CN105636403A - Heat-dissipation device - Google Patents
Heat-dissipation device Download PDFInfo
- Publication number
- CN105636403A CN105636403A CN201410603310.2A CN201410603310A CN105636403A CN 105636403 A CN105636403 A CN 105636403A CN 201410603310 A CN201410603310 A CN 201410603310A CN 105636403 A CN105636403 A CN 105636403A
- Authority
- CN
- China
- Prior art keywords
- heat
- support member
- conducting piece
- heat abstractor
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat-dissipation device, and the device comprises a heat dissipation part, a heat conduction part, and a supporting part. One side of the heat conduction part is correspondingly attached to the heat dissipation part, and the opposite peripheral sides of the heat conduction part respectively form at least one assembly connection part and a perforation, and the supporting part is correspondingly assembled at the other side of the heat conduction part. The opposite peripheral sides of the supporting part also respectively form at least one butting joint part, wherein the butting joint part is combined with the assembly connection part. Moreover, a hollow-out region is formed at the central position of the supporting part. Through the above design, the device can greatly increases a withstood locking force when the heat conduction part and the heat dissipation part are combined, and improves the deformation of the heat conduction part.
Description
[technical field]
The invention relates to a kind of be significantly increased with radiating piece in conjunction with time the locking force that bears outside, also can improve the heat abstractor of heat-conducting piece problem on deformation.
[background technology]
Progress due to Technology Times, the operational effectiveness of electronic component is more and more higher, to such an extent as to the functional requirement of heat-sink unit is consequently increased, known heat-sink unit is in order to be able to increase heat radiation function, all significantly adopt the radiating fin group of stack, and constantly research and development improvement on radiating fin, therefore high-effect heat abstractor has been one of the most important Research Emphasis of industrial circle today, it is provided above radiating piece again or in this electronic component and through this radiating piece, described electronic component is dispelled the heat, described radiating piece is generally radiator or radiating fin correspondence is mixed a radiator fan and carried out heat radiation work, it is further transmitted through heat-conducting piece attaching described radiating piece thermal source guiding to be dispelled the heat to side.
The known circulation change utilizing temperature-uniforming plate to pass through phase, to provide the heat-conducting piece of hot biography effect, is usually applied in field of radiating; But due under the demand of scientific and technological progress now and frivolous requirement, cause suitable thin of the corresponding plate body thickness covered of this heat-conducting piece, therefore when this radiating piece is locked on this heat-conducting piece, owing to the locking force demand of described heat-conducting piece is increasing, if with current heat-conducting piece and so big locking force cannot be born, causing that this heat-conducting piece produces diastrophic problem, cause heat-conducting effect to have a greatly reduced quality, severe patient is even anergy.
The above, known have following shortcoming:
1. cannot bear bigger locking force;
2. cause problem on deformation;
3. heat-conducting effect is poor.
Therefore how to solve the above-mentioned problem commonly used and disappearance, the inventor being this case and the relevant manufactures being engaged in the industry are desired most ardently place, the direction person of research improvement.
[summary of the invention]
For effectively solving above-mentioned problem, the main purpose of the present invention be in that to provide a kind of increase heat-conducting piece and radiating piece in conjunction with time the heat abstractor of locking force that bears.
The secondary objective of the present invention, is in that to provide the heat abstractor of a kind of problem on deformation improving heat-conducting piece.
The secondary objective of the present invention, is in that the heat abstractor providing one that heat-conducting effect is substantially improved.
For reaching above-mentioned purpose, the present invention provides a kind of heat abstractor, including: a radiating piece, there is plurality of radiating fins; One heat-conducting piece, its side is corresponding with this radiating piece to be sticked, and the dual-side that this heat-conducting piece is relative forms at least one group connecting part respectively; And a support member, correspondence is combined in this heat-conducting piece opposite side, and the dual-side that this support member is relative forms the combination corresponding with this group connecting part of at least one docking section respectively, and this support member central position forms a vacancy section portion.
This heat-conducting piece is temperature-uniforming plate, and this temperature-uniforming plate central position is formed with a boss correspondence and is located in this vacancy section.
This heat-conducting piece has one first side and one second side, the combination corresponding with this support member of this first side, and this second side is corresponding with this radiating piece to be sticked.
This support member has on the upside of in the of one and on the downside of in the of one, is convexly equipped with at least one protuberance on the upside of this, and to forming at least one groove in lug position place on the downside of this, this projection is distributed in the upside of described support member.
