TWM336472U - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TWM336472U
TWM336472U TW97202831U TW97202831U TWM336472U TW M336472 U TWM336472 U TW M336472U TW 97202831 U TW97202831 U TW 97202831U TW 97202831 U TW97202831 U TW 97202831U TW M336472 U TWM336472 U TW M336472U
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TW
Taiwan
Prior art keywords
heat
heat sink
circuit board
sink
heating
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Application number
TW97202831U
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Chinese (zh)
Inventor
Guang-Liang Guo
Tsai-Kuei Cheng
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Inventec Corp
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Priority to TW97202831U priority Critical patent/TWM336472U/en
Publication of TWM336472U publication Critical patent/TWM336472U/en

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Abstract

A heat sink is disclosed, characterized by using a first heat-generating element abutting against the circuit board to perform heat-dissipation, wherein the heat sink is a level board structure having a size greater than that of the first heat-generating element such that effective heat-dissipation and reduction of the structure height can be achieved.

Description

M336472 八、新型說明: 【新型所屬之技術領域】 本創作係有關於一種散熱技術,更詳而言之,係有關 一種應用於電路板之散熱器。 【先前技術】 • · 酼著電子技術的高速發展,各類電子裝置之配件亦隨 之不斷更新換代來滿足提升之處理速度及更大資訊處理 里之而要。但是,功能之增強並不意味著其體積亦越大, 籲恰恰相反,由於電路積體化程度的加速提升,相應的,電 子裝置也愈趨向於小巧化、輕薄化發展,例如現有之筆記 型電腦、行動電話、個人數位助理(PDA)等,均係典型之 小巧便攜之電子裝置,而為人們所爭相使用。 疋以,生産廠商總是積極地縮減電子裝置之體積,然 如此來,電子裝置内部空間受到極大壓縮,給實際的佈 局設計帶來不小困難。 Φ 請夢閲第1目,係顯示一種電子X置之電路板卜該 •電子裝置可為例如液晶顯示裝置之電子裝置。如第丨圖所 _ 為縮減小該電子裝置之整體高度,係於電子裝置之機 相(未圖不)中省略諸如散熱風扇之散熱元件,而改以散 熱器(heat sink) 2對應設於該電路板1之第一發熱元 件(未圖示),以對該機箱中之電路…進行散熱。該第 一發熱元件可為例如中央處理單元(Central Pr0cessingM336472 VIII. New Description: [New Technology Field] This creation is about a heat dissipation technology. More specifically, it relates to a heat sink applied to a circuit board. [Prior Art] • With the rapid development of electronic technology, the accessories of various electronic devices are constantly updated to meet the processing speed of improvement and greater information processing. However, the enhancement of function does not mean that the volume is larger. On the contrary, due to the accelerated increase in the degree of integration of the circuit, correspondingly, electronic devices are becoming more compact and lighter, such as the existing notebook type. Computers, mobile phones, personal digital assistants (PDAs), etc., are typical small and portable electronic devices that are used by people. As a result, manufacturers are always actively reducing the size of electronic devices. However, the internal space of electronic devices is greatly compressed, which brings difficulties to the actual layout design. Φ Please dream of the first item, which is a circuit board that displays an electronic X. The electronic device can be an electronic device such as a liquid crystal display device. As shown in the figure, in order to reduce the overall height of the electronic device, the heat dissipating component such as the heat dissipating fan is omitted in the phase of the electronic device (not shown), and the heat sink 2 is correspondingly disposed on The first heat generating component (not shown) of the circuit board 1 dissipates heat from the circuitry in the chassis. The first heating element can be, for example, a central processing unit (Central Pr0cessing)

