CN210781849U - Heat sink combination structure - Google Patents
Heat sink combination structure Download PDFInfo
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- CN210781849U CN210781849U CN201921356667.XU CN201921356667U CN210781849U CN 210781849 U CN210781849 U CN 210781849U CN 201921356667 U CN201921356667 U CN 201921356667U CN 210781849 U CN210781849 U CN 210781849U
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- heat sink
- plate body
- heat
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Abstract
The utility model provides a heat abstractor integrated structure contains: a first plate body, a second plate body and a combination part; the first plate body is provided with a first side and a second side; the second plate body is provided with a third side and a fourth side, the third side is correspondingly covered with the first side, the first plate body and the second plate body jointly define a closed chamber, the fourth side is provided with a heated part, and the heated part is in contact heat conduction with at least one heating source; the combination component is arranged adjacent to the heated part and is combined with the heating source, and the combination component is directly connected with the heat dissipation device and the heating source, so that the heat dissipation device and the heating source have tighter combination degree to prevent thermal resistance from generating, and the heat dissipation device is not penetrated through, and vacuum leakage of the heat dissipation device can be prevented.
Description
Technical Field
The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly that can be tightly coupled to a heat source without penetrating the heat sink assembly having an airtight chamber.
Background
As the performance of the existing electronic devices is improved, the electronic components for processing signals and calculating generate higher heat than the previous electronic components, and the most commonly used heat dissipation components include heat pipes, heat sinks, temperature equalization plates, etc. by directly contacting the electronic components that generate heat, the heat dissipation performance is further improved, thereby preventing the electronic components from being burnt due to over-high temperature.
The temperature equalizing plate is applied to heat conduction from surface to surface in a larger range, is different from a point-to-point heat conduction mode of a heat pipe, and is suitable for being used in places with narrow space.
The prior art mainly relates to a part of a temperature-equalizing plate which avoids a cavity, namely four couples outside the closed part of the temperature-equalizing plate are respectively provided with a through hole and a copper column with internal threads, the position of the substrate corresponding to the copper column arranged on the temperature-equalizing plate is provided with at least one hole, and then the temperature-equalizing plate is fixed on the substrate by simultaneously penetrating the copper columns and the holes in a screw locking way through a screw locking element, but the copper column is arranged at the four couples of the temperature-equalizing plate in a fixing way, so that the temperature-equalizing plate is far away from the heating element and cannot be tightly attached to the heating element after being fixed, and a thermal resistance phenomenon is generated; in order to solve the problem that the copper pillars cannot be tightly attached to the heat generating element, the copper pillars are directly and correspondingly arranged at the positions adjacent to the positions where the temperature equalizing plate and the heat generating element are attached to each other, so that the copper pillars directly penetrate through the positions where the temperature equalizing plate has the cavity, although the tightness can be increased to prevent the thermal resistance phenomenon during assembly, the cavity of the temperature equalizing plate loses air tightness after being broken by the penetration of the copper pillars, the cavity is no longer in a vacuum state, and the flow path of working fluid inside the cavity is possibly blocked due to the fact that the copper pillars penetrate through and break the cavity, so that the heat transfer efficiency is reduced, even leakage can be generated seriously, and the temperature equalizing plate loses the heat transfer effect.
Further, U.S. patent nos. 7066240 and 6302192 and 7100680 disclose a vapor chamber structure 5 referring to fig. 9 and 10 of the U.S. patent, a body 51 has a first plate 511 and a second plate 512 separated from each other, and an outer protrusion 513 is provided at the periphery of the body such that the outer protrusion 513 is connected to form a closed chamber 514; a groove 5111 is located on the first plate 511 and away from the outer protrusion 513, and is connected to the second plate 512; an opening 52 penetrates through the groove 5111 of the first plate 511 and the second plate 512, and the groove 5111 includes an annular outer surface 5112 connected to a corresponding annular edge surface 5121 of the second plate 512, such that the opening 52 is independently isolated from the body 51; a spacer 53 extending between the first plate 511 and the second plate 512; although the structure has a supporting structure and an airtight effect by virtue of the design of the groove 5111, the arrangement of the groove greatly reduces the space of the chamber in which vapor and liquid circulate inside the vapor-liquid distribution plate, and the arrangement of the groove relatively reduces the contact area between the vapor-liquid distribution plate and a heat source, so that the contact area is greatly reduced due to the reduction of heat transfer efficiency.
