TW201300722A - A thermal module structure and a manufacturing method thereof - Google Patents

Abstract

A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered.

Description

Heat dissipation module structure and manufacturing method thereof

A heat dissipating module structure and a manufacturing method thereof, in particular, a heat dissipating component structure and a manufacturing method thereof are replaced by a mutual disassembly assembly instead of a conventional soldering joint.

The current heat dissipating device and the heat dissipating module are composed of a plurality of heat dissipating components which are assembled with each other. The heat dissipating components are components such as a heat pipe, a heat sink, a heat sink base, etc., and the heat dissipating components are mainly combined with each other by welding, but If the heat dissipating component made of aluminum is to be welded, it is not only required to be welded by special welding work, but also the processing cost is relatively increased.

In addition, some manufacturers use a fixing component such as a screw to fix and fix the heat dissipating components, but the fixing component can only be screwed and fixed for some heat dissipating components (such as a heat sink fin set and a heat sink base), and the heat pipe cannot directly Fix by means of screw lock.

Moreover, the prior art is that a hole or a groove is formed in the heat dissipation base, and the heat pipe is disposed in the hole or the groove of the heat dissipation base, so that the heat pipe and the heat dissipation base are combined. Although the method solves the problems of the above-mentioned welding and screw locking method, the heat pipe indirectly conducts heat through the heat dissipation base, and the heat resistance phenomenon is likely to occur due to the gap therebetween, so that the heat conduction efficiency is poor.

The fixing method of the conventional heat dissipating component is not applicable to the combination of various heat dissipating components, and the prior art has the following disadvantages:

1. Higher cost;

2. Not applicable to all types of heat dissipating components;

3. Thermal conductivity is not good.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a heat dissipation module structure that can increase the flexibility of the combination of heat dissipating components.

A secondary object of the present invention is to provide a heat dissipation module structure that can increase thermal conductivity.

It is still another object of the present invention to provide a method of fabricating a heat dissipation module structure that increases the flexibility of the combination of heat dissipating components and increases thermal conductivity.

The present invention provides a heat dissipation module structure, comprising: a base and at least one heat pipe; the base has a first side and a second side and at least one first groove, the first A first groove portion is recessed on one side, and the first groove communicates with the first groove portion.

The heat pipe has a first side surface and a second side surface, and the heat pipe is correspondingly disposed in the first groove.

In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipation module structure, comprising the steps of: providing at least one heat pipe and a base having at least one groove and a plate; and the heat pipe is correspondingly disposed on the base The groove is disposed on the opposite side of the groove, and a groove portion is mechanically machined to connect the groove portion to the heat pipe.

The heat dissipation module structure and the manufacturing method thereof of the invention can increase the heat transfer efficiency of the heat dissipation module and improve the assembly flexibility between the heat dissipation components.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

1 and 2 are a perspective exploded view and a combined view of a first embodiment of a heat dissipation module structure according to the present invention. As shown, the heat dissipation module structure 1 includes a base 11 and at least a heat pipe 12; the base 11 has a first side 111 and a second side 112 and at least one first groove 113. The first side 111 is recessed with a first groove portion 114. The groove 113 communicates with the first groove portion 114.

The heat pipe 12 has a first side surface 121 and a second side surface 122. The heat pipe 12 is disposed in the first groove 113, and the first side surface 121 is aligned with the bottom of the first groove 113.

Referring to FIG. 3, it is a side view of the second embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and therefore will not be further described herein. The first recess 113 of the present embodiment differs from the first embodiment in that it has an open side 1131 and a closed side 1132. The width of the open side 1131 is smaller than the width of the closed side 1132.

FIG. 4 is a perspective view of a third embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the first embodiment, and thus will not be further described herein. The pedestal 11 of the present embodiment has a first extending end 115 and a second extending end 116 and a third extending end 117 and a fourth extending end 118. The first, second, third, and fourth extending ends 115, 116, 117, and 118 have at least one hole 119, respectively.

Please refer to FIG. 5 and FIG. 6 , which are perspective exploded and combined views of the fourth embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment described above. It is not described here, but the difference between the embodiment and the first embodiment is that the plate body 13 is correspondingly attached to the second side 112 of the base 11 .