Unit’ CPU),該放熱2係一表面對準該第一發熱元件 10而固定至該電路板丨,另—表面則設有複數向上延伸之 5 M336472 散熱鰭片 熱0 21如此,便可藉由空氣之自然流動來進行散 但是’為了使產品更趨於輕薄短小,設置該電路板工 =殼體高度有限,相對限制空氣的流動速度,再加上該類 -第一發熱70件之功能提昇連帶使功耗變大,發敎量提高, '因此容易導致該散熱器2上方之殼體溫度。同時,此種出 現局部高溫之散熱技術’易會引發外插的部件因為孰聚隼 而造成損害,從而影響產品正常使用。而且,當出現局部 鲁高溫時,四周之溫度相對較低,亦可能因而令殼體產生變 形。 此外,台灣專利證書第258331號新型專利係提出一 種無風扇電源供應器之散熱結構,主要於電路板上垂直設 置複數導熱塊,然後以螺絲鎖固具有複數貫穿槽之散熱件 至該電路板,以將該散熱件鎖固於該電路板上方處,且該 散熱件内侧面緊密貼附於該複數導熱塊之頂面,俾由該散 熱件與該電路板之間所形成之對流通道進行散熱。 惟,此專利技術必須設置垂直於電路板之複數導熱 塊’自無法有效縮減殼體高度,不符現今之設計要求。同 時,設置這些導熱塊勢必改變電路板上之元件的佈局設 计、估據可佈局之空間;換言之,此種技術會令可用於佈 局佈線的空間大大減小,相對影響整個裝置之功能。此 外,由於此種技術之結構複雜,製造難度與成本亦相對提 南。另外’對於仍採用諸如散熱風扇之散熱元件的電子裝 置來說,便無法應用此種技術進行散熱,而限制其產業利 6 M33 6472 用範圍 再者,前述習知技術及專利均未論及 :晶片等第二發熱元件進行散熱;是以,雖然前述第橋^ =件之功耗較小,發熱量亦相對較^、,但當元件數【 夕%,所產生之熱能亦不容小覷。 里^ 間來均句導熱 ’遂成為目前 因此,如何找到一種可充分運用殼體空 之散熱技術,避免出現前述習知技術之缺失 亟待解決的問題。 _ 【新型内容】 一種散熱 蓉於上述習知技術之缺點’本創作係提供 器,可均勻傳導熱量,有效避免局部高溫。 一目的在於提供一種結構簡單之散熱器。 本創作之再—目的在於提供—種容易製造之散熱器。 =創,之又-目的在於提供—種具成本效益(一 effective)之散熱器。 本創作之又另—目的在於提供_種散㈣ 丨減裝置之殼體高度,相對可令裝置薄型化。有助、细 ,為為達上述及其他目的,本創作係提供一種散数哭, 係應用貼靠於電路板之第―發熱元件,以㈣第—發熱口元 件進灯散熱,其特徵在於··該散熱㈣呈平板結構,且面 積大於涵蓋該第-發熱元件之區域,㈣擴散_一_ 兀件所產生之熱能,並藉此縮減所佔用之空間高度。 前述之散熱器中,該散熱器係為金屬平板,盆中,該 散熱器係包括貼靠於該第—發熱元件之散熱器主體、以及 M336472 一體形成於該散熱器主髀夕從私,,μ ^ 卜 版之稷數開口部。該電路板設有高 度大於該第一發熱元件之亓杜 之7^件’該開口部則可對應該元件 而設置,·當然,於其他資始能接Λ 斗0日 r 〜Mm / 中,該開口部亦可對應該 弟u 1卜之弟二發熱元件而設置,而此 埶 ,元件可為發熱量較小之發熱元件。該散熱器亦可包括1 ,形成於該散熱器主體之固定部,該固定部係可為例如開 孔,其中’該固定部係可選擇設於該散熱器主體 , 此時,該固定部係可選擇為十字型開孔。該散熱器主體及 >該第-發減件之間復可具有結合部,其中,該結合部例 如為散熱貧、導熱墊、散熱石夕膠之其令一者。較佳地,談 散熱器之面積大於該電路板之面積。 Μ 相較於習知技術,本創作之散熱器可採用平板 貼靠電路板之第-發熱元件,達到既不影響佈局空間,且 又增大散熱面積之效果,以解決習知技射出現局部古π 之問題。同時’應用本創作係利用既有空間設置散埶:/皿 ^目較習知技術疊設散熱器於第一發熱元件會增厚裳、置。敕 •體體積,本創作相對可縮減所佔用之空間高度,有^於^ •型化。此外,本創作之散熱器結構簡單且製 ? 低廉。 %成本 【實施方式】 以下係藉由特定的具體實例說明本創徐 工,1、、怂此技藝之人士可由本說明書所揭示之内容 瞭解本創作之其他優點與功效。 二 請參閱第2圖’係顯示本創作之散熱器之結構示意 8 M336472 圖。如第2圖所示,本創作之散熱器3係包括:散熱器主 體30、以及設於該散熱器主體3〇之複數開口部31與固 定部33。於本實施例中,該散熱器3係可由例如紹材所 展開之金屬平板,且例如一體沖壓成型該散熱器主體 ' go、該複數開口部31、以及該固定部33;但應了解的是, •忒散熱器3係可為質量輕、導熱性好之金屬 .金所製成之薄板,當然,諸如金、銀、鎮、銅=其^ 熱性=之金屬、合金、非金屬亦適用於本創作,而非偈限 1於本實施例中所述者。 請-併參閲第3及第4圖,係為本創作之散熱器3 二用於電子裝置之殼體(均未圖示)内的電路板4上之示 :圖其中’為了便於與習知技術進行比較,該電路板& 】二類似於第1圖所示之電路板1為例說明,例如設置 40 Λ熱^件之位置係相同’本實施例之第一發熱元件 亦可為中央處理器’但應知本創作並非偈限於此。如 二 所!,該散熱器主體3°係貼靠於該電路板4之第 义"、、兀件40,且表面大致俘拉 於等於該雷改4^ 穴致保持千坦,而其面積則可小 中,二非侷限於此。例如,於其他實施例 器3=敕厂主體3〇之面積可大該電路板4,使該散熱 3接觸罢 乓強導熱性;而且,可使該散熱器 使啁屯子裝置之機箱f 傳導。 相C未圖不),以通過該機箱進行熱 4圖所示,該電 該散熱器主I#训夕心址板4上汉有弟一發熱兀件40, 積大於涵蓋該第一發熱元件40之區 9 M336472 域’且表面接觸該第一發熱元件40,以提供大散熱面積 均勻散熱。換言之,該散熱器3之面積大於涵蓋該第一發 熱元件40之區域並小於等於該電路板4,以供擴散該第 一發熱元件40所產生之熱能。因此,即使未使用散熱風 扇之散熱元件而僅有微弱的氣流,也能有效地帶走熱量。 應了解的是,本實施例中之散熱器主體30之表面大 致保持平坦,但於其他實施例中亦可加以改變。例如,對 於仍採用諸如散熱風扇之散熱元件(未圖示)的電子裝置 >來說,亦可順應該散熱元件之形狀設置該散熱器主體 30,形成一連通於該第一發熱元件4〇以及該散熱元件之 間的流道,以引導散熱氣流之流向。 μ 該開口部31係一體形成於該散熱器主體3〇。於本, 施例中,該電路板4復設有例如高度大於該第一發熱元^ 40之το件41 ’該元件41可為例如電容、電阻、連接埠 雷對應該70件41而設置。如此,當該散熱器 > :該電路板4上方時’可令㈣件4!對應穿過該開 口31 #以露出;換言之,裝設該散熱H 3至該電路括 ,4後’並不會佔用該殼體之高度。而且 本創作係應用殼體内該電路板4已:二圖所不, 置該散熱器3,不合购,二用之佈局空間來設 不曰4到該電路板4之原有佈局。 於兮第般來說,該^路板4會設有—些發熱量相對 於該弟-發熱元件4。為小之第 相對 例如南橋、北橋”笙a ”未圖不), 小,發熱量亦Λ第二發熱元件功耗較 才相對“’错由空氣對流來進行散熱即可; 10 M336472 此外’該第二發熱元件亦可為無法直接貼靠於該散熱器^ = 件,換言之,此種第二發熱元件係與該散熱器^ :下表面在南度上具有間隙,而無法直接由該散熱器主體 3〇進行散熱者。因此,該開口部31亦可對應此類第二發 …'凡件而δχ置’以使熱量經由該開口部31達到該散熱器 '主體30之上方,透過空氣的自然流動將熱能帶走。而且, 該開口部31之設置數量並非侷限於本實施例中所述者, 亦即’不必與該等元件4卜前述元件或其他元件一一對 #應;例如,可將某些開口部31尺寸設計得較大,且形狀 不疋要對應於該等元件41或其他元件,以同時露出相 鄰之複數元件4:1、前述第二發熱元件或其他元件,以便 於簡化該散熱器3之結構。 該固疋邛33係一體形成於該散熱器主體3〇。於本實 施例中,該固定部33係例如為開孔,可供該電子裝置之 设體中例如下殼之固定柱(stand〇f f )(未圖示)支撐、 鲁或者供殼體中例如上蓋之固定部穿過,而可選擇對應該上 .