1288977 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種封裝治具之校正技術，特別係有 關於一種熱壓合頭之共平面調整方法。 【先前技術】 捲帶式封裝（Tape Automated Bonding，TAB )與覆晶 接合（Flip Chip bonding)等技術中是利用加熱與加壓的熱 壓合方式使晶片上凸塊和捲帶/基板之引腳間達到電性導 通以及機械結合。隨著元件輕薄短小之要求，熱壓合技術 也面臨高腳數（Highl/O)和微細間距（FinePitch)之接 合技術問題。因此，熱壓合頭之壓合面與載台共平面之控 制非常重要，當壓合面與載台共平面的誤差過大時係會造 成接合應力分佈不均，而導致内引腳與凸塊接合不良或内 引腳未接合至晶片之凸塊。習知為校正壓合面與載台使其 達到共平面，係將一壓力顯色紙放置於載台上，並以熱壓 合頭壓觸該壓力_&紙，接著，觀察該壓力顯色紙之色差 進行調整熱壓合頭，但由於壓力顯色紙並無數據可參考， 因此需依操作人員之觀察經驗調整熱壓合頭，故其校正步 驟需經多次操作。 · 【發明内容】 本發明之主要目的係在於提供一種熱壓合頭之共平 面調整方法，一測試晶片係具有複數個等高之凸塊，以一 熱壓合頭壓觸該些等高之凸塊，並量測被壓觸後之該些凸 塊之高度，以被壓觸後之該些凸塊之高度差數據作為該熱 • 1288977 壓合頭之-壓合面相對於—載台之水平度校正，可提昇校 正工作之效率與準確度。 '； 本發明之次一目的係在於提供一種熱壓合頭之共平 .*調整方法，其中該測試晶片係為-空白晶片，或可為一 報廢晶片’降低測試晶片之成本。 依據本發明，一種熱壓合頭之共平面調整方法，首 先，提供一測試晶片，該測試晶片係具有複數個等高之凸 馨塊；接著，進行一熱壓合步驟，將該測試晶片係放置於一 載台上，並以一熱壓合頭壓觸該些等高之凸塊·，之後，量 測被壓觸後之該些凸塊之高度，以被壓觸後之該些凸塊之 高度差數據作為該熱壓合頭之一壓合面相對於該載台之 水平度校正數據，以提昇校正工作之效率與準確度。 【實施方式】 本發明之一種熱壓合頭之共平面調整方法，首先，請 參閱第1圖，其係提供一測試晶片110，該測試晶片11〇 # 係為一空白晶片，或可為一報廢晶片。該空白晶片係指未 佈置有積體電路之半導體基板。較佳地，該測試晶片n 〇 係由報廢晶片中選取而得，避免造成生產成本之增加。該 測試晶片110係具有複數個等高之凸塊丨丨2，該些等高之 凸塊112係設置於該測試晶片11 〇之一主動面1丨丨上，該 些等高之凸塊112係分佈於該測試晶片11 〇之複數個表面 角隅113。例如，該主動面111為矩形時，該些等高之凸 塊112係位於該主動面111上之四邊矩形角隅，可使所測 得之數據較為平均及準確。其中該些等高之凸塊112係為 1288977 金凸塊，可利用電鍍形成並在熱壓合前先量測其高度。接 著’請參閱第2圖，進行一壓合步驟，將該測試晶片i工〇 放置於一載台220(或稱壓焊座）上，並以一熱壓合頭21〇 壓觸該些等高之凸塊112(如第3圖所示），該熱壓合頭21〇 係為一種接合治具，其係組配於溫度、壓力或超音波能量 等熱壓方式輸出設備（圖未繪出），待壓合步驟完成之後， 將該熱壓合頭21(f脫離該些凸塊112，該些凸塊112經壓 合後’其高度會產生變化。之後，請參閱第4圖，以測高 顯微鏡（圖未繪出）量測被壓觸後之該些凸塊丨丨2之高度， 以該些凸塊112於被壓觸後之高度差數據，作為該熱壓合 頭210之一壓合面211相對於該載台220之水平度校正數 據’達到提昇校正工作之效率與準確度之功效。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 ^ 【圖式簡單說明】 第1圖：依據本發明之第一具體實施例，一具有複數個等 高之凸塊之測試晶片之立體示意圖。 第2圖·依據本發明之第一具體實施例，一種熱壓合頭之 共平面調整方法之熱壓合步驟前之截面示意圖。 第3圖··依據本發明之第一具體實施例，該熱壓合頭之共 平面調整方法之熱壓合步驟之截面示意圖。 第4圖：依據本發明之第一具體實施例，該熱壓合頭之共 7 12.88977 片之截 平面調整方法之熱壓合步驟後該測試晶 面示意圖。 【主要元件符號說明】 11 0測試晶片 111主動面 112凸塊 ^ 113表面角隅 210熱壓合頭 211壓合面 220載台 81288977 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a calibration technique for a package jig, and more particularly to a coplanar adjustment method for a thermocompression head. [Prior Art] In the technologies such as Tape Automated Bonding (TAB) and Flip Chip Bonding, the bump and the tape/substrate on the wafer are introduced by thermal compression bonding using heating and pressurization. Electrical conduction and mechanical bonding are achieved between the feet. As the components are light and thin, the thermocompression technique also faces the technical problems of high-level (Highl/O) and fine pitch (FinePitch). Therefore, it is very important to control the coplanar surface of the thermocompression head and the coplanar surface of the stage. When the error of the coplanar surface of the pressing surface and the stage is too large, the joint stress distribution will be uneven, resulting in internal pins and bumps. A poorly bonded or inner lead is not bonded to the bump of the wafer. Conventionally, in order to correct the pressing surface and the stage to be coplanar, a pressure coloring paper is placed on the stage, and the pressure is pressed against the pressure by a thermocompression head, and then the pressure coloring paper is observed. The color difference is adjusted to the thermocompression head, but since the pressure coloring paper has no data to refer to, it is necessary to adjust the thermocompression head according to the observation experience of the operator, so the calibration step requires multiple operations. SUMMARY OF THE INVENTION The main object of the present invention is to provide a coplanar adjustment method for a thermal compression head. A test wafer has a plurality of bumps of equal height, and a thermocompression head is pressed against the contours. a bump, and measuring the height of the bumps after being pressed, the height difference data of the bumps after being pressed as the heat of the 1288977 press-fit head-pressing surface relative to the stage Level correction improves the efficiency and accuracy of calibration work. The second object