CN204362489U - Heat radiator of electronic element - Google Patents
Heat radiator of electronic element Download PDFInfo
- Publication number
- CN204362489U CN204362489U CN201420863388.3U CN201420863388U CN204362489U CN 204362489 U CN204362489 U CN 204362489U CN 201420863388 U CN201420863388 U CN 201420863388U CN 204362489 U CN204362489 U CN 204362489U
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- Prior art keywords
- heat
- thermal conductive
- conducting part
- conducting
- electronic element
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Abstract
The utility model discloses a kind of heat radiator of electronic element.Heat radiator of electronic element of the present utility model comprises fin; Described fin comprises thermal conductive zone, the first radiating part and the second radiating part; Also comprise thermal conductive network; Described thermal conductive network is arranged between described fin and the thermal source of electronic component; Described thermal conductive network comprises the first heat-conducting part and the second heat-conducting part; Described first heat-conducting part, thermal conductive zone are corresponding with the thermal source of electronic component or fit respectively; Described second heat-conducting part is corresponding with described first radiating part; First heat-conducting part of described thermal conductive network and the second heat-conducting part fit with described thermal conductive zone and the first radiating part respectively.Heat radiator of electronic element of the present utility model, can reach the effect of quick heat radiating, and the temperature difference in the region of stow away from heat on fin near heating sources and fin is kept within the specific limits.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to a kind of rapid heat radiation device being applied to electronic component.
Background technology
Along with height is integrated and the fast development of high performance electronics, electronic devices and components volume is more and more less, speed and the efficiency requirements of work are more and more higher, accordingly, the caloric value of electronic devices and components is also increasing, metal species heat conduction and heat radiation assembly known has at present been subjected to the restriction of its material and self heat conduction and heat radiation limit, and the heat conduction and heat radiation material of advanced heat conduction and heat radiation technique and excellent performance must be adopted effectively to take away heat, ensures that electronic product effectively works.
In equal backing or fin technology, for accelerating heat-conducting effect, high-thermal conductive metal material is adopted to make.Current fin is many by aluminium alloy, and brass or bronze make sheet material, sheet, splintery etc.Although reach the effect of quick heat radiating, have in electronic devices and components or comparatively significantly hot spot region can be there is.There is this larger temperature difference in heat source position and stow away from heat position, affects radiating effect.Because the heat of near heating sources can not leave fast, have impact on the useful life of heater element, even affect the whole service life of electronic product.
Need novel heat radiator of electronic element badly to solve the problem.
Utility model content
The utility model proposes to solve above-mentioned each problem, and it is faster that object is to provide a kind of heat radiation, the more uniform heat radiator of electronic element of heat radiation.
Another object of the present utility model is that providing a kind of can keep heat source region and the heat radiator of electronic element of stow away from heat space temperature variation within 3 degree.
To achieve these goals, heat radiator of electronic element of the present utility model, comprises fin; Described fin comprises thermal conductive zone, the first radiating part and the second radiating part; Comprise thermal conductive network; Described thermal conductive network is arranged between described fin and the thermal source of electronic component; Described thermal conductive network comprises the first heat-conducting part and the second heat-conducting part; Described first heat-conducting part, thermal conductive zone are corresponding with the thermal source of electronic component or fit respectively; Described second heat-conducting part is corresponding with described first radiating part; First heat-conducting part of described thermal conductive network and the second heat-conducting part fit with described thermal conductive zone and the first radiating part respectively.
Preferably, described first radiating part is connected with the centre position of described thermal conductive zone, and described first radiating part extends to the periphery along the centre position of described thermal conductive zone; Described second heat-conducting part is connected with the centre position of described first heat-conducting part, and described second heat-conducting part extends to the periphery along the centre position of described first heat-conducting part.
Preferably, described first radiating part, described thermal conductive zone, the second heat-conducting part and the first heat-conducting part are square, and described first radiating part and described thermal conductive zone form T-shaped; Described thermal conductive zone and described second heat-conducting part form T-shaped.
Preferably, described first radiating part and described second heat-conducting part are eccentric circular ring.
