1236335 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱器固定裝置，特別是指一種 可多方向穩固定位散熱器，使得散熱器可與發熱元件密切 接觸，以有效提昇散熱效率，同時具有輕射隔離效果之散 熱器固定裝置。 【先前技術】 10 15 隨著科技發展的曰新月異，各式電子裝置的功能曰益 2強’除了元件之操作速率提高外，元件集積度亦大幅成 二但部也造成電子裝置内部各封襄元件的發熱密度愈來 m南。由於電子元件之故陸吝 則早產生，大部分來自於溫度因辛 ，因此若要確保電子*置運作無誤 置來將此-密集的熱量有效地導離的放熱裝 元件於額定溫度下運作。 、電子裝置外’以維持 通常最常見的處理模式异附★也上 式疋附加政熱片於發熱元件之表 辦力孰：增加總體散熱面積，或是與散熱風扇相結合，以 增加熱交換的速度。 w 至於散熱片之定位方式，當貝羽 、 面貼雙面谬，以與發熱元件^，法是在散熱片底 發熱元件溫度過高，而使雙面勝產口二:因此種做法常因 性，造成散“紐確實與發熱元^㈣化現象失去點 另一習知做法是在散熱片上設置 片與發熱元件黏貼固定後，再 （’於散熱 夂丹才y用螺絲貫穿久 散熱片鎖固定位於電路板上π疋孔而將 史仔放熱片可與發熱元件密 20 1236335 切接觸，然而在線路設計時，易因螺 成電路板空間的浪費及設叶* …”、空間過大，造 必須將複數個螺絲一一螺鎖定 二此之外，更因 工時之缺點。 疋位目此更存在有耗費組裝 有鑑於珂述以複數螺絲鎖固定位之做法m+ ，因而另有做、去私相u 之做法所存在之缺失 片，…，： 之電路板上設置兩固定扣 田月产、、片熱7C件黏貼固定後， 別壓制於散熱片近用兩固疋扣片分 位處，而達定位持於電路板之預設 此種做法同樣會因固定扣片之 佔用過大電路板空 片之 的阻礙。 4成—間的浪費及設計空間 再者，習知設計更有一種利用一固 器的做法，此鍤田^壯 衷置以疋位散熱 、複數用、如圖1所示’包含有-固定片η 二 ^於電路板21上之筒體！2,以及複數螺絲13 二片熱…固於電路板21上之發熱元件22表面後’ 各個开4 11置於散熱片14上表面’再利用各螺絲13貫穿 :=於固定片11周緣處之穿孔⑴及各筒體⑴進而 Γ之作板21之對應螺孔（圖未示）内，以達定位散熱片 22上的：。然而此種習知固定裝置僅能針對單-發熱元件 、放熱片14而設置，無法同時對多組散熱片14固定 °另外’因固中 片11疋以面對面接觸方式下壓散熱片14， · 大二备散熱片14與發熱元件22表面間的黏勝液化 黏性後，勒舟u “、、片14仍會因外界震動現象而產生水平方向位 移0 1236335 【發明内容】 因此，本發明之目的，是在提供一種可多方向穩固定 位散熱器’使散熱器可與發熱元件密切接觸，以有效提昇 散熱效率之散熱器固定裝置。 本發明之另一目的，是在提供一種具有輻射隔離效果 之散熱器固定裝置。 於是’本發明散熱器固定裝置，用以使至少一散熱哭 疋位於一電路板上之至少一發熱元件上表面，散熱器固定 裝置包含有一限制件，以及一用以使限制件定位於電路板 上之定位件。限制件具有一用以間隔配置於電路板上方之 基板、至少一貫設於基板而供散熱器向上穿置並予限位之 限位孔’以及至少一自基板朝限位孔上方延伸而用以壓制 散熱器之壓制部。 本發明之功效是在於藉由限制件之基板配置於電路板 上方，而使定位於發熱元件表面之散熱器可貫穿限制件之 限位孔，同時配合壓制部壓制散熱器，以多方向穩固定位 散熱器’並使散熱器可與發熱元件密切接觸，而提昇散熱 效率。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之多較佳實施例的詳細說明中，將可清 楚的明白，另外，為了方便說明，以下的實施例，相同的 元件將以相同的標號表示。 如圖2、3、4所示，是本發明散熱器固定裝置5第 5 10 15 1236335 -較佳實施例’而用以使三個散熱器3分別定位於一電路 板4上之，個發熱元件41上表面。但於其他應用中，本發 亦可t、單或其他數篁散熱器3定位。本發明中散熱器3 係屬習知元件，而具有-可用以貼靠於發熱元件41上表面 之基座31，以及複數個由基座31向上延伸之㈣μ，但 散熱器3的形式及外形也可做其他多種變化。 a散熱器固定裝置5包含有一用以限制並保持散熱器3 定位之限制件51 ’以及―用以使限制件51 ^位於電路板* 上之定位件52。限制件51具有一可用以平行配置於電路板 二上方並能同時具有輕射隔離效果之金屬基板5ιι、複數開 於基板5 11而供政熱裔3向上穿置並予限位之限位孔5 i 2 ’以及至少-自基板511朝限位孔512上方一體延伸而用以 壓制散熱H 3之Μ制部5U。基板511上周緣特定處設有複 數個穿孔514，限位孔512及壓制部513數目則對應該等散 熱器3數量。另外，各壓制部513皆具有一自基板川向上 直立延伸之延伸臂515，以及—自延伸臂515朝散熱器3水 平延伸之接觸臂516，使得壓制部513大致形成倒[形。此 外，因電路板4上各個發熱元件41的高度不盡相同，使置 於各發熱it件41上之散熱器3穿出限位孔512而位於基板 5Π上表面的高度亦隨之不同，因此各延伸臂515向上延伸 之高度亦配合散熱器3高度而有所不同。 定位件52則包含有複數個置於基板511與電路板4間 用以支撐限制件51之支撐筒體521、複數個用以貫穿基板 511之各穿孔514與各支撐筒體521進而鎖固於電路板4上 20 1236335 之兀件522，以及複數個可與各鎖固元件522配合螺鎖 5 10 15 定^件523。支撐筒體521具有一第一連接部524，及 :自該第—連接部524向下軸向延伸之第二連接部525，且 卜連接。卩524内部並形成有一軸向貫穿之貫孔526，第一 連接部524對應貫孔526之内壁面形成有複數内螺紋切， ，連接。卩525之外表面則形成有複數外螺紋。另外’ 各鎖固元# 522之外表面並形成有可與第一連接冑似之 —累、文527螺接的螺紋段529，而固定元件523則為一可與 第一連接部525之外螺紋528配合螺鎖之螺帽。 散熱器固定裝置5用於定位散熱器3之操作步驟，係 、將各散熱器3置於各發熱元件41頂面，再將基板⑴置 於電路板4上方且各散熱器3並向上穿置於各限位孔M2 中’用以限制散熱器3產生前、後、左、右水平位移，此 時限制件51之各制部513並壓制於各散熱器3之部分，鰭 片32頂緣處’使得各散熱器3可與各對應之發轨元件41 密切貼觸’同時將各支編521分別置於複數個預設在 電路：4上之定位孔42處，且使支撐筒體521與基板5ιι 之各穿孔514相對應，利用固定元件523自電路板4底面 與第二連接部525之外螺紋528螺接鎖固，之後再將鎖固 兀件522螺設於第—連接部524之貫孔526内，使得各鎖 S 70件522與各支揮筒體521鎖固成一體’基板511即可平 行電路板4且定位於電路板4上。 當然’為使散熱器3與發熱元件41之接觸更為緊密， 亦可於散熱器3與發熱元件41之接觸面間提供—導熱膠以 20 1236335 加強定位，縱使膠質因高溫而液化，散熱器3仍可在限制 牛 之夕方向限位下保持定位，藉此發熱元件41所產生 的熱1可確實傳遞至散熱器3而進—步散逸至外界，以提 昇散熱效率，且金屬製限制件51本身亦具增加散熱面積之 效果。 如圖5所示，是本發明散熱器固定裝置之第二較佳實 轭例，其與第一較佳實施例差異處僅在於各支撐筒體6幻 並未區分為第-、二連接冑，而為一内部轴向貫穿形成有 一可供一鎖固元件522穿置之貫孔624的筆直筒體。在定 位基板511時，係將支撐筒體621置於電路板4上，且使支 撐筒體621之貫孔624與電路板4之定位孔42連通，利用 鎖固tl件522貫穿基板511上之穿孔514、支撐筒體621之 貫孔624，且鎖固元件522之螺紋段529並穿出於電路板4 之定位孔42底部，配合固定元件523與螺紋段529螺接鎖 固’同樣能使基板5 11定位於電路板4上。 如圖6、7所示，為本發明散熱器固定裝置之第三較 佳貫施例’其與第一較佳實施例差異處在於更包含有一支 撐件713，用於各基板711之限位孔712上方可配置一散熱 風扇8(在本例中是以一個散熱風扇8做說明），散熱風扇8 近周緣處並設置有複數個開孔81。