CN202003980U - Radiator structure with temperature equalizing plate - Google Patents

Radiator structure with temperature equalizing plate Download PDF

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Publication number
CN202003980U
CN202003980U CN2011200475125U CN201120047512U CN202003980U CN 202003980 U CN202003980 U CN 202003980U CN 2011200475125 U CN2011200475125 U CN 2011200475125U CN 201120047512 U CN201120047512 U CN 201120047512U CN 202003980 U CN202003980 U CN 202003980U
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CN
China
Prior art keywords
heat
temperature
lock
plate
uniforming plate
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Expired - Fee Related
Application number
CN2011200475125U
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Chinese (zh)
Inventor
施川伟
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CHIA CHERNE INDUSTRY Co Ltd
Original Assignee
CHIA CHERNE INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN2011200475125U priority Critical patent/CN202003980U/en
Application granted granted Critical
Publication of CN202003980U publication Critical patent/CN202003980U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a radiator structure with a temperature equalizing plate, which comprises a heat conducting plate and the temperature equalizing plate. A plurality of radiating fins are integrally formed on one side of the heat conducting plate, two lock-joint portions are respectively integrally formed at two edges of the other side of the heat conducting plate, a concave portion is formed between the two lock-joint portions, the temperature equalizing plate is adhered on the concave portion, and at least one screw penetrates through each lock-joint portion to be locked on a printed circuit board in a screwed manner so that the temperature equalizing plate contacts with a high heating element. The lock-joint portions which are integrally formed and have certain thicknesses have sufficient strength to resist locking force of the screws, the heat conducting plate can be prevented from deforming to affect contact closeness of the temperature equalizing plate with the high heating element, the temperature equalizing plate can flatly contact with the high heating element in an attached manner, and heat can be quickly transferred outwards indeed.

