloy.
8. The method of claim 2, wherein: the shape of the base material includes a sheet shape or a curved surface shape.
9. The method of claim 2, wherein: the counter electrode comprises a metal or semiconductor material, preferably a platinum sheet or graphite; and/or, the electrochemical working system further comprises a reference electrode, and the reference electrode comprises a silver/silver chloride electrode.
10. A high efficiency boiling heat transfer copper material produced by the process of any one of claims 2 to 9; preferably, the distribution density of the copper nanocones is 1.0 × 105～1.0×107Per mm2(ii) a Preferably, the size of the porous micro-cavity structure is 1-12 μm.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782452A (en) * | 2021-08-30 | 2021-12-10 | 北京航空航天大学 | Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface |
| CN114351198A (en) * | 2022-01-13 | 2022-04-15 | 常州大学 | Preparation method of extensible nickel-containing carbon nanotube-copper composite film |
| CN115354368A (en) * | 2022-07-07 | 2022-11-18 | 广东工业大学 | Fractional distribution microstructure and preparation method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860938A (en) * | 2016-03-28 | 2016-08-17 | 上海交通大学 | Graphite film with strengthened critical heat flux and preparation method therefor |
| CN106400067A (en) * | 2016-09-18 | 2017-02-15 | 中山大学 | Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof |
| CN107552804A (en) * | 2017-09-05 | 2018-01-09 | 北京科技大学 | A kind of method of preparation and use of the alloy powder of slug type high-flux heat exchange |
| CN109023459A (en) * | 2018-08-04 | 2018-12-18 | 中山大学 | A kind of multiple dimensioned surface texture and preparation method thereof for strengthening boiling of bilayer |
| CN110158127A (en) * | 2019-05-15 | 2019-08-23 | 重庆大学 | A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies |
| CN110408977A (en) * | 2019-06-20 | 2019-11-05 | 吴赞 | The multiple dimensioned reinforcing boiling function surface of one kind and composite preparation process |
-
2019
- 2019-07-03 CN CN201910594411.0A patent/CN112176369A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860938A (en) * | 2016-03-28 | 2016-08-17 | 上海交通大学 | Graphite film with strengthened critical heat flux and preparation method therefor |
| CN106400067A (en) * | 2016-09-18 | 2017-02-15 | 中山大学 | Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof |
| CN107552804A (en) * | 2017-09-05 | 2018-01-09 | 北京科技大学 | A kind of method of preparation and use of the alloy powder of slug type high-flux heat exchange |
| CN109023459A (en) * | 2018-08-04 | 2018-12-18 | 中山大学 | A kind of multiple dimensioned surface texture and preparation method thereof for strengthening boiling of bilayer |
| CN110158127A (en) * | 2019-05-15 | 2019-08-23 | 重庆大学 | A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies |
| CN110408977A (en) * | 2019-06-20 | 2019-11-05 | 吴赞 | The multiple dimensioned reinforcing boiling function surface of one kind and composite preparation process |
Non-Patent Citations (2)
| Title |
|---|
| BO SHI等: ""Pool boiling heat transfer enhancement with copper nanowire arrays"", 《APPLIED THERMAL ENGINEERING》 * |
| HONG LI等: ""In Situ Growth of Densely Packed Single-Crystal Copper Nanocone Structure Films with Condensate Microdrop Self-Removal Function on Copper Surfaces"", 《ADV.MATER.INTERFACES》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782452A (en) * | 2021-08-30 | 2021-12-10 | 北京航空航天大学 | Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface |
| CN113782452B (en) * | 2021-08-30 | 2024-05-10 | 北京航空航天大学 | Micro-channel structure design and preparation method for efficient enhanced boiling heat transfer surface |
| CN114351198A (en) * | 2022-01-13 | 2022-04-15 | 常州大学 | Preparation method of extensible nickel-containing carbon nanotube-copper composite film |
| CN115354368A (en) * | 2022-07-07 | 2022-11-18 | 广东工业大学 | Fractional distribution microstructure and preparation method and application thereof |
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