This support member periphery more extends an extension towards direction, described downside, and this extension cover sets described heat-conducting piece.
Four corners of this support member have more at least one hole.
Four corners of this heat-conducting piece have more at least one perforation correspondence and are connected with described hole.
This radiating piece more forms at least one depression, described hole and perforation to caving in.
The material of this support member may be selected to be metal or nonmetal any of which.
Through the design of this structure of the present invention, when described heat-conducting piece and support member can be made to be combined with each other so that bigger locking force can be born when this radiating piece locks, in addition, also can improve known heat-conducting piece and be easily generated problem on deformation.
[accompanying drawing explanation]
Figure 1A is the axonometric chart one of the support member first embodiment of heat abstractor of the present invention;
Figure 1B is the axonometric chart two of the support member first embodiment of heat abstractor of the present invention;
Fig. 2 A is the three-dimensional exploded view of heat abstractor first embodiment of the present invention;
Fig. 2 B is the three-dimensional combination figure of heat abstractor first embodiment of the present invention;
Fig. 3 is the axonometric chart of heat abstractor the second embodiment of the present invention;
Fig. 4 A is the three-dimensional exploded view of heat abstractor the second embodiment of the present invention;
Fig. 4 B is the three-dimensional combination figure of heat abstractor the second embodiment of the present invention.
The component name that in figure, each accompanying drawing labelling is corresponding is:
Heat abstractor 2
Radiating piece 21
Radiating fin 211
Depression 212
Heat-conducting piece 22
First side 221
Second side 222
Boss 223
Group connecting part 224
Perforation 225
Support member 23
Upside 231
Protuberance 2311
Downside 232
Groove 2312
Extension 233
Hole 234
Docking section 235
Vacancy section 236
[detailed description of the invention]
The above-mentioned purpose of the present invention and structure thereof and characteristic functionally, will be explained according to the preferred embodiment of institute's accompanying drawings.
Such as Figure 1A and 1B and 2A and 2B, for the axonometric chart of first embodiment support member of heat abstractor of the present invention and the three-dimensional exploded view of heat abstractor and three-dimensional combination figure, as shown in the figure, a kind of heat abstractor 2, including radiating piece 21 and heat-conducting piece 22 and a support member 23, this radiating piece 21 has several radiating fin 211 and forms at least one depression 212;
Radiating piece 21 is corresponding is sticked with this in the side of described heat-conducting piece 22, and the dual-side that this heat-conducting piece 22 is relative forms at least one group connecting part 224 and at least one perforation 225 respectively;
Described support member 23 correspondence is combined in described heat-conducting piece 22 opposite side, the dual-side that this support member 23 is relative forms the combination corresponding with this group connecting part 224 of at least one docking section 235 respectively, and this support member 23 central position forms a vacancy section portion 236, four corners of this support member 23 have more at least one hole 234 again;
Aforementioned heat-conducting piece 22 is temperature-uniforming plate, this temperature-uniforming plate central position forms a boss 223, this boss 223 is located in concordant in this vacancy section 236 or dimpling in the upside 231 of this support member 23, and this heat-conducting piece 22 has the second side 222 of one first side 221 and this first side 221 contrary, the combination corresponding with described support member 23 of this first side 221, radiating piece 21 is corresponding is sticked with this in this second side 222, again four corners of this heat-conducting piece 22 have more at least one perforation 225 correspondence be connected with described hole 234, and the corresponding described hole 234 of aforementioned radiating piece 21 and perforation 225 are formed with described depression 212,
Aforementioned support member 23 has on the upside of in the of one on the downside of in the of 231 and one 232, on the upside of this, 231 are convexly equipped with at least one protuberance 2311, on the downside of this, 232 to forming at least one groove 2312 in protuberance 2311 position, this protuberance 2311 is distributed in the upside 231 of described support member 23 in order to strengthen this support member 23 structural strength, and wherein the material of this support member 23 may be selected to be metal or nonmetal any of which;
Design through this structure of the present invention, when combining with heat-conducting piece 22 by described support member 23, owing to this heat-conducting piece 22 for copper or aluminum or has made by the metal material of heat conduction, select using copper coin as explanation in the present invention, and material that this support member 23 uses is comparatively hard compared to this heat-conducting piece 22, and protuberance 2311 of arranging in pairs or groups again is distributed in the setting on this support member 23, when described radiating piece 21 can be made to lock, bigger locking force can be born through the setting of this support member 23, in addition, still prevent the problem that known heat-conducting piece is easily generated deformation, and then the effect of heat conduction is significantly increased.
