TWM495714U - Shielding structure for electronic device to prevent EMI - Google Patents

Description

Electronic component anti-EMI shielding structure

The present invention relates to an anti-electromagnetic interference structure, and more particularly to an anti-electromagnetic interference shielding structure of an electronic component having a heat dissipation function.

A general electronic device such as a mobile phone, a tablet computer or other electronic device or the like is equipped with a plurality of electronic components. When the electronic device operates or operates, the electronic components generate a certain degree of electromagnetic field, and the electromagnetic field generated by the electronic components Interference and blocking will occur, which will affect the normal operation of electronic equipment, and electromagnetic waves will also cause external damage to the human body. This phenomenon is called EMI (Electro Magnetic Interference).

At present, the general methods for preventing EMI include water plating, electric plating, vacuum sputtering, and spraying of conductive paint, or directly attached to the outside of the electronic component and an appropriate electromagnetic mask of the metal material to shield the electromagnetic wave, and the metal component is shielded. The method is the most costly and complies with current environmental regulations, so it is most commonly used; the common electromagnetic shielding structure is a one-piece cover or cover made of metal such as stainless steel, aluminum foil, iron or aluminum-magnesium alloy. The body has a top wall and a support (side) wall extending perpendicularly from the periphery of the top wall. In use, the cover is covered (or covered) outside the electronic component to be shielded, and the support wall is fixed to the circuit board by soldering or the like.

However, the conventional electromagnetic shielding structure has only a function of shielding electromagnetic waves. But in fact, when the electronic components are operated or used, in addition to electromagnetic waves, in actual use, the electronic components will still generate heat during operation, and the heat is concentrated in the cover body and cannot be dissipated outward, and the metal material is electromagnetic. The heat transfer speed of the mask structure is too slow, that is, the cover body cannot efficiently transfer the heat generated by the electronic components outward, which will cause the heat generated by the electronic components to continuously increase, resulting in a short life of the electronic components covered by the cover. Or reduced performance. Therefore, how to achieve the best electromagnetic shielding effect and excellent heat dissipation effect is the subject of this creation.

In view of the above problems, the purpose of the present invention is to provide an EMI shielding structure for an electronic component that achieves an optimal electromagnetic shielding effect and has excellent heat dissipation efficiency.

Another object of the present invention is to provide an EMI shielding cover structure for an electronic component, the top of which has a capillary structure and a working fluid inside the chamber for excellent heat dissipation.

To achieve the above objective, the present invention provides an electronic component anti-EMI shielding structure, comprising: a cover having a top portion, the top portion forming a chamber, the interior of the chamber being provided with at least one capillary structure, a working fluid volume Located within the chamber, the top portion contacts at least one electronic component.

In one embodiment, the top portion has a plate body and a cover plate disposed on an upper side or a lower side of the plate body, and the plate body and the cover plate are spaced apart, the chamber is located at the plate body and the Between the covers.

In one embodiment, the cover body further includes a side portion extending perpendicularly from the periphery of the top portion, and a mask space is defined below the top portion for receiving the at least one electronic component.

In an implementation of the cover plate on the upper side of the plate body, the plate system contacts the electronic component.

In a implementation, the cover plate is located on a lower side of the plate body, and the cover plate contacts the electronic component.

In one embodiment, the plate body has a plurality of side edges, and the side portions are bent downward from the side edges and formed to extend vertically.

The top portion and the side portion are made of an electromagnetic wave preventing material.

In one implementation, the anti-electromagnetic wave material comprises a metal.

In a implementation of the top corresponding plurality of electronic components, and the heights of the electronic components are different, the top portion corresponds to a position of the electronic component having a low height to form a convex portion contacting the electronic component.

In one implementation the chamber has a recess corresponding to the top of the projection.

