CN220931823U - Uniform temperature plate - Google Patents

Abstract

The application provides a temperature equalization plate, wherein a first cover body adopts a first composite material structure, a second cover body adopts a copper layer or a second composite material structure, the first composite material structure and the second composite material structure are formed by compounding a copper composite layer and a stainless steel composite layer/titanium alloy composite layer, and the application of the composite materials can effectively improve the whole tensile yield strength of the temperature equalization plate, so that the temperature equalization plate is not easy to deform in a high-temperature environment and has high reliability.

Description

Uniform temperature plate

Technical Field

The application relates to the technical field of heat dissipation, in particular to a temperature equalizing plate.

Background

The temperature equalizing plate is a liquid working medium which passes through the bottom of the vacuum cavity and is evaporated and diffused into the vacuum cavity after absorbing external heat, the heat is conducted onto the heat radiating device, the gaseous working medium is condensed into liquid state later, the bottom of the vacuum cavity is returned through a capillary structure in the vacuum cavity, the evaporation and condensation processes are realized to be rapidly circulated in the vacuum cavity, and the effect of high-efficiency heat radiation is achieved.

The structure of the temperature equalizing plate generally comprises a vacuum sealing container, an internal capillary structure and an internal phase change working medium, wherein the vacuum sealing container is formed by a shape shell. Most of the existing temperature equalization plates adopt a copper substrate, a stainless steel substrate or an aluminum substrate as a shell material of a cavity, capillary structures are formed by internal sintering of silk screen powder, etching machining and other modes, and phase change working media generally adopt pure water, ethanol, acetone, refrigerant, heat conducting polymers, naphthalene and the like applied at medium and high temperatures. The copper substrate is typically welded to form a vacuum seal by a diffusion welding process, and the stainless steel substrate and the aluminum substrate are typically brazed to form a vacuum seal. In terms of materials, the tensile strength, yield strength and hardness of the materials of the copper substrate and the aluminum substrate are low, but the welding process is relatively simple and reliable, and the stainless steel has better tensile yield strength, but the brazing process is complex, the cost is high and the reliability is poor.

In some electronic heat dissipation fields, heat dissipation application and process manufacturing at a high temperature of 150-350 ℃ are required, the air pressure in a cavity generated by a conventional copper substrate temperature equalizing plate in such a high-temperature environment is larger than the bending resistance and tensile yield strength of a shell with a general design thickness, and the expansion plate phenomenon generally begins to occur above the application environment of 150 ℃. The aluminum substrate temperature-equalizing plate has similar problems, and the internal working medium adopted by the aluminum substrate temperature-equalizing plate is working medium such as refrigerant acetone, and the like, so that the pressure in a formed cavity is higher than that of pure water, and the temperature of an invar plate borne by a shell is lower. The temperature equalizing plate made of stainless steel and the like has the problems of complex brazing process, poor reliability and the like.

Therefore, how to effectively solve the problem that the existing temperature equalization plate is easy to generate expansion plate has become a technical problem to be solved in the field.

Disclosure of Invention

In view of the above, the application provides a temperature equalizing plate, which aims to effectively solve the problems that the existing temperature equalizing plate is easy to deform and has poor reliability in a high-temperature environment.

The application provides a temperature equalization plate which comprises a first cover body and a second cover body, wherein the first cover body is connected with the second cover body to form a sealed and vacuum cavity, a phase-change fluid working medium is filled in the cavity, the second cover body is provided with a contact surface contacted with an external heat source, the first cover body is of a first composite material structure, the second cover body is of a copper layer or a second composite material structure, and the first composite material structure and the second composite material structure are formed by compositing a copper composite layer and a stainless steel composite layer/titanium alloy composite layer.

In an embodiment, the first composite structure includes a first copper composite layer and a first stainless steel composite layer/first titanium alloy composite layer, the first copper composite layer being located on a side of the first stainless steel composite layer/first titanium alloy composite layer adjacent to the second cover; the second cover body is a copper layer or a second composite material structure, the second composite material structure comprises a second copper composite layer and a second stainless steel composite layer/a second titanium alloy composite layer, and the second copper composite layer is positioned on one side of the second stainless steel composite layer/the second titanium alloy composite layer, which is close to the first cover body.

In an embodiment, the first composite structure further comprises a third copper composite layer, the third copper composite layer being located on a side of the first stainless steel composite layer/the first titanium alloy composite layer remote from the second cover.

In an embodiment, the thickness of the first copper composite layer is 0.1 mm-1 mm, the thickness of the third copper composite layer is 0.05 mm-0.2 mm, the thickness of the first stainless steel composite layer/the first titanium alloy composite layer is 0.1 mm-2 mm, and the thickness of the first stainless steel composite layer/the first titanium alloy composite layer is greater than or equal to the thickness of the first copper composite layer.

In one embodiment, the third copper composite layer is connected with a heat dissipation fin.

In one embodiment, the thickness of the temperature equalizing plate is 1 mm-10 mm, and the applicable temperature is 60-350 ℃.

In an embodiment, the first cover body includes a central portion and a first connection portion connected to a periphery of the central portion, the second cover body includes a lower recess and a second connection portion extending outward from an upper edge of the lower recess, the first connection portion is connected to the second connection portion, and the cavity is formed by surrounding between the central portion and the lower recess.

In an embodiment, the first connection portion and the second connection portion are welded and connected by diffusion welding, resistance welding, laser welding, argon arc welding or high-frequency welding.

In an embodiment, a groove is formed in one side of the second cover body, a degassing pipe is arranged in the groove, and the degassing pipe is communicated with the cavity and the outside of the temperature equalizing plate; and/or the inner wall of the cavity is provided with a capillary structure, and the capillary structure is formed by sintering copper powder or a copper mesh on the inner wall of the cavity.

In one embodiment, a plurality of supporting structures are arranged in the cavity at intervals, and the supporting structures are connected between the inner surface of the central part and the bottom surface of the concave part; the supporting structure is made of copper, and is connected to the inner wall of the cavity in a diffusion welding, resistance welding or brazing mode.

In summary, the application provides the temperature equalization plate, the first cover body adopts the first composite material structure, the second cover body adopts the copper layer or the second composite material structure, the first composite material structure and the second composite material structure are both formed by compounding the copper composite layer and the stainless steel composite layer/titanium alloy composite layer, and the application of the composite materials can effectively improve the whole tensile yield strength of the temperature equalization plate, so that the temperature equalization plate is not easy to deform in a high-temperature environment, and has high reliability. The temperature-equalizing plate can avoid high-temperature assembly, can not deform and lose efficacy when being applied in a high-temperature environment, and has the advantages of reduced material cost and more stable performance.

Drawings

Fig. 1 is a schematic perspective view of a temperature uniformity plate according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of the cryopanel of fig. 1 taken along a direction.

Fig. 3 is an enlarged schematic view of the portion a in fig. 2.

Fig. 4 is an exploded view of the isopipe of fig. 1.

Fig. 5 is an exploded view of a temperature uniformity plate according to another embodiment of the present application.

Fig. 6 is a partial structural sectional view of the temperature equalization plate in fig. 5.

Fig. 7 is an exploded view of a temperature uniformity plate according to another embodiment of the present application.

Fig. 8 is a partial structural sectional view of the temperature uniformity plate in fig. 7.

Detailed Description

Before the embodiments are explained in detail, it is to be understood that the application is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of the terms "comprising," "including," "having," and the like are intended to encompass the items listed thereafter and equivalents thereof as well as additional items. In particular, when "a certain element" is described, the present application is not limited to the number of the element as one, but may include a plurality of the elements.

Referring to fig. 1 to 3, the present application provides a temperature equalizing plate 10, which can be applied to electronic heat dissipation products such as servers and computers. The temperature-equalizing plate 10 can be applied to a high-temperature environment of 60-350 ℃, and the bending resistance and the tensile resistance of the temperature-equalizing plate 10 are improved mainly through adopting a composite material structure on the shell of the temperature-equalizing plate 10, so that the temperature-equalizing plate can resist saturated vapor pressure formed by fluid working media of a high-temperature internal vacuum cavity and prevent the temperature-equalizing plate 10 from losing efficacy due to deformation and expansion of the plate.

In the application, the temperature equalization plate 10 comprises a first cover body 12 and a second cover body 14, wherein the first cover body 12 and the second cover body 14 are connected to form a sealed and vacuum cavity 16, the cavity 16 is filled with a phase-change fluid working medium, the phase-change fluid working medium can be pure water, ethanol, acetone, a refrigerant, heat conducting polymers, naphthalene and the like applied at medium and high temperature, and the phase-change fluid working medium is pure water. The second cover 14 is provided with a contact surface 15 contacted with an external heat source, the first cover 12 is of a first composite material structure, the second cover 14 is of a copper layer or a second composite material structure, and the application of the composite material can effectively improve the whole tensile yield strength of the temperature equalization plate 10, so that the temperature equalization plate is not easy to deform in a high-temperature environment. The first composite material structure and the second composite material structure are formed by compounding a copper composite layer and a stainless steel composite layer/titanium alloy composite layer, and the welding layers connected with the first cover body 12 and the second cover body 14 are made of copper materials, so that the first cover body 12 and the second cover body 14 can be welded and connected in the conventional manners of diffusion welding, resistance welding, laser welding, high-frequency welding and the like, and brazing with complex process is not needed, and the welding device is high in reliability and low in cost.