Description

Heat spreader structures with temperature-uniforming plate
Technical field
The utility model relates to radiator, particularly has the heat spreader structures of temperature-uniforming plate.
Background technology
See also shown in Figure 1, existing radiator has a heat-conducting plate 1 and a temperature-uniforming plate 2, one side of this heat-conducting plate 1 is provided with a plurality of radiating fins 3, and glutinous this temperature-uniforming plate 2 of establishing of this heat-conducting plate 1 opposite side, screw lock is passed on a printed circuit board (PCB) (figure does not show) by at least one screw 4 respectively in the both sides of this heat-conducting plate 1 again, so that these temperature-uniforming plate 2 contacts one are installed in the high heater element (figure does not show) on this printed circuit board (PCB), in this temperature-uniforming plate 2 is hollow, and vacuumize and be sealed with conductive fluid 5 (pure water), but the liquid gas by pure water changes and high speed heat conduction, therefore the heat that this high heater element produced can be scattered fast by this temperature-uniforming plate 2, and scatter by a plurality of radiating fins 3 of this heat-conducting plate 1, to reduce temperature.
Yet in order to save material, lower weight and to quicken heat-conducting effect, what the thickness of this heat-conducting plate 1 was suitable approaches, therefore when these heat-conducting plate 1 both sides respectively when these screw 4 screw locks are on this printed circuit board (PCB), can cause this heat-conducting plate 1 flexural deformation because of the screw lock power of this screw 4, that is these temperature-uniforming plate 2 meeting flexural deformations, and can't contact this high heater element in driving fit ground, and make heat-conducting effect have a greatly reduced quality.
Between this temperature-uniforming plate 2 and this heat-conducting plate 1, also produce the space because of distortion easily again, it also can cause heat-conducting effect low, can't fast heat be passed to this heat-conducting plate 1 from this temperature-uniforming plate 2, and can't bring into play the due radiating effect of radiator.
The utility model content
Therefore, main purpose of the present utility model is to disclose a kind of heat spreader structures that can transmit out really fast to heat, with the due radiating effect of certain performance radiator.
Via as can be known above, for achieving the above object, the utility model is a kind of heat spreader structures with temperature-uniforming plate, it comprises a heat-conducting plate and a temperature-uniforming plate, wherein a side of this heat-conducting plate is integrally formed goes out a plurality of radiating fins, and each integrally formedly goes out a lock-joining part dual-side of this heat-conducting plate opposite side, forms a recess between these two lock-joining parts, and glutinous this recess of being located at of this temperature-uniforming plate.
According to the further improved technical scheme of the utility model, this heat-conducting plate respectively forms one and fixes bank in the both sides, front and back of this recess, and dig down and establish an airtight space, this temperature-uniforming plate is fixed bank by these two and these two lock-joining parts center on the location and cover this airtight space of sealing.
According to the further improved technical scheme of the utility model, this temperature-uniforming plate is provided with a plurality of heat conduction fins, and these a plurality of heat conduction fins stretch in this airtight space.
According to the further improved technical scheme of the utility model, this heat-conducting plate is provided with an aspirating hole, and this aspirating hole is communicated with this airtight space.
According to the further improved technical scheme of the utility model, this lock-joining part is provided with at least one perforation of passing at least one screw.
According to the further improved technical scheme of the utility model, this at least one screw respectively is arranged with a spring.
In view of the above, this lock-joining part of the present utility model can pass screw lock on a printed circuit board (PCB) and make this temperature-uniforming plate contact a high heater element at least one screw, because this lock-joining part is one of the forming and has suitable thickness, relative prior art, have enough intensity and resist the coupling mechanism force of this at least one screw, can avoid the distortion of this heat-conducting plate and influence the adaptation that contacts of this temperature-uniforming plate and this high heater element, make this temperature-uniforming plate can entirely attach this high heater element of contact, and can transmit heat out really fast.
Description of drawings
Fig. 1 is existing heat spreader structures figure with temperature-uniforming plate;
Fig. 2 is a three-dimensional decomposition chart of the present utility model;
Fig. 3 is three-dimensional figure of the present utility model;
Fig. 4 is another execution mode structure chart of the utility model;
Fig. 5 is another execution mode cutaway view of the utility model; And
Fig. 6 is the another execution mode cutaway view of the utility model.
Embodiment
For specifically presenting structural design of the present utility model and technology, careful conjunction with figs. is discussed in the back again:
See also Fig. 2 and shown in Figure 3, the utility model is a kind of heat spreader structures with temperature-uniforming plate, it comprises a heat-conducting plate 10 and a temperature-uniforming plate 20, wherein a side of this heat-conducting plate 10 is integrally formed goes out a plurality of radiating fins 30, and each integrally formedly goes out a lock-joining part 40 dual-side of these heat-conducting plate 10 opposite sides, form a recess 50 and this temperature-uniforming plate 20 glutinous this recesses 50 of being located between these two lock-joining parts 40, this lock-joining part 40 is provided with at least one perforation 41 of passing at least one screw 60 again, and this at least one screw 60 respectively is arranged with a spring 61.In view of the above, this lock-joining part 40 can pass and this temperature-uniforming plate 20 contacts one high heater elements (scheming not show) are gone up and made to screw lock in a printed circuit board (PCB) (figure do not show) for this at least one screw 60.
Please consult Fig. 4 and shown in Figure 5 again, it is another execution mode of the present utility model, wherein this heat-conducting plate 10 respectively forms one and fixes bank 52 in the both sides, front and back of this recess 50, and can dig down and establish an airtight space 51, this temperature-uniforming plate 20 is fixed bank 52 by these two, these two lock-joining parts 40 are around locating and cover this airtight space 51 of sealing, this heat-conducting plate 10 is provided with an aspirating hole 11 again, this aspirating hole 11 is communicated with this airtight space 51, in view of the above since present embodiment can deflate and pour into conductive fluid 70 by this aspirating hole 11, conductive fluid 70 can be used pure water, change and quick conductive with gas-liquid by this conductive fluid 70, this temperature-uniforming plate 20 has a confined space 22 again, this confined space 22 is sealed with conductive fluid 71 equally, change and quick conductive with gas-liquid, so the heat of this temperature-uniforming plate 20 can be directed at this heat-conducting plate 10 fast by this conductive fluid 71.
Please consult shown in Figure 6 again, it is an another execution mode of the present utility model, wherein this temperature-uniforming plate 20 more can be provided with a plurality of heat conduction fins 21, and these a plurality of heat conduction fins 21 stretch in this airtight space 51 and contact this conductive fluid 70, can increase the contact area of conductive fluid 70 and this temperature-uniforming plate 20 in view of the above, and promote heat-conducting effect further, satisfy the demand on using.
As mentioned above, this lock-joining part 40 of the present utility model is one of the forming and the suitable thickness of tool, therefore has the coupling mechanism force that enough intensity is resisted this at least one screw 60, can avoid 10 distortion of this heat-conducting plate and influence the adaptation that contacts of this temperature-uniforming plate 20 and this high heater element, make this temperature-uniforming plate 20 can entirely attach this high heater element of contact, can further increase heat-conducting effect by the quick conductive of this conductive fluid 70 again, satisfy the demand on using.