The prior art has the following disadvantages: 1. the thermal resistance phenomenon is easy to generate; 2. the heat dissipation area is reduced; 3. the heat transfer efficiency is lowered.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above-mentioned drawbacks of the prior art, the present invention provides a heat sink combination structure that can provide a heat sink and a heat source closely combined without penetrating through an airtight chamber.
To achieve the above object, the present invention provides a heat dissipation device combining structure, which comprises:
a first plate body having a first side and a second side;
the second plate body is provided with a third side and a fourth side, the third side is correspondingly covered with the first side, the first plate body and the second plate body jointly define a closed chamber, the fourth side is provided with a heated part, and the heated part is in contact heat conduction with at least one heating source;
a combination component adjacent to the heat receiving unit and having one end combined with the heat generating source.
The heat sink combination structure, wherein: the first side has a hydrophilic coating.
The heat sink combination structure, wherein: and a capillary structure is generated on the third side surface opposite to the closed chamber.
The heat sink combination structure, wherein: the capillary structure is a mesh or a fiber.
The heat sink combination structure, wherein: the capillary structure is formed by electrochemical deposition or electroforming or 3D printing or printing.
The heat sink combination structure, wherein: the material of the electrochemical deposition is copper or nickel or aluminum.
The heat sink combination structure, wherein: the material of the grid body is any one of copper, aluminum, stainless steel or titanium.
The heat sink combination structure, wherein: the first plate body and the second plate body are made of any one of copper or aluminum or stainless steel or titanium materials.
The heat sink combination structure, wherein: the combination part and the second plate body are connected and fixed with each other in any one mode of integral injection, welding, gluing or devil's felt.
The heat sink combination structure, wherein: the first side surface extends to the third side surface to form a plurality of convex bodies, and the free ends of the convex bodies are abutted against the capillary structure.
The heat sink combination structure, wherein: the combination component is provided with a first combination element, a second combination element, a third combination element and a fourth combination element, and the first combination element, the second combination element, the third combination element and the fourth combination element are combined with the heating source in a hooking and buckling mode.
The heat sink combination structure, wherein: the combined fastener is a dovetail seat structure and is adjacently arranged on the periphery of the heating source, and the combined component is correspondingly in a dovetail groove and is embedded with the combined component.
The heat sink combination structure, wherein: the combining component is provided with a free end, the free end corresponds to the holes arranged on the peripheral side of the heating source, and the free end of the combining component correspondingly penetrates through the holes and is clamped through a C-shaped retaining ring.
The heat sink combination structure, wherein: the combination part is provided with a sleeve part which is sleeved outside the first plate body and the second plate body, one side of the combination part is provided with at least one extension end, the periphery of the heating source is provided with at least one hole, and the at least one extension end is arranged corresponding to the hole in an inserting assembly mode.
The heat sink combination structure, wherein: the combination part and the second plate body are integrally formed.
Through the heat sink combination structure of the utility model, the heat sink can not need to run through, and can still be really closely combined with the heating source, and the air tightness of the internal closed cavity of the heat sink is really protected.
Drawings
Fig. 1 is an exploded perspective view of a first embodiment of a heat sink assembly according to the present invention;
fig. 2 is a combined sectional view of the first embodiment of the heat sink combination structure of the present invention;
fig. 3 is a combined sectional view of a second embodiment of the heat sink combination structure of the present invention;
fig. 4 is a combined sectional view of a third embodiment of the heat sink combination structure of the present invention;
fig. 5 is an exploded perspective view of a fourth embodiment of the heat dissipating device of the present invention;
fig. 6 is a combined sectional view of a fifth embodiment of the heat dissipating device combination structure of the present invention;
fig. 7 is an exploded perspective view of a sixth embodiment of the heat dissipating device of the present invention;
fig. 8 is an exploded perspective view of a sixth embodiment of the heat sink assembly of the present invention;
FIG. 9 is a schematic view of a conventional heat dissipation device;
fig. 10 is a schematic cross-sectional view of a conventional heat dissipation device.
