CN214095678U

CN214095678U - Temperature equalizing plate structure

Info

Publication number: CN214095678U
Application number: CN202022840898.7U
Authority: CN
Inventors: 谢国俊
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2021-08-31
Anticipated expiration: 2030-12-01

Abstract

The utility model relates to a temperature-uniforming plate structure, which comprises an upper plate, a lower plate, an intermediate layer and a polymer layer; wherein the polymer layer is selectively combined with any one of the upper plate and the lower plate, the lower plate and the upper plate are covered to define a cavity together, the cavity is filled with a working fluid, the intermediate layer is arranged in the cavity, the intermediate layer is provided with a first side, a second side, a plurality of through holes and a plurality of grooves, the through holes penetrate through the first side and the second side, the plurality of grooves are arranged on one of the first side and the second side, and the total thickness of the whole structure of the temperature-uniforming plate is equal to or less than 0.25mm through the combination so as to achieve extremely thin.

Description

Temperature equalizing plate structure

Technical Field

The present invention relates to a vapor chamber, and more particularly to a very thin vapor chamber.

Background

In order to achieve better heat transfer effect, the heat dissipation field uses a heat dissipation device applying a two-phase flow heat exchange principle as a heat conduction element, wherein a temperature equalization plate and a heat pipe are most popular, and the temperature equalization plate and the heat pipe apply the two-phase flow heat exchange principle, and a material with better heat conduction efficiency is used as a main body structure of the temperature equalization plate and the heat pipe, wherein copper is most common, a vacuum airtight chamber is required to be arranged inside the main body, and a capillary structure is arranged on the inner surface of the chamber and filled with working liquid, so that two-phase flow (vapor and liquid) circulation is performed inside the vacuum airtight chamber through the reduction of the boiling point of the working liquid in a vacuum environment, thereby providing better heat conduction efficiency.

The existing temperature-uniforming plate is provided with a capillary structure on at least one plate body, and then the plate body is covered with another plate body to form a main body, and then the main body is subjected to edge sealing, water filling (liquid working fluid), vacuum pumping and other operations to form the temperature-uniforming plate; the capillary structure is mainly used in the vapor chamber for the liquid working fluid to flow back from the condensation zone to the evaporation zone and to store the liquid working fluid in the evaporation zone, and the capillary structure is usually used in the form of sintered body, grid body, fiber body, grooves, etc. which can provide capillary force.

The sintered body is mainly characterized in that metal powder is covered on one side of a plate body, the metal powder is sintered and attached to the plate body in a sintering mode to form a capillary structure with porous property, the capillary structure in the sintered body form formed in the sintering mode is the capillary structure with the optimal capillary force, every two adjacent powder are heated to a semi-solid state in the sintering work to enable the powder to be mutually connected and form the capillary structure with porous property, in order to keep the capillary structure of the sintered powder to keep the porous property, the particle size of the sintered powder has certain limitation, and when the particle size of the sintered powder is too small, the powder is sintered to generate solid fusion, so that almost no pores exist among the powder, the capillary structure with porous property cannot be formed, and the capillary structure cannot provide the capillary force. Therefore, the particle size of the sintering powder used in the conventional sintered body cannot be selected to be too fine, so that in the capillary structure formed by the conventional sintering method, the sintering powder must be selected to have a proper particle size to form pores among the particles and have the function of capillary force, but the thickness of the relative sintering structure is increased accordingly, which means that the conventional sintered body cannot be applied to an extremely thin uniform temperature plate structure. In addition, the prior temperature equalizing plate using the sintered body can not be partially bent (bent), and if the temperature equalizing plate is bent (bent), the sintered body in the cavity is damaged, falls off and is broken, so that the plate body has no capillary structure and loses the effect of temperature equalizing and heat dissipation.