盍或該下殼中用於固定該電路板4之固定結構而設置,以 •夾設於該上蓋與該下殼之間。於本實施例中,該固定部 33係為例如十字型開孔,且主要設於該散熱器3之邊緣 (即,該散熱器主體30之邊緣),以相對於該電路板4 之結構進行固定;然,應知此係對應用於固定該電路板4 之固定結構而設置者,但並非以此限制本創作。 再者’於本實施例中復可於該散熱器主體3〇及該第 一發熱元件40之間塗佈具黏性之導熱材料作為結合部 11 M336472 (未圖示),忒結合部例如為散熱膏、導熱塾、散熱石夕勝 等,但非侷限於此。由於該散熱器主體3〇比較輕薄,故 僅依靠該結合部之黏性就足以結合該散熱器主體3〇至該 第一發熱元件40。同時,由於該類結合技術係為所屬技 '術中具有通常知識者所能理解及實施者,故於此不再另繪 _ 圖式作說明。 % 由於本創作係設計平板化之散熱器,將習知之散熱器 展開為大片散熱為主體30’該第一發熱元件々ο之局部 ♦熱量可藉由大面積之散熱器主體3〇傳導而擴散開來,故 一方面充分利用了殼體内的空間,另一方面更可均勻散 熱。同時,由於本創作之散熱器3結構簡單,不僅製造容 易,且相對可降低成本。此外,本創作係設計該開口部 31 ’除了可避免安裝過程中與其他元件發生干涉,更可利 用該開口部31根據冷空氣比熱空氣重的原理,使熱量透 過該開口部31自然地往上升。 … 鲁 相較於習知技術,本創作之散熱器係透過大面積舖展 -於電路板之上,將該電路板之第一發熱元件產生的熱量通 .過傳導而均勻散熱,達到既不影響佈局空間,且又增大散 熱面積以迅速散熱之效果,避免習知技術中出現局^高^ 之問題。 狐 同時,由於本創作之散熱器的散熱面積較習知散敎技 ,大上許多,亦利於提升散熱效率。此外,本創作之散敎 益結構簡單且製作方便’成本低廉。而且,應用本創作^ 會增加電子裝置殼體之高度,且相對可薄型化,符合設計 12 M336472 要求。另外,無論電子裝置 熱元件,皆可使用本創作, 領域。 中是否使用諸如散熱風扇之散 故本創作具有廣泛之產業應用 上述實_僅例示性說日林創作之原理及其功效,而 ' i限制本創作。任何熟習此項技藝之人士均可在不違 本4 i之精神及範’下,對上述實施例進行修飾與改 ^因此’本創作之權利保護範_,應如後述之申請專利 範圍所列。 ⑩【圖式簡單說明】 第1圖係為習知散熱技術之應用示意圖; 第2圖係為本創作之散熱器一實施例之結構示意圖; 弟3圖係為第2圖之散熱器應用於電子裝置殼體中的 電路板上之示意圖;以及 第4圖係為沿第3圖之A-A線段剖開之剖視圖。 【主要元件符號說明】 1、4 電路板 10、40 第一發熱元件 2 散熱器 21 散熱鰭片 3 散熱器 30 散熱器主體 31 開口部 33 固定部 41 元件 13Unit's CPU), the surface of the exotherm 2 is aligned with the first heating element 10 and fixed to the circuit board, and the other surface is provided with a plurality of upwardly extending 5 M336472 heat sink fins 0 21 so that From the natural flow of air to disperse but 'to make the product more light and thin, set the circuit board = the shell height is limited, relatively restrict the flow speed of the air, plus the function of this type - the first heat 70 The splicing increases the power consumption and increases the amount of hair, so it is easy to cause the temperature of the casing above the radiator 2. At the same time, such a heat-dissipating technique with local high temperature is likely to cause damage to the externally inserted components due to the entanglement of the enthalpy, thereby affecting the normal use of the product. Moreover, when a local high temperature occurs, the surrounding temperature is relatively low, which may also cause the casing to be deformed. In addition, the new patent of Taiwan Patent Certificate No. 258331 proposes a heat dissipation structure of a fanless power supply, which is mainly provided with a plurality of heat conducting blocks vertically disposed on the circuit board, and then the heat sink having a plurality of through slots is screwed to the circuit board. The heat dissipating member is fixed on the top surface of the circuit board, and the inner side surface of the heat dissipating member is closely attached to the top surface of the plurality of heat conducting blocks, and the convection channel formed between the heat dissipating member and the circuit board is performed. Cooling. However, this patented technology must be provided with a plurality of thermal blocks perpendicular to the board. Since it is not possible to effectively reduce the height of the housing, it does not meet the design requirements of today. At the same time, setting these thermal blocks will inevitably change the layout design of the components on the board, and estimate the space for layout; in other words, this technology will greatly reduce the space available for layout wiring and affect the function of the entire device. In