of the present invention is to provide a method of adjusting the flatness of a thermocompression head, wherein the test wafer is a blank wafer, or can be a scrap wafer, reducing the cost of the test wafer. According to the present invention, a coplanar adjustment method for a thermal press head, firstly, a test wafer having a plurality of contoured bumps; and then performing a thermal compression step to test the test wafer Placed on a stage and pressed against the bumps of the contours by a thermocompression head. After that, the heights of the bumps after being pressed are measured to be pressed after being pressed The height difference data of the block is used as the level correction data of the pressing surface of the hot pressing head relative to the stage to improve the efficiency and accuracy of the calibration work. [Embodiment] A method for coplanar adjustment of a thermal compression head according to the present invention. First, referring to FIG. 1 , a test wafer 110 is provided. The test wafer 11 is a blank wafer, or may be a Scrap wafers. The blank wafer refers to a semiconductor substrate on which an integrated circuit is not disposed. Preferably, the test wafer n is selected from the scrapped wafers to avoid an increase in production cost. The test wafer 110 has a plurality of bumps 等2 of equal height, and the bumps 112 of the equal height are disposed on one of the active faces 1 of the test wafer 11 , and the bumps 112 of the contours are It is distributed over a plurality of surface angles 隅 113 of the test wafer 11 . For example, when the active surface 111 is rectangular, the contoured protrusions 112 are located on the rectangular corners of the four sides of the active surface 111, so that the measured data is relatively average and accurate. The bumps 112 of the contours are 1288977 gold bumps which can be formed by electroplating and measured for height before thermocompression bonding. Then, please refer to FIG. 2, perform a pressing step, place the test wafer i on a loading table 220 (or a bonding pad), and press the hot pressing head 21 to press the same. The high bump 112 (as shown in FIG. 3), the hot press head 21 is a joint fixture, which is combined with a hot pressing output device such as temperature, pressure or ultrasonic energy (not shown) After the completion of the pressing step, the hot-pressing head 21 (f is separated from the bumps 112, and the bumps 112 are pressed and their height changes). After that, please refer to FIG. The heights of the bumps 2 after being pressed are measured by a height measuring microscope (not shown), and the height difference data of the bumps 112 after being pressed is used as the thermal head 210. The degree of correction data of one of the pressing surfaces 211 relative to the stage 220 is effective to improve the efficiency and accuracy of the calibration work. The scope of protection of the present invention is subject to the definition of the patent application scope, any Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are The scope of protection of the present invention. ^ [Simple description of the drawings] FIG. 1 is a perspective view of a test wafer having a plurality of bumps of equal height according to the first embodiment of the present invention. FIG. 2 is a diagram of the present invention. A first embodiment of a co-planar adjustment method of a thermocompression head is a cross-sectional view prior to a thermocompression step. FIG. 3 is a coplanar view of the thermocompression head according to the first embodiment of the present invention. A schematic cross-sectional view of the thermal compression step of the adjustment method. Figure 4: According to the first embodiment of the present invention, the test surface of the thermocompression head is 71.288977. Schematic. [Main component symbol description] 11 0 test wafer 111 active surface 112 bumps ^ 113 surface angle 隅 210 hot pressing head 211 pressing surface 220 stage 8