Therefore, in order to solve the above-mentioned problem that the conventional sintered body cannot be used in the structure of the ultra-thin vapor chamber, the manufacturer is faced with the groove with poor efficacy of capillary force in the capillary structure, or tries to use the grid body or the woven mesh with inferior efficacy of capillary force in the capillary structure than the sintered powder, wherein the grid body or the woven mesh is convenient to install and can be used at the position to be bent, but the grid body or the woven mesh must be completely attached to the wall of the chamber or the wall of the chamber when being installed in the vapor chamber to enable the working fluid to diffuse in the grid body or the woven mesh by capillary action, so that when the grid body or the woven mesh is not completely attached to the surface of the chamber or the wall of the chamber, the grid body or the woven mesh cannot provide efficacy of capillary force to supply the working fluid for diffused vapor-liquid circulation, and the grid body and the woven mesh are mainly composed of a plurality of filament-shaped single bodies which are mutually interwoven or woven, because the thickness of the wire diameter of each single filamentous monomer (such as a filamentous metal wire) cannot be changed due to the limitation of the current processing machinery and materials, the whole thickness of the mesh body (or the woven mesh) formed by all the filamentous monomers which are mutually interwoven (or woven) cannot be reduced any more, and the conventional mesh body and the woven mesh can not be applied to the ultra-thin temperature-equalizing plate structure.

The groove with poor capillary force is used instead, and the groove is mainly formed on the wall surface of the temperature-equalizing plate through machining and other methods, so that the groove is used as a capillary structure, but another problem is that the groove formed in the temperature-equalizing plate inevitably causes the wall of the temperature-equalizing plate to become thin, the overall structural strength is affected, the wall is broken, working liquid in the groove leaks outwards to lose the temperature-equalizing and heat-dissipating effects, and the groove is arranged to thin the wall and further reduce the overall structural strength, so that the groove is easy to break at the position where the groove is arranged if the temperature-equalizing plate is bent (bent), and the like.

Therefore, with the extremely thin design, the thickness of the whole temperature equalizing plate is greatly limited, and not only the thickness of the tube wall is limited to the extremely thin size, but also the internal airtight chamber and the internal capillary structure must be further reduced, so that the use and arrangement of the capillary structures mentioned above become a problem in the extremely thin design.

Therefore, how to achieve the ultra-thin structure and have the capillary force is the first improvement goal of the skilled person.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a temperature equalization plate structure that can realize extremely thin type.

Another object of the present invention is to provide a foldable (bendable) vapor chamber with a better capillary force.

To achieve the above object, the present invention provides a vapor chamber structure, comprising an upper plate, a lower plate, a middle layer and a polymer layer, wherein the lower plate covers the upper plate and defines a chamber, the chamber is filled with a working fluid, the middle layer is disposed in the chamber, the middle layer is provided with a first side, a second side, a plurality of through holes and a plurality of grooves, the through holes penetrate the first side and the second side, the plurality of grooves are disposed on one of the first side and the second side, the polymer layer is selectively combined with any one of the upper plate and the lower plate, and the total thickness of the vapor chamber structure is equal to or less than 0.25 mm.

Through the utility model discloses can realize the slimming of heat dissipation unit, rely on this intermediate level to come as the capillary structure that provides vapour attitude and liquid working fluid vapour-liquid circulation simultaneously for can solve the shortcoming of the slimming of current heat dissipation unit.

The upper plate is formed by mutually overlapping a plurality of upper plate bodies, and the polymer layer is clamped between the plurality of upper plate bodies to form the upper plate. The lower plate is formed by laminating a plurality of lower plates, and the polymer layer is clamped between the plurality of lower plates to form the lower plate. The polymer layer is selectively formed on the upper inner side or the upper outer side of the upper plate by coating, printing and bonding.

The polymer layer is selectively formed on the lower inner side or the lower outer side of the lower plate by coating, printing and bonding. The plurality of grooves are formed on the second side of the middle layer in a staggered manner in the longitudinal direction or the transverse direction or the longitudinal direction and the transverse direction. The plurality of grooves and the plurality of through holes are disposed alternately or non-alternately.

The temperature equalization plate structure further comprises a hydrophilic layer selectively disposed on the upper inner side or the lower inner side or the second side of the middle layer and the surfaces of the plurality of grooves. The upper plate has a plurality of protrusions protruding from the upper inner side of the upper plate, and the second side of the middle layer is attached to the plurality of protrusions.

In conclusion, through the utility model discloses the design of samming plate structure can effectively improve the various capillary structure that prior art used and can receive the problem that the restriction can't be very slim smoothly when using extremely slim. Therefore, rely on the utility model discloses the whole thickness of this temperature-uniforming plate structure is for being equal to or being less than 0.25mm, so the utility model discloses the disappearance that prior art capillary structure can't extremely thin type has been improved.

Drawings

Fig. 1 is an exploded view of a first embodiment of the present invention.