Preferably, the utility model also comprises a plurality of first heat-conducting part, and one end of described a plurality of first heat-conducting part is connected with described second heat-conducting part, and the other end fits with the thermal source of electronic component or corresponding.
Preferably, described fin is metallic film or sheet metal; The surface-coated thermal dispersant coatings of described second radiating part.
Preferably, described thermal conductive network is provided with the mesh of radius between 0.05MM ~ 5MM.
Preferably, described thermal conductive network comprises the Network substrates that macromolecular material or PE or PET or PC are made, and the surface of described Network substrates is provided with heat conducting coating.
Preferably, described heat conducting coating is nano coating; Preferably, described heat conducting coating is nano metal powder coating
Preferably, described heat conducting coating is nano-sized carbon copper powders coating.
The beneficial effect of the heat radiator of electronic element that the utility model provides is: owing to being provided with thermal conductive network between fin and thermal source, and the heat of thermal source can be made to be transmitted to other regions on fin at faster speed.Radiating effect faster can be reached on the one hand, make uniform heat distribution on the other hand, reduce the temperature difference of heat source region and neighboring area.In addition, because thermal conductive network is netted, adopt the structure of polymer base material surface-coated heat conducting coating, there is heat-conducting effect faster, lower cost, and the weight reducing heat radiator of electronic element entirety.
Accompanying drawing explanation
Fig. 1 shows the structural representation of the embodiment of heat radiator of electronic element of the present utility model.
Fig. 2 shows the cross section structure schematic diagram of heat radiator of electronic element of the present utility model.
Fig. 3 shows the structural representation of the fin of heat radiator of electronic element of the present utility model.
Fig. 4 shows the structural representation of the thermal conductive network of heat radiator of electronic element of the present utility model.
Fig. 5 shows another structural representation of the thermal conductive network of heat radiator of electronic element of the present utility model.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Before the technical scheme describing various embodiments of the present invention in detail, involved noun and term are explained.It should be noted that in this manual, the parts that title is identical or label is identical represent similar or identical structure, and are only limitted to the object of signal.
Fig. 1 and Fig. 2 shows the structural representation of the embodiment of heat radiator of electronic element of the present utility model.As depicted in figs. 1 and 2, heat radiator of electronic element of the present utility model comprises fin 100; Described fin 100 comprises thermal conductive zone 101, first radiating part 102 and the second radiating part 103; Also comprise thermal conductive network 200 further.It should be noted that, described thermal conductive network 200 forms mesh on base material.Generally speaking, base material can select macromolecular material, plastic material, PE(polyvinyl resin, Poly ethylene) or PET(pet inside have PETG to be topmost kind in thermoplastic polyester, English by name Polyethylene terephthalate is called for short PET or PEIT (following or be called PET), is commonly called as polyester resin.It is the condensation polymer of terephthalic acid (TPA) and ethylene glycol, thermoplastic polyester is referred to as together with PBT, or saturated polyester) or PC material (Merlon, Polycarbonate is called for short PC) etc., base material forms mesh, and described mesh can be square, circular, triangle, the geometries such as polygon.In order to better thermal conduction effect and reduction manufacturing cost, preferably, radius can be selected at the circular hole of 0.05MM to 5MM.Certainly, also according to the size of the size of electronic product and fin, the thermal conductive network of greater or lesser size can be adopted.
As shown in Figure 2, described thermal conductive network 200 is arranged between described fin 100 and the thermal source 500 of electronic component; Described thermal conductive network 200 comprises the first heat-conducting part 201 and the second heat-conducting part 202; Described first heat-conducting part 201, thermal conductive zone 101 are corresponding with the thermal source 500 of electronic component or fit respectively; Described second heat-conducting part 202 is corresponding with described first radiating part 102; First heat-conducting part 201 of described thermal conductive network 200 and the second heat-conducting part 202 fit with described thermal conductive zone 101 and the first radiating part 102 respectively; It should be noted that, the first heat-conducting part 201 of described thermal conductive network 200 and the second heat-conducting part 202 can be fitted with described thermal conductive zone 101 and the first radiating part 102 respectively by heat-conducting glue 300
In addition, described first radiating part 102 of fin of the present utility model is connected with the centre position of described thermal conductive zone 101, and described first radiating part 102 extends to the periphery along the centre position of described thermal conductive zone 101; Second heat-conducting part 202 of described thermal conductive network 200 is connected with the centre position of described first heat-conducting part 201, and described second heat-conducting part 202 extends to the periphery along the centre position of described first heat-conducting part 201.