Please refer to FIGS. 7 and 8 , which are perspective exploded and combined views of the fifth embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the fourth embodiment described above. For the fourth embodiment of the present invention, at least one hole 131 is provided in the fourth embodiment of the present invention. The hole 131 is permeable to a locking component 2 and a substrate. 3 fixed.

FIG. 9 is a perspective exploded view of the sixth embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the foregoing fourth embodiment, and thus will not be further described herein. The heat dissipation module structure 1 of the present embodiment further has at least one combination portion 14 having a receiving groove 141 and a protrusion 142, which is connected to the fourth embodiment. The groove 141 is disposed on the second side 112 of the base 11 . The protrusion 142 is disposed on one side of the second side 112 of the plate body 13 , and the protrusion 142 is correspondingly engaged with the receiving groove 141 .

FIG. 10 is a perspective exploded view of the seventh embodiment of the heat dissipation module structure of the present invention. As shown in the figure, the structure of the embodiment is the same as that of the foregoing fourth embodiment, and thus will not be further described herein. The heat dissipation module structure 1 of the present embodiment further has at least one combination portion 14 having a receiving groove 141 and a protrusion 142, which is connected to the third embodiment. The groove 141 is disposed on one side of the second side 112 of the plate body 13 . The protrusion 142 is disposed on the second side 112 of the base 11 , and the protrusion 142 is correspondingly engaged with the receiving groove 141 .

Please refer to FIG. 11 , which is a flow chart of the steps of the first embodiment of the method for manufacturing the heat dissipation module structure of the present invention, and refers to the first and second figures. As shown in the figure, the heat dissipation module structure manufacturing method is Contains the following steps:

S1: providing at least one heat pipe and a base having at least one groove; providing a heat pipe 12 and a base 11 having at least one groove (ie, the first groove 113).

S2: The heat pipe is disposed correspondingly in the groove of the base; and at least one end of the heat pipe 12 is press-fitted into the groove of the base 11 (ie, the first groove 113) to be coupled with the base 11.

S3: The opposite side of the groove is disposed on the base, and a groove portion is mechanically machined to connect the groove portion to the heat pipe.

On the other side of the opposite end of the groove 11 (ie, the first groove 113), a groove portion (ie, the first groove portion 114) is formed by machining, and the groove portion (ie, the first groove portion) is formed. 114) communicating with the aforementioned groove (ie, the first groove 113) while the first side 121 of the heat pipe 12 is aligned with the bottom of the groove portion (ie, the first groove portion 114).

Please refer to FIG. 12 , which is a flow chart of the second embodiment of the method for manufacturing the heat dissipation module structure of the present invention, and refer to the first to sixth figures. As shown in the figure, the heat dissipation module structure manufacturing method is The method includes the following steps: S1: providing at least one heat pipe and a pedestal having at least one groove; S2: locating the heat pipe correspondingly in the groove of the pedestal; S3: arranging the groove opposite to the pedestal On the side, a groove portion is formed by machining, and the groove portion is connected to the heat pipe.

The steps in this embodiment are the same as those in the foregoing first embodiment, and therefore will not be described again here. However, the difference between the embodiment and the first embodiment is the step S2 of the embodiment: the heat pipe is correspondingly disposed on the The inside of the groove of the base; further comprising a step S4: correspondingly covering a plate body with the groove, and simultaneously sealing the heat pipe in the groove; the plate body 13 corresponding to the base 11 has the same One side of the groove (ie, the first groove 113) and correspondingly covers the groove (ie, the first groove 113), and at the same time, the heat pipe 12 is enclosed inside the groove (ie, the first groove 113) .

The machining systems of the first and second embodiments described above may be any of a milling process and a planing process.

Referring to FIG. 13 , as shown in the figure, the pedestal 1 of the heat dissipation module structure 1 of the present invention can simultaneously contact the heat source 4 with the first side 121 and the second side 122 of the heat pipe 12 , thereby increasing heat dissipation efficiency and The use of space constraints greatly increases the flexibility of use.