The composite material may be composed of a multi-layer composite, for example, a two-layer or three-layer composite, as described in the following in specific examples. In the following examples, the stainless steel composite layer/titanium alloy composite layer in the composite material is described by way of example as a stainless steel composite layer, and in other examples, the composite material may be a titanium alloy composite layer.

In the embodiment shown in fig. 1-4, the first composite structure includes a first copper composite layer 18 and a first stainless steel composite layer 20, the first copper composite layer 18 being located on a side of the first stainless steel composite layer 20 adjacent to the second cover 14. The second cover 14 is a second composite structure that includes a second copper composite layer 22 and a second stainless steel composite layer 24, the second copper composite layer 22 being located on a side of the second stainless steel composite layer 24 that is adjacent to the first cover 12. From another perspective, the two copper composite layers are located on the inner side so that the two copper composite layers can be welded by a conventional welding manner other than brazing, and the connection reliability of the first cover body 12 and the second cover body 14 is ensured. The two layers of stainless steel composite layers are positioned on the outer side, so that the overall structural strength of the temperature equalization plate 10 can be enhanced, and the bending resistance and the tensile strength of the temperature equalization plate 10 are improved.

In the embodiment shown in fig. 5 and 6, the first composite structure further comprises a third copper composite layer 26 on the basis of the embodiment shown in fig. 1 to 4, the third copper composite layer 26 being connected to the side of the first stainless steel composite layer 20 remote from the second cover 14. In some embodiments, the third copper composite layer 26 may be connected with a heat dissipation fin, and the heat dissipation fin may be made of copper, so that the heat dissipation fin may be directly welded on the third copper composite layer 26, and the welding of the same material is more stable; the heat radiation fins can also be made of aluminum materials without special treatment so as to overcome the defect that stainless steel materials need brazing with complex process.

In this embodiment, the thickness of the first copper composite layer 18 is 0.1 mm-1 mm, the thickness of the third copper composite layer 26 is 0.05 mm-0.2 mm, the thickness of the first stainless steel composite layer 20 is 0.1 mm-2 mm, and the thickness of the first stainless steel composite layer 20 is greater than or equal to the thickness of the first copper composite layer 18, so as to ensure that the temperature-equalizing plate 10 has better structural strength.

In the illustrated embodiment, the thickness of the temperature equalization plate 10 is set to be 1 mm-10 mm, and is within the thickness range of the conventional temperature equalization plate, so that the deformation resistance is not enhanced by increasing the thickness of the temperature equalization plate 10 in the high-temperature environment with the temperature of 60-350 ℃, and conversely, the thickness of the temperature equalization plate 10 is thinner than that of the conventional temperature equalization plate, so that the problems of integral deformation, expansion and the like of the temperature equalization plate 10 in the high-temperature environment are finally avoided, the application of the temperature equalization plate 10 is prevented from being limited due to the thickness problem, and conversely, the temperature equalization plate 10 has application advantages because the thickness is thinner than that of the conventional temperature equalization plate Wen Banhou.

In the embodiment shown in fig. 7 and 8, the first composite structure includes a first copper composite layer 28 and a first stainless steel composite layer 30, the first copper composite layer 28 being connected to a side of the first stainless steel composite layer 30 adjacent to the second cover 14, the second cover 14 being a copper layer 32. The second cover 14 is made of pure copper, and is superior to the composite material in terms of heat conduction capacity, so that the heat conduction efficiency is better.

In this embodiment, the heating surface of the temperature equalization plate 10 is made of pure copper, and the heat dissipation surface is made of a two-layer composite structure, in other embodiments, the heat dissipation surface can be made of a three-layer composite structure, so that the heat absorption and heat conductivity of the heating surface are enhanced under certain bending resistance and tensile strength, and the welding heat dissipation material of the heat dissipation surface is more widely selected due to the design of the three-layer composite structure (the outermost layer is made of copper).