addition, due to the complex structure of this technology, manufacturing difficulty and cost are relatively advanced. In addition, for electronic devices that still use heat-dissipating components such as cooling fans, this technology cannot be used for heat dissipation, and the scope of the industry is limited to 6 M33 6472. The above-mentioned conventional technologies and patents are not mentioned: The second heat-generating component such as a chip is radiated; therefore, although the power consumption of the bridge element is small, the heat generation amount is relatively small, but when the number of components is less than 5%, the heat energy generated may not be too small. ^ 遂 导热 导热 导热 导热 导热 遂 遂 遂 遂 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此_ [New content] A kind of heat dissipation is the shortcoming of the above-mentioned conventional technology. This creation is a provider that can conduct heat evenly and effectively avoid local high temperature. One object is to provide a heat sink with a simple structure. The re-creation of this creation - the purpose is to provide a radiator that is easy to manufacture. = Create, and again - the goal is to provide a cost-effective (one effective) radiator. Another object of the present invention is to provide a housing height of the _ seeding (four) smashing device, which is relatively thinner. It is helpful and fine. In order to achieve the above and other purposes, the creation department provides a kind of crying, which is applied to the first heating element of the circuit board, and (4) the first-heating component enters the lamp to dissipate heat, which is characterized by The heat dissipation (four) is in the form of a flat plate, and the area is larger than the area covering the first heat generating component, and (4) the heat energy generated by the diffusion element, and thereby reducing the space height occupied. In the above heat sink, the heat sink is a metal flat plate, and the heat sink includes a heat sink body that abuts against the first heat generating component, and M336472 is integrally formed on the heat sink main body, The number of openings in the μ ^ version. The circuit board is provided with a height greater than that of the first heat-generating component. The opening portion can be disposed corresponding to the component, and of course, in other capitals, the bucket can be connected to the bucket 0 days r to Mm / The opening portion may be provided for the heating element of the younger brother, and the component may be a heating element having a small amount of heat generation. The heat sink may further include a fixing portion formed on the heat sink main body, and the fixing portion may be, for example, an opening, wherein the fixing portion may be optionally disposed on the heat sink body, and at this time, the fixing portion is Can be selected as a cross-shaped opening. The heat sink body and the first-reducing member may have a joint portion, wherein the joint portion is, for example, a heat-dissipating heat-dissipating heat-dissipating pad or a heat-dissipating gel. Preferably, the area of the heat sink is greater than the area of the circuit board. Μ Compared with the prior art, the heat sink of the present invention can use the flat-heating component of the flat plate to achieve the effect of not affecting the layout space and increasing the heat dissipation area, so as to solve the local problem of the conventional technology. The problem of ancient π. At the same time, the application of this creation system uses the existing space to set up the divergence: / the dish is more conventional than the conventional technology to superimpose the heat sink on the first heating element to thicken the skirt and set.