Claims (6)

1. the heat spreader structures with temperature-uniforming plate is characterized in that, comprising:
One heat-conducting plate (10), a side of described heat-conducting plate (10) is integrally formed to go out a plurality of radiating fins (30), and the dual-side of described heat-conducting plate (10) opposite side each integrally formedly go out a lock-joining part (40), form a recess (50) between these two lock-joining parts (40); And
One temperature-uniforming plate (20), the glutinous described recess (50) of being located at of described temperature-uniforming plate (20).
2. the heat spreader structures with temperature-uniforming plate according to claim 1, it is characterized in that, described heat-conducting plate (10) respectively forms one and fixes bank (52) in the both sides, front and back of described recess (50), and dig down and establish an airtight space (51), described temperature-uniforming plate (20) is fixed bank (52) by two and two lock-joining parts (40) seal described airtight space (51) around locating and covering.
3. the heat spreader structures with temperature-uniforming plate according to claim 2 is characterized in that, described temperature-uniforming plate (20) is provided with a plurality of heat conduction fins (21), and described a plurality of heat conduction fins (21) stretch in the described airtight space (51).
4. the heat spreader structures with temperature-uniforming plate according to claim 2 is characterized in that, described heat-conducting plate (10) is provided with an aspirating hole (11), and described aspirating hole (11) is communicated with described airtight space (51).
5. the heat spreader structures with temperature-uniforming plate according to claim 1 is characterized in that, described lock-joining part (40) is provided with at least one perforation (41) of passing at least one screw (60).
6. the heat spreader structures with temperature-uniforming plate according to claim 5 is characterized in that, described at least one screw (60) respectively is arranged with a spring (61).
CN2011200475125U 2011-02-24 2011-02-24 Radiator structure with temperature equalizing plate Expired - Fee Related CN202003980U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200475125U CN202003980U (en) 2011-02-24 2011-02-24 Radiator structure with temperature equalizing plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200475125U CN202003980U (en) 2011-02-24 2011-02-24 Radiator structure with temperature equalizing plate

Publications (1)

Publication Number Publication Date
CN202003980U true CN202003980U (en) 2011-10-05

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CN2011200475125U Expired - Fee Related CN202003980U (en) 2011-02-24 2011-02-24 Radiator structure with temperature equalizing plate

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244627A (en) * 2014-09-23 2014-12-24 中国北方车辆研究所 Board packaging mechanism
CN105636403A (en) * 2014-10-29 2016-06-01 奇鋐科技股份有限公司 Heat-dissipation device
US9989321B2 (en) 2014-11-20 2018-06-05 Asia Vital Components Co., Ltd. Heat dissipation device
CN111023879A (en) * 2015-03-26 2020-04-17 株式会社村田制作所 Thin heat radiation plate
CN113241333A (en) * 2021-04-30 2021-08-10 阳光电源股份有限公司 Power device heat dissipation system, assembly method thereof and semiconductor equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244627A (en) * 2014-09-23 2014-12-24 中国北方车辆研究所 Board packaging mechanism
CN104244627B (en) * 2014-09-23 2017-11-07 中国北方车辆研究所 A kind of board packaging mechanism
CN105636403A (en) * 2014-10-29 2016-06-01 奇鋐科技股份有限公司 Heat-dissipation device
CN105636403B (en) * 2014-10-29 2018-08-21 奇鋐科技股份有限公司 Radiator
US9989321B2 (en) 2014-11-20 2018-06-05 Asia Vital Components Co., Ltd. Heat dissipation device
CN111023879A (en) * 2015-03-26 2020-04-17 株式会社村田制作所 Thin heat radiation plate
CN113241333A (en) * 2021-04-30 2021-08-10 阳光电源股份有限公司 Power device heat dissipation system, assembly method thereof and semiconductor equipment

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111005

Termination date: 20160224

CF01 Termination of patent right due to non-payment of annual fee