TWI727430B - Heat transfer component reinforcement structure - Google Patents
Heat transfer component reinforcement structure Download PDFInfo
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- TWI727430B TWI727430B TW108134263A TW108134263A TWI727430B TW I727430 B TWI727430 B TW I727430B TW 108134263 A TW108134263 A TW 108134263A TW 108134263 A TW108134263 A TW 108134263A TW I727430 B TWI727430 B TW I727430B
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Abstract
Description
一種熱傳元件補強結構,尤指一種透過組合一補強件藉以提升熱傳元件結構強度的熱傳元件補強結構。 A reinforcing structure for a heat transfer element, in particular, a reinforcing structure for a heat transfer element that enhances the structural strength of the heat transfer element by combining a reinforcing member.
一般電子設備中具有複數電子元件,諸如中央處理器等電子元件在運行的過程中將會產生大量的熱,若沒有及時排除其產生之熱量,將導致電子元件之工作環境的溫度升高,而嚴重影響電子元件之正常運作,因此通常於該等發熱電子元件表面固定置設一散熱元件如散熱器或散熱鰭片等或設置有導熱單元如導熱基座或均溫板或平板式熱管等,藉以達到散熱及熱傳導之功效。 Generally, electronic devices have multiple electronic components. Electronic components such as central processing units will generate a lot of heat during operation. If the heat generated is not removed in time, the temperature of the working environment of the electronic components will increase. It seriously affects the normal operation of electronic components. Therefore, a heat dissipation element such as a radiator or heat dissipation fin or a heat conduction unit such as a heat conduction base or a temperature equalizing plate or a flat heat pipe is usually fixed on the surface of the heat generating electronic components. To achieve the effect of heat dissipation and heat conduction.
一般而言,散熱元件或導熱單元之定位方式係直接藉由一彈性簧片或扣具扣合在主機板上電子元件(CPU)周緣之適當部位,另散熱元件或導熱單元對電子元件產生一相對壓抵的力量,已令其得完全貼附於發熱電子元件之表面。 Generally speaking, the positioning method of the heat-dissipating element or the heat-conducting unit is directly fastened to an appropriate part of the periphery of the electronic element (CPU) on the motherboard by an elastic reed or a fastener, and the heat-dissipating element or the heat-conducting unit generates an impact on the electronic element. The relative pressing force has made it completely adhere to the surface of the heating electronic component.
但是主機板在結構設計上並不能提供強大的承受力而設計,此種固定方式將使散熱元件或導熱單元之重量對主機板產生不當施力,進而容易對主機板造成損傷,因此便設置一種習知之散熱元件及導熱單元的固定結構,利用一板體置放於主機板之下方,藉由複數固定元件貫穿位於主機板上之孔位而將該板體與位於主機板上方之散熱元件或導熱單元固定,如此主機板便不會受到不當施力 而損壞,如此僅增加主機板之強度,當對該散熱元件或導熱單元設置更大的向下壓制力時,則該散熱元件會造成彎曲或斷裂等破壞情形。 However, the structural design of the motherboard is not designed to provide strong bearing capacity. This fixing method will cause the weight of the heat dissipation element or the heat conduction unit to improperly force the motherboard, which will easily cause damage to the motherboard. Therefore, a kind of The conventional fixing structure of the heat dissipating element and the heat conducting unit utilizes a board to be placed under the main board, and a plurality of fixing elements penetrate through the holes on the main board to connect the board to the heat dissipating element located above the main board. The heat conduction unit is fixed so that the motherboard will not be improperly applied However, this only increases the strength of the motherboard. When a greater downward pressing force is applied to the heat dissipation element or the heat conduction unit, the heat dissipation element will cause damage such as bending or breaking.
則如何增加散熱元件或導熱基座之結構強度,則為該項技藝之入士首重之目標。 How to increase the structural strength of the heat-dissipating element or the heat-conducting base is the most important goal of this art.
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種可增加熱傳元件強度的熱傳元件補強結構。 Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat transfer element reinforcement structure that can increase the strength of the heat transfer element.