敕 • Body volume, the space height occupied by this creation can be reduced. In addition, the heat sink structure of this creation is simple and system-made. low. % Costs [Embodiment] The following is a description of the specific examples by the specific examples. 1. The person skilled in the art can understand the other advantages and effects of the present invention by the contents disclosed in the present specification. 2. Please refer to Figure 2 for the structure of the heat sink of this creation. 8 M336472. As shown in Fig. 2, the heat sink 3 of the present invention includes a heat sink main body 30, and a plurality of openings 31 and fixing portions 33 provided in the heat sink main body 3. In this embodiment, the heat sink 3 is made of, for example, a metal flat plate unfolded by a material, and the heat sink main body 'go, the plurality of openings 31, and the fixing portion 33 are integrally stamped and formed; however, it should be understood that , 忒 Radiator 3 series can be a light-weight, thermally conductive metal. The thin plate made of gold, of course, such as gold, silver, town, copper = its heat = metal, alloy, non-metal is also suitable for This creation, but not limited to 1, is described in this embodiment. Please refer to Figures 3 and 4 for the design of the heat sink 3 for the circuit board 4 in the housing (both not shown) of the electronic device: For comparison, the circuit board & 2 is similar to the circuit board 1 shown in FIG. 1 , for example, the position of the 40 thermal components is the same. The first heating element of the embodiment may also be Central processor 'But it should be noted that this creation is not limited to this. As two! The heat sink main body 3° is abutted against the first meaning of the circuit board 4, and the surface 40 is substantially captured, and the surface is substantially captured to be equal to the Thunder 4^ hole to maintain the thousand tan, and the area thereof can be small. Medium and second are not limited to this. For example, in other embodiments, the area of the main body 3 can be larger than that of the circuit board 4, so that the heat dissipation 3 is in contact with the strong thermal conductivity; and the heat sink can be made to conduct the casing f of the tweezers. Phase C is not shown), in order to perform heat through the chassis, as shown in the figure 4, the heat sink main I# training eve heart board 4 on the Han brother has a heating element 40, the product is larger than the first heating element Zone 40, M336472 domain' and surface contacts the first heating element 40 to provide uniform heat dissipation over a large heat dissipation area. In other words, the area of the heat sink 3 is larger than the area covering the first heat generating element 40 and less than or equal to the circuit board 4 for diffusing the heat energy generated by the first heat generating element 40. Therefore, even if the heat radiating element of the heat dissipating fan is not used and only a weak air current