另外，支撐件713係具 有複數個凸出於基板711上表面且内壁面具内螺紋之定位螺 筒714，以及複數可用以將散熱風扇8鎖固於各定位螺筒 714之鎖固元件715，當基板711如前述各實施例般定位於 電路板4上方後，可將散熱風扇8置於該等定位螺筒71 * 1236335 上’利用鎖固元件715貫穿散熱風扇8之開孔81並進而螺 設於定位螺筒714中，使得散熱風扇8可穩固且平行配置 於基板711上方，藉散熱風扇8朝散熱器3方向送（或抽）風 ’進而更能提昇散熱速率。再者’可藉由散熱器3、限制件 5 5丨（標示於圖2至4)、定位件52(亦標示於圖2至4)、支撐 件713及散熱風扇8共同構成一散熱裝置，或進一步包含 該電路板4及發熱元件41(標示於圖2至句而構成一電路板 模組。 歸納上述，本發明散熱器固定裝置，藉由一可水平配 1〇 置於電路板4上方之限制件5，利用限制件5之基板511上 形成限位孔512 ’以供設置於電路板4之發熱元件41上的 散熱器3穿置，藉此利用限位孔512限制散熱器3以避免 產生4後左、右向水平位移，同時配合壓制部5丨3壓 制散熱器3,使散熱器3可與發熱元件4密切接觸，而提昇 15 散熱效率，因此，確實能達到前述本發明之目的。 准以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 2〇 【圖式簡單說明】 圖1是習知散熱器之固定裝置示意圖； 圖2是本發明散熱器固定裝置之第一較佳實施例立體 分解示意圖； 圖3是該第-較佳實施例之細合側視圖，顯示鎖固元 1236335 件、支撐筒體及固定元件之組合剖視態樣； 圖4是該第一較佳實施例之組合俯視圖； 圖5是該第二較佳實施例之組合側視圖，顯示鎖固元 件、支撐筒體及固定元件之組合剖視態樣； 5 圖6是本發明散熱器固定裝置之第三較佳實施例立體 分解示意圖；及 圖7是該第三較佳實施例之組合立體圖，未顯示電路 板、發熱元件及固定元件。 1236335 【圖式之主要元件代表符號說明】 3散熱器 5散熱器固定裝置 31基座 4 1發熱元件 51限制件 8 1開孔 511、711 基板 5 1 3壓制部 5 1 5延伸臂 521支撐筒體 523固定元件 525第二連接部 527内螺紋 529螺紋段 7 14定位螺筒 4電路板 8散熱風扇 32鰭片 42定位孔 52定位件 5 1 2、7 12限位孔 5 1 4穿孔 5 1 6接觸臂 522鎖固元件 524第一連接部 526貫孔 528外螺紋 713支撐件 7 1 5鎖固元件 121236335 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a radiator fixing device, in particular to a radiator that can be stably fixed in multiple directions, so that the radiator can be in close contact with a heating element to effectively improve heat dissipation. Efficiency, and radiator fixing device with light shot isolation effect at the same time. [Previous technology] 10 15 With the rapid development of science and technology, the functions of various electronic devices are said to be “strong 2”. In addition to the increase in the operation rate of components, the degree of component integration has also greatly increased. The heating density of the Fengxiang element is increasing. Because the electronic components are produced early, most of them come from the temperature. Therefore, to ensure that the electronics are set up correctly, the heat-dissipating components that effectively conduct this dense heat away from them operate at the rated temperature. ”Outside the electronic device” to maintain the most common processing mode. Attachment is also described above. 疋 Adding a political heat film to the surface of the heating element. 孰: Increase the overall heat dissipation area, or combine it with a cooling fan to increase heat exchange. speed. w As for the positioning of the heat sink, when the shell and the surface are double-sided, the heating element ^ is used. The method is that the temperature of the heating element at the bottom of the heat sink is too high, which makes the double-sided win. It ’s difficult to disperse the heat dissipation element and the heat generating element. Another known practice is to set the heat sink on the heat sink and stick it together, and then use the screw to penetrate the heat sink lock for a long time. It is fixed on the π 疋 hole on the circuit board and the Shizi heat sink can be in close contact with the heating element 20 1236335. However, when the circuit is designed, it is easy to waste the space of the circuit board and set up the leaves * ... " It is necessary to lock a plurality of screws one by one, and the other is because of the shortcomings of man-hours. The position is more costly to assemble. In view of the practice of fixing the position by using a plurality of screw locks m +, so do, go to The missing piece in the practice of the private phase u, ...: Two fixed buckles are provided on the circuit board. After the 7C pieces of the hot piece are pasted and fixed, do not press them on the heat sink near the two solid buckle tabs. , And reach positioning on the circuit board It is also assumed that this method will also be hindered by the excessive use of fixed clips on the empty pieces of the circuit board. 