CN110708931A - Heat transfer element reinforcing structure - Google Patents
Heat transfer element reinforcing structure Download PDFInfo
- Publication number
- CN110708931A CN110708931A CN201910901531.0A CN201910901531A CN110708931A CN 110708931 A CN110708931 A CN 110708931A CN 201910901531 A CN201910901531 A CN 201910901531A CN 110708931 A CN110708931 A CN 110708931A
- Authority
- CN
- China
- Prior art keywords
- reinforcing
- transfer element
- heat transfer
- heat
- reinforcing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a heat transfer element reinforcing structure, which comprises: a body; the body is provided with a pair of first sides, a pair of second sides and a reinforcing piece, the reinforcing piece is correspondingly buckled and jointed with any more than one of four corners of the first side, the second side and the connection of the first side and the second side of the body in an external connection mode, and the strength of the body structure is increased by means of the combination of the reinforcing piece and the body.
Description
Technical Field
The present invention relates to a heat transfer element reinforcing structure, and more particularly, to a heat transfer element reinforcing structure which can enhance the strength of a heat transfer element structure by combining a reinforcing member.
Background
Generally, electronic devices have a plurality of electronic components, such as a central processing unit, which generate a large amount of heat during operation, and if the heat generated by the electronic components is not removed in time, the temperature of the working environment of the electronic components is increased, which seriously affects the normal operation of the electronic components.
Generally, the heat dissipation element or the heat conduction unit is directly fastened to the proper position of the periphery of the electronic Component (CPU) on the motherboard by an elastic spring or a fastener, and the heat dissipation element or the heat conduction unit generates a relative pressing force to the electronic component, so that the heat dissipation element or the heat conduction unit can be completely attached to the surface of the heat-generating electronic component.
However, the motherboard cannot provide strong bearing force for the structural design, and such a fixing method will cause the weight of the heat dissipation element or the heat conduction unit to generate improper force on the motherboard, thereby easily causing damage to the motherboard.
How to increase the structural strength of the heat dissipation device or the heat conductive base is the first important goal of those skilled in the art.
Disclosure of Invention
Therefore, to effectively solve the above problems, the main objective of the present invention is to provide a heat transfer element reinforcing structure capable of increasing the strength of the heat transfer element.
To achieve the above object, the present invention provides a heat transfer element reinforcing structure, comprising:
the body is provided with a pair of first sides, a pair of second sides and a reinforcing piece, wherein the reinforcing piece is correspondingly buckled and jointed with any more than one of the four corners of the first side, the second side and the connection of the first side and the second side of the body in an external connection mode.
The heat transfer element reinforcing structure, wherein: the reinforcing piece is provided with a hook part and a reinforcing body, the hook part is arranged at two ends of the reinforcing body and is perpendicular to the reinforcing body, the body is provided with a first side and a second side which are respectively arranged at the upper side and the lower side of the body, a clamping groove is arranged at the position of the body opposite to the hook part and is communicated with the first side and the second side of the body, the reinforcing body is selectively attached to the first side and the second side of the body, and the hook part is correspondingly embedded into and clamped in the clamping groove of the body.
The heat transfer element reinforcing structure, wherein: the body and the reinforcing piece are made of the same or different materials.
The heat transfer element reinforcing structure, wherein: the body is provided with a first side and a second side, an airtight cavity is arranged between the first side and the second side, and a capillary structure and working liquid are arranged in the airtight cavity.
The heat transfer element reinforcing structure, wherein: the body is provided with a first side and a second side, the first side is in butt joint with a heat dissipation unit, the heat dissipation unit is a radiator or a heat dissipation fin group, the second side is in scarf joint with a heat conduction block, the heat conduction block is any one of copper, aluminum, stainless steel and ceramic, and a plurality of heat pipes are connected with the heat conduction block and the body.
The heat transfer element reinforcing structure, wherein: the body is provided with a reinforcing body, a first folding edge and a second folding edge, and the first folding edge and the second folding edge are formed by extending two sides of the reinforcing body and are vertical to the reinforcing body.
The invention provides a heat transfer element reinforcing structure, which increases the strength of the body structure by combining the reinforcing piece and the body, so that the heat transfer element is not deformed or damaged when being fixed under larger downward or upward pressure or tension.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of a reinforcing structure for a heat transfer element of the present invention;
FIG. 2 is a perspective assembly view of a first embodiment of a reinforcing structure of a heat transfer element of the present invention;
FIG. 3 is an exploded perspective view of a second embodiment of the reinforcing structure of the heat transfer element of the present invention;
FIG. 4 is a perspective cross-sectional view of a third embodiment of a reinforcing structure of a heat transfer element of the present invention;
FIG. 5 is a perspective assembly view of a fourth embodiment of a reinforcing structure of a heat transfer element of the present invention;
FIG. 6 is a perspective assembly view of a fifth embodiment of the reinforcing structure of the heat transfer element of the present invention.