為達上述之目的,本發明係提供一種熱傳元件補強結構,係包含:一本體;所述本體具有一對第一側邊及一對第二側邊及一補強件,所述補強件係以外接(搭配)之方式對應與該本體第一側邊、第二側邊、第一側邊與第二側邊交接之四隅處其中任一以上進行相互卡扣接合,藉由該補強件與該本體結合增加該本體結構之強度。 In order to achieve the above objective, the present invention provides a heat transfer element reinforcement structure, which includes: a body; the body has a pair of first side edges, a pair of second side edges, and a reinforcement member. By means of an external connection (matching), the first side, the second side, the first side and the second side of the body are connected to any one or more of the four corners to be buckled together. The reinforcing member and The body combination increases the strength of the body structure.
本發明提供一種增加熱傳元件固定時之結構強度,令熱傳元件固定時受到較大之向下或向上之壓力或張力時不產生變形或損壞者。 The present invention provides a method for increasing the structural strength of the heat transfer element when it is fixed, so that the heat transfer element will not be deformed or damaged when it is subjected to greater downward or upward pressure or tension during the fixation.
1:本體 1: body
11:第一側邊 11: First side
12:第二側邊 12: second side
13:第一側 13: first side
14:第二側 14: second side
15:卡接槽 15: card slot
16:凹槽 16: groove
18:氣密腔室 18: Airtight chamber
181:毛細結構 181: Capillary structure
182:工作液體 182: working fluid
2:補強件 2: Reinforcement
21:勾部 21: Hook
22:補強本體 22: Reinforce the body
23:第一折邊 23: The first fold
24:第二折邊 24: Second hem
3:導熱塊 3: Thermal block
4:散熱單元 4: Cooling unit
5:熱管 5: Heat pipe
第1圖係為本發明之熱傳元件補強結構之第一實施例之立體分解圖;第2圖係為本發明之熱傳元件補強結構之第一實施例之立體組合圖;第3圖係為本發明之熱傳元件補強結構之第二實施例之立體分解圖;第4圖係為本發明之熱傳元件補強結構之第三實施例之立體剖視圖;第5圖係為本發明之熱傳元件補強結構之第四實施例之立體組合圖;第6圖係為本發明之熱傳元件補強結構之第五實施例之立體組合圖; Figure 1 is a perspective exploded view of the first embodiment of the heat transfer element reinforcement structure of the present invention; Figure 2 is a perspective assembly view of the first embodiment of the heat transfer element reinforcement structure of the present invention; Figure 3 is a perspective view of the first embodiment of the heat transfer element reinforcement structure of the present invention; Is a perspective exploded view of the second embodiment of the heat transfer element reinforcement structure of the present invention; Figure 4 is a perspective cross-sectional view of the third embodiment of the heat transfer element reinforcement structure of the present invention; Figure 5 is a perspective view of the heat transfer element reinforcement structure of the present invention A three-dimensional assembly view of the fourth embodiment of the heat transfer element reinforcement structure; Figure 6 is a three-dimensional assembly view of the fifth embodiment of the heat transfer element reinforcement structure of the present invention;
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.
請參閱第1、2圖,係為本發明之熱傳元件補強結構之第一實施例之立體及組合剖視圖,如圖所示,本發明熱傳元件補強結構,係包含:一本體1;所述本體1具有一對第一側邊11及一對第二側邊12及一補強件2,所述補強件2係以外接(搭配)之方式對應與該本體1第一側邊11、第二側邊12、第一側邊11與第二側邊12交接之四隅或由四隅互相延伸交錯其中任一以上相互卡扣接合。
Please refer to Figures 1 and 2, which are three-dimensional and combined cross-sectional views of the first embodiment of the heat transfer element reinforcement structure of the present invention. As shown in the figure, the heat transfer element reinforcement structure of the present invention includes: a
所述本體1及該補強件2係為金屬或非金屬材質,所述金屬材質係為金或銀或銅或鋁或鐵或不銹鋼或鈦或鋁合金或銅合金或鈦合金,非金屬材質係為陶瓷或塑膠或石材等,所述本體1與該補強件2係可選用為相同或相異材質。
The
所述補強件2具有一勾部21及一補強本體22,所述勾部21於本實施立中係選擇係設於該補強本體22兩端並相互垂直,當然該勾部21可視需求設置於補強本體22之任一地方,並與該補強本體22呈一角度(0~180度之間)之設置,所述本體1具有一第一側13及一第二側14,該本體1相對該勾部21處具有一卡接槽15,該卡接槽15連通該本體1第一、二側13、14兩側,所述補強本體22選擇貼設於該本體1第一、二側13、14其中任一,本實施例係以貼設第二側14作為說明實施例,但並不引以為限,並該勾部21對應嵌入卡制於該本體1之卡接槽15內。