Fig. 2 is a schematic view of a first embodiment of the present invention in combination with a sectional view and a partial enlarged view.

Fig. 3A is a schematic combined cross-sectional view of a second embodiment of the present invention.

Fig. 3B is a schematic combined cross-sectional view of a third embodiment of the present invention.

Description of reference numerals: a vapor chamber structure 1; an upper plate 11; an upper plate body 110; an upper outer side 111; an upper inner side 112; a convex portion 113; a lower plate 13; a lower plate body 130; a lower outer side 131; a lower inner side 132; a chamber 14; an intermediate layer 15; a first side 151; a second side 152; a perforation 153; a trench 154; a polymer layer 16; a hydrophilic layer 18.

Detailed Description

The above objects, together with the structure and functional characteristics of the invention, will be best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.

The utility model provides a temperature equalization plate structure, and the exploded schematic view of the first embodiment of the utility model is shown in figure 1; fig. 2 is a schematic view showing a combination of a cross-sectional view and a partial enlarged view of a first embodiment of the present invention. As shown in the figure, the vapor chamber structure 1 includes an upper plate 11, a lower plate 13, an intermediate layer 15 and a polymer layer 16, the upper plate 11 has an upper outer side 111, an upper inner side 112 and a plurality of protrusions 113, the plurality of protrusions 113 are protruded from the upper inner side 112, the lower plate 13 has a lower outer side 131 and a lower inner side 132, the lower inner side 132 is opposite to the upper inner side 112, the lower plate 13 and the upper plate 11 cover and jointly define a chamber 14, and the chamber 14 is filled with a working fluid (such as pure water). Wherein the upper plate 11 and the lower plate 13 are made of any one of copper, aluminum, stainless steel and commercially pure titanium, and the thickness of the upper plate 11 and the lower plate 13 is about 0.05mm (mm), for example. In a possible embodiment, the temperature equalization plate structure 1 can also be a hot plate structure.

The middle layer 15 can be a sheet or a plate disposed in the chamber 14, and the middle layer 15 has a first side 151, a second side 152, a plurality of through holes 153 and a plurality of grooves 154, the first side 151 and the second side 152 are respectively attached to the corresponding lower inner side 132 and the plurality of protrusions 113, the plurality of grooves 154 are disposed on the first side 151 or the second side 152, or both sides of the plurality of grooves 154 are disposed with grooves 154, in this embodiment, the plurality of grooves 154 are disposed on the second side 152 of the middle layer 15 at intervals, i.e., the plurality of grooves 154 are alternately recessed longitudinally and transversely formed on the second side 152 of the middle layer 15, and the plurality of longitudinal grooves 154 are communicated with the plurality of transverse grooves 154, so that the liquid working fluid rapidly flows back to the lower inner side 132 (i.e., the evaporation region) along the plurality of longitudinal and transverse grooves 154 by the capillary force of the plurality of grooves 154. Wherein the intermediate layer 15 has a thickness of about, for example, 0.05mm (millimeters).

The plurality of through holes 153 penetrate the first and

second sides

151, 152, the plurality of through holes 153 and the plurality of grooves 154 are disposed alternately or non-alternately, and the plurality of through holes 153 and the plurality of grooves 154 are horizontally disposed alternately for illustration and not limitation. So through the utility model discloses the slot 154 that one side or both sides of this intermediate level 15 set up and run through the design of the perforation 153 of this intermediate level 15, make this plural slot 154 can provide liquid working fluid backward flow and use, this plural perforation 153 can regard as the working fluid to use through the steam passageway of evaporation vaporization, with the capillary suction structure that has gas circulation passageway and liquid reflux is realized simultaneously, not only can solve the unit of heat dissipation when thin, the narrow difficult problem that sets up capillary structure in inside cavity 14 space, and this intermediate level 15 still can regard as the bearing structure of samming plate structure 1, can keep integrality and can not receive the extrusion deformation and lose vapour liquid circulation work's efficiency in making this samming plate structure 1's cavity 14. In another possible embodiment, the plurality of through holes 153 and the plurality of grooves 154 are vertically stacked and arranged in a staggered manner. In another embodiment, the plurality of trenches 154 are formed laterally or longitudinally on the second side 152 of the middle layer 15.

