TWM594179U - Vapor chamber - Google Patents

Abstract

The present utility model provides a vapor chamber including an upper plate and a lower plate. The upper plate includes a first metal layer and a second metal layer having different materials. The lower plate is attached to the upper plate. The first metal layer and the second metal layer of the upper plate are subjected to press working, so that the first metal layer and the second metal layer are simultaneously deformed to form at least one supporting structure and a first skirt structure, the upper plate defines a working space by the first skirt structure being attached to the lower plate, and at least one supporting structure is located in the working space.

Description

Even temperature plate

This creation is about a heat dissipation device, especially about a temperature equalizing plate.

Vapor chamber is a heat dissipation device. Its working principle is similar to that of heat pipe. The difference is that the heat conduction of the heat pipe is the transmission in the one-dimensional direction, and the temperature even plate is the transmission in the two-dimensional direction. The temperature equalizing plate is mainly composed of an upper plate body, a lower plate body and an action space. When the lower plate body is in contact with a heat source such as a heat-generating electronic component, the working medium in the action space will be converted from a liquid state to a gaseous state. Transfer to the direction of the upper plate body, and finally transfer the heat energy through the area other than the heat source on the temperature equalizing plate or the heat dissipation device outside the temperature equalizing plate, such as fins. At this time, the working medium will be converted back to the liquid state and return to the bottom The board body, restart the next cycle.

Since handheld electronic devices such as smartphones, tablets, or small notebook computers are the mainstream products on the market, these handheld electronic devices mainly use thin temperature-averaging plates to achieve the purpose of heat dissipation of internal electronic components. However, due to the fact that the thin uniform temperature plate is prone to deformation, especially when the uniform temperature plate is attached to the heat source during the assembly operation, how to improve the structural strength of the uniform temperature plate, while not Obstructing the normal operation of the temperature equalizing plate is indeed the focus of the relevant personnel in the field.

One of the purposes of this creation is to provide a temperature-equalizing plate, the upper and lower plates of which are mainly composite metal plates made of at least two different materials of metal, and are processed by stamping or The etching process directly forms the support structure and the skirt structure on the upper or lower plate, so as to ensure the normal operation of the temperature equalizing plate and improve its structural strength and reliability of use.

The other purposes and advantages of this creation can be further understood from the technical features disclosed in this creation.

In order to achieve one, some or all of the above purposes or other purposes, this creation provides a temperature equalization plate, including an upper plate and a lower plate. The upper plate includes a first metal layer and a second metal layer with different materials. The lower plate is attached to the upper plate. Wherein, the first metal layer and the second metal layer of the upper plate are stamped, so that the first metal layer and the second metal layer are deformed at the same time to form at least the support structure and the first skirt structure. The skirt structure is attached to the lower plate to define an action space, and at least one support structure is located in the action space.

In an embodiment of the present creation, the first metal layer and the second metal layer of the upper plate are bonded to each other by diffusion bonding.

In an embodiment of the present creation, the above lower plate includes a third metal layer and a fourth metal layer with different materials, and the third metal layer is etched to form a second skirt structure on the third metal layer, The lower board defines the working space by the second skirt structure being attached to the first skirt structure of the upper board.

In an embodiment of the present creation, the third metal layer and the fourth metal layer of the lower plate described above are bonded to each other by diffusion bonding.

In an embodiment of the present creation, the above-mentioned first skirt structure defines a first space, the second skirt structure defines a second space, and the function space includes a first space and a second space.

In an embodiment of the present invention, a capillary structure is formed on the third metal layer of the lower plate, the capillary structure is located in the action space, and at least one supporting structure is in contact with the capillary structure.

In an embodiment of the present invention, the above-mentioned first metal layer is located between the second metal layer and the third metal layer, the thickness of the second metal layer is greater than or equal to a quarter of the thickness of the first metal layer, and the The thickness of the second metal layer is less than or equal to one-third of the thickness of the first metal layer, the third metal layer is located between the first metal layer and the fourth metal layer, and the thickness of the fourth metal layer is greater than or equal to one-quarter The thickness of the third metal layer, and the thickness of the fourth metal layer is less than or equal to one third of the thickness of the third metal layer.

In an embodiment of the invention, the metal strength of the second metal layer is greater than the metal strength of the first metal layer, and the metal strength of the fourth metal layer is greater than the metal strength of the third metal layer.

Another aspect of this creation is to provide a temperature equalizing plate, including an upper plate and a lower plate. The upper plate includes a first metal layer and a second metal layer with different materials. The lower plate is attached to the upper plate. Among them, the first metal layer of the upper plate is punched to deform the first metal layer to form at least one support structure and a first skirt structure. The upper plate is defined by the first skirt structure being attached to the lower plate Out of the working space, at least one supporting structure is located in the working space.

Another aspect of this creation is to provide a temperature equalizing plate, including an upper plate and a lower plate. The upper plate includes a first metal layer and a second metal layer with different materials. The lower plate includes a third metal layer and a fourth metal layer with different materials. Wherein, the first metal layer and the second metal layer on the upper plate are punched, so that the first metal layer and the second metal layer are simultaneously deformed to form a first skirt structure. Wherein, the third metal layer of the lower plate is etched to form a second skirt structure and at least one supporting structure on the third metal layer, and the lower plate is attached to the first skirt of the upper plate by the second skirt structure The side structure defines the working space, and at least one supporting structure is located in the working space.

In order to make the above and other purposes, features and advantages of this creation more obvious and understandable, the following is a detailed description of the preferred embodiments and the accompanying drawings.

1, 2, 3 ‧‧‧ temperature plate

11, 21, 31

12, 22, 32

111, 211, 311‧‧‧ First metal layer

112, 212, 312‧‧‧Second metal layer

121, 221, 321‧‧‧ third metal layer

122, 222, 322‧‧‧ Fourth metal layer

113, 213, 323‧‧‧ support structure

114, 214, 313‧‧‧ First skirt structure

123、324‧‧‧Second skirt structure

223‧‧‧Skirt structure

124, 224, 314‧‧‧ capillary structure

M1, M2‧‧‧mold

S1‧‧‧First Space

S2‧‧‧Second Space

WS, WS’, WS”‧‧‧

FIG. 1 is a schematic cross-sectional view of a temperature equalizing plate according to an embodiment of the creation;

2A to 2F are schematic diagrams of the manufacturing process of the temperature equalizing board shown in FIG. 1;

3 is a schematic cross-sectional view of a temperature-sharing plate according to another embodiment of the creation;

4 is a schematic cross-sectional view of a temperature equalizing plate according to another embodiment of the creation;

5A to 5F are schematic diagrams of the manufacturing process of the temperature equalizing board shown in FIG. 4.

Please refer to FIG. 1, which is a schematic cross-sectional view of a temperature equalizing board according to an embodiment of the invention. As shown in FIG. 1, the temperature equalizing plate 1 of this embodiment includes an upper plate 11 and a lower plate 12. The upper plate 11 includes a first metal layer 111 and a second metal layer 112 of different materials. The lower plate 12 is attached to the upper plate 11. In this embodiment, the upper plate 11 has a plurality of support structures 113 extending toward the lower plate 12 and a first skirt structure 114, the support structures 113 are arranged at intervals from each other, and the upper plate 11 is passed through the first skirt structure 114 is attached to the lower plate 12 and defines a working space WS with the lower plate 12, and the above support structures 113 are located in the working space WS, and the working space WS is filled with working medium. Specifically, the support structures 113 and the first skirt structure 114 of the upper plate 11 are formed by stamping, that is, the first metal layer 111 and the second metal layer 112 of the upper plate 11 are stamped, so that the first A metal layer 111 and a second metal layer 112 are simultaneously deformed to form the supporting structures 113 and the first skirt structure 114 extending toward the lower plate 12. The heat dissipation principle and operating system of the temperature equalizing plate 1 are known to those skilled in the art, so they will not be repeated here.

The detailed structure of the temperature equalizing plate 1 of this creative embodiment will be further described below.