40% of the time and waste of design space. In addition, the design method also uses a fixture. This Putian ^ Strongly set aside for heat dissipation, multiple, as shown in Figure 1 'contains-fixing piece η 2 ^ cylinder on the circuit board 21! 2, and a plurality of screws 13 two heat ... fixed on the circuit board 21 On the surface of the heating element 22, 'each open 4 11 is placed on the upper surface of the heat sink 14', and then each screw 13 is used to penetrate: = the perforation 于 at the periphery of the fixing piece 11 and the cylinder ⑴ and Γ corresponding to the plate 21 Inside the screw holes (not shown) to locate the heat sink 22: However, this conventional fixing device can only be set for single-heating elements and heat sinks 14, and cannot fix multiple groups of heat sinks 14 at the same time. In addition, 'Because the solid middle sheet 11 疋 presses the heat sink 14 in a face-to-face contact manner, · After the stickiness between the sophomore heat sink 14 and the surface of the heating element 22 is liquefied, the boat 14 will still Displacement in the horizontal direction due to external vibrations 0 1236335 [Abstract] Therefore, The purpose of the present invention is to provide a heat sink fixing device capable of stably fixing the position in multiple directions, so that the heat sink can be in close contact with the heating element to effectively improve heat dissipation efficiency. Another object of the present invention is to provide a heat sink fixing device having Radiator fixing device with radiation isolation effect. 'The heat sink fixing device of the present invention is used to cause at least one heat sink to be located on the upper surface of at least one heating element on a circuit board. The heat sink fixing device includes a limiting member, and a A positioning member for positioning the restricting member on the circuit board. The restricting member has a limiting hole for spacedly arranging the substrate above the circuit board, at least consistently disposed on the substrate for the heat sink to pass upward and to limit the position ' And at least one pressing portion extending from the base plate above the limiting hole for pressing the heat sink. The effect of the present invention is that the base plate of the restricting member is arranged above the circuit board, so that the heat sink positioned on the surface of the heating element can penetrate the restricting hole of the restricting member, and at the same time cooperate with the pressing part to suppress the heat sink, and stabilize the position in multiple directions The heat sink 'enables the heat sink to be in close contact with the heating element, thereby improving heat dissipation efficiency. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of preferred embodiments with reference to the drawings. In addition, for the convenience of explanation, the following implementation For example, the same elements will be represented by the same reference numerals. As shown in Figures 2, 3, and 4, it is the fifth embodiment of the heat sink fixing device 5 of the present invention 5 10 15 1236335-a preferred embodiment, and is used to position the three heat sinks 3 on a circuit board 4 respectively, each of which generates heat. Element 41 upper surface. However, in other applications, the present invention can also be used for t, single or other data radiator 3 positioning. The heat sink 3 in the present invention is a conventional element, and has a base 31 that can be used to abut against the upper surface of the heating element 41 and a plurality of ㈣μ extending upward from the base 31. However, the form and shape of the heat sink 3 Many other changes are also possible. a The heat sink fixing device 5 includes a restricting member 51 ′ for restricting and maintaining the positioning of the heat sink 3, and a positioning member 52 for positioning the restricting member 51 ^ on the circuit board *. The limiting member 51 has a limiting hole that can be arranged in parallel on the circuit board two and can simultaneously have a light-emitting isolation effect. The plurality of metal substrates can be opened on the substrate 5 and 11 for the government enthusiast 3 to pass upward and limit the position. 5 i 2 ′ and at least-the M-made part 5U integrally extending from the substrate 511 above the limiting hole 512 to suppress heat dissipation H 3. A plurality of perforations 514 are provided at specific positions on the upper periphery of the base plate 511, and the number of the limiting holes 512 and the pressing portion 513 corresponds to the number of the heat sinks 3. In addition, each of the pressing portions 513 has an extension arm 515 extending upright from the base plate, and a contact arm 516 extending horizontally from the extension arm 515 toward the heat sink 3, so that the pressing portion 513 is formed into a substantially inverted shape. In addition, because the height of each heating element 41 on the circuit board 4 is different, the height of the heat sink 3 placed on each of the heating it 41 through the limit hole 512 and the height of the upper surface of the substrate 5 is different. The height of each extension arm 515 extending upward also varies with the height of the radiator 3. The positioning member 52 includes a plurality of supporting cylinders 521 placed between the substrate 511 and the circuit board 4 to support the limiting member 51, a plurality of perforations 514 and supporting cylinders 521 for penetrating the substrate 511, and then locked to The 20 522 3535 pieces 522 on the circuit board 4 and a plurality of 5 5 15 fixing pieces 523 that can cooperate with each locking element 522. The supporting cylinder 521 has a first connecting portion 524 and a second connecting portion 525 extending axially downward from the first connecting portion 524 and connected. A through hole 526 is formed inside the 524 in the axial direction, and a plurality of internal thread cuts are formed on the inner wall surface of the first connecting portion 524 corresponding to the through hole 526 to connect. The outer surface of 外 525 is formed with a plurality of external threads. In addition, the outer surface of each lock solid element # 522 is formed with a thread segment 529 that can be screwed to the first connection, and the fixing element 523 is a part that can be connected to the first connection portion 525. The thread 528 cooperates with the nut of the screw lock. The heat sink fixing device 5 is used to locate the operation steps of the heat sink 3, that is, place each heat sink 3 on the top surface of each heating element 41, and then place the substrate on the circuit board 4 and