1. . . Thermal module structure

11. . . Pedestal

111. . . First side

112. . . Second side

113. . . First groove

1131. . . Open side

1132. . . Closed side

114. . . First groove

115. . . First extension

116. . . Second extension

117. . . Third extension

118. . . Fourth extension

119. . . Hole

12. . . Heat pipe

121. . . First side

122. . . Second side

13. . . Plate body

131. . . Hole

14. . . Combination department

141. . . Receiving slot

142. . . Protrusion

2. . . Locking element

3. . . Substrate

4. . . Heat source

1 is an exploded perspective view of a first embodiment of a heat dissipation module structure of the present invention;

2 is a perspective assembled view of the first embodiment of the heat dissipation module structure of the present invention;

Figure 3 is a side view of a second embodiment of the heat dissipation module structure of the present invention;

Figure 4 is a perspective assembled view of a third embodiment of the heat dissipation module structure of the present invention;

Figure 5 is a perspective exploded view of a fourth embodiment of the heat dissipation module structure of the present invention;

Figure 6 is a perspective assembled view of a fourth embodiment of the heat dissipation module structure of the present invention;

Figure 7 is a perspective exploded view of a fifth embodiment of the heat dissipation module structure of the present invention;

Figure 8 is a perspective assembled view of a fifth embodiment of the heat dissipation module structure of the present invention;

Figure 9 is a perspective exploded view of a sixth embodiment of the heat dissipation module structure of the present invention;

Figure 10 is a perspective exploded view of a seventh embodiment of the heat dissipation module structure of the present invention;

Figure 11 is a flow chart showing the steps of the first embodiment of the method for manufacturing the heat dissipation module structure of the present invention;

Figure 12 is a flow chart showing the steps of the second embodiment of the method for manufacturing the heat dissipation module structure of the present invention;

Figure 13 is a schematic view showing the application of the heat dissipation module structure of the present invention.

1. . . Thermal module structure

11. . . Pedestal

111. . . First side

112. . . Second side

113. . . First groove

114. . . First groove

12. . . Heat pipe

121. . . First side

122. . . Second side

Claims (10)

A heat dissipation module structure includes: a base having a first side and a second side and at least one first groove, wherein the first side recess is provided with a first groove portion, the first groove The first groove portion is connected to the first groove portion; the at least one heat pipe has a first side surface and a second side surface, and the heat pipe is disposed correspondingly in the first groove. The heat dissipation module structure of claim 1, wherein the heat dissipation module structure further comprises a plate body, and the plate body is correspondingly attached to the second side of the base. The heat dissipation module structure of claim 2, further comprising at least one combination portion, the assembly portion having a receiving groove and a protrusion, the receiving groove being disposed on the second side of the base The convex body is disposed on one side of the second side of the plate body, and the convex body is correspondingly engaged with the receiving groove. The heat dissipation module structure of claim 2, further comprising at least one combination portion, the assembly portion having a receiving groove and a protrusion, the receiving groove being disposed on the second side of the plate body On one side, the protrusion is disposed on the second side of the base, and the protrusion is correspondingly engaged with the receiving groove. The heat dissipation module structure according to claim 2, wherein the plate body has at least one hole. The heat dissipation module structure of claim 1, wherein the base further has a first extension end and a second extension end, and a third extension end and a fourth extension end, the first The second, third, and fourth extension ends respectively have at least one hole. The heat dissipation module structure of claim 1, wherein the first groove further has an open side and a closed side, and the open side has a width smaller than a width of the closed side. A method for manufacturing a heat dissipation module structure includes the steps of: providing at least one heat pipe and a base having at least one groove; and arranging the heat pipe correspondingly in the groove of the base; On the opposite side of the groove, a groove portion is machined to connect the groove portion to the heat pipe. The manufacturing method of the heat dissipation module structure according to claim 8, wherein the machining system is any one of a milling process and a planing process. The manufacturing method of the heat dissipation module structure according to claim 8 , wherein the heat pipe is disposed correspondingly in the groove of the base, and further comprises a step of providing a plate body corresponding to the concave surface Slot and close the heat pipe at the same time.