As shown in FIG. 1, the lower plate 12 of this embodiment includes a third metal layer 121 and a fourth metal layer 122 of different materials. In this embodiment, the lower plate 12 has a second skirt structure 123, and the lower plate 12 is attached to the first skirt structure 114 of the upper plate 11 by the second skirt structure 123 and defined between the upper plate 11 Out of the above-mentioned function space WS. Specifically, the second skirt structure 123 of the lower plate 12 is formed by etching, that is, the third metal layer 121 of the lower plate 12 is etched to form the above-mentioned second skirt on the third metal layer 121边结构123.

As shown in FIG. 1, when the first metal layer 111 and the second metal layer 112 of the upper plate 11 are stamped to form a plurality of support structures 113 and a first skirt structure 114, the first skirt structure 114 will be on top The first space S1 is defined below the plate 11, that is, the space between the first skirt structure 114 and the adjacent support structure 113 and the space between any two adjacent support structures 113. When the third metal layer 121 of the lower plate 12 is etched to form the second skirt structure 123, the second skirt structure 123 defines a second space S2 above the lower plate 12. When the first skirt structure 114 of the upper board 11 and the second skirt structure 123 of the lower board 12 are attached to each other, the working space WS defined between the two includes the above-mentioned first space S1 and second space S2 , That is, the first space S1 and the second space S2 are combined to form a complete working space WS.

As shown in FIG. 1, the lower plate 12 of this embodiment further includes a capillary structure 124. The capillary structure 124 is formed on the third metal layer 121 of the lower plate 12, and the capillary structure 124 is located in the working space WS, and the support structures 113 extending from the upper plate 11 are in contact with the capillary structure 124. Specifically, after the third metal layer 121 of the lower plate 12 is etched to form the second skirt structure 123, the second skirt structure 123 defines a second space S2 above the lower plate 12, at this time, the capillary is formed The structure 124 is located in the second space S2 of the lower plate 12. When the first skirt structure 114 of the upper plate 11 and the second skirt structure 123 of the lower plate 12 are attached to each other, these supports extending from the upper plate 11 The structure 113 contacts the capillary structure 124.

As shown in FIG. 1, the first metal layer 111 of this embodiment is located between the second metal layer 112 and the third metal layer 121 of the lower plate 12, that is, the first metal layer 111 is the inner metal layer of the upper plate 11, The second metal layer 112 is an outer metal layer of the upper plate 11. In this embodiment, the thickness of the second metal layer 112 is, for example, greater than or equal to one-quarter of the thickness of the first metal layer 111 and less than or equal to three-thirds One of the thicknesses of the first metal layer 111, that is, the thickness of the outer metal layer of the upper plate 11 is smaller than the thickness of the inner metal layer, and the metal strength of the second metal layer 112 is greater than that of the first metal layer 111. The third metal layer 121 of this embodiment is located between the fourth metal layer 122 and the first metal layer 111 of the upper plate 11, that is, the third metal layer 121 is the inner metal layer of the lower plate 12, and the fourth metal layer 122 is The outer metal layer of the lower plate 12, in this embodiment, the thickness of the fourth metal layer 122 is, for example, greater than or equal to a quarter of the thickness of the third metal layer 121 and less than or equal to one third of the third metal The thickness of the layer 121 is also that the thickness of the outer metal layer of the lower plate 12 is smaller than the thickness of the inner metal layer, and the metal strength of the fourth metal layer 122 is greater than the strength of the third metal layer 121. In addition, the first metal layer 111 and the second metal layer 112 are bonded to each other by diffusion bonding, for example, to form the upper plate 11 of the composite metal layer structure. Similarly, the third metal layer 121 and the fourth metal layer 122 are, for example, The lower plates 12 of the composite metal layer structure are formed by diffusion bonding.

It should be noted that the materials of the first metal layer 111 and the second metal layer 112 of the upper plate 11 and the third metal layer 121 and the fourth metal layer 122 of the lower plate 12 may be selected from titanium, nickel, copper, and steel One of them is that the metal strength of the outer metal layer (the second metal layer 112 and the fourth metal layer 122) is greater than the strength of the inner metal layer (the first metal layer 111 and the third metal layer 121). The material of the metal layer can be arbitrarily replaced. In this embodiment, the outer metal layer (the second metal layer 112 and the fourth metal layer 122) is, for example, nickel, and the inner metal layer (the first metal layer 111 and the third metal) The layer 121) is made of copper, for example. Furthermore, this creation does not The bonding method between the first metal layer 111 and the second metal layer 112 and the bonding method between the third metal layer 121 and the fourth metal layer 122 are defined. The bonding method and the bonding method between the third metal layer 121 and the fourth metal layer 122 can be changed according to actual needs. In addition, the above standard for measuring the strength of the metal is selected from one of the Young's coefficient and the Vickers hardness.

Please refer to FIGS. 2A to 2F, which are schematic diagrams of the manufacturing process of the temperature equalizing board shown in FIG. As shown in FIG. 2A, an upper plate 11 composed of a first metal layer 111 and a second metal layer 112 is provided; then, as shown in FIG. 2B, the first metal layer 111 and the second metal layer are formed by a mold M1 112 is punched to form a plurality of support structures 113 and a first skirt structure 114; then, as shown in FIG. 2C, a lower plate 12 composed of a third metal layer 121 and a fourth metal layer 122 is provided; then, As shown in FIG. 2D, an etching process is performed on the third metal layer 121 to form a second skirt structure 123 on the third metal layer 121; then, as shown in FIG. 2E, in the second space S2 of the third metal layer 121 A capillary structure 124 is formed; then, as shown in FIG. 2F, the first skirt structure 114 of the upper plate 11 is attached to the second skirt structure 123 of the lower plate 12 to form the temperature-averaging plate 1 structure shown in FIG.

It should be noted that the manufacturing process sequence of the temperature equalizing board shown in FIGS. 2A to 2F is only one of the embodiments of this creation, and this creation does not limit the order of the manufacturing process of the above temperature equalizing board. For example, The above steps of FIGS. 2C to 2E can be completed before the steps of FIGS. 2A to 2B, that is, the manufacturing of the lower plate 12 (such as etching the third metal layer 121 and forming the capillary structure 124) can be performed first. The production of the board 11 (such as the simultaneous punching of the first metal layer 111 and the second metal layer 112), that is to say, the production of the upper board 11 and the lower board 12 are two separate processes, which are completed between the two The sequence does not affect the subsequent steps of attaching the upper board 11 to the lower board 12 (see FIG. 2F).

Please refer to FIG. 3, which is a schematic cross-sectional view of a temperature equalizing plate according to another embodiment of the creation. As shown in FIG. 3, the temperature equalizing plate 2 of this embodiment includes an upper plate 21 and a lower plate 22. The upper plate 21 includes a first metal layer 211 and a second metal layer 212 of different materials. The lower plate 22 includes a third metal layer 221 and a fourth metal layer 222 of different materials, and the lower plate 22 is attached to the upper plate 21. In this embodiment, the upper plate 21 has a plurality of support structures 213 extending toward the lower plate 22. The support structures 213 are arranged at intervals, and the upper plate 21 is attached to the lower plate 22 by the second metal layer 212. A working space WS' is defined with the lower plate 22, and the above support structures 213 are located in the working space WS', and the working space WS' is filled with working medium. The lower plate 22 has a skirt structure 223, and the lower plate 22 is attached to the second metal layer 212 of the upper plate 21 by the skirt structure 223, and defines the above-mentioned working space WS' with the upper plate 11, that is to say In this embodiment, the working space WS′ is directly defined by the skirt structure 223 of the lower plate 22.