The polymer layer 16 is, for example, a synthetic polymer (e.g., Polyethylene (PE), p.v.c, nylon, dacron, ABS or SBR) or an inorganic polymer (e.g., quartz, asbestos, mica or graphite), the polymer layer 16 is selectively bonded to any one of the upper and

lower plates

11, 13, and the polymer layer 16 is selectively formed on a surface (e.g., an upper outer side 111 surface, an upper inner side 112 surface, a lower inner side 132 surface or a lower outer side 131 surface) of any one of the upper and

lower plates

11, 13 by coating, printing, bonding or adhering, in this embodiment, the polymer layer 16 is formed on a lower outer side 131 surface of the lower plate 13 by coating, and the total thickness of the entire isothermal plate structure 1 is equal to, but not limited to, 0.25mm (mm). In practical application, the total thickness of the temperature-equalizing plate structure 1 can be less than 0.25 mm.

Fig. 3A is a cross-sectional view of a temperature equalizing plate structure 1 according to a second embodiment of the present invention. As shown in the drawings, the present embodiment has the same structure as the previous embodiments, and therefore, the description thereof is not repeated herein, and the difference between the two embodiments lies in: the polymer layer 16 is disposed or sandwiched between the upper plate 11 and/or the lower plate 13, and the upper plate 11 (and/or the lower plate 13) is formed by laminating a plurality of upper plates 110 (and/or lower plates 130).

Fig. 3B is a cross-sectional view of a temperature equalizing plate structure 1 according to a third embodiment of the present invention. As shown in the drawings, the present embodiment has the same structure as the previous embodiments, and therefore, the description thereof is not repeated herein, and the difference between the two embodiments lies in: the vapor-chamber structure 1 further comprises a hydrophilic layer 18, wherein the hydrophilic layer 18 is selectively disposed on the surfaces of the second side 152 and the plurality of grooves 154 of the upper inner side 112, the lower inner side 132, or the middle layer 15.

In conclusion, through the utility model discloses samming plate structure 1's design can effectively improve the various capillary structure that prior art used and can receive the unable extremely thin problem smoothly of restriction when using extremely thin. Therefore, rely on the utility model discloses the whole thickness of this temperature-uniforming plate structure 1 is for being equal to or being less than 0.25mm, so the utility model discloses the disappearance that prior art capillary structure can't extremely thin type has been improved.

Claims

1. A vapor panel structure, comprising:

an upper plate having an upper outer side and an upper inner side;

a lower plate having a lower outer side and a lower inner side, the lower plate and the upper plate are correspondingly covered and jointly define a chamber, and the chamber is filled with a working fluid;

the middle layer is arranged in the cavity and provided with a first side, a second side, a plurality of through holes and a plurality of grooves, the plurality of through holes penetrate through the first side and the second side, and the plurality of grooves are arranged on at least one of the first side and the second side; and

and the polymer layer is selected to be combined with any one of the upper plate and the lower plate, so that the overall total thickness of the temperature-uniforming plate structure is equal to or less than 0.25 mm.

2. The vapor plate structure of claim 1, wherein: the upper plate is formed by mutually overlapping a plurality of upper plate bodies, and the polymer layer is clamped between the plurality of upper plate bodies to form the upper plate.

3. The vapor plate structure of claim 1, wherein: the lower plate is formed by laminating a plurality of lower plates, and the polymer layer is clamped between the plurality of lower plates to form the lower plate.

4. The vapor plate structure of claim 1, wherein: the polymer layer is formed on the upper inner side or the upper outer side of the upper plate by means of coating, printing or bonding.

5. The vapor plate structure of claim 1, wherein: the polymer layer is formed on the lower inner side or the lower outer side of the lower plate by coating, printing or bonding.

6. The vapor plate structure of claim 1, wherein: the plurality of grooves are formed on the second side of the middle layer in a staggered mode along the longitudinal direction or along the transverse direction or along the longitudinal direction and the transverse direction.

7. The vapor plate structure of claim 1, wherein: the plurality of grooves and the plurality of through holes are disposed alternately or non-alternately.

8. The vapor plate structure of claim 1, wherein: the hydrophilic layer is selectively arranged on the upper inner side or the lower inner side or the second side of the middle layer and the surfaces of the plurality of grooves.

9. The vapor plate structure of claim 1, wherein: the upper plate is provided with a plurality of convex parts which are arranged on the upper inner side of the upper plate in a protruding way, and the second side of the middle layer is attached to the plurality of convex parts.