10‧‧‧ cover

11‧‧‧ top

111‧‧‧ board

111a~111d‧‧‧ side edge

1111‧‧‧ convex

112‧‧‧ Cover

1121‧‧‧ convex

113‧‧‧ chamber

1131‧‧‧ recess

114‧‧‧ inner wall

115‧‧‧Capillary structure

12‧‧‧ side

13‧‧‧Mask space

116‧‧‧Working fluid

100‧‧‧ Grounding

20‧‧‧ boards

201‧‧‧ Grounding Hole

30‧‧‧Electronic components

30a‧‧‧First electronic component

30b‧‧‧Second electronic components

The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are described in detail by reference to the specific embodiments herein,

1A is a perspective exploded view of at least one electronic component of the creation cover;

1B is a partial enlarged view of FIG. 1A;

1C is a partial enlarged view of FIG. 1A;

2A is a schematic cross-sectional view showing at least one electronic component of the creation cover;

2B is a partial enlarged view of FIG. 2A;

Figure 3A is a schematic cross-sectional view of the creation;

3B is a partial enlarged view of FIG. 3A;

Figure 3C is a schematic view of another embodiment of the capillary structure;

FIG. 4A is a schematic cross-sectional view showing a plurality of electronic components of the creation cover;

Figure 4B is a partial enlarged view of Figure 4A;

Figure 5A is a schematic cross-sectional view showing another embodiment of the present creation;

Figure 5B is a partial enlarged view of Figure 5A;

FIG. 6A is a schematic cross-sectional view showing another embodiment of the present invention for covering at least one electronic component;

Figure 6B is a partial enlarged view of Figure 6A;

Figure 6C is a schematic view of another embodiment of the capillary structure;

FIG. 7A is a schematic cross-sectional view showing another embodiment of the present invention for arranging a plurality of electronic components;

Fig. 7B is a partially enlarged schematic view of Fig. 4A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, preferred embodiments of the invention will be described with reference to the accompanying drawings, in which

1A is a perspective exploded view of at least one electronic component of the creation cover; FIG. 1B is a partial enlarged view of FIG. 1A; FIG. 1C is a partial enlarged view of FIG. 1A; FIG. 2B is a partial enlarged view of FIG. 2A; FIG. 3A is a schematic cross-sectional view of the creation; FIG. 3B is a partial enlarged view of FIG. 3A; Figure 3C is a schematic illustration of another embodiment of a capillary structure. The cover 10 is used to cover and shield at least one electronic component 30 on the circuit board 20 to shield electromagnetic waves. The bottom of the cover 10 is provided with a plurality of grounding ends 100. The circuit board 20 is provided with a plurality of grounding holes 201. The cover 10 is coupled to the grounding holes 201 through the grounding terminals 100 and soldered to the circuit board 20.

The cover body 10 includes a top portion 11 and a side portion 12 extending perpendicularly from the top periphery. The top portion 11 has a plate body 111 and a cover plate 112. The plate body 111 and the cover plate 112 are spaced apart from each other. The chamber 113 is located between the plate body 111 and the cover plate 112, and the periphery of the plate body 111 and the cover plate 112 are sealed and combined. In the present embodiment, the cover plate 112 is disposed on an upper side of the plate body 111, but in other embodiments (described later), the cover plate 112 is disposed on the lower side of the plate body 111. The plate body 111 has a plurality of side edges 111a-111d. A capillary structure 115 is disposed in the chamber 113. A working fluid 116 is received in the chamber 113.

The chamber 113 is in a vacuumed state and injected into the working fluid 116. The capillary structure 115 is formed, for example but not limited to a metal powder sintered on at least one inner wall 114 of the chamber 113. The capillary structure 115 has The porous structure provides a capillary force to drive the working fluid 116. In the present embodiment, the capillary structure 115 is formed on the upper and lower sides of the inner wall 114 of the chamber 113, but in another embodiment, as shown in Fig. 3C, the capillary structure 115 is formed only under the inner wall 114. Side (this figure shows the upper side of the plate body 111). The working fluid 116 is, for example but not limited to, pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, organic compounds, or mixtures thereof.