Description of reference numerals: a body 1; a first side edge 11; a second side edge 12; a first side 13; a second side 14; a clip groove 15; a recess 16; a gas-tight chamber 18; a capillary structure 181; a working fluid 182; a reinforcing member 2; a hook part 21; a reinforcement body 22; a first folded edge 23; a second flange 24; a heat-conducting block 3; a heat dissipation unit 4; a heat pipe 5.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and fig. 2, which are three-dimensional and combined cross-sectional views of a heat transfer element reinforcing structure according to a first embodiment of the present invention, as shown in the drawings, the heat transfer element reinforcing structure of the present invention comprises: a body 1;
the body 1 has a pair of first sides 11 and a pair of second sides 12 and a reinforcement 2, the reinforcement 2 is connected (mated) with the first sides 11, the second sides 12 of the body 1, and the four corners of the first sides 11 and the second sides 12 or more than one of the four corners extending and crossing each other.
The body 1 and the reinforcement 2 are made of metal or nonmetal materials, the metal material is gold, silver, copper, aluminum, iron, stainless steel, titanium, aluminum alloy, copper alloy or titanium alloy, the nonmetal material is ceramic, plastic, stone or the like, and the body 1 and the reinforcement 2 can be made of the same or different materials.
The reinforcing member 2 has a hook portion 21 and a reinforcing body 22, the hook portion 21 is selectively disposed at two ends of the reinforcing body 22 and perpendicular to each other in this implementation, certainly, the hook portion 21 can be disposed at any place of the reinforcing body 22 according to requirements and forms an angle (between 0-180 degrees) with the reinforcing body 22, the body 1 has a first side 13 and a second side 14, the body 1 has a clamping groove 15 at a position opposite to the hook portion 21, the clamping groove 15 is communicated with the first side 13 and the second side 14 of the body 1, the reinforcing body 22 is selectively attached to any one of the first side 13 and the second side 14 of the body 1, in this embodiment, the attachment of the second side 14 is taken as an illustrative embodiment, but not taken as a limitation, and the hook portion 21 is correspondingly inserted into the clamping groove 15 of the body 1.
Please refer to fig. 3, which is an exploded perspective view of a second embodiment of a heat transfer element reinforcement structure of the present invention, and as shown in the drawings, a portion of the structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described herein, but the present embodiment is different from the first embodiment in that the main body 1 is a heat conductive base, the main body 1 has a first side 13 and a second side 14, a groove 16 is formed at the center of the main body 1, a heat conduction block 3 is embedded in the groove 16, the heat conduction block 3 is any one of copper, aluminum, stainless steel, and ceramic, the first side 13 of the main body 1 is connected to a heat dissipation unit 4, and the heat dissipation unit 4 is a heat sink or a set of heat dissipation fins; the heat pipes 5 are connected with the heat conducting block 3 and the main body 1.
Referring to fig. 4, a combined cross-sectional view of a third embodiment of a heat transfer element reinforcing structure of the present invention is shown, and referring to fig. 1 to fig. 3 together, as shown in the figure, a portion of the structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described herein, but the present embodiment is different from the first embodiment in that the main body 1 has a first side 13 and a second side 14, an airtight chamber 18 is formed between the first side 13 and the second side 14 of the main body 1, a capillary structure 181 and a working liquid 182 are disposed in the airtight chamber 18, and the reinforcing member 2 is selected to be correspondingly disposed on one of the first side 11 and the second side 12 or the first side 13 and the second side 14.
Please refer to fig. 5, which is a perspective assembly diagram of a fourth embodiment of a heat transfer element reinforcing structure of the present invention, as shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, and therefore will not be described herein again, but the difference between this embodiment and the first embodiment lies in that the reinforcing member 2 has a reinforcing body 22, a first folded edge 23 and a second folded edge 24, the first and second folded edges 23, 24 are formed by extending from two sides of the reinforcing body 22 and are perpendicular to the reinforcing body 22, and the reinforcing body 22 is attached to the first and second sides 13, 14 of the body 1 through the first and second folded edges 23, 24 respectively to be fastened (buckled) with the body 1.
Please refer to fig. 6, which is a perspective assembly diagram of a fifth embodiment of a heat transfer element reinforcing structure of the present invention, as shown in the figure, a portion of the structure of the present embodiment is the same as that of the fourth embodiment, and therefore will not be described herein again, but the present embodiment is different from the first embodiment in that the reinforcing member 2 is disposed at a corner where the first side 11 and the second side 12 of the main body 1 meet or extends and crosses from the corner to the corner.
The invention provides a heat conduction element, a heat conduction base, a radiator and other elements, which are increased in resistance to pressure or deflection force during fixing, and the structural strength of the heat conduction element, the heat conduction base, the radiator and other elements is greatly improved through the arrangement of a reinforcing piece.