According to the above description, the difference between the temperature equalizing plate 2 described in this embodiment and the temperature equalizing plate 1 shown in FIG. 1 lies in that, in this embodiment, only the inner first metal layer 211 is stamped, but not The outer second metal layer 212 is stamped, so that only the first metal layer 211 is deformed to form these support structures 213 extending toward the lower plate 22. In addition to the above differences, the other detailed structure of the temperature equalizing plate 2 of this embodiment, the skirt structure 223 of the following plate 22 is etched and the capillary structure 224 formed on the third metal layer 221 of the lower plate 22, and The temperature equalizing plate 1 shown in FIG. 1 is similar, so it will not be repeated in this paragraph. In addition, the manufacturing process of the temperature equalizing plate 2 of this embodiment is similar to the manufacturing process shown in FIGS. 2A to 2F, the only difference is that before the first metal layer 211 and the second metal layer 212 are joined to form the upper plate 21, the first A metal layer 211 is punched.

Please refer to FIG. 4, which is a schematic cross-sectional view of a temperature equalizing board according to another embodiment of the creation. As shown in FIG. 4, the temperature equalizing plate 3 of this embodiment includes an upper plate 31 and a lower plate 32. On board 31 includes a first metal layer 311 and a second metal layer 312 of different materials. The lower plate 32 includes a third metal layer 321 and a fourth metal layer 322 with different materials. In this embodiment, the upper plate 31 has a first skirt structure 313. The lower plate 32 has a plurality of support structures 323 extending toward the upper plate 31 and a second skirt structure 324. The support structures 323 are arranged at intervals from each other, and the lower plate 32 is attached to the upper plate 31 by the second skirt structure 324 In the first skirt structure 313, the working space WS" is defined between the upper plate 31 and the lower plate 32, and the above support structures 323 are located in the working space WS", and the working space WS" is filled with working medium.

According to the above description, the difference between the temperature equalizing plate 3 of this embodiment and the temperature equalizing plate 1 shown in FIG. 1 is that in this embodiment, the first skirt structure 313 of the upper plate 31 is formed by stamping, That is, the first metal layer 311 and the second metal layer 312 of the upper plate 31 are stamped, so that the first metal layer 311 and the second metal layer 312 are simultaneously deformed to form the first skirt structure 313. The support structures 323 and the second skirt structure 324 of the lower plate 32 are formed by etching, that is, the third metal layer 321 of the lower plate 32 is etched to form the support structures 323 on the third metal layer 321 The second skirt structure 324. In addition, the upper plate 31 of this embodiment further includes a capillary structure 314. The capillary structure 314 is formed on the first metal layer 311 of the upper plate 31, and the capillary structure 314 is located in the active space WS″ (that is, in the first space S1 defined by the first skirt structure 313), and from the lower plate The support structures 323 extending from 32 are in contact with the capillary structure 314. In addition to the above differences, the other details of the temperature equalizing plate 3 of this embodiment are similar to the temperature equalizing plate 1 shown in FIG. Repeat them.

Please refer to FIG. 5A to FIG. 5F, which are schematic diagrams of the manufacturing process of the temperature equalizing board shown in FIG. 4. As shown in FIG. 5A, an upper plate 31 composed of a first metal layer 311 and a second metal layer 312 is provided; then, as shown in FIG. 5B, the first metal layer 311 and the second metal layer are formed by a mold M2 312 is punched to form the first skirt structure 313; then, as shown in FIG. 5C, Provide the lower plate 32 composed of the third metal layer 321 and the fourth metal layer 322; then, as shown in FIG. 5D, the third metal layer 321 is etched to form a plurality of support structures on the third metal layer 321 323 and the second skirt structure 324; then, as shown in FIG. 5E, a capillary structure 314 is formed in the first space S1 of the first metal layer 311; then, as shown in FIG. 5F, the first skirt of the upper plate 31 The structure 313 is attached to the second skirt 324 of the lower plate 32 to form the temperature equalizing plate 3 structure shown in FIG. 4.

It should be noted that the manufacturing process sequence of the temperature equalizing board shown in FIGS. 5A to 5F is only one of the embodiments of this creation, and this creation does not limit the order of the manufacturing process of the above temperature equalizing board. For example, The above steps of FIGS. 5C to 5D can be completed before the steps of FIGS. 5A to 5B, that is, the manufacturing of the lower plate 32 (such as etching the third metal layer 321) is performed before the manufacturing of the upper plate 31 ( (For example, the first metal layer 311 and the second metal layer 312 are stamped at the same time), that is to say, the production of the upper plate 31 and the lower plate 32 are two separate processes, and the order of completion between the two is not This will affect the subsequent steps of attaching the upper plate 31 to the lower plate 32 (see FIG. 5F).

