TWI795815B - Method for assembling heat dissipation device and heat dissipation device - Google Patents

Abstract

A method for assembling heat dissipating device includes loading a metal platform on a positioning jig, the positioning jig includes a working plane, the working plane is recessed with a positioning groove, the metal platform is filled into the positioning groove for positioning, and the upper surface is exposed; The glue is cured at room temperature on the upper surface of the metal platform. The heat sink is stacked on the working plane of the positioning fixture. The heat sink includes a heat sink and a plurality of heat sink fins. The heat sink has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the metal platform. Pressure is applied to the radiator and the positioning jig. The radiator and the positioning jig are detached, and the heat-conducting adhesive is cured at room temperature and fixed on it between the upper surface and the second surface.

Description

Heat sink assembly method and heat sink

A method for assembling a heat sink, in particular a method for assembling a heat sink using room temperature curing thermally conductive adhesive, and a heat sink assembled by the method for assembling the heat sink.

In order to fit traditional aluminum extruded heat sinks into chips of different heights on the motherboard, the bottom of the heat sink is usually processed to different heights by CNC to match the chips on the motherboard. In addition, thermal pads of different thicknesses can be added to fill the gap between the heat sink and the chip, or the boss is glued to the heat sink with epoxy resin, or the boss and the heat sink can be combined by welding. However, gluing by epoxy resin must go through cumbersome processes such as heating and curing, and high material costs will be generated by welding.

In view of this, according to some embodiments, a method for assembling a heat sink is provided, including loading at least one metal platform on a positioning jig, the positioning jig includes a working plane, and at least one positioning groove is recessed on the working plane, and the at least one metal platform is covered by Filling into at least one positioning slot for positioning and exposing the upper surface; sizing room temperature curing thermal adhesive on the upper surface of at least one metal platform; stacking the radiator on the working plane of the positioning fixture, the radiator includes cooling fins and a plurality of heat dissipation fins, the heat dissipation fins have opposite first surfaces and second surfaces, the second surface is in contact with the upper surface of at least one metal platform; pressure is applied to the heat sink and the positioning fixture; the heat sink and the positioning fixture are detached. The positioning jig is fixed between the upper surface and the second surface with a room temperature curing thermally conductive adhesive.

In some embodiments, the number of at least one metal platform in the filling step is two and has different thicknesses, and the number of at least one positioning groove is correspondingly two and has different depths.

In some embodiments, at least one metal platform in the packing step includes an aluminum block.

In some embodiments, the gluing step is performed by dispensing, screen printing, gluing or spraying.

In some embodiments, the working plane in the stacking step further includes a positioning structure, and the heat sink is stacked on the working plane against the positioning structure.

In some embodiments, the positioning structure in the stacking step is a positioning protrusion.

In some embodiments, the step of applying pressure is performed by clamping with a dovetail clip or pressing down with a counterweight.

According to some embodiments, a heat dissipation device is provided, including a heat sink, the heat sink includes a heat dissipation fin and a plurality of heat dissipation fins, the heat dissipation fin has a first surface and a second surface opposite to each other, and the heat dissipation fins are respectively erected on the first surface .

In some embodiments, it further includes a metal boss and a heat-conducting glue, and the heat-conducting glue is glued between the metal boss and the second surface.

In some embodiments, the metal boss and the metal platform are of different thicknesses.

In some embodiments, the metal boss and the metal platform are both aluminum blocks.

In some embodiments, the thermally conductive adhesive is made of the same material as the room temperature curing thermally conductive adhesive.

In some embodiments, the cooling fins are arranged parallel to each other.

To sum up, according to the method for assembling a heat sink provided in one embodiment, the boss is assembled to the heat sink by curing the thermally conductive adhesive at room temperature, and there is no need to cure the thermally conductive adhesive by an external heat source, and only need to apply pressure until the surface is cured. The assembly of the boss and the heat sink is completed, which achieves a fast and convenient effect, and reduces the cost of processing and materials.

See Figures 1 through 6. FIG. 1 is a flow chart of a method for assembling a heat sink according to an embodiment. 2 to 6 are schematic diagrams (1) to (5) of an assembly method of a heat sink according to an embodiment. Chips of various specifications are usually arranged on the motherboard, such as chips with different widths, heights or lengths. In order to match chips of different shapes assembled on the motherboard, the heat sink 100 can use a metal platform 2 to match the motherboard. Various chips on the board, and the heat sink assembly method can be realized by an automated process. As shown in Figures 1 and 2, the assembly method of the heat sink 100 includes loading at least one metal platform 2 on the positioning jig 5 (step S10). A positioning groove 51 , at least one metal platform 2 is loaded into at least one positioning groove 51 for positioning, and the upper surface 21 is exposed. In this embodiment, at least one metal platform 2 can be, for example, multiple metal platforms 2, and at least one positioning groove 51 corresponds to, for example, multiple positioning grooves 51. The multiple metal platforms 2 can, for example, have different thicknesses to match the motherboard. Wafers of different shapes. In addition, with metal platforms 2 of different heights, the plurality of positioning grooves 51 also have different depths. When the metal platform 2 is positioned in the positioning grooves 51, the upper surface 21 of the metal platform 2 and the working plane 50 of the positioning fixture 5 are exposed. Qie Qi. The specific configuration of the plurality of metal platforms 2 and the plurality of positioning grooves 51 will be described in detail later.

As shown in FIG. 3 , the room temperature curing thermally conductive adhesive 211 is applied on the upper surface 21 of at least one metal platform 2 (step S20 ). In this embodiment, the gluing step is performed by dispensing, screen printing, gluing or spraying. In addition, because the exposed upper surface 21 of the metal platform 2 is aligned with the working plane 50 of the positioning jig 5, glue can be applied conveniently, that is to say, the exposed upper surface 21 of the metal platform 2 is aligned with the working plane 50 of the positioning jig 5 Cut and flat, when for example screen printing, can be done on smooth surfaces.

As shown in Figure 4, the heat sink 1 is stacked on the working plane 50 of the positioning jig 5 (step S30), the heat sink 1 includes a heat sink 11 and a plurality of heat sink fins 12, and the heat sink 11 has an opposite first surface 111 and a second surface 112 , the second surface 112 is in contact with the upper surface 21 of at least one metal platform 2 .

As shown in FIG. 5 , pressure is applied to the radiator 1 and the positioning jig 5 (step S40 ). In this embodiment, the pressing time is 10-15 minutes. In this embodiment, the step of applying pressure is carried out by means of dovetail clip clamping or counterweight pressing down. Here, the heat sink 1 and the positioning jig 5 are clamped by using dovetail clips as an example, and the dovetail clip continuously exerts pressure on the heat sink 1 and the positioning jig 5 to improve the fixing effect of the heat sink 1 and the metal platform 2 . In addition, an automatic assembly process can also be realized by applying pressure on the heat sink 1 and the positioning jig 5 by, for example, a robot arm.

As shown in FIG. 6 , the heat sink 1 and the positioning fixture 5 are detached (step S50 ), and the room-temperature-cured thermally conductive adhesive 211 is glued between the upper surface 21 and the second surface 112 . For example, the heat sink 1 and the positioning fixture 5 are clamped by dovetail clips. When the room temperature curing thermal conductive adhesive 211 is cured, and the metal platform 2 is fixed on the second surface 112 of the heat sink 11, the dovetail clips can be removed. Separate the radiator 1 and the positioning jig 5 , and then detach the radiator 1 and the positioning jig 5 from each other.

Specifically, the assembling method of the heat sink 100 is to fill the metal platform 2 into the positioning jig 5, apply a normal temperature curing thermal conductive adhesive 211 on the exposed upper surface 21 of the metal platform 2, and then stack the heat sink 1 on the positioning The jig 5 is pressed for 10-15 minutes, so that the metal platform 2 is fixed on the radiator 1, and then the radiator 1 and the positioning jig 5 can be detached. Assembling the metal platform 2 to the heat sink 1 by curing the heat conduction adhesive 211 at room temperature does not require an external heat source to cure the heat conduction adhesive, and only needs to apply pressure until the surface is cured to complete the assembly of the metal platform 2 and the heat sink 1. Fast and convenient effect, and reduce the cost of processing and materials.

Please refer to FIG. 7 again. FIG. 7 is a schematic front view of an assembly method of a heat sink according to an embodiment. In this embodiment, the number of at least one metal platform 2 is two and has different thicknesses, and the number of at least one positioning groove 51 is correspondingly two and has different depths. Specifically, two chips of different heights are arranged on the motherboard, and in order to cooperate with the chips, two metal platforms 2 of different thicknesses are arranged. For example, a higher chip and a shorter chip are arranged on the motherboard. 1 is placed on the wafer smoothly, and a higher metal platform 2 and a lower metal platform 2 are configured. The higher metal platform 2 corresponds to a shorter chip, and the lower metal platform 2 corresponds to a higher chip. In the loading step, two positioning grooves 51 of different depths are also provided in order to align the upper surface 21 of each metal platform 2 with the working plane 50 after filling the positioning jig 5 with two metal platforms 2 of different thicknesses. The higher metal platform 2 corresponds to the deeper positioning groove 51 , and the lower metal platform 2 corresponds to the shallower positioning groove 51 . In this embodiment, at least one metal platform 2 includes an aluminum block. For example, the metal platform 2 is an aluminum block. When there are two metal platforms 2, the two metal platforms 2 can be aluminum blocks, or One of them is an aluminum block, and the other is a different material.

As shown in FIG. 7, in this embodiment, the working plane 50 further includes a positioning structure 501. In the stacking step, as shown in FIG. . For example, the positioning structure 501 has a shape similar to that of the heat sink 1 , so that the heat sink 1 can be embedded into the positioning jig 5 . In this embodiment, the positioning structure 501 is a positioning protrusion. That is to say, as shown in FIG. 7 , the positioning structure 501 is a raised wall 502 , and the wall 502 surrounds the working plane 50 , so that the radiator 1 can be embedded into the positioning jig 5 along the wall 502 .

See Figure 8. Fig. 8 is an exploded view of a heat sink according to an embodiment. The heat dissipation device 100 includes a heat sink 1 and a metal platform 2 . By assembling the metal platform 2 on the heat sink 1, the heat sink 100 can match the chips on the motherboard. The heat sink 100 can be assembled, for example, by the aforementioned heat sink assembly method.

In this embodiment, the assembled heat sink 1 includes a heat sink 11 and a plurality of heat sink fins 12. The heat sink 11 has a first surface 111 and a second surface 112 opposite to each other. on the surface 111. In this embodiment, the cooling fins 12 are arranged parallel to each other.

The metal platform 2 includes an upper surface 21 and a lower surface 22 opposite to each other. The upper surface 21 is provided with a room temperature curing thermally conductive adhesive 211 , and the room temperature curing thermally conductive adhesive 211 is bonded between the upper surface 21 and the second surface 112 .

In this embodiment, the heat dissipation device 100 further includes a metal boss 3 and a thermally conductive adhesive 311 , and the thermally conductive adhesive 311 is glued between the metal boss 3 and the second surface 112 . In this embodiment, the metal boss 3 and the metal platform 2 have different thicknesses. Specifically, two chips of different heights are arranged on the main board. In order to match the chips, metal platforms 2 and metal bosses 3 of different thicknesses are arranged. Place the heat sink 1 smoothly on the chip, configure a higher metal platform and a lower metal boss 3, the metal platform 2 corresponds to the lower chip, and the metal boss 3 corresponds to the higher chip. In this embodiment, the metal boss 3 and the metal platform 2 are both aluminum blocks. For example, both the metal platform 2 and the metal boss 3 can be aluminum blocks, or the metal platform 2 and the metal boss 3. One is a block of aluminum and the other is a different material.

In this embodiment, the thermally conductive adhesive 311 is made of the same material as the room temperature curing thermally conductive adhesive 211 . That is to say, the thermally conductive adhesive 311 has the same properties as the room temperature curing thermally conductive adhesive 211 , and the thermally conductive adhesive 311 can be cured at room temperature without being heated by a heat source. In another embodiment, the thermally conductive adhesive 311 can also be made of a different material from the room temperature curing thermally conductive adhesive 211 .

In summary, according to an embodiment, a method for assembling the heat sink 100 and the heat sink 100 are provided. The method for assembling the heat sink 100 includes filling the metal platform 2 into the positioning jig 5 and exposing the upper surface 21 of the metal platform 2 Apply glue and cure the thermally conductive adhesive 211 at room temperature, then stack the radiator 1 on the positioning fixture 5 and apply pressure for 10-15 minutes, so that the metal platform 2 is fixed on the radiator 1, and then the radiator 1 and the positioning fixture 5 can be disassembled Leave. Assembling the metal platform 2 to the heat sink 1 by curing the heat conduction adhesive 211 at room temperature does not require an external heat source to cure the heat conduction adhesive, and only needs to apply pressure until the surface is cured to complete the assembly of the metal platform 2 and the heat sink 1. Fast and convenient effect, and reduce the cost of processing and materials.

100: cooling device 1: Radiator 11: Heat sink 111: first surface 112: second surface 12: cooling fins 2: metal platform 21: upper surface 211: room temperature curing thermal adhesive 22: lower surface 3: metal boss 311: Thermally conductive adhesive 5: Positioning fixture 50: work plane 51: positioning slot 501: positioning structure 502: wall Step S10: loading at least one metal platform on the positioning jig Step S20: Sizing the thermally conductive adhesive cured at room temperature on the upper surface of at least one metal platform Step S30: Stack the radiator on the working plane of the positioning jig Step S40: Applying pressure to the radiator and the positioning jig Step S50: Detach the radiator and positioning fixture

[ FIG. 1 ] is a flow chart of a method for assembling a heat sink according to an embodiment. [ FIG. 2 ] is a schematic diagram (1) of an assembly method of a heat sink according to an embodiment. [ Fig. 3 ] is a schematic diagram (2) of an assembly method of a heat sink according to an embodiment. [ FIG. 4 ] is a schematic diagram (3) of an assembly method of a heat sink according to an embodiment. [ FIG. 5 ] is a schematic diagram (4) of an assembly method of a heat sink according to an embodiment. [ FIG. 6 ] is a schematic diagram (5) of an assembly method of a heat sink according to an embodiment. [ Fig. 7 ] is a schematic front view of a method of assembling a heat sink according to an embodiment. [ Fig. 8 ] is an exploded view of a heat sink according to an embodiment.

Step S10: loading at least one metal platform on the positioning jig

Step S20: Sizing the thermally conductive adhesive cured at room temperature on the upper surface of at least one metal platform

Step S30: Stack the radiator on the working plane of the positioning jig

Step S40: Applying pressure to the radiator and the positioning jig

Step S50: Detach the radiator and positioning fixture

Claims (8)

A method for assembling a heat sink, comprising: loading two metal platforms on a positioning jig, wherein the positioning jig includes a working plane, and two positioning grooves are recessed on the working plane, and the two metal platforms are respectively loaded Enter the two positioning grooves to be positioned, and expose an upper surface, wherein the two metal platforms have different thicknesses, and the two positioning grooves respectively correspond to the two metal platforms with different depths; apply a normal temperature curing thermally conductive adhesive to the at least one metal platform On the upper surface of the platform, wherein the gluing system is carried out by dispensing, screen printing, gluing or spraying; a heat sink is stacked on the working plane of the positioning jig, wherein the heat sink includes a A heat sink and a plurality of heat sink fins, the heat sink has an opposite first surface and a second surface, and the second surface is in contact with the upper surface of the at least one metal platform, wherein the working plane further includes a a positioning structure, the radiator is positioned against the positioning structure and superimposed on the working plane; pressure is applied to the radiator and the positioning fixture; and the radiator and the positioning fixture are detached, wherein, The room temperature curing thermally conductive adhesive is glued between the upper surface and the second surface. The method for assembling a heat sink according to claim 1, wherein in the filling step, the at least one metal platform includes an aluminum block. The method for assembling a heat sink according to claim 1, wherein in the stacking step, the positioning structure is a positioning protrusion. The method for assembling a heat sink as described in Claim 1, wherein the step of applying pressure is performed by clamping with dovetail clips or pressing down with a counterweight. A heat dissipation device, comprising: a radiator, including a heat dissipation fin and a plurality of heat dissipation fins, the heat dissipation fin has a first surface and a second surface opposite to each other, and the heat dissipation fins are respectively erected on the first surface ; a metal platform, including an upper surface and a lower surface opposite to each other, the upper surface is provided with a room temperature curing thermally conductive adhesive, and the room temperature curing thermally conductive adhesive is glued between the upper surface and the second surface; and a metal boss , the metal boss is glued to the second surface of the radiator through a heat-conducting adhesive, wherein the metal boss and the metal platform have different thicknesses. The heat dissipation device according to claim 5, wherein the metal boss and the metal platform are both aluminum blocks. The heat dissipation device according to claim 5, wherein the thermal conductive adhesive and the normal temperature curing thermal conductive adhesive are made of the same material. The heat dissipation device according to claim 5, wherein the heat dissipation fins are arranged parallel to each other.

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