Claims (6)
1. A heat transfer element reinforcing structure, comprising:
the body is provided with a pair of first sides, a pair of second sides and a reinforcing piece, wherein the reinforcing piece is correspondingly buckled and jointed with any more than one of the four corners of the first side, the second side and the connection of the first side and the second side of the body in an external connection mode.
2. The heat transfer element reinforcing structure of claim 1, wherein: the reinforcing piece is provided with a hook part and a reinforcing body, the hook part is arranged at two ends of the reinforcing body and is perpendicular to the reinforcing body, the body is provided with a first side and a second side which are respectively arranged at the upper side and the lower side of the body, a clamping groove is arranged at the position of the body opposite to the hook part and is communicated with the first side and the second side of the body, the reinforcing body is selectively attached to the first side and the second side of the body, and the hook part is correspondingly embedded into and clamped in the clamping groove of the body.
3. The heat transfer element reinforcing structure of claim 1, wherein: the body and the reinforcing piece are made of the same or different materials.
4. The heat transfer element reinforcing structure of claim 1, wherein: the body is provided with a first side and a second side, an airtight cavity is arranged between the first side and the second side, and a capillary structure and working liquid are arranged in the airtight cavity.
5. The heat transfer element reinforcing structure of claim 1, wherein: the body is provided with a first side and a second side, the first side is in butt joint with a heat dissipation unit, the heat dissipation unit is a radiator or a heat dissipation fin group, the second side is in scarf joint with a heat conduction block, the heat conduction block is any one of copper, aluminum, stainless steel and ceramic, and a plurality of heat pipes are connected with the heat conduction block and the body.
6. The heat transfer element reinforcing structure of claim 1, wherein: the body is provided with a reinforcing body, a first folding edge and a second folding edge, and the first folding edge and the second folding edge are formed by extending two sides of the reinforcing body and are vertical to the reinforcing body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910901531.0A CN110708931A (en) | 2019-09-23 | 2019-09-23 | Heat transfer element reinforcing structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910901531.0A CN110708931A (en) | 2019-09-23 | 2019-09-23 | Heat transfer element reinforcing structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110708931A true CN110708931A (en) | 2020-01-17 |
Family
ID=69195970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910901531.0A Pending CN110708931A (en) | 2019-09-23 | 2019-09-23 | Heat transfer element reinforcing structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110708931A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI763164B (en) * | 2020-04-29 | 2022-05-01 | 雙鴻科技股份有限公司 | Heat dissipation base |
TWI835697B (en) * | 2023-08-21 | 2024-03-11 | 大陸商深圳興奇宏科技有限公司 | Capillary structure and heat dissipation device thereof |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2481640Y (en) * | 2001-04-17 | 2002-03-13 | 张福隆 | Plastic pallet |
CN2490791Y (en) * | 2001-05-22 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Fastener of heat sink |
TWM287461U (en) * | 2005-07-12 | 2006-02-11 | Thermoshuttle Co Ltd | Strengthening positioning structure of thin fin sheet |
CN201222842Y (en) * | 2008-06-10 | 2009-04-15 | 徐秀沧 | Plate type temperature-equalization heat transmission module |
CN201674751U (en) * | 2010-04-20 | 2010-12-15 | 博大科技股份有限公司 | Fastener of radiator |
CN201707636U (en) * | 2010-05-17 | 2011-01-12 | 苏州聚力电机有限公司 | Pressing fastener structure of heat sink |
US20110032714A1 (en) * | 2009-08-06 | 2011-02-10 | Chang Ko-Ning | Led lighting fixture |
CN103209569A (en) * | 2012-01-16 | 2013-07-17 | 奇鋐科技股份有限公司 | Radiating base and manufacturing method thereof |
CN103700636A (en) * | 2012-09-27 | 2014-04-02 | 同和金属技术有限公司 | Heat radiating plate and method for producing same |
CN204392738U (en) * | 2014-10-29 | 2015-06-10 | 奇鋐科技股份有限公司 | Heat abstractor |
CN105636403A (en) * | 2014-10-29 | 2016-06-01 | 奇鋐科技股份有限公司 | Heat-dissipation device |