Description of reference numerals: a heat sink coupling structure 1; a first plate body 11; a first side 111; a second side 112; a second plate body 12; a third side 121; a fourth side 122; a heat receiving unit 123; a coupling member 13; a first coupling element 131; a second coupling member 132; a third coupling member 133; a fourth coupling member 134; the sleeve portion 136; an extension end 137; a closed chamber 14; a heat generating source 2; a hole 21; a combined buckle 3; a capillary structure 4; and a C-shaped retaining ring 5.
Detailed Description
Referring to fig. 1 and 2, a three-dimensional exploded combined cross-sectional view of a heat dissipation device combination structure according to a first embodiment of the present invention is shown, in which the heat dissipation device combination structure 1 includes: a first board body 11, a second board body 12, a combination part 13;
the first board 11 has a first side 111 and a second side 112, and the first and second sides 111, 112 are respectively disposed on the upper and lower sides of the first board 11.
The second plate 12 has a third side 121 and a fourth side 122, the third side 121 is covered with the first side 111, the first plate, the second plate 11, 12 define a sealed chamber 14, the fourth side 122 has a heat receiving portion 123, and the heat receiving portion 123 is in contact with at least one heat generating source 2 for heat conduction.
The connecting member 13 is disposed adjacent to the heat receiving unit 123, and one end of the connecting member 13 is connected to the heat generating source 2, the connecting member 13 in this embodiment has a first connecting element 131, a second connecting element 132, a third connecting element 133 and a fourth connecting element 134, and the connecting member 13 is selected from a configuration integrally extending from the fourth side 122 of the second plate 12, or is integrally connected to each other by being integrally wrapped or welded, or by being adhered or velcro.
The first, second, third and fourth combining elements 131, 132, 133 and 134 are correspondingly disposed adjacent to the heat generating source 2 and one end of each combining element is hooked with the heat generating source 2.
The first plate body and the second plate body 11 and 12 are made of any one of copper, aluminum, stainless steel and titanium, and the first plate body and the second plate body 11 and 12 can be made of the same material or can be matched in a mixed mode.
The first side 111 of the first plate 11 is provided with a hydrophilic coating 141 corresponding to the location of the sealed chamber 14, and the vapor-liquid circulation efficiency of the working fluid in the sealed chamber 14 is increased by the hydrophilic coating 141.
Please refer to fig. 3, which is a combined cross-sectional view of a second embodiment of the heat dissipating device combination structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment and will not be described herein again, but the third side 121 of this embodiment, which is located in the sealed chamber 14, is provided with a capillary structure 4, the capillary structure 4 is a mesh or a fiber or any one of porous structures, and when the capillary structure 4 is a porous structure, the capillary structure can be formed by electrochemical deposition or electroforming or 3D printing or laminating.
When the porous structure is formed by electrochemical deposition, the material is copper, nickel, aluminum or metal with good heat conductivity.
If the mesh body is selected as the capillary structure, the material of the mesh body is any one of copper, aluminum, stainless steel or titanium, and the mesh body can be arranged in a mode of mixing laminated materials.
Please refer to fig. 4, which is a combined cross-sectional view of a third embodiment of the heat dissipating device combination structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the second embodiment and will not be described herein, but the difference between this embodiment and the second embodiment lies in that a plurality of protrusions 123 extend from the first side 111 of the first plate 11 to the third side 121 of the second plate 12, the capillary structure 4 is formed on the surface of the third side 121, the protrusions 123 abut against one side of the capillary structure 4, and the other side of the protrusion 123 opposite to the one side is recessed.
Please refer to fig. 5, which is a three-dimensional exploded cross-sectional view of a fourth embodiment of the heat dissipation device combination structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment and will not be described herein again, and for the difference between this embodiment and the first embodiment, a combination fastener 3 is disposed around the heat source, the combination fastener 3 is a dovetail seat structure, the combination component 13 is a dovetail groove, and the combination fastener 3 is correspondingly a dovetail seat embedded with the combination component 13.
Please refer to fig. 6, which is a combined cross-sectional view of a fifth embodiment of the heat dissipating device combination structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment and will not be described herein again, for the difference between this embodiment and the first embodiment, the one end of the combination parts 13, which are free ends, corresponds to the plurality of holes 21 disposed around the heat source 2, the one end of the combination parts 13, which are free ends, penetrates through the holes 21, and the one end of the combination parts 13, which penetrate through the holes 21, is limited and fixed by a C-shaped retaining ring 5.
Please refer to fig. 7 and 8, which are exploded perspective views illustrating a sixth embodiment of the heat dissipating device combination structure of the present invention, as shown in the figures, part of the structure of this embodiment is the same as that of the first embodiment and will not be described herein again, for the difference between this embodiment and the first embodiment, the combination component 13 has a sleeve portion 136 sleeved outside the first plate body and the second plate body 11, 12, one side of the combination component 13 has at least one extension end 137, the periphery of the heat source 2 has at least one hole 21, and the extension ends 137 are inserted and assembled corresponding to the hole 21.
The utility model aims to provide a heat abstractor with airtight cavity in vacuum corresponds cooperation group through these some combination parts 13 and this combination buckle 3 and establishes and need not to run through and can fix with the source that generates heat to the vapour-liquid circulation that maintains the inside working fluid of heat abstractor normally functions and uses through the collocation of hydrophilicity cladding material and capillary structure and promote inside vapour-liquid circulation efficiency.
Claims (15)
1. A heat sink assembly structure, comprising:
a first plate body having a first side and a second side;
the second plate body is provided with a third side and a fourth side, the third side is correspondingly covered with the first side, the first plate body and the second plate body jointly define a closed chamber, the fourth side is provided with a heated part, and the heated part is in contact heat conduction with at least one heating source;
a combination component adjacent to the heat receiving unit and having one end combined with the heat generating source.
2. The heat sink combination structure of claim 1, wherein: the first side has a hydrophilic coating.
3. The heat sink combination structure of claim 1, wherein: and a capillary structure is generated on the third side surface opposite to the closed chamber.
4. The heat sink combination structure of claim 3, wherein: the capillary structure is a mesh or a fiber.
5. The heat sink combination structure of claim 3, wherein: the capillary structure is formed by electrochemical deposition or electroforming or 3D printing or printing.
6. The heat sink combination structure of claim 5, wherein: the material of the electrochemical deposition is copper or nickel or aluminum.
7. The heat sink combination structure of claim 4, wherein: the material of the grid body is any one of copper, aluminum, stainless steel or titanium.
8. The heat sink combination structure of claim 1, wherein: the first plate body and the second plate body are made of any one of copper or aluminum or stainless steel or titanium materials.
9. The heat sink combination structure of claim 1, wherein: the combination part and the second plate body are connected and fixed with each other in any one mode of integral injection, welding, gluing or devil's felt.
10. The heat sink combination structure of claim 3, wherein: the first side surface extends to the third side surface to form a plurality of convex bodies, and the free ends of the convex bodies are abutted against the capillary structure.
11. The heat sink combination structure of claim 1, wherein: the combination component is provided with a first combination element, a second combination element, a third combination element and a fourth combination element, and the first combination element, the second combination element, the third combination element and the fourth combination element are combined with the heating source in a hooking and buckling mode.
12. The heat sink combination structure of claim 1, wherein: the combined fastener is a dovetail seat structure and is adjacently arranged on the periphery of the heating source, and the combined component is correspondingly in a dovetail groove and is embedded with the combined component.
13. The heat sink combination structure of claim 1, wherein: the combining component is provided with a free end, the free end corresponds to the holes arranged on the peripheral side of the heating source, and the free end of the combining component correspondingly penetrates through the holes and is clamped through a C-shaped retaining ring.
14. The heat sink combination structure of claim 1, wherein: the combination part is provided with a sleeve part which is sleeved outside the first plate body and the second plate body, one side of the combination part is provided with at least one extension end, the periphery of the heating source is provided with at least one hole, and the at least one extension end is arranged corresponding to the hole in an inserting assembly mode.
15. The heat sink combination structure of claim 1, wherein: the combination part and the second plate body are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921356667.XU CN210781849U (en) | 2019-08-20 | 2019-08-20 | Heat sink combination structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921356667.XU CN210781849U (en) | 2019-08-20 | 2019-08-20 | Heat sink combination structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210781849U true CN210781849U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921356667.XU Active CN210781849U (en) | 2019-08-20 | 2019-08-20 | Heat sink combination structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210781849U (en) |
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2019
- 2019-08-20 CN CN201921356667.XU patent/CN210781849U/en active Active
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