is used, the heat can be effectively removed. It should be understood that the surface of the heat sink body 30 in this embodiment is generally kept flat, but may be modified in other embodiments. For example, for an electronic device that still employs a heat dissipating member (not shown) such as a heat dissipating fan, the heat sink main body 30 may be disposed in a shape corresponding to the heat dissipating member to form a communication with the first heat generating element. And a flow path between the heat dissipating elements to guide the flow of the heat dissipating airflow. μ The opening 31 is integrally formed in the heat sink body 3〇. In the embodiment, the circuit board 4 is provided with, for example, a height 41 that is greater than the first heat generating element 40. The component 41 can be disposed, for example, as a capacitor, a resistor, and a connection 70. Thus, when the heat sink > is above the circuit board 4, the (four) piece 4! can be correspondingly passed through the opening 31# to be exposed; in other words, the heat dissipation H3 is installed to the circuit, and after 4' Will occupy the height of the housing. Moreover, the circuit board 4 in the application housing of the present invention has been disposed in the second embodiment: the heat sink 3 is not provided, and the layout space for the second use is not set to the original layout of the circuit board 4. In the general case, the circuit board 4 will have some heat generation relative to the younger-heating element 4. For the small relatives such as the South Bridge, the North Bridge "笙a" is not shown), small, the heat is also the second heating element power consumption is relatively "relative to air convection for heat dissipation; 10 M336472 In addition The second heating element may also be incapable of directly contacting the heat sink, in other words, the second heating element and the lower surface of the heat sink have a gap in the south, and cannot be directly used by the heat sink. The main body 3 〇 is configured to dissipate heat. Therefore, the opening portion 31 may also correspond to the second type of the second portion to allow heat to reach above the main body 30 of the radiator through the opening portion 31, and the air is permeable. The natural flow carries away the thermal energy. Moreover, the number of the openings 31 is not limited to that described in the embodiment, that is, 'there is no need to pair with the components 4 or the other components. Certain openings 31 may be sized larger and do not correspond to the elements 41 or other elements to simultaneously expose adjacent plurality of elements 4:1, the aforementioned second heating elements or other elements so that To simplify the heat dissipation The structure of the heat sink 33 is integrally formed in the heat sink body 3. In the embodiment, the fixing portion 33 is, for example, an opening, which can be fixed in the body of the electronic device, for example, the lower case. A column (stand ff ) (not shown) supports, ruins or passes through a fixing portion of the housing, for example, an upper cover, and may select a fixed structure corresponding to the upper or lower case for fixing the circuit board 4 The fixing portion 33 is, for example, a cross-shaped opening, and is mainly disposed at an edge of the heat sink 3 (ie, the heat dissipation) is disposed between the