CN106061210A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Heat dissipation device with reinforcing support structure |
CN205983368U (en) * | 2016-05-30 | 2017-02-22 | 番禺得意精密电子工业有限公司 | Radiator device combination |
CN206272929U (en) * | 2016-11-10 | 2017-06-20 | 昆山华乐电子科技有限公司 | Steel disc stiffening plate |
CN206332208U (en) * | 2016-12-09 | 2017-07-14 | 天津亿鑫通科技股份有限公司 | The FPC of supporting pressing is carried out with pressing self-feeding type connector |
CN207257362U (en) * | 2017-08-29 | 2018-04-20 | 马勒贝洱热系统(济南)有限公司 | A kind of fixed structure of car radiator |
CN109906017A (en) * | 2018-11-27 | 2019-06-18 | 奇鋐科技股份有限公司 | Heat-sink unit |
-
2019
- 2019-09-23 CN CN201910901531.0A patent/CN110708931A/en active Pending
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2481640Y (en) * | 2001-04-17 | 2002-03-13 | 张福隆 | Plastic pallet |
CN2490791Y (en) * | 2001-05-22 | 2002-05-08 | 富准精密工业(深圳)有限公司 | Fastener of heat sink |
TWM287461U (en) * | 2005-07-12 | 2006-02-11 | Thermoshuttle Co Ltd | Strengthening positioning structure of thin fin sheet |
CN201222842Y (en) * | 2008-06-10 | 2009-04-15 | 徐秀沧 | Plate type temperature-equalization heat transmission module |
US20110032714A1 (en) * | 2009-08-06 | 2011-02-10 | Chang Ko-Ning | Led lighting fixture |
CN201674751U (en) * | 2010-04-20 | 2010-12-15 | 博大科技股份有限公司 | Fastener of radiator |
CN201707636U (en) * | 2010-05-17 | 2011-01-12 | 苏州聚力电机有限公司 | Pressing fastener structure of heat sink |
CN103209569A (en) * | 2012-01-16 | 2013-07-17 | 奇鋐科技股份有限公司 | Radiating base and manufacturing method thereof |
CN103700636A (en) * | 2012-09-27 | 2014-04-02 | 同和金属技术有限公司 | Heat radiating plate and method for producing same |
CN204392738U (en) * | 2014-10-29 | 2015-06-10 | 奇鋐科技股份有限公司 | Heat abstractor |
CN105636403A (en) * | 2014-10-29 | 2016-06-01 | 奇鋐科技股份有限公司 | Heat-dissipation device |
CN205983368U (en) * | 2016-05-30 | 2017-02-22 | 番禺得意精密电子工业有限公司 | Radiator device combination |
CN106061210A (en) * | 2016-07-29 | 2016-10-26 | 苏州聚力电机有限公司 | Heat dissipation device with reinforcing support structure |
CN206272929U (en) * | 2016-11-10 | 2017-06-20 | 昆山华乐电子科技有限公司 | Steel disc stiffening plate |
CN206332208U (en) * | 2016-12-09 | 2017-07-14 | 天津亿鑫通科技股份有限公司 | The FPC of supporting pressing is carried out with pressing self-feeding type connector |
CN207257362U (en) * | 2017-08-29 | 2018-04-20 | 马勒贝洱热系统(济南)有限公司 | A kind of fixed structure of car radiator |
CN109906017A (en) * | 2018-11-27 | 2019-06-18 | 奇鋐科技股份有限公司 | Heat-sink unit |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI763164B (en) * | 2020-04-29 | 2022-05-01 | 雙鴻科技股份有限公司 | Heat dissipation base |
TWI835697B (en) * | 2023-08-21 | 2024-03-11 | 大陸商深圳興奇宏科技有限公司 | Capillary structure and heat dissipation device thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7749812B2 (en) | Heat sink with thermally compliant beams | |
CN110708931A (en) | Heat transfer element reinforcing structure | |
US20080019095A1 (en) | Configurable heat sink with matrix clipping system | |
JP6512644B1 (en) | Heat dissipation structure and heat dissipation method | |
US20090201646A1 (en) | Retaining device | |
US12111113B2 (en) | Heat transfer component reinforcement structure | |
CN210781874U (en) | Heat transfer element reinforcing structure | |
CN101309574A (en) | Combination of cooling device | |
US11719491B2 (en) | Heat transfer member reinforcement structure | |
US7841388B2 (en) | Radiating fin assembly for thermal module | |
JP6146466B2 (en) | Semiconductor device | |
TWM588235U (en) | Reinforcement structure of heat conduction member | |
CN210328135U (en) | Heat sink and circuit board assembly | |
CN110648985B (en) | Heat transfer member reinforcing structure | |
TWM588234U (en) | Reinforcement structure of heat transfer element | |
CN210805746U (en) | Heat transfer member reinforcing structure | |
TWI727430B (en) | Heat transfer component reinforcement structure | |
TWI726424B (en) | Heat transfer member reinforcement structure | |
JP4999060B2 (en) | Heat receiving member mounting structure | |
TWI320302B (en) | Heat dissipation module | |
JP6835244B2 (en) | Semiconductor device | |
US7400507B2 (en) | Fastening structure | |
TW201821939A (en) | Heat dissipation device and mother board assembly | |
CN221468222U (en) | Liquid cooling radiator | |
TWI391087B (en) | Expansion card assembly and heat sink thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200117 |