TWM568028U - Heat dissipation device - Google Patents

Abstract

The present invention relates to a heat dissipating device for mounting a plurality of circuit boards on a heat dissipating device. The heat dissipating device of the present invention only needs to lock a plurality of circuit boards through a connecting hole to one substrate of a heat dissipating module, The side plate and a bottom plate are configured to fix the plurality of circuit boards to the heat dissipation module. In this way, a plurality of circuit boards can be disposed on a single heat sink, thereby increasing the usability of the housing accommodation space.

Description

Heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device capable of mounting a plurality of circuit boards.

In general, the heat sink transmits heat emitted from the electronic device to the heat sink and then to the air and the like, wherein the heat is transferred by heat transfer in the thermodynamics. The heat transfer methods mainly include heat conduction, heat convection and heat radiation. When there is a temperature difference when the substance is in contact with the substance, heat transfer occurs until the temperature is the same everywhere.

Please refer to FIG. 1 , which is a cross-sectional view of a conventional heat sink. As shown in FIG. 1 , the conventional heat sink 1 ′ includes: a heat conducting seat 11 ′, a heat dissipating fin 12 ′, and a fixing member 13 ′; wherein the heat dissipating fin 12 ′ is disposed on the heat conducting seat 11 ′ One side, and the fixing member 13' is disposed on the other side of the heat conducting seat 11'. Thus, the heat conducting seat 11' can be fixed to a circuit board 2' by the fixing member 13', and the heat conducting seat 11' is attached to a wafer 3' for heat transfer.

Although the above-mentioned conventional heat sink 1' has been widely used at present, however, the creator of the present invention found in practice that the conventional heat sink 1' has the following drawbacks: after installing the conventional heat sink 1', In the conventional heat sink 1', only a single wafer can be thermally conducted. If another wafer needs to dissipate heat, an additional heat sink 1' is additionally mounted on the other wafer, which not only causes the housing space to be small, but also Reduce the usability of the housing accommodation space.

Therefore, in light of the above content, the creators of this case tried to study the new creation, and finally developed a new type of heat sink.

The present invention relates to a heat dissipating device for mounting a plurality of circuit boards on a heat dissipating device. The heat dissipating device of the present invention only needs to lock a plurality of circuit boards through a connecting hole to one substrate of a heat dissipating module, The side plate and a bottom plate are configured to fix the plurality of circuit boards to the heat dissipation module. In this way, a plurality of circuit boards can be disposed on a single heat sink, thereby increasing the usability of the housing accommodation space.

Therefore, in order to achieve the above object of the present invention, the creator of the present invention proposes a heat dissipating device, comprising: a heat dissipating module, which is composed of a substrate, two side plates and a bottom plate; wherein the two side plates are disposed on the substrate a plurality of coupling holes are disposed on the substrate and the two side plates; wherein the circuit boards are provided with at least one connection hole, and corresponding to the two sides of the two side plates; The bonding holes; wherein each of the bonding holes is correspondingly coupled to each of the connecting holes, and the circuit boards are fixed on the substrate, the two side plates or the bottom plate through the at least one locking component.

In order to more clearly describe a heat dissipating device proposed by the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.

Please refer to FIG. 2 and FIG. 3 at the same time, which are respectively a perspective view and a cross-sectional exploded view of the heat dissipation device of the present invention. As shown in the figure, a heat dissipating device of the present invention is provided with a plurality of circuit boards 2, and includes: a heat dissipating module 11 comprising a substrate 111, two side plates 112 and a bottom plate 113; One end of the two side plates 112 is disposed on two sides of the substrate 111, and the bottom plate 113 is disposed at the other end of the two side plates 112; and the substrate 111 and the two side plates 112 are provided with a plurality of bonding holes Further, a plurality of connection holes 21 are disposed on the circuit boards 2 and corresponding to the plurality of connection holes 114. The heat dissipation module 11 further includes a heat dissipation fin 115, wherein the heat dissipation fins 115 are The substrate 111 is disposed between the substrate 111 and the bottom plate 113.

The material of the substrate 111, the two side plates 112, and the bottom plate 113 may be copper or aluminum. Further, the locking component 110 can be a screw or a fixing post.

The above structure has completely explained the structural composition of the heat sink of the present invention; and then, the functions and technical features of the heat sink of the present invention will be further described. Please continue to refer to Figures 3 and 4, wherein Figure 4 is a side view of the heat sink of the present invention. As shown in FIG. 3 and FIG. 4 , in use, each of the bonding holes 114 is correspondingly coupled to each of the connecting holes 21 , and the circuit boards 2 are fixed to the substrate 111 through the at least one locking component 110 . The two side plates 112 or the bottom plate 113 are above. Thus, the wafers 3 disposed on the circuit boards 2 can be respectively attached to the substrate 111, the two side plates 112, and the bottom plate 113.

Thus, the above system has completely and clearly explained the structure and function of the heat sink of the present invention; through the above, we can know that the novel has the following technical features and advantages:

Different from the conventional heat sink 1 ′, the present invention provides a heat dissipating device for mounting a plurality of circuit boards 2 on a heat dissipating device. The heat dissipating device of the present invention only needs to pass a plurality of circuit boards 2 through the connecting holes 21 respectively. The plurality of circuit boards 2 are fixed to the heat dissipation module 11 by being fixed to the substrate 111, the two side plates 112, and the bottom plate 113 of the heat dissipation module 11. In this way, a plurality of circuit boards 2 can be disposed on a single heat sink, thereby increasing the usability of the housing accommodation space and reducing the setting of the heat sink.

It is to be understood that the foregoing detailed description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, Both should be included in the scope of the patent in this case.

<This new type>

2‧‧‧ boards

3‧‧‧ wafer

11‧‧‧ Thermal Module

21‧‧‧Connection hole

110‧‧‧Locking components

111‧‧‧Substrate

112‧‧‧ side panels

113‧‧‧floor

114‧‧‧Contact hole

115‧‧‧Heat fins

<知知>

1'‧‧‧知知散热器

2’‧‧‧ boards

3'‧‧‧ wafer

11'‧‧‧heating seat

12’‧‧‧Friction fins

13’‧‧‧Fixed parts

1 is a cross-sectional view of a conventional heat sink; FIG. 2 is a perspective view of a heat sink of the present invention; FIG. 3 is a cross-sectional exploded view of the heat sink of the present invention;

Claims (5)

A heat dissipating device is provided for mounting a plurality of circuit boards, and comprises: a heat dissipating module, which is composed of a substrate, two side plates and a bottom plate; wherein one end of the two side plates is disposed on both sides of the substrate, And the bottom plate is disposed at the other end of the two side plates; and the plurality of bonding holes are disposed on the substrate and the two side plates; wherein the circuit boards are provided with at least one connecting hole and corresponding to the bonding holes Wherein, each of the bonding holes is correspondingly coupled to each of the connecting holes, and the circuit boards are fixed to the substrate, the two side plates or the bottom plate through the at least one locking component. The heat sink of claim 1, wherein the substrate is made of copper or aluminum. The heat dissipation device of claim 1, wherein the heat dissipation module further comprises a heat dissipation fin disposed between the substrate and the bottom plate. The heat sink of claim 1, wherein the locking component is a screw. The heat sink of claim 1, wherein the bottom plate is made of copper or aluminum.