each heat sink 3 and pass upward. In each limiting hole M2, 'is used to restrict the horizontal displacement of the radiator 3 from front, back, left, and right. At this time, each part 513 of the restricting member 51 is pressed against the part of each radiator 3, and the top edge of the fin 32 "Make each radiator 3 be in close contact with each corresponding rail element 41" while placing each braid 521 at a plurality of positioning holes 42 preset on the circuit: 4, and supporting the cylinder 521 Corresponding to the perforations 514 of the substrate 5m, the fixing element 523 is screwed and locked from the bottom surface of the circuit board 4 and the outer thread 528 of the second connection portion 525, and then the locking element 522 is screwed to the first connection portion 524. The through hole 526 allows each lock S 70 piece 522 and each swinging body 521 to be locked into one body. The substrate 511 can be parallel to the circuit board 4 and positioned on the circuit board 4. Of course 'In order to make the heat sink 3 and the heating element 41 more closely contact, it can also be provided between the contact surface of the heat sink 3 and the heating element 41-the thermal conductive adhesive is strengthened with 20 1236335, even if the glue is liquefied due to high temperature, the heat sink 3 can still maintain the position under the limit of the direction of the limit of the cow's eve, whereby the heat 1 generated by the heating element 41 can be surely transferred to the radiator 3 and further dissipated to the outside to improve the heat dissipation efficiency, and the metal restriction 51 itself also has the effect of increasing heat dissipation area. As shown in FIG. 5, it is the second preferred real yoke example of the radiator fixing device of the present invention. The difference from the first preferred embodiment is only that each support cylinder 6 is not divided into the first and second connection. A straight cylindrical body is formed with a through hole 624 through which a locking element 522 can pass through. When positioning the substrate 511, the support cylinder 621 is placed on the circuit board 4, and the through hole 624 of the support cylinder 621 and the positioning hole 42 of the circuit board 4 are communicated. The locking tl member 522 is used to penetrate the substrate 511. The perforation 514, the through hole 624 of the support cylinder 621, and the threaded segment 529 of the locking element 522 pass through the bottom of the positioning hole 42 of the circuit board 4, and the fixing element 523 and the threaded segment 529 are screwed and locked. The substrate 5 11 is positioned on the circuit board 4. As shown in Figs. 6 and 7, this is a third preferred embodiment of the radiator fixing device according to the present invention. The difference from the first preferred embodiment is that it further includes a support 713 for limiting the position of each substrate 711. A heat dissipation fan 8 (in this example, one heat dissipation fan 8 is used as an example) may be arranged above the hole 712. The heat dissipation fan 8 is provided with a plurality of openings 81 near the periphery. In addition, the supporting member 713 has a plurality of positioning screw cylinders 714 protruding from the upper surface of the base plate 711 and an inner wall mask with internal threads, and a plurality of locking elements 715 for locking the cooling fan 8 to each positioning screw cylinder 714. After the substrate 711 is positioned above the circuit board 4 as in the previous embodiments, the cooling fan 8 can be placed on the positioning screws 71 * 1236335. 