In summary, in the temperature-averaged plate of this creative embodiment, the upper plate and the lower plate are mainly composite metal plates made of at least two different materials of metal, and are directly stamped or etched on the upper plate or the lower plate The support structure and the skirt structure are formed, so as to ensure the normal operation of the temperature equalizing plate while improving its structural strength and reliability of use.

However, the above are only the preferred embodiments of this creation, which should not be used to limit the scope of the implementation of this creation, that is, the simple equivalent changes and modifications made by Dafan in accordance with the scope of the patent application for this creation and the content of the creation description, All still fall within the scope of this creative patent. In addition, any embodiment or scope of patent application of this creation does not need to achieve all the purposes or advantages or features disclosed by the cost creation. In addition, the abstract part and title are only used to assist the search of patent documents, not to limit the scope of the patent of this creation. In addition, this manual or application The terms "first" and "second" mentioned in the patent scope are only used to name the element or distinguish different embodiments or ranges, and are not used to limit the upper or lower limit of the number of elements.

1‧‧‧average temperature plate

11‧‧‧Upboard

12‧‧‧Lower plate

111‧‧‧First metal layer

112‧‧‧Second metal layer

121‧‧‧The third metal layer

122‧‧‧Fourth metal layer

113‧‧‧Support structure

114‧‧‧The first skirt structure

123‧‧‧Second skirt structure

124‧‧‧Capillary structure

S1‧‧‧First Space

S2‧‧‧Second Space

WS‧‧‧Function space

Claims (22)

An even temperature plate, including: An upper plate, including a first metal layer and a second metal layer of different materials; and Click on the board and attach it to the upper board; Wherein, the first metal layer and the second metal layer on the upper plate are subjected to a stamping process, so that the first metal layer and the second metal layer are simultaneously deformed to form at least one support structure and a first skirt In the structure, the upper plate defines a working space by the first skirt structure being attached to the lower plate, and the at least one supporting structure is located in the working space. The temperature equalizing plate as described in item 1 of the patent application range, wherein the first metal layer and the second metal layer of the upper plate are bonded to each other by diffusion bonding. The temperature equalizing plate as described in item 1 of the patent application scope, wherein the lower plate includes a third metal layer and a fourth metal layer of different materials, and an etching process is performed on the third metal layer to the third A second skirt structure is formed on the metal layer, and the lower plate defines the working space by the first skirt structure that the second skirt structure is attached to the upper plate. The temperature equalizing plate as described in item 3 of the patent application range, wherein the third metal layer and the fourth metal layer of the lower plate are bonded to each other by diffusion bonding. The temperature equalizing plate as described in item 3 of the patent application scope, wherein the first skirt structure defines a first space, the second skirt structure defines a second space, and the action space includes the first space and The second space. The temperature equalizing plate as described in item 3 of the patent application scope, wherein a capillary structure is formed on the third metal layer of the lower plate, the capillary structure is located in the action space, and the at least one support structure contacts the capillary structure. The temperature equalizing plate as described in item 3 of the patent application scope, wherein the first metal layer is located between the second metal layer and the third metal layer, and the thickness of the second metal layer is greater than or equal to a quarter of the The thickness of the first metal layer, and the thickness of the second metal layer is less than or equal to one third of the thickness of the first metal layer, the third metal layer is located between the first metal layer and the fourth metal layer, The thickness of the fourth metal layer is greater than or equal to a quarter of the thickness of the third metal layer, and the thickness of the fourth metal layer is less than or equal to one third of the thickness of the third metal layer. The temperature equalizing plate as described in item 7 of the patent application range, wherein the metal strength of the second metal layer is greater than that of the first metal layer, and the metal strength of the fourth metal layer is greater than that of the third metal layer . An even temperature plate, including: An upper plate, including a first metal layer and a second metal layer of different materials; and Click on the board and attach it to the upper board; Wherein, the first metal layer of the upper plate is punched to deform the first metal layer to form at least one support structure, and the upper plate is defined by the second metal layer being attached to the lower plate An action space, the at least one support structure is located in the action space. The temperature equalizing plate as described in item 9 of the patent application range, wherein the first metal layer and the second metal layer of the upper plate are bonded to each other by diffusion bonding. The temperature equalizing plate as described in item 9 of the patent application scope, wherein the lower plate includes a third metal layer and a fourth metal layer of different materials, and an etching process is performed on the third metal layer of the lower plate A skirt structure is formed on the third metal layer, and the lower plate defines the working space by the skirt structure being attached to the second metal layer of the upper plate. The temperature equalizing plate as described in item 11 of the patent application range, wherein the third metal layer and the fourth metal layer of the lower plate are bonded to each other by diffusion bonding. The temperature equalizing plate as described in item 11 of the patent application scope, wherein the skirt structure of the lower plate defines the action space. The temperature equalizing plate as described in item 11 of the patent application scope, wherein a capillary structure is formed on the third metal layer of the lower plate, the capillary structure is located in the action space, and the at least one support structure contacts the capillary structure. The temperature equalizing plate as described in item 11 of the patent application range, wherein the first metal layer is located between the second metal layer and the third metal layer, and the thickness of the second metal layer is greater than or equal to a quarter of the The thickness of the first metal layer, and the thickness of the second metal layer is less than or equal to one third of the thickness of the first metal layer, the third metal layer is located between the first metal layer and the fourth metal layer, The thickness of the fourth metal layer is greater than or equal to a quarter of the thickness of the third metal layer, and the thickness of the fourth metal layer is less than or equal to one third of the thickness of the third metal layer. The temperature equalizing plate as described in Item 15 of the patent application range, wherein the metal strength of the second metal layer is greater than that of the first metal layer, and the metal strength of the fourth metal layer is greater than that of the third metal layer . An even temperature plate, including: An upper plate, including a first metal layer and a second metal layer of different materials; and A board, including a third metal layer and a fourth metal layer of different materials; Wherein, a stamping process is performed on the first metal layer and the second metal layer on the upper plate, so that the first metal layer and the second metal layer are simultaneously deformed to form a first skirt structure; Wherein, an etching process is performed on the third metal layer of the lower plate to form a second skirt structure and at least one supporting structure on the third metal layer, and the lower plate is bonded by the second skirt structure An action space is defined by the first skirt structure of the upper plate, and the at least one support structure is located in the action space. The temperature equalizing plate as described in item 17 of the patent application range, wherein the first metal layer and the second metal layer of the upper plate are bonded to each other by diffusion bonding, and the third metal layer of the lower plate and the first The four metal layers are bonded to each other by diffusion bonding. The temperature equalizing plate as described in item 17 of the patent application scope, wherein the first skirt structure defines a first space, the second skirt structure defines a second space, and the action space includes the first space and The second space. The temperature equalizing plate as described in item 17 of the patent application scope, wherein a capillary structure is formed on the first metal layer of the upper plate, the capillary structure is located in the action space, and the at least one support structure contacts the capillary structure. The temperature equalizing plate as described in Item 17 of the patent application range, wherein the first metal layer is located between the second metal layer and the third metal layer, and the thickness of the second metal layer is greater than or equal to a quarter of the The thickness of the first metal layer, and the thickness of the second metal layer is less than or equal to one third of the thickness of the first metal layer, the third metal layer is located between the first metal layer and the fourth metal layer, The thickness of the fourth metal layer is greater than or equal to a quarter of the thickness of the third metal layer, and the thickness of the fourth metal layer is less than or equal to one third of the thickness of the third metal layer. The temperature equalizing plate as described in item 21 of the patent application range, wherein the metal strength of the second metal layer is greater than that of the first metal layer, and the metal strength of the fourth metal layer is greater than that of the third metal layer .

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