Such as Fig. 3 and 4A and 4B, for the axonometric chart of the second embodiment support member of heat abstractor of the present invention and the three-dimensional exploded view of heat abstractor and three-dimensional combination figure, described heat abstractor portion of element and the corresponding pass of interelement are identical with aforementioned heat abstractor, therefore do not repeat them here, only this heat abstractor and aforementioned main difference are, described support member 23 periphery more extends an extension 233 towards direction, described downside 232, this extension 233 cover sets or positions described heat-conducting piece 22, that is, in the present embodiment, heat-conducting piece 22 described in the overall structure cover cap of this support member 23, when combining with heat-conducting piece 22 by described support member 23, utilize material relatively this heat-conducting piece 22 of this support member 23 for hard, when described radiating piece 21 can be made to lock, and can bear outside bigger locking force, still prevent the problem that known heat-conducting piece is easily generated deformation, and then the effect of heat conduction is significantly increased.
The above, the present invention has the advantage that compared to known
1. can bear bigger locking force;
2. improve problem on deformation;
3. heat-conducting effect is substantially improved.
Below the present invention being described in detail, only as described above, be only preferable embodiment, when the scope that can not limit the invention process. Namely all equalizations made according to the present patent application scope change and modification etc., all should still belong to the patent covering scope of the present invention.
Claims (9)
1. a heat abstractor, it is characterised in that including:
One radiating piece, has plurality of radiating fins;
One heat-conducting piece, its side is corresponding with this radiating piece to be sticked, and the dual-side that this heat-conducting piece is relative forms at least one group connecting part respectively; And
One support member, correspondence is combined in this heat-conducting piece opposite side, and the dual-side that this support member is relative forms the combination corresponding with this group connecting part of at least one docking section respectively, and this support member central position forms a vacancy section portion.
2. heat abstractor according to claim 1, it is characterised in that described heat-conducting piece is temperature-uniforming plate, this temperature-uniforming plate central position is formed with a boss correspondence and is located in this vacancy section.
3. heat abstractor according to claim 2, it is characterised in that described heat-conducting piece has one first side and one second side, the combination corresponding with this support member of this first side, and this second side is corresponding with this radiating piece to be sticked.
4. heat abstractor according to claim 3, it is characterized in that, described support member has on the upside of in the of one and on the downside of in the of one, is convexly equipped with at least one protuberance on the upside of this, to forming at least one groove in lug position place on the downside of this, this projection is distributed in the upside of described support member.
5. heat abstractor according to claim 3, it is characterised in that described support member periphery more extends an extension towards direction, described downside, this extension cover sets described heat-conducting piece.
6. heat abstractor according to claim 1, it is characterised in that four corners of this support member described have more at least one hole.
7. heat abstractor according to claim 6, it is characterised in that four corners of described heat-conducting piece have more at least one perforation correspondence and are connected with described hole.
8. heat abstractor according to claim 7, it is characterised in that described radiating piece more forms at least one depression, described hole and perforation to caving in.