The composite material structure of the application is that metal stainless steel (the tensile strength is 515 Mpa-1035 Mpa), titanium alloy (the tensile strength is 686 Mpa-1176 Mpa) and the like with stronger tensile strength are compounded with pure copper (the tensile strength is 150 Mpa-300 Mpa), and the tensile strength of the temperature equalizing plate can be greatly improved. The vacuum temperature equalizing plate formed by the composite material structure can ensure that the internal steam cavity is not subjected to space compression under the condition of not increasing the plate thickness, and the capillary structure in the cavity is not greatly influenced, so that the phase-change fluid working medium can smoothly and efficiently form the cyclic heat transfer and the heat diffusion of evaporation and condensation. Meanwhile, the inner cavity is guaranteed to work with pure water working medium with high latent heat, and the high saturated vapor pressure formed by the inner liquid working medium can not cause deformation and bulge of the shell of the temperature equalization plate under the high-temperature use environment. The composite material structure of the application not only ensures deformation and bulge resistance, but also can reduce the material cost, so that the product has more competitive power.

Referring to fig. 2, 4, 5 and 7, the first cover 12 is generally flat and includes a central portion 34 and a first connecting portion 36 connected to a periphery of the central portion 34, and the central portion 34 and the first connecting portion 36 are, for example, integrally formed. The second cover 14 includes a lower recess 38 and a second connecting portion 40 extending outward from an upper edge of the lower recess 38, the second connecting portion 40 is perpendicular to a sidewall of the lower recess 38, the lower recess 38 and the second connecting portion 40 are integrally formed, the central portion 34 and the lower recess 38 enclose a cavity 16, and the contact surface 15 is disposed on an outer surface of a bottom central portion of the lower recess 38. The first connecting portion 36 is connected to the second connecting portion 40, and the first connecting portion 36 and the second connecting portion 40 are welded and connected by a conventional welding method other than non-brazing, such as diffusion welding, resistance welding, laser welding, argon arc welding, high-frequency welding, and the like, with good reliability.

In the illustrated embodiment, a groove 42 is formed on one side of the second cover 14, a degassing pipe 44 is formed in the groove 42, the degassing pipe 44 communicates the cavity 16 with the outside of the temperature equalization plate 10, so that the cavity 16 is vacuumized and filled with the phase-change fluid working medium, and after the completion, the degassing pipe 44 is closed, so that the cavity 16 is in a vacuum sealing state.

In the present application, the inner wall layer of the cavity 16 of the temperature equalizing plate 10 is a copper layer, so that the capillary structure 46 and the supporting structure 52 are conveniently arranged in a conventional welding manner, so as to ensure reliability. More specifically, the inner wall of the cavity 16 is provided with a capillary structure 46, and the capillary structure 46 is formed on the inner wall of the cavity 16 by, for example, copper powder or copper mesh sintering. In the illustrated embodiment, the capillary structure 46 includes a first portion 48 and a second portion 50, the first portion 48 being attached to an inner wall of the central portion 34 and the second portion 50 being attached to an inner wall of the lower recess 38, wherein the inner wall of the lower recess 38 includes a side wall and a bottom wall.

The cavity 16 is further provided with a plurality of supporting structures 52 distributed at intervals, the supporting structures 52 are connected between the inner surface of the central portion 34 and the bottom surface of the concave portion 38, the supporting structures 52 can be cylindrical, square or the like, and the supporting structures 52 are used for enhancing the structural strength of the temperature equalization plate 10, so that the compression resistance, the tensile resistance and the deformation resistance of the temperature equalization plate are enhanced. In this embodiment, the supporting structure 52 is made of copper material, which can improve the heat conduction performance. The support structure 52 may be attached to the inner wall of the cavity 16 by diffusion welding, resistance welding or brazing.

The application has at least the following advantages by adopting a composite structure formed by stainless steel or titanium alloy and copper as the housing of the temperature equalization plate:

1. The bending strength and the tensile strength of the temperature equalizing plate can be improved, so that the temperature equalizing plate is not deformed and does not bulge, and the tensile and bending resistance of the temperature equalizing plate is far greater than that of pure copper materials particularly in high-temperature application and assembly welding.

2. The stainless steel or titanium alloy is adopted as the composite layer to replace part of pure copper material, so that the material cost can be effectively reduced.

3. The composite material structure is used as the shell of the temperature equalization plate, the inner wall of the cavity of the temperature equalization plate adopts a copper layer as a welding layer, and the welding and capillary structure sintering can be carried out at 600-900 ℃, thereby solving the defects that the welding process is complex, the reliability of welded products is poor, the capillary structure in the cavity is difficult to manufacture and the like when the temperature equalization plate is manufactured by traditional pure stainless steel and titanium alloy at high temperature of more than 1000 ℃.