It should be noted that, the described fin 100 mentioned in the utility model comprises thermal conductive zone 101, first radiating part 102 and the second radiating part 103 and described thermal conductive network 200 and comprises the first heat-conducting part 201 and the second heat-conducting part 202 just for convenience of description, in fact, described thermal conductive zone 101, first radiating part 102 and the second radiating part 103 can be integrated fin.The utility model is just in order to the convenience illustrated carries out artificial definition or division according to the function of different parts; Certainly, described thermal conductive zone 101, first radiating part 102 and the second radiating part 103 also can be separate heat transfer devices, are fitted together by the mode engaging or bond.Described thermal conductive network 200 also can be the structure of one-body molded formation on the whole.Certainly, also can be separate heat transfer device, be fitted together by the mode engaging or bond.
Adopt heat radiator of electronic element of the present utility model, the heat of thermal source can be made to be transmitted to the region of stow away from heat on fin fast and to dispel the heat.Owing to have employed thermal conductive network 200, heat rapid diffusion can be made, thus obtain better radiating effect.The more important thing is, because heat can rapid diffusion being dispelled the heat by fin, the temperature difference in the region of heat source region and stow away from heat can be made to remain within 3 degrees Celsius.This ensure that the radiating effect of electronic product and the whole service life of electronic device.
In addition, the second heat-conducting part 202 and first heat-conducting part 201 of the first radiating part 102 of fin of the present utility model, described thermal conductive zone 101, described thermal conductive network 200 are square, and described first radiating part 102 forms T-shaped with described thermal conductive zone 101; Described first heat-conducting part 201 forms T-shaped with described second heat-conducting part 202.In addition, as shown in Figure 4, described first radiating part 102 of the present utility model is eccentric circular ring with described second heat-conducting part 202.It should be noted that, as shown in Figure 5, thermal conductive network 200 of the present utility model can further include a plurality of first heat-conducting part 201, and one end of described a plurality of first heat-conducting part 201 is connected with described second heat-conducting part 202, and the other end fits with the thermal source 500 of electronic component or corresponding.It should be noted that, one end of described described a plurality of first heat-conducting parts 201 is connected with described second heat-conducting part 202, refer to the mode bonded by heat-conducting glue, or also can be that described first heat-conducting part 201 forms integrated structure with described second heat-conducting part 202.
As shown in Figure 3, the described fin 100 of heat radiator of electronic element of the present utility model fits together for multiple layer metal film or sheet metal; The surface-coated thermal dispersant coatings 400 of described second radiating part 103.After being coated with thermal dispersant coatings 400, better radiating effect can be obtained.
As shown in Figure 1, Figure 4 and Figure 5, described thermal conductive network 200 of the present utility model is provided with the mesh of radius between 0.05MM ~ 5MM.Described thermal conductive network 200 of the present utility model can also comprise the Network substrates that macromolecular material or PE or PET or PC are made, and the surface of described Network substrates is provided with heat conducting coating.Described heat conducting coating is nano coating.Preferably, described hot coating is nano metal powder coating.Preferably, described heat conducting coating is nano-sized carbon copper powders coating.The excellent thermal conducting function of nano-sized carbon copper powder coating can be utilized to carry out quick conductive.