upper cover and the lower case. The edge of the main body 30 is fixed with respect to the structure of the circuit board 4; however, it should be understood that this is provided corresponding to the fixing structure for fixing the circuit board 4, but the present invention is not limited thereto. In the present embodiment, a viscous heat conductive material is applied between the heat sink body 3 and the first heat generating component 40 as a bonding portion 11 M336472 (not shown), and the 忒 bonding portion is, for example, a thermal grease. , thermal conductivity, heat dissipation, etc., but not limited to this. Because of the heat dissipation The body 3 is relatively thin and light, so that the adhesiveness of the joint portion alone is sufficient to bond the heat sink body 3 to the first heat generating component 40. At the same time, since the bonding technology is a technique of the prior art It can be understood and implemented, so it is not illustrated here. Illustrated as a figure. % Since this creation department designs a flat-shaped heat sink, the conventional heat sink is expanded into a large heat sink as the main body 30'. ο Part ♦ The heat can be diffused by the large-area heat sink body 3〇, so on the one hand, the space inside the casing is fully utilized, and on the other hand, the heat can be uniformly dissipated. At the same time, due to the heat sink of the creation 3 The structure is simple, not only easy to manufacture, but also relatively low in cost. In addition, the present invention designs the opening portion 31' to avoid interference with other components during installation, and the opening portion 31 can be utilized to be colder than hot air. The principle is such that heat is naturally raised through the opening portion 31. ... Lu is more than the conventional technology, the heat sink of this creation is spread over a large area - on the circuit board, the heat generated by the first heating element of the circuit board is passed through the conduction and evenly dissipated, reaching neither Affect the layout space, and increase the heat dissipation area to quickly dissipate heat, avoiding the problem of high-level ^ in the prior art. Fox At the same time, because the heat sink area of this creation is much better than the conventional technology, it is also beneficial to improve the heat dissipation efficiency. In addition, the creation of this creation is simple and easy to manufacture, and the cost is low. Moreover, the application of this creation ^ will increase the height of the electronic device housing, and relatively thin, in line with the design requirements of 12 M336472. In addition, this creation can be used regardless of the thermal components of the electronic device. Whether or not to use such a dissipative fan, this creation has a wide range of industrial applications. The above is only an example of the principle and function of Rilin's creation, and 'i limits this creation. Anyone who is familiar with the art can modify and modify the above embodiments without violating the spirit and scope of this article. Therefore, the scope of protection of this creation should be as listed in the patent application scope mentioned later. . 10 [Simple description of the drawing] Fig. 1 is a schematic diagram of the application of the conventional heat dissipation technology; Fig. 2 is a schematic structural view of an embodiment of the heat sink of the present invention; A schematic view of a circuit board in the housing of the electronic device; and FIG. 4 is a cross-sectional view taken along line AA of FIG. [Description of main component symbols] 1, 4 Circuit board 10, 40 First heating element 2 Heat sink 21 Heat sink fin 3 Heat sink 30 Heat sink body 31 Opening part 33 Fixing part 41 Element 13