9. heat abstractor according to claim 1, it is characterised in that the material of described support member may be selected to be metal or nonmetal any of which.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410603310.2A CN105636403B (en) | 2014-10-29 | 2014-10-29 | Radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410603310.2A CN105636403B (en) | 2014-10-29 | 2014-10-29 | Radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105636403A true CN105636403A (en) | 2016-06-01 |
CN105636403B CN105636403B (en) | 2018-08-21 |
Family
ID=56050727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410603310.2A Active CN105636403B (en) | 2014-10-29 | 2014-10-29 | Radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105636403B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110648985A (en) * | 2019-09-23 | 2020-01-03 | 奇鋐科技股份有限公司 | Heat transfer member reinforcing structure |
CN110708931A (en) * | 2019-09-23 | 2020-01-17 | 奇鋐科技股份有限公司 | Heat transfer element reinforcing structure |
US11719491B2 (en) | 2019-10-29 | 2023-08-08 | Asia Vital Components Co., Ltd. | Heat transfer member reinforcement structure |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201167446Y (en) * | 2008-02-18 | 2008-12-17 | 索士亚科技股份有限公司 | Radiating module |
CN201222842Y (en) * | 2008-06-10 | 2009-04-15 | 徐秀沧 | Plate type temperature-equalization heat transmission module |
CN202003980U (en) * | 2011-02-24 | 2011-10-05 | 佳承精工股份有限公司 | Radiator structure with temperature equalizing plate |
CN202721196U (en) * | 2012-09-05 | 2013-02-06 | 黑龙江省爱普照明电器有限公司 | LED directly-conducting heat radiator |
CN102956582A (en) * | 2011-08-29 | 2013-03-06 | 富准精密工业(深圳)有限公司 | Radiating device |
CN102956580A (en) * | 2011-08-17 | 2013-03-06 | 奇鋐科技股份有限公司 | Fixing structure of radiating unit |
CN203454875U (en) * | 2013-07-22 | 2014-02-26 | 施金城 | Vapor chamber |
JP2014053442A (en) * | 2012-09-07 | 2014-03-20 | Mitsubishi Electric Corp | Plate laminated type cooling device |
CN204392738U (en) * | 2014-10-29 | 2015-06-10 | 奇鋐科技股份有限公司 | Heat abstractor |
-
2014
- 2014-10-29 CN CN201410603310.2A patent/CN105636403B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201167446Y (en) * | 2008-02-18 | 2008-12-17 | 索士亚科技股份有限公司 | Radiating module |
CN201222842Y (en) * | 2008-06-10 | 2009-04-15 | 徐秀沧 | Plate type temperature-equalization heat transmission module |
CN202003980U (en) * | 2011-02-24 | 2011-10-05 | 佳承精工股份有限公司 | Radiator structure with temperature equalizing plate |
CN102956580A (en) * | 2011-08-17 | 2013-03-06 | 奇鋐科技股份有限公司 | Fixing structure of radiating unit |
CN102956582A (en) * | 2011-08-29 | 2013-03-06 | 富准精密工业(深圳)有限公司 | Radiating device |
CN202721196U (en) * | 2012-09-05 | 2013-02-06 | 黑龙江省爱普照明电器有限公司 | LED directly-conducting heat radiator |
JP2014053442A (en) * | 2012-09-07 | 2014-03-20 | Mitsubishi Electric Corp | Plate laminated type cooling device |
CN203454875U (en) * | 2013-07-22 | 2014-02-26 | 施金城 | Vapor chamber |
CN204392738U (en) * | 2014-10-29 | 2015-06-10 | 奇鋐科技股份有限公司 | Heat abstractor |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110648985A (en) * | 2019-09-23 | 2020-01-03 | 奇鋐科技股份有限公司 | Heat transfer member reinforcing structure |
CN110708931A (en) * | 2019-09-23 | 2020-01-17 | 奇鋐科技股份有限公司 | Heat transfer element reinforcing structure |
US11719491B2 (en) | 2019-10-29 | 2023-08-08 | Asia Vital Components Co., Ltd. | Heat transfer member reinforcement structure |
Also Published As
Publication number | Publication date |
---|---|
CN105636403B (en) | 2018-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6117288B2 (en) | Cooling system | |
JP3182697U (en) | Heat dissipation device | |
WO2020137569A1 (en) | Heatsink | |
JP6367251B2 (en) | Radiator | |
CN105636403A (en) | Heat-dissipation device | |
JP3196886U (en) | Support frame for fixing | |
US7032650B1 (en) | Cooling fin set | |
CN108695275B (en) | Heat radiator | |
CN107529315A (en) | Temperature-uniforming plate and heat abstractor | |
CN204392738U (en) | Heat abstractor | |
US10132571B2 (en) | Knockdown heat dissipation unit | |
TWM559045U (en) | Memory heat dissipation unit | |
TWM591754U (en) | Fastening structure of heat dissipation module | |
JP3195578U (en) | Heat dissipation device for electronic equipment | |
TWI472292B (en) | Heat-dissipation unit and method of manufacturing same | |
US9475156B2 (en) | Heat-dissipation unit and method of manufacturing same | |
TWI522595B (en) | Heat sink | |
CN208520247U (en) | Assembling connection type radiating fin group | |
CN104144590B (en) | Heat radiation module integrated structure | |
CN210610128U (en) | Heat dissipation sheet and cooking utensil | |
US9989321B2 (en) | Heat dissipation device | |
US9879920B2 (en) | Vapor chamber structure | |
CN102829669B (en) | Heat radiation module and manufacture method thereof | |
TWI668555B (en) | Memory heat dissipation unit and manufacturing method thereof | |
CN103702547B (en) | Heat pipe radiator of anti-explosion shell |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |