CN109906017A - Heat-sink unit - Google Patents
Heat-sink unit Download PDFInfo
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- CN109906017A CN109906017A CN201811426999.0A CN201811426999A CN109906017A CN 109906017 A CN109906017 A CN 109906017A CN 201811426999 A CN201811426999 A CN 201811426999A CN 109906017 A CN109906017 A CN 109906017A
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Abstract
The present invention provides a kind of heat-sink unit, includes an ontology, has a upper surface and a lower surface, and there is an at least heat-conducting piece heat-absorbent surface and a heat transfer face, the heat transfer face to be set to the lower surface of the ontology.This is designed by virtue of this invention, heat-sink unit of the invention can be directly attached to by an at least heat-conducting piece height relatively around or the heater element of the also low heater element of nearby electron element or plural different height on, it is not required to the effect of curved (recessed) deconsolidation hot cell destroys its internal capillary structure and obstruction steam channel, reaches preferable heat dissipation effect.
Description
Technical field
The present invention relates to heat-sink unit, refer in particular at least one thermally conductive on a kind of outer surface by being incorporated in an ontology
Part, to carry out contact heat dissipation to the heater element for generating high and low fall because of nearby electron element, effectively to reach heat dissipation effect
Good heat-sink unit.
Background technique
Existing mobile device, PC, server, communication machine box or other systems or device are all because operation efficiency mentions
It rises, and heat caused by its internal heating element (such as, but not limited to chip) is also with promotion, and existing electronic equipment
Function is more and more polynary, and substrate is equipped with various heater elements.Temperature-uniforming plate (Vapor chamber) is a kind of larger range face
With the heat transfer application in face, temperature-uniforming plate system is in square type or the shell (or plate body) of non-rectangle shape, enclosure interior chamber at least one
Capillary structure is arranged in inner wall, and the enclosure interior is filled with working fluid, and the one side (heating surface) of the shell is enabled to be sticked
Heat caused by the heater element is adsorbed on the heater element, so that the working fluid of liquid is evaporated to steam state, heat is conducted
To the other side (cryosurface) of the shell, the working fluid of the steam state is condensed into liquid after being cooled down, the working fluid of the liquid
Heating surface is back to by gravity or capillary structure again and continues steam-condensate circulating, effectively to achieve the effect that temperature uniforming heat radiation, temperature-uniforming plate
Thermal contact conductance area it is larger, be different from the point-to-point heat exchange pattern of heat pipe, thus be suitble to heating area larger or it is plural away from
From closer heater element.
However, the design of electronic circuits of existing substrate, the height that will form the heater element that need to be radiated may be than surrounding
Or neighbouring resistance, capacitor or other passive devices are also low, therefore existing scattered element member such as radiator, heat pipe, temperature-uniforming plate,
Loop hot-pipe etc. is difficult to effectively be pasted on heater element completely.
Another existing problem is, when with a plurality of heater elements that need to be radiated, each fever that need to be radiated
The height of element is not identical.It is existing using temperature-uniforming plate to the heater element of a lower height of heater element or plural different height
When being radiated, curved (recessed) folding can be carried out to temperature-uniforming plate and is used, to enable temperature-uniforming plate that can attach the heater element of different height, but
Temperature-uniforming plate is also easy to produce after curved (recessed) folding destroys internal capillary structure (such as capillary structure falls off) and obstruction steam channel or because curved
Be folded over greatly cause capillary phenomenon failure can not return water phenomena such as, all cause temperature-uniforming plate entirety heat dissipation effect reduce or disable, into
And cause temperature of heating elements excessively high.
Therefore, how to solve the above problems is the direction to be made great efforts of those skilled in the art.
Summary of the invention
A purpose of the invention is providing an a kind of at least heat-conducting piece by the outer surface of an ontology to height
Around relatively or the heater element of the also low heater element of nearby electron element or plural different height effectively reaches excellent in heat dissipation effect
Heat-sink unit.
To reach above-mentioned purpose, the present invention a kind of heat-sink unit is provided, characterized by comprising:
One ontology has a upper surface and a lower surface；And
There is an at least heat-conducting piece heat-absorbent surface and a heat transfer face, the heat transfer face to be set to the lower surface of the ontology.
The heat-sink unit, in which: the ontology and this at least a heat-conducting piece is independent element respectively, at least one leads for this
The corresponding lower surface for being incorporated in the ontology in the heat transfer face of warmware.
The heat-sink unit, in which: the heat transfer face of an at least heat-conducting piece is formed under the ontology with being integrated
Surface.
The heat-sink unit, in which: the ontology is a heat conduction substrate, a radiator, a temperature-uniforming plate, a heat pipe and one time
Road formula heat pipe it is any or in which wantonly two or more combination.
The heat-sink unit, in which: the ontology has one first plate body and one second plate body, the upper surface be located at this
The outer surface of one plate body, the lower surface are located at the outer surface of second plate body, which closes second plate body and common
A chamber is defined, which has a capillary structure and a working fluid.
The heat-sink unit, in which: the ontology and an at least heat-conducting piece are same material or non-same material.
The heat-sink unit, in which: the ontology and an at least heat-conducting piece are metal material or ceramic material, the gold
Category material is gold, silver, copper, iron, aluminium, stainless steel, titanium, billon, silver alloy, copper alloy, ferroalloy, aluminium alloy, titanium alloy material
Matter is any, and the ceramic material is that silicon nitride, zirconium oxide and aluminium oxide are any.
The heat-sink unit, in which: the combination of the ontology and an at least heat-conducting piece passes through soft soldering, hard solder, expansion
It dissipates engagement, ultrasonic welding, laser welding, gluing, interlocking, mounting, sintering and directly covers any mode of copper method and combine.
The heat-sink unit, in which: the lower surface of the ontology has an at least combined area and at least one non-binding area, should
The adjacent at least one non-binding area in an at least combined area, the heat transfer face of an at least heat-conducting piece is set to the lower surface of the ontology
An at least combined area.
The heat-sink unit, in which: there is plural heat-conducting piece, the plural number heat-conducting piece height is different, the following table of the ontology
There is plural combined area and the non-binding area of plural number, the plural number combined area to distinguish the adjacent non-binding area of the plural number in face, and the plural number is thermally conductive
The heat transfer face of part is respectively arranged at the plural number combined area, and the heat-absorbent surface of the plural number heat-conducting piece is corresponding to be attached at plural height difference
Heater element.
The heat-sink unit, in which: include also an at least binding medium layer, be correspondingly arranged in the lower surface of the ontology
And between the heat transfer face of an at least heat-conducting piece, by this, at least a binding medium layer connects this at least for the lower surface of the ontology
The heat transfer face of one heat-conducting piece.
The heat-sink unit, in which: the lower surface of the ontology has an at least combined area and at least one non-binding area, should
The adjacent at least one non-binding area in an at least combined area, the heat transfer face of an at least heat-conducting piece is set to the lower surface of the ontology
An at least combined area, an at least binding medium layer be correspondingly arranged in the ontology an at least combined area and this at least one
Between the heat transfer face of heat-conducting piece.
The heat-sink unit, in which: an at least binding medium layer passes through vapor deposition, sputter, any mode of plating
It is formed in the lower surface of the ontology.
The heat-sink unit, in which: an at least binding medium layer be a nickel coating, a tin coating and a copper plate its
In it is any.
The heat-sink unit, in which: at least combination of a binding medium layer and an at least heat-conducting piece passes through
Soft soldering, hard solder, diffusion bonding, ultrasonic welding, any mode of laser welding combine.
The heat-sink unit, in which: there is plural heat-conducting piece, the plural number heat-conducting piece height is different, the following table of the ontology
There is plural combined area and the non-binding area of plural number, the plural number combined area to distinguish the adjacent non-binding area of the plural number in face, and the plural number is thermally conductive
The heat transfer face of part is respectively arranged at the plural number combined area, and plural binding medium layer is correspondingly arranged in being somebody's turn to do for the lower surface of the ontology
Between plural combined area and the heat transfer face of the plural number heat-conducting piece, the heat-absorbent surface of the plural number heat-conducting piece is corresponding to be attached at plural height
Different heater elements.
By virtue of this invention this design, heat-sink unit of the invention can by an at least heat-conducting piece be directly attached to height compared with
Around or the heater element of the also low heater element of nearby electron element or plural different height on, it is single to be not required to curved (recessed) deconsolidation heat
The effect of member destroys its internal capillary structure and obstruction steam channel, reaches preferable heat dissipation effect.
The purpose of following schema is to enable the invention to be more easily understood, and can encyclopaedize those schemas in this article,
And it is made to constitute some of specific embodiment.Pass through specific embodiment herein and refer to corresponding schema, with detailed
Explain specific embodiments of the present invention, and the action principle to illustrate invention.
Detailed description of the invention
Fig. 1 is the stereogram exploded view of the first embodiment of heat-sink unit of the present invention；
Fig. 2 is another visual angle of stereogram exploded view of the first embodiment of heat-sink unit of the present invention；
Fig. 3 is the assembled sectional view of the first embodiment of heat-sink unit of the present invention；
Fig. 4 is the binding medium layer assembled sectional view of the first embodiment of heat-sink unit of the present invention；
Fig. 5 is the stereogram exploded view of the second embodiment of heat-sink unit of the present invention；
Fig. 6 is another visual angle of stereogram exploded view of the second embodiment of heat-sink unit of the present invention；
Fig. 7 is the assembled sectional view of the second embodiment of heat-sink unit of the present invention；
Fig. 8 is the binding medium layer assembled sectional view of the second embodiment of heat-sink unit of the present invention.
Description of symbols: heat-sink unit 1；Ontology 11；Upper surface 111；Lower surface 112；First plate body 113；Second plate
Body 114；Chamber 115；Capillary structure 116；Working fluid 117；Combined area 118a, 118b；Non-binding area 119a, 119b；It is thermally conductive
Part 12a, 12b；Heat-absorbent surface 121；Heat transfer face 122；Binding medium layer 131,132；Machine plate 2；Heater element 21,22；Electronics member
Part 23.
Specific embodiment
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given
Explanation.
Fig. 1, Fig. 2 and Fig. 3 are please referred to, is the stereogram exploded view and stereo decomposing of the first embodiment of heat-sink unit of the present invention
Another visual angle and assembled sectional view are schemed, as shown, 1 system of heat-sink unit of the present invention needs to radiate applied to an electronic device
Pyrotoxin on, be attached at machine plate (such as a circuit board or host of the electronic device in 1 system of the heat-sink unit contact of the present embodiment
Plate) on the 2 at least heater elements 21 being equipped with, with to this, at least a heater element 21 radiates, and in the present embodiment, be
It is expressed as height heater element 21 low compared with ambient electron element 23 (such as central processing unit and display processing chip).Wherein
The heater element 21 is not limited to above-mentioned central processing unit and display processing chip, in when it is implemented, the heater element 21
It may be selected to be such as the transistor or other electronic components for needing to radiate on south, north bridge chip or circuit board.
The heat-sink unit 1 includes that an ontology 11 and an at least heat-conducting piece 12a, the ontology 11 are expressed as one in the present embodiment
Temperature-uniforming plate, in other embodiments, the ontology 11 are alternatively chosn to a heat conduction substrate (such as thermal coefficient high metal block or alloy
Block), a radiator (such as aluminium extruded type radiator or finned radiator), a heat pipe, primary Ioops formula heat pipe it is any or its
In combination, wherein an at least heat-conducting piece 12a is expressed as a solid heat-conducting block in the present embodiment, in other embodiments, should
An at least heat-conducting piece 12a is alternatively chosn to the heat carrier (such as temperature-uniforming plate or flat plate heat tube) of a tool hollow chamber, it is described at least
One heat-conducting piece is expressed as the corresponding heater element 21 of heat-conducting piece 12a in the present embodiment, but the heat-conducting piece of the present embodiment with
The quantity of heater element is not limited to said one, and variant embodiment will be additionally carried out description.Aforementioned heat-conducting piece and fever member
The height of part can be designed according to radiating requirements in advance, adjust the height of aforementioned heat-conducting piece and heater element.
The aforementioned ontology 11 has a upper surface 111 and a lower surface 112, and since 11 system of ontology is expressed as a samming
Plate, therefore the ontology 11 has one first plate body 113 and one second plate body 114, which is located at first plate body 113
Outer surface, the lower surface 112 are located at the outer surface of second plate body 114, and first plate body 113 lid closes second plate body 114 simultaneously
A chamber 115 is defined jointly, which is an air-tight chamber and has a capillary structure 116 and a working fluid 117, should
116 system of capillary structure indicate be, for example, sintering body of powder, knitted body, grid body, corpus fibrosum and groove it is any or in which appoint
Two or more combination.
The lower surface 112 of the ontology 11 has at least non-binding area 119a of a combined area 118a and at least one, this at least one
Combined area 118a can the adjacent or neighbour at least one non-binding area 119a, at least a combined area 118a is expressed as in the present embodiment for this
The corresponding heat-conducting piece 12a of one combined area 118a, and at least one non-binding area 119a in the present embodiment be expressed as one it is non-
Combined area 119a is adjacent and around combined area 118a, which is to combine heat-conducting piece 12a to inhale in combined area 118a
Receive height relatively around or the heat that generates when the also low running of heater element 21 of nearby electron element 23, which is at this
Non-binding area 119a flashes higher-height electronic component 23 around the heater element 21, but the combined area of the present embodiment, non-knot
The quantity for closing area and heat-conducting piece is not limited to said one, and variant embodiment will be additionally carried out description.The combined area 118a
And non-binding area 119a means the region of the lower surface 112 of the ontology 11, is not necessarily referring to 112 additional of lower surface of the ontology 11
Structure, and be in the drawings to outline the region with dotted line to indicate.
Heat-conducting piece 12a has a heat-absorbent surface 121 and a heat transfer face 122, the heat-absorbent surface 121 and the heat transfer face 122
It is divided into the upper and lower side of heat-conducting piece 12a, the heat transfer face 122 of heat-conducting piece 12a is set to the lower surface of the ontology 11
112 combined area 118a, and the heat transfer face 122 of heat-conducting piece 12a is transmitted to the heat for being absorbed into heat-absorbent surface 121
The ontology 11.The heat-absorbent surface 121 of heat-conducting piece 12a is corresponding to be attached at the heater element 21, and heat-conducting piece 12a and fever member
Height after part 21 is sticked is expressed as the height of the electronic component 23 around the slightly above heater element 21 in the present embodiment, at it
In his embodiment, heat-conducting piece 12a can also be expressed as being greater than or equal to the fever with the height after the heater element 21 is sticked
The height of electronic component 23 around element 21.
The heat-sink unit 1 is expressed as the ontology 11 in the present embodiment and the selection of heat-conducting piece 12a system is independent respectively
Element, and corresponding combine in heat transfer face 122 of heat-conducting piece 12a explains in the lower surface of the ontology 11 112.Aforementioned ontology 11
And heat-conducting piece 12a can be expressed as same material or non-same material, same material can be divided into identical metal material (such as copper,
Aluminium, stainless steel or titanium matter) or identical ceramic material (such as aluminium oxide (Al2O3), silicon nitride (Si3N4) or zirconium oxide
(ZrO2)), same material can not be divided into different metal material or different ceramic material or different metal and pottery
Porcelain material.
Wherein when it is such as copper material that the ontology 11 and heat-conducting piece 12a, which are identical metal material, the of the ontology 11
One, the combination of two plate bodys 113,114 and heat-conducting piece 12a are combined by diffusion bonding mode.In addition, in other embodiments
In, the ontology 11 and heat-conducting piece 12a of identical metal material (such as gold, silver, copper, iron, aluminium, stainless steel or titanium or alloy material)
It can also be combined by soft soldering, hard solder, ultrasonic welding, laser welding, gluing, interlocking and any mode of mounting.
It is wherein such as aluminium oxide (Al when the ontology 11 and heat-conducting piece 12a are identical ceramic materials2O3) material when, should
First and second plate body 113,114 of ontology 11 and the combination of heat-conducting piece 12a are combined by sintering processing, but are not limited to
In this, in other embodiments, identical ceramic material (aluminium oxide (Al2O3), silicon nitride (Si3N4) or zirconium oxide (ZrO2))
Ontology 11 and heat-conducting piece 12a can also be combined by adhesive means.