The side portion 12 extends vertically along the periphery of the top portion 11 and defines a mask space 13 below the top portion 11 for receiving the electronic component 30. In detail, in the implementation of the side portion 12 The plurality of side edges 111a to 111d of the plate body 111 are bent downward and vertically extended, and in the other embodiment, the side portions 12 are vertically connected to the plurality of side edges 111a to 111d of the plate body 111. The grounding end 100 is disposed at the end of the side portion 12 for fixing and forming a grounding use. The top portion 11 and the side portion 12 are made of an electromagnetic wave preventing material, and a common electromagnetic wave preventing material includes a metal such as stainless steel, aluminum, iron or aluminum magnesium alloy.

Furthermore, in the present embodiment, the plate body 111 of the top portion 11 faces the mask space 13 as a heat receiving side (or evaporation end) for absorbing heat generated by the electronic component, and the cover plate 112 of the top portion 11 contacts the external environment. The air acts as a heat dissipating side (or condensing end) for transferring heat absorbed by the plate body 111 to the external environment for heat dissipation.

As shown in FIG. 2A, after the cover 10 covers the electronic component 30 on the shield circuit board 20, the electronic component 30 is housed in the mask space 13, and the body 111 of the top portion 11 of the cover 10 is flanked. The electronic component 30 is in contact with a top surface of the electronic component 30. The electromagnetic wave generated when the electronic component 30 operates is blocked in the cover body 10, especially since the electromagnetic wave generated by the electronic component 30 has the strongest strength on the top surface thereof, and the structure of the top portion 11 of the cover body 10 can be optimally utilized. The shielding effect shields the electromagnetic waves of the electronic component 30. At the same time, electromagnetic waves generated by other electronic components outside the cover 10 can be shielded to prevent electromagnetic wave interference.

Moreover, the heat generated by the electronic component 30 is absorbed by the plate body 111, so that the working fluid 116 in the chamber 113 is evaporated into steam by heat and then brought to the cover plate 112. When the steam contacts the cover plate 112, the heat is outward. During the ambient air transfer, the steam condenses into a liquid to return to the plate body 111 via the capillary structure 115, the liquid-vapor two-phase change circulating through the working fluid 116 in the chamber 113, and the plate body 111 of the vapor and liquid at the top portion 11 and The convection of the vapor returning between the cover plates 112 achieves a rapid heat dissipation effect.

4A is a schematic cross-sectional view of a plurality of electronic components of the creation cover; and FIG. 4B is a partially enlarged schematic view of FIG. 4A. As shown, the cover 10 can also cover and shield a plurality of electronic components on the circuit board 20, such as the first electronic component 30a and the second electronic component 30b, to shield electromagnetic waves of the electronic components 30a, 30b. Moreover, in one implementation, each of the plurality of electronic components has a different height, and in order to contact the board 111 of the top portion 11 of the cover 10 with each electronic component, the respective electrons corresponding to the board 111 The height of the component position can be adjusted, for example, forming a convex portion corresponding to a shorter height electronic component, the convex portion having a convex distance complementary to the height of the electronic component to contact a top surface of the electronic component. The chamber 113 has a recess corresponding to the projection.

For example, the height of the first electronic component 30a is higher than the height of the second electronic component 30b, and the plate body 111 of the cover 10 is formed with a convex portion 1111 corresponding to the position of the second electronic component 30b, and the convex portion 1111 is convex. The extension is connected to the top surface of the second electronic component 30b. The position of the chamber 113 corresponding to the convex portion 1121 may form a concave portion 1131 or a flat surface. The first electronic component 30a and the second electronic component 30b are dissipated by such a structure.