The beneficial effect of the heat radiator of electronic element that the utility model provides is: owing to being provided with thermal conductive network between fin and thermal source, and the heat of thermal source can be made to be transmitted to other regions on fin at faster speed.Radiating effect faster can be reached on the one hand, make uniform heat distribution on the other hand, reduce the temperature difference of heat source region and neighboring area.In addition, because thermal conductive network is netted, adopt the structure of polymer base material surface-coated heat conducting coating, there is heat-conducting effect faster, lower cost, and the weight reducing heat radiator of electronic element entirety.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; and be not used in restriction protection range of the present utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. a heat radiator of electronic element, comprises fin (100); Described fin (100) comprises thermal conductive zone (101), the first radiating part (102) and the second radiating part (103); It is characterized in that, comprise thermal conductive network (200); Described thermal conductive network is arranged between the thermal source (500) of described fin (100) and electronic component; Described thermal conductive network comprises the first heat-conducting part (201) and the second heat-conducting part (202); Described first heat-conducting part (201), thermal conductive zone (101) are corresponding with the thermal source (500) of electronic component or fit respectively; Described second heat-conducting part (202) is corresponding with described first radiating part (102); First heat-conducting part (201) of described thermal conductive network (200) and the second heat-conducting part (202) fit with described thermal conductive zone (101) and the first radiating part (102) respectively.
2. heat radiator of electronic element according to claim 1, it is characterized in that, described first radiating part (102) is connected with the centre position of described thermal conductive zone (101), and described first radiating part (102) extends to the periphery along the centre position of described thermal conductive zone (101); Described second heat-conducting part (202) is connected with the centre position of described first heat-conducting part (201), and described second heat-conducting part (202) extends to the periphery along the centre position of described first heat-conducting part (201).
3. heat radiator of electronic element according to claim 2, it is characterized in that, described first radiating part (102), described thermal conductive zone (101), the second heat-conducting part (202) are square with the first heat-conducting part (201), and described first radiating part (102) and described thermal conductive zone (101) form T-shaped; Described first heat-conducting part (201) and described second heat-conducting part (202) form T-shaped.
4. heat radiator of electronic element according to claim 2, is characterized in that, described first radiating part (102) and described second heat-conducting part (202) are eccentric circular ring.
5. heat radiator of electronic element according to claim 4, it is characterized in that, comprise a plurality of first heat-conducting part (201), one end of described a plurality of first heat-conducting part (201) is connected with described second heat-conducting part (202), and the other end fits with the thermal source (500) of electronic component or corresponding.
6. the heat radiator of electronic element according to any one of Claims 1 to 4 claim, is characterized in that, described fin (100) is metallic film or sheet metal; The surface-coated thermal dispersant coatings (400) of described second radiating part (103).
7. the heat radiator of electronic element according to any one of Claims 1 to 4 claim, is characterized in that, described thermal conductive network (200) is provided with the mesh of radius between 0.05MM ~ 5MM.
8. the heat radiator of electronic element according to any one of Claims 1 to 4 claim, it is characterized in that, described thermal conductive network (200) comprises the Network substrates that macromolecular material or PE or PET or PC are made, and the surface of described Network substrates is provided with heat conducting coating.
9. the heat radiator of electronic element according to any one of Claims 1 to 4 claim, is characterized in that, described heat conducting coating is nano coating.
10. the heat radiator of electronic element according to any one of Claims 1 to 4 claim, is characterized in that, described heat conducting coating is nano-sized carbon copper powders coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420863388.3U CN204362489U (en) | 2014-12-31 | 2014-12-31 | Heat radiator of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420863388.3U CN204362489U (en) | 2014-12-31 | 2014-12-31 | Heat radiator of electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204362489U true CN204362489U (en) | 2015-05-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420863388.3U Expired - Fee Related CN204362489U (en) | 2014-12-31 | 2014-12-31 | Heat radiator of electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204362489U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304759A (en) * | 2015-05-29 | 2017-01-04 | 旭景光电股份有限公司 | Ultra-thin equal backing |
| CN106793716A (en) * | 2017-02-28 | 2017-05-31 | 北京奇虎科技有限公司 | The heat abstractor and robot of robot control mainboard |
-
2014
- 2014-12-31 CN CN201420863388.3U patent/CN204362489U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304759A (en) * | 2015-05-29 | 2017-01-04 | 旭景光电股份有限公司 | Ultra-thin equal backing |
| CN106304759B (en) * | 2015-05-29 | 2018-12-11 | 旭景光电股份有限公司 | Ultra-thin equal backing |
| CN106793716A (en) * | 2017-02-28 | 2017-05-31 | 北京奇虎科技有限公司 | The heat abstractor and robot of robot control mainboard |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20211231 |