Referring to FIG. 4, wherein when the ontology 11 and heat-conducting piece 12a are different metal materials, due to not identical
Ontology 11 and heat-conducting piece 12a of material are not easy to be combined together, such as the ontology 11 is titanium matter and heat-conducting piece 12a
For copper material, and titanium matter is not easy to be soldered or welded together with other metal materials.Therefore it is single to radiate described in the present embodiment
Member 1 further includes an at least binding medium layer 131, which is correspondingly arranged in the lower surface of the ontology 11
112 and this at least between the heat transfer face 122 of a heat-conducting piece 12a, the lower surface 112 of the ontology 11 at least one is combined and is situated between by this
Matter layer 131 connects at least heat transfer face 122 of a heat-conducting piece 12a, and the heat transfer face 122 of an at least heat-conducting piece 12a is corresponding
Be incorporated in an at least combined area 118a for the lower surface 112 of the ontology 11, and this at least a binding medium layer 131 is correspondingly arranged
In an at least combined area 118a for the ontology 11 and this at least between the heat transfer face 122 of a heat-conducting piece 12a.
An at least binding medium layer 131 is expressed as a binding medium layer 131, and a corresponding combination in the present embodiment
An area 118a and heat-conducting piece 12a.In other embodiments, aforementioned binding medium layer, which can design, is changed to more than two binding mediums
The corresponding more than two combined areas of layer and heat-conducting piece, in other words, be exactly aforementioned binding medium layer quantity and corresponding combined area and
The cooperating number of heat-conducting piece closes.
The binding medium layer 131 is expressed as a nickel coating in the present embodiment, and the binding medium layer 131 passes through plating mode
It is formed in the combined area 118a of the lower surface 112 of the ontology 11.In other embodiments, the binding medium layer 131 is also optional
It is selected as a tin coating and a copper plate is any, in addition, the binding medium layer 131 can also wherein be appointed by vapor deposition and sputter
One mode is formed in the combined area 118a of the lower surface 112 of the ontology 11.
Heat-conducting piece 12a is incorporated in the binding medium layer 131 of the lower surface 112 of the ontology 11 by diffusion bonding mode,
However, it is not limited to this, and in other embodiments, which also can choose as gold, silver, copper, iron, aluminium, stainless steel and alloy
Any material, and heat-conducting piece 12a also can choose for the different gold, silver of ontology 11, copper, iron, aluminium, stainless
Steel, titanium and alloy wherein another material.In addition, in other embodiments, different metal material (such as gold, silver, copper, iron,
Aluminium, stainless steel, titanium and alloy material) the ontology 11 and heat-conducting piece 12a, heat-conducting piece 12a can also be by soft soldering, hard
Weldering, ultrasonic welding and any mode of laser welding are incorporated in the binding medium layer 131 of the lower surface 112 of the ontology 11.
Wherein when the ontology 11 and heat-conducting piece 12a are different metal material and ceramic material, such as the ontology
11 be aluminium oxide (Al2O3) material and the plural number heat-conducting piece 12a be copper material, heat-conducting piece 12a is combined by diffusion bonding mode
Binding medium layer 131 in the lower surface of the ontology 11 112, however, it is not limited to this, in other embodiments, the ontology 11
It can be expressed as silicon nitride (Si3N4) or zirconium oxide (ZrO2) any material, and heat-conducting piece 12a can also be expressed as gold,
Silver, iron, aluminium, stainless steel, titanium and any material of alloy.
Wherein when such as ontology 11 is copper material and heat-conducting piece 12a is aluminium oxide (Al2O3) material when, the heat-conducting piece
12a is by directly covering the lower surface 112 that copper method (Direct Bonding Cooper, DBC) mode is incorporated in the ontology 11.
In addition, in addition to the ontology 11 and heat-conducting piece 12a are independent respectively other than element combines, in other embodiments
In, the heat transfer face 122 of heat-conducting piece 12a, which also can choose, to be formed as one in the lower surface of the ontology 11 112.
Therefore, ontology by virtue of this invention combines the design of the heat-conducting piece, makes the ontology 11 can in the non-binding area 119a
To flash higher-height electronic component 23 around the heater element 21, keep the ontology 11 thermally conductive by this in combined area 118a
Part 12a be absorbed into height relatively around or the heat that generates when operating of the also low heater element 21 of nearby electron element 23, and it is rapid
Outside Homogeneouslly-radiating, outside effectively achieving the effect that radiate to a lower height of heater element 21.Further, since to height compared with
Around or the also low heater element 21 of nearby electron element 23 when being radiated, do not have to curved (recessed) to the ontology 11 progress itself
Folding, and then can reach and avoid the capillary structure that will not be destroyed in chamber 115 116 and steam channel will not be blocked, effectively to reach
Preferable heat dissipation effect.Another person makes the ontology of not same material since the binding medium layer is formed in the lower surface of the ontology
11 and heat-conducting piece 12a, which can achieve, preferably combines effect, such as with structural strengths such as stainless steel, titanium matter or ceramic materials
Preferable material constitutes the ontology 11, then is constituted heat-conducting piece 12a with the preferable material of the pyroconductivities such as copper or aluminium material, makes this
Invention heat-sink unit 1 can reach that structural strength is preferable and the preferable effect of pyroconductivity simultaneously.
Fig. 5, Fig. 6, Fig. 7 are please referred to, is the stereo decomposing of the second embodiment of heat-sink unit of the present invention and its manufacturing method
Figure and another visual angle of stereogram exploded view and assembled sectional view, and be aided with refering to the figure of the 1st, 2 and 3, as shown, the present embodiment part
Structure and function are identical as above-mentioned first embodiment respectively, therefore will not be described in great detail herein, and only the present embodiment and above-mentioned first is implemented
Not existing together for example is that the heat-sink unit 1 has plural heat-conducting piece 12a, 12b, which is expressed as in the present embodiment
Two height different heat-conducting piece 12a, 12b, and the corresponding different heater element 21,22 of two height, but the present embodiment
Heat-conducting piece and heater element quantity be not limited to it is above-mentioned two, in other embodiments, aforementioned heat-conducting piece and heater element
Quantity and height can be designed in advance according to radiating requirements, adjust the quantity and height of aforementioned heat-conducting piece and heater element, and
The quantity and height of aforementioned heat-conducting piece are to match with the quantity of corresponding aforementioned heater element and height, such as three height are different
Corresponding three different heights of heat-conducting piece (heat-conducting piece of such as high, medium and low height) the heater element (hair of such as high, medium and low height
Thermal element), and so on.
And the lower surface 112 of the ontology 11 has plural number combined area 118a, 118b and plural number non-binding area 119a, 119b,
The plural number combined area 118a, 118b can adjacent or the neighbour plural number non-binding area 119a, 119b, plural number combined area 118a,
118b is expressed as two basic change area 118a, 118b corresponding two heat-conducting pieces 12a, 12b, and the non-binding area of the plural number in the present embodiment
119a, 119b are expressed as two non-binding area 119a, 119b in the present embodiment, and first non-binding area 119a is to be located at first
Between combined area 118a and second combined area 118b, second non-binding area 119a is adjacent and around first combined area
118a and second combined area 118b.In other embodiments, aforementioned combined area, which can be designed, is changed to three or more combined areas correspondences
In other words three or more heat-conducting pieces are exactly that the cooperating number of quantity and the corresponding heat-conducting piece of aforementioned combined area closes, and aforementioned non-knot
Conjunction area, which can also design, is changed to three or more non-binding areas' correspondence three or more combined areas.
The heat transfer face 122 of the plural number heat-conducting piece 12a, 12b respectively correspond the plural number combined area for being incorporated in the ontology 11
On 118a, 118b, that is to say, that the heat transfer face 122 of first heat-conducting piece 12a is incorporated in first combined area of the ontology 11
118a, the heat transfer face 122 of second heat-conducting piece 12b is incorporated in second combined area 118b of the ontology 11, and the plural number is led
The heat transfer face 122 of warmware 12a, 12b are transmitted on the ontology 11 to the heat for being absorbed into heat-absorbent surface 121.