In summary, the application provides the temperature equalization plate, the first cover body adopts the first composite material structure, the second cover body adopts the copper layer or the second composite material structure, the first composite material structure and the second composite material structure are both formed by compounding the copper composite layer and the stainless steel composite layer/titanium alloy composite layer, the application of the composite material can effectively improve the whole tensile yield strength of the temperature equalization plate, so that the temperature equalization plate is not easy to deform in a high-temperature environment, and the welding layers connected with the first cover body and the second cover body are all made of copper materials and can be welded and connected in the conventional manners of diffusion welding, resistance welding, laser welding, high-frequency welding and the like, and the brazing with relatively complex process is not needed, so that the reliability is high and the cost is low. The temperature-equalizing plate can avoid high-temperature assembly, can not deform and lose efficacy when being applied in a high-temperature environment, and has the advantages of reduced material cost and more stable performance.

The concepts described herein may be embodied in other forms without departing from the spirit or characteristics thereof. The particular embodiments disclosed are illustrative and not restrictive. The scope of the application is, therefore, indicated by the appended claims rather than by the foregoing description. Any changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (10)

1. The utility model provides a samming board, its characterized in that includes first lid and second lid, first lid with the second lid is connected and is formed sealed and vacuum cavity, the cavity intussuseption is filled with phase change fluid working medium, the second lid is equipped with the contact surface with outside heat source contact, first lid is first combined material structure, the second lid is copper layer or second combined material structure, first combined material structure with the second combined material structure is by copper combined layer and stainless steel combined layer/titanium alloy combined layer complex constitution.

2. The isopipe of claim 1 wherein the first composite structure comprises a first copper composite layer and a first stainless steel composite layer/first titanium alloy composite layer, the first copper composite layer being located on a side of the first stainless steel composite layer/first titanium alloy composite layer adjacent to the second cover; the second cover body is a copper layer or a second composite material structure, the second composite material structure comprises a second copper composite layer and a second stainless steel composite layer/a second titanium alloy composite layer, and the second copper composite layer is positioned on one side of the second stainless steel composite layer/the second titanium alloy composite layer, which is close to the first cover body.

3. The isopipe of claim 2 wherein the first composite structure further comprises a third copper composite layer, the third copper composite layer being located on a side of the first stainless steel composite layer/the first titanium alloy composite layer remote from the second cover.

4. The isopipe of claim 3 wherein the first copper composite layer has a thickness of 0.1mm to 1mm, the third copper composite layer has a thickness of 0.05mm to 0.2mm, the first stainless steel composite layer/first titanium alloy composite layer has a thickness of 0.1mm to 2mm, and the first stainless steel composite layer/first titanium alloy composite layer has a thickness equal to or greater than the thickness of the first copper composite layer.

5. The temperature uniformity plate according to claim 3, wherein the third copper composite layer is connected with heat dissipation fins.

6. The temperature-equalizing plate according to any one of claims 1 to 5, wherein the thickness of the temperature-equalizing plate is 1mm to 10mm, and the applicable temperature is 60 ℃ to 350 ℃.

7. The temperature uniformity plate according to any one of claims 1 to 5, wherein the first cover comprises a central portion and a first connecting portion connected to a periphery of the central portion, the second cover comprises a lower concave portion and a second connecting portion extending outwardly from an upper edge of the lower concave portion, the first connecting portion is connected to the second connecting portion, and the central portion and the lower concave portion enclose the cavity.

8. The isopipe of claim 7 wherein the first connection portion and the second connection portion are welded together by diffusion welding, resistance welding, laser welding, argon arc welding, or high frequency welding.

9. The temperature equalization plate according to claim 7, wherein a groove is formed in one side of the second cover body, a degassing pipe is arranged in the groove, and the degassing pipe is communicated with the cavity and the outside of the temperature equalization plate; and/or the inner wall of the cavity is provided with a capillary structure, and the capillary structure is formed by sintering copper powder or a copper mesh on the inner wall of the cavity.

10. The isopipe of claim 7 wherein a plurality of spaced apart support structures are disposed within the cavity, the support structures being connected between the inner surface of the central portion and the bottom surface of the recess; the supporting structure is made of copper, and is connected to the inner wall of the cavity in a diffusion welding, resistance welding or brazing mode.