Claims (1)

M336472 九、申請專利範圍: κ 一種散熱器,係應用貼靠於電路板之第一發熱元件, 以對該第一發熱元件進行散熱,其特徵係在於:該散 熱器係呈平板結構,且面積大於涵蓋該第一發熱元件 之區域。M336472 IX. Patent application scope: κ A heat sink is applied to the first heat-generating component of the circuit board to dissipate heat from the first heat-generating component. The feature is that the heat sink has a flat structure and an area. Greater than the area covering the first heating element. 如申請專利範圍第1項之散熱器,其中,該散熱器係 為金屬平板。 如申請專利範圍第i項之散熱器,其中,該散熱器係 包括貼靠於該第一發熱元件之散熱器主體、以及一體 形成於該散熱器主體之複數開口部。 如申請專利範圍第3項之散熱器,其中,該散熱器主 體及該第-發熱元件之間係具有結合部。 如申請專利範圍第4項之散熱器,其中,該結合部係 為政熱賞、導熱塾、散熱石夕膠之其中一者。 =請專利範11第3項之散熱/,、其中,該電路板設 南度大於該第一發熱元件之元件,該開口部則對應 該元件而設置。 =請專圍第3項之散熱器,其中,該電路板設 =-發熱70件,該開口部則對應該第二發熱元件而 §又置。 :申請專利範圍第1項之散熱器,其中,該散敎哭係 :括貼靠於該第一發熱元件之散熱器主體、以及一體 形成於該散熱器主體之固定部。 如申請專利範圍第8項之散熱器,其中,該固定部係 14 M336472 為開孔。 10. 如申請專利範圍第8項之散熱器,其中,該固定部係 設於該散熱器主體之邊緣。 11. 如申請專利範圍第10項之散熱器,其中,該固定部 係為十字型開孔。 12. 如申請專利範圍第1項之散熱器,其中,該散熱器之 面積大於該電路板之面積。The heat sink of claim 1, wherein the heat sink is a metal flat plate. The heat sink of claim i, wherein the heat sink comprises a heat sink body that abuts the first heat generating component, and a plurality of openings integrally formed in the heat sink body. The heat sink of claim 3, wherein the heat sink body and the first heat generating element have a joint therebetween. For example, in the heat sink of claim 4, the joint portion is one of a hot heat, a heat conductive crucible, and a heat dissipating gel. = Please refer to the heat dissipation of the third item of Patent No. 11, wherein the circuit board is set to be larger than the element of the first heating element, and the opening is provided corresponding to the element. = Please use the radiator of item 3, where the board is set to - 70 heat, and the opening corresponds to the second heating element. The heat sink of claim 1, wherein the heat sink body comprises: a heat sink body that abuts against the first heat generating component; and a fixing portion integrally formed on the heat sink body. The heat sink of claim 8, wherein the fixing portion 14 M336472 is an opening. 10. The heat sink of claim 8, wherein the fixing portion is attached to an edge of the heat sink body. 11. The heat sink of claim 10, wherein the fixing portion is a cross-shaped opening. 12. The heat sink of claim 1, wherein the heat sink has an area greater than an area of the circuit board. 1515
TW97202831U 2008-02-18 2008-02-18 Heat sink TWM336472U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483672B (en) * 2011-08-30 2015-05-01 Apple Inc Electronic device enclosures and heatsink structures with thermal management features

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483672B (en) * 2011-08-30 2015-05-01 Apple Inc Electronic device enclosures and heatsink structures with thermal management features
US9095076B2 (en) 2011-08-30 2015-07-28 Apple Inc. Electronic device enclosures and heatsink structures with thermal management features

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