In addition, the correspondence of heat-absorbent surface 121 of different heat-conducting piece 12a, the 12b of two height is attached at two different hairs of height
Thermal element 21,22, that is to say, that the height of first heater element 21 is low compared with the height of second heater element 22, and first is led
The height of warmware 12a is high compared with the height of second heat-conducting piece 12b, enables the heat-absorbent surface 121 of first heat-conducting piece 12a contact and is sticked
On first heater element 21, the contact of heat-absorbent surface 121 of second heat-conducting piece 12b is sticked corresponding in second heater element 22
On.So the height by the plural number heat-conducting piece 12a, 12b is adjusted with the height for the plural number heater element 21,22 being sticked
Whole design, the whole height after making plural number heat-conducting piece 12a, the 12b be sticked with the plural number heater element 21,22 phases reach mutually same
Cause, for example, first heat-conducting piece 12a and first 21 phase of heater element be sticked after height be equal to second heat-conducting piece
12b and second 22 phase of heater element be sticked after height.And heat-conducting piece 12a and the heater element 21 and heat-conducting piece 12b
Height after being sticked with the heater element 22 is higher than and/or equal to around the plural number heater element 21,22 or neighbouring electronics member
Part 23.
Therefore, ontology by virtue of this invention combines the design of the plural number heat-conducting piece, and so that the ontology 11 is higher than and/or is equal to should
Electronic component 23 around plural heater element 21,22, and be absorbed into simultaneously by heat-conducting piece 12a, 12b of multiple and different height
The heat that the heater element 21,22 of multiple and different height generates when operating, and outside Homogeneouslly-radiating rapidly, effectively to reach to not
Level heater element 21,22 achievees the effect that outside heat dissipation.Further, since the heater element 21,22 to different height into
When row heat dissipation, do not have to carry out the ontology 11 itself curved (recessed) folding, and then can reach the capillary for avoiding will not destroying in chamber 115
Structure 116 and steam channel will not be blocked, effectively to reach preferable heat dissipation effect.
Referring to Fig. 8, wherein when the ontology 11 and the plural number heat-conducting piece 12a, 12b be different metal material or this
Body 11 is ceramic material and when the plural number heat-conducting piece 12a, 12b is metal material, and combination please refers to the combination of earlier figures 4
Mode repeats no more below.
Described above to be merely exemplary for the purpose of the present invention, and not restrictive, those of ordinary skill in the art understand,
Without departing from the spirit and scope defined by the claims, can many modifications may be made, variation or equivalent, but will all fall
Enter within protection scope of the present invention.
Claims (16)
1. a kind of heat-sink unit, characterized by comprising:
One ontology has a upper surface and a lower surface；And
There is an at least heat-conducting piece heat-absorbent surface and a heat transfer face, the heat transfer face to be set to the lower surface of the ontology.
2. heat-sink unit according to claim 1, it is characterised in that: the ontology and an at least heat-conducting piece are respectively independent
Element, the corresponding lower surface for being incorporated in the ontology in the heat transfer face of an at least heat-conducting piece.
3. heat-sink unit according to claim 1, it is characterised in that: the heat transfer face of an at least heat-conducting piece is integrated ground
It is formed in the lower surface of the ontology.
4. heat-sink unit according to claim 1, it is characterised in that: the ontology be a heat conduction substrate, a radiator, one
Warm plate, a heat pipe and primary Ioops formula heat pipe it is any or in which wantonly two or more combination.
5. heat-sink unit according to claim 1, it is characterised in that: the ontology has one first plate body and one second plate
Body, the upper surface are located at the outer surface of first plate body, which is located at the outer surface of second plate body, the first plate body lid
It closes second plate body and defines a chamber jointly, which has a capillary structure and a working fluid.
6. heat-sink unit according to claim 1, it is characterised in that: the ontology and an at least heat-conducting piece are same material
Or not same material.
7. heat-sink unit according to claim 1, it is characterised in that: the ontology and an at least heat-conducting piece are metal material
Or ceramic material, the metal material are gold, silver, copper, iron, aluminium, stainless steel, titanium, billon, silver alloy, copper alloy, iron conjunction
Gold, aluminium alloy, titanium alloy material are any, and the ceramic material is that silicon nitride, zirconium oxide and aluminium oxide are any.