'The locking element 715 is used to penetrate the opening 81 of the cooling fan 8 and then be screwed. In the positioning screw 714, the cooling fan 8 can be stably and parallelly disposed above the substrate 711, and the cooling fan 8 can send (or draw) wind toward the radiator 3 to further increase the heat dissipation rate. Furthermore, 'the heat sink 3, the limiting member 5 5 丨 (labeled in Figs. 2 to 4), the positioning member 52 (also labeled in Figs. 2 to 4), the support member 713, and the cooling fan 8 can be used to form a heat dissipation device. Or further includes the circuit board 4 and the heating element 41 (labeled in Figure 2 to the sentence to form a circuit board module. To summarize the above, the heat sink fixing device of the present invention can be horizontally disposed on the circuit board 4 above the circuit board 4 The limiting member 5 uses a limiting hole 512 ′ formed on the substrate 511 of the limiting member 5 for the heat sink 3 provided on the heating element 41 of the circuit board 4 to pass through, thereby limiting the heat sink 3 to Avoid horizontal displacement of 4 rear left and right, and press the heat sink 3 with the pressing part 5 丨 3, so that the heat sink 3 can be in close contact with the heating element 4 and improve the heat dissipation efficiency of 15, so it can indeed achieve the aforementioned invention. Purpose: The above mentioned ones are only the preferred embodiments of the present invention, and when the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes made according to the scope of the patent application of the present invention and the contents of the description of the invention, and Modifications should still belong to the invention It is within the scope of patents. 2 [Simplified description of the drawings] Fig. 1 is a schematic diagram of a fixing device of a conventional radiator; Fig. 2 is a schematic exploded perspective view of a first preferred embodiment of the radiator fixing device of the present invention; A detailed side view of the first preferred embodiment, showing a combined sectional view of 12,363,35 locking elements, a support cylinder, and a fixing element; FIG. 4 is a combined top view of the first preferred embodiment; FIG. 5 is the The combined side view of the second preferred embodiment shows the combined sectional view of the locking element, the supporting cylinder and the fixing element; FIG. 6 is a schematic exploded perspective view of the third preferred embodiment of the radiator fixing device of the present invention; And FIG. 7 is a combined perspective view of the third preferred embodiment, which does not show a circuit board, a heating element, and a fixing element. 1236335 [Description of the main components of the figure] 3 Radiator 5 Radiator fixing device 31 Base 4 1 Heating element 51 restricting member 8 1 opening 511, 711 substrate 5 1 3 pressing part 5 1 5 extension arm 521 supporting cylinder 523 fixing element 525 second connecting part 527 internal thread 529 thread segment 7 14 positioning screw cylinder 4 circuit board 8 Cooling wind Fan 32 Fin 42 Positioning hole 52 Positioning member 5 1 2, 7 12 Limiting hole 5 1 4 Perforation 5 1 6 Contact arm 522 Locking element 524 First connection portion 526 Through hole 528 External thread 713 Support 7 1 5 Lock Solid element 12