The reinforcing
請參閱第3圖,係為本發明之熱傳元件補強結構第二實施例之立體分解圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述本體1係為一導熱基座,所述本體1具有一第一側13及一第二側14,所述本體1中央處開設一凹槽16,並該凹槽16嵌埋一導熱塊3,所述導熱塊3係為銅、鋁、不銹鋼、陶瓷其中任一,該本體1
之第一側13對接一散熱單元4,該散熱單元4係為散熱器或散熱鳍片組;複數熱管5與該導熱塊3及該本體1相互連接。
Please refer to Figure 3, which is a three-dimensional exploded view of the second embodiment of the heat transfer element reinforcement structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the
請參閱第4圖,係為本發明之熱傳元件補強結構第三實施例之組合剖視圖,一併參閱第1-3圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述本體1具有一第一側13及一第二側14,所述本體1之第一、二側13、14間具有一氣密腔室18,該氣密腔室18內具有一毛細結構181及一工作液體182,所述補強件2選擇對應設於該第一、二側邊11、12或第一、二側13、14其中任一。
Please refer to Figure 4, which is a combined cross-sectional view of the third embodiment of the heat transfer element reinforcement structure of the present invention. Refer to Figures 1-3 together. As shown in the figure, this embodiment is a partial structure of the first embodiment described above. The same, so it will not be repeated here, but the difference between this embodiment and the aforementioned first embodiment is that the
請參閱第5圖,係為本發明之熱傳元件補強結構第四實施例之立體組合圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述補強件2具有一補強本體22及一第一折邊23及一第二折邊24,該第一、二折邊23、24由該補強本體22兩側延伸所形成,並與該補強本體22呈垂直,所述補強本體22透過第一、二折邊23、24分別貼設於該本體1之第一、二13、14側藉以與該本體1卡制(扣)結合。
Please refer to Figure 5, which is a three-dimensional assembly view of the fourth embodiment of the heat transfer element reinforcement structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the foregoing first embodiment is that the reinforcing
請參閱第6圖,係為本發明之熱傳元件補強結構第五實施例之立體組合圖,如圖所示,本實施例係部分結構與前述第四實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述補強件2設置於該本體1之第一側邊11與第二側邊12交接之四隅處或由四隅互相延伸交錯。
Please refer to Figure 6, which is a three-dimensional assembly view of the fifth embodiment of the heat transfer element reinforcement structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as the foregoing fourth embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the reinforcing
本發明係提供一種增加導熱元件、導熱基座、散熱器等元件,進行固定時受到壓力或撓曲力之抵抗能力,透過該補強件之設置則大幅提升該導熱元件、導熱基座、散熱器等元件之結構強度。 The present invention provides a heat-conducting element, a heat-conducting base, a heat sink and other elements that can resist pressure or flexural force when being fixed. The arrangement of the reinforcement can greatly improve the heat-conducting element, heat-conducting base, and heat sink. The structural strength of other components.
1:本體 1: body
11:第一側邊 11: First side
12:第二側邊 12: second side
15:卡接槽 15: card slot
2:補強件 2: Reinforcement
21:勾部 21: Hook
22:補強本體 22: Reinforce the body
Claims (5)
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TWI727430B true TWI727430B (en) | 2021-05-11 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2490791Y (en) * | 2001-05-22 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Fastener of heat sink |
CN201674751U (en) * | 2010-04-20 | 2010-12-15 | 博大科技股份有限公司 | Fastener of radiator |
TWM570587U (en) * | 2018-09-11 | 2018-11-21 | 華碩電腦股份有限公司 | Heat dissipation assembly |
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- 2019-09-23 TW TW108134263A patent/TWI727430B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2490791Y (en) * | 2001-05-22 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Fastener of heat sink |
CN201674751U (en) * | 2010-04-20 | 2010-12-15 | 博大科技股份有限公司 | Fastener of radiator |
TWM570587U (en) * | 2018-09-11 | 2018-11-21 | 華碩電腦股份有限公司 | Heat dissipation assembly |
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