8. heat-sink unit according to claim 2, it is characterised in that: the combination of the ontology and an at least heat-conducting piece
By soft soldering, hard solder, diffusion bonding, ultrasonic welding, laser welding, gluing, interlocking, mounting, sintering and directly cover copper method its
Middle either type combines.
9. heat-sink unit according to claim 1, it is characterised in that: the lower surface of the ontology have an at least combined area and
At least one non-binding area, the adjacent at least one non-binding area in an at least combined area, the heat transfer face of an at least heat-conducting piece is set
It is placed in an at least combined area for the lower surface of the ontology.
10. heat-sink unit according to claim 9, it is characterised in that: have plural heat-conducting piece, the plural number heat-conducting piece height
Difference, the lower surface of the ontology have plural combined area and the non-binding area of plural number, and it is non-that which distinguishes the adjacent plural number
Combined area, the heat transfer face of the plural number heat-conducting piece are respectively arranged at the plural number combined area, and the heat-absorbent surface of the plural number heat-conducting piece is corresponding
It is attached at the different heater element of plural height.
11. heat-sink unit according to claim 2, it is characterised in that: also include an at least binding medium layer, correspondence is set
It is placed between the lower surface of the ontology and the heat transfer face of an at least heat-conducting piece, the lower surface of the ontology passes through an at least knot
Close the heat transfer face that dielectric layer connects an at least heat-conducting piece.
12. heat-sink unit according to claim 11, it is characterised in that: the lower surface of the ontology has an at least combined area
And at least one non-binding area, the adjacent at least one non-binding area in an at least combined area, the heat transfer face of an at least heat-conducting piece
Be set to an at least combined area for the lower surface of the ontology, an at least binding medium layer be correspondingly arranged in the ontology this extremely
Between a few combined area and the heat transfer face of an at least heat-conducting piece.
13. heat-sink unit according to claim 11, it is characterised in that: an at least binding medium layer is by being deposited, splashing
It plates, the lower surface that any mode is formed in the ontology is electroplated.
14. heat-sink unit according to claim 11, it is characterised in that: an at least binding medium layer be a nickel coating,
One tin coating and a copper plate are any.
15. heat-sink unit according to claim 11, it is characterised in that: an at least binding medium layer and this at least one leads
The combination of warmware is combined by soft soldering, hard solder, diffusion bonding, ultrasonic welding, any mode of laser welding.
16. heat-sink unit according to claim 11, it is characterised in that: there is plural heat-conducting piece, the plural number heat-conducting piece is high
Degree is different, and there is plural combined area and the non-binding area of plural number, the plural number combined area to distinguish the adjacent plural number for the lower surface of the ontology
Non-binding area, the heat transfer face of the plural number heat-conducting piece are respectively arranged at the plural number combined area, and plural binding medium layer is correspondingly arranged
Between the plural number combined area of the lower surface of the ontology and the heat transfer face of the plural number heat-conducting piece, the heat absorption of the plural number heat-conducting piece
Face is corresponding to be attached at the different heater element of plural height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811426999.0A CN109906017B (en) | 2018-11-27 | 2018-11-27 | Heat radiation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811426999.0A CN109906017B (en) | 2018-11-27 | 2018-11-27 | Heat radiation unit |
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| Publication Number | Publication Date |
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| CN109906017A true CN109906017A (en) | 2019-06-18 |
| CN109906017B CN109906017B (en) | 2020-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811426999.0A Active CN109906017B (en) | 2018-11-27 | 2018-11-27 | Heat radiation unit |
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| CN (1) | CN109906017B (en) |
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| CN110648985A (en) * | 2019-09-23 | 2020-01-03 | 奇鋐科技股份有限公司 | Heat transfer member reinforcing structure |
| CN110708931A (en) * | 2019-09-23 | 2020-01-17 | 奇鋐科技股份有限公司 | Heat transfer element reinforcing structure |
| TWI795815B (en) * | 2021-06-18 | 2023-03-11 | 亞旭電腦股份有限公司 | Method for assembling heat dissipation device and heat dissipation device |
| US11719491B2 (en) | 2019-10-29 | 2023-08-08 | Asia Vital Components Co., Ltd. | Heat transfer member reinforcement structure |
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| Publication number | Publication date |
|---|---|
| CN109906017B (en) | 2020-08-14 |
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