Please refer to FIG. 5A for a schematic cross-sectional view of another embodiment of the present invention; FIG. 5B is a partial enlarged view of FIG. 5A; FIG. 6A is a cross-sectional view of at least one electronic component of another embodiment of the present invention. Fig. 6B is a partial enlarged view of Fig. 6A; Fig. 6C is a schematic view showing another embodiment of the capillary structure. The present embodiment is substantially the same as the previous embodiment, and the same components are denoted by the same reference numerals. The difference between the present embodiment is that the cover plate 112 is disposed on the lower side of the plate body 111. The cover plate 112 faces the mask space 13 as a heat receiving side (or an evaporation end) for absorbing heat generated by the electronic component, and the plate body 111 of the top portion 11 contacts the air of the external environment as a heat dissipating side (or The condensing end) is used to transfer the heat absorbed by the cover 112 to the external environment for heat dissipation.

As shown in FIG. 6A, after the cover 10 covers the electronic component 30 on the shielded circuit board 20, the electronic component 30 is housed in the mask space 13, and the cover 112 of the top portion 11 of the cover 10 is covered. The electronic component 30 is in contact with a top surface of the electronic component 30. In addition to shielding the electromagnetic waves generated by the electronic component 30, the cover 10 transfers heat generated by the electronic component 30 to the cover plate 112. The working fluid 116 in the chamber 113 is vaporized by heat and then transferred to the plate body 111 when the steam contacts. When the plate body 111 is heated, the heat is transferred to the ambient air, and the steam is condensed into liquid to return to the cover plate 112 via the capillary structure 115, and the liquid-vapor two-phase change circulating through the working fluid 116 in the chamber 113, and the vapor and the liquid The convection of the vapor return between the cover 112 of the top portion 11 and the plate body 111 achieves a rapid heat dissipation effect.

In the present embodiment, the capillary structure 115 is formed on the upper and lower sides of the inner wall 114 of the chamber 113, but in another embodiment, as shown in Fig. 6C, the capillary structure 115 is formed only under the inner wall 114. Side (this figure shows the upper side of the cover 112).

7A is a schematic cross-sectional view of another embodiment of the present invention, and FIG. 7B is a partial enlarged view of FIG. 7A. As shown, the cover 10 can also cover and shield the plurality of electronic components on the circuit board 20 at the same time.

In summary, the above-mentioned structure can achieve the best electromagnetic shielding effect by the above structure, and can improve the heat dissipation efficiency of electronic components.

Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.

10‧‧‧ cover

11‧‧‧ top

111‧‧‧ board

112‧‧‧ Cover

113‧‧‧ chamber

114‧‧‧ inner wall

115‧‧‧Capillary structure

116‧‧‧Working fluid

12‧‧‧ side

13‧‧‧Mask space

100‧‧‧ Grounding

20‧‧‧ boards

30‧‧‧Electronic components

Claims (7)

[Item 1] An EMI shielding structure for an electronic component covers or shields at least one electronic component, the shielding structure comprising: a cover having a top portion and a side portion extending perpendicularly from the top periphery, the top configuration having a chamber The interior of the chamber is provided with at least one capillary structure, a working fluid is received in the chamber, and the top portion contacts the at least one electronic component. [Item 2] The EMI shielding structure of the electronic component of claim 1, wherein the top has a plate body and a cover plate, the cover plate is disposed on an upper side or a lower side of the plate body, and the plate body and the cover plate are The spacing is set, and the chamber is located between the plate body and the cover plate. [Item 3] The EMI shielding structure of the electronic component of claim 2, the side portion defining a mask space under the top portion for accommodating the at least one electronic component. [Item 4] The EMI shielding structure of the electronic component of claim 3, wherein the cover is located on an upper side of the board, the board system contacting the electronic component. [Item 5] The shielding structure for preventing EMI of an electronic component according to claim 3, wherein the cover is located on a lower side of the board, and the cover contacts the electronic component. [Item 6] The shielding structure for preventing EMI of an electronic component according to claim 4 or 5, wherein the top portion can simultaneously contact the plurality of electronic components. [Item 7] The shielding structure for preventing EMI of an electronic component according to claim 6, wherein the top portion is formed with at least one convex portion contacting at least one electronic component having a low height among the electronic components due to different heights of the electronic components.