CN115500043A - Heat sink assembling method and heat sink - Google Patents
Heat sink assembling method and heat sink Download PDFInfo
- Publication number
- CN115500043A CN115500043A CN202110678195.5A CN202110678195A CN115500043A CN 115500043 A CN115500043 A CN 115500043A CN 202110678195 A CN202110678195 A CN 202110678195A CN 115500043 A CN115500043 A CN 115500043A
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- Prior art keywords
- heat
- heat sink
- metal platform
- positioning
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 95
- 239000002184 metal Substances 0.000 claims abstract description 95
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A method for assembling a heat sink comprises loading a metal platform on a positioning tool, wherein the positioning tool comprises a working plane, the working plane is concavely provided with a positioning groove, and the metal platform is loaded in the positioning groove to be positioned and exposes the upper surface; applying glue and curing heat-conducting glue at normal temperature on the upper surface of the metal platform; superposing a radiator on a working plane of the positioning tool, wherein the radiator comprises a radiating fin and a plurality of radiating fins, the radiating fin is provided with a first surface and a second surface which are opposite, and the second surface is attached to and contacted with the upper surface of the metal platform; pressing on the radiator and the positioning tool; the radiator and the positioning tool are detached, and the normal-temperature curing heat-conducting glue is adhered between the upper surface and the second surface.
Description
Technical Field
The present invention relates to a method for assembling a heat dissipating device, and more particularly, to a method for assembling a heat dissipating device using a heat conductive adhesive cured at room temperature, and a heat dissipating device assembled by the method for assembling a heat dissipating device.
Background
In order to be assembled to chips of different heights on a motherboard, a conventional aluminum extruded heat sink is usually fabricated to have different heights by CNC so as to fit the chips on the motherboard. In addition, heat-conducting gaskets with different thicknesses can be added to fill the gap between the radiating fin and the chip, or the boss is glued to the radiating fin by epoxy resin, or the boss and the radiating fin are combined in a welding mode. However, epoxy resin bonding requires a complicated process such as heating and curing, and welding results in high material cost.
Disclosure of Invention
In view of the above, according to some embodiments, a method for assembling a heat dissipation device includes loading at least one metal platform on a positioning tool, the positioning tool including a working plane having at least one positioning slot, the at least one metal platform being loaded into the at least one positioning slot for positioning and exposing an upper surface of the at least one metal platform; applying glue and curing heat-conducting glue at normal temperature on the upper surface of at least one metal platform; superposing a radiator on a working plane of the positioning tool, wherein the radiator comprises a radiating fin and a plurality of radiating fins, the radiating fin is provided with a first surface and a second surface which are opposite, and the second surface is attached and contacted with the upper surface of at least one metal platform; pressing on the radiator and the positioning tool; the radiator and the positioning tool are detached, and the normal-temperature curing heat-conducting glue is adhered between the upper surface and the second surface.
In some embodiments, the number of the at least one metal platform in the filling step is two and has different thicknesses, and the number of the at least one positioning groove is two and has different depths.
In some embodiments, at least one of the metal platforms in the filling step comprises an aluminum block.
In some embodiments, the sizing step is performed by dispensing, screen printing, gluing, or spraying.
In some embodiments, the working plane in the stacking step further includes a positioning structure against which the heat sink is stacked on the working plane.
In some embodiments, the positioning structure in the stacking step designates the positioning projection.
In some embodiments, the pressing step is performed by dovetail clip clamping or weight down.
According to some embodiments, a heat dissipation device includes a heat sink including a heat dissipation plate and a plurality of heat dissipation fins, the heat dissipation plate having a first surface and a second surface opposite to each other, the heat dissipation fins being respectively vertically disposed on the first surface.
In some embodiments, the package further includes a metal boss and a thermal conductive adhesive, wherein the thermal conductive adhesive is adhered between the metal boss and the second surface.
In some embodiments, the metal boss is a different thickness than the metal platform.
In some embodiments, the metal boss and the metal platform are both aluminum blocks.
In some embodiments, the heat-conducting adhesive and the normal-temperature-curing heat-conducting adhesive are made of the same material.
In some embodiments, the heat fins are disposed parallel to each other.
In summary, according to the assembling method of the heat dissipating device provided in an embodiment, the boss is assembled to the heat dissipating fin by the heat conductive adhesive cured at normal temperature, the heat conductive adhesive is not cured by an external heat source, and the boss and the heat dissipating fin are assembled only by applying pressure to the surface for curing, so that the effects of rapidness and convenience are achieved, and the costs of processing and materials are reduced.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a flow chart of a method for assembling a heat dissipation device according to an embodiment.
FIG. 2 is a schematic diagram of a heat sink assembly method according to one embodiment;
FIG. 3 is a diagram illustrating a method for assembling a heat dissipation device according to an embodiment;
FIG. 4 is a schematic diagram of a heat sink assembly method according to one embodiment;
FIG. 5 is a diagram of a heat sink assembly method according to one embodiment;
FIG. 6 is a schematic diagram of a heat sink assembly method according to one embodiment;
FIG. 7 is a schematic front view illustrating a method for assembling a heat dissipation device according to an embodiment;
FIG. 8 is an exploded view of a heat sink according to one embodiment.
Wherein the reference numerals
100 heat sink
1: radiator
11: heat sink
111 first surface
112 second surface
12 heat dissipation fin
2: metal platform
21 upper surface of
211 normal temperature curing heat-conducting glue
22 lower surface
3: metal boss
311 heat-conducting glue
5 positioning tool
50 working plane
51 positioning groove
501 positioning structure
502 wall surface
Step S10, filling at least one metal platform on the positioning tool
S20, applying glue and curing the heat-conducting glue on the upper surface of at least one metal platform at normal temperature
Step S30, superposing the radiator on the working plane of the positioning tool
S40, pressing on the radiator and the positioning tool
Step S50, detaching the heat sink and positioning tool
Detailed Description
The structural and operational principles of the present invention are described in detail below with reference to the accompanying drawings:
please refer to fig. 1 to 6. FIG. 1 is a flow chart of a method for assembling a heat dissipation device according to an embodiment. Fig. 2 to 6 are schematic views (a) to (b) illustrating an assembly method of a heat dissipation device according to an embodiment. Various chips with different specifications are usually configured on the motherboard, for example, chips with different widths, heights or lengths are configured, and the heat dissipation device 100 can be matched with various chips on the motherboard by using the metal platform 2 in order to match the chips with different shapes assembled on the motherboard, and the assembly method of the heat dissipation device can be realized by an automatic process. As shown in fig. 1 and fig. 2, the assembling method of the heat dissipation apparatus 100 includes loading at least one metal platform 2 on a positioning tool 5 (step S10), the positioning tool 5 includes a working plane 50, at least one positioning groove 51 is concavely formed on the working plane 50, and the at least one metal platform 2 is loaded into the at least one positioning groove 51 for positioning and exposing the upper surface 21. In this embodiment, the at least one metal platform 2 may be, for example, a plurality of metal platforms 2, the at least one positioning groove 51 corresponds to, for example, a plurality of positioning grooves 51, and the plurality of metal platforms 2 may have, for example, different thicknesses to fit different shapes of chips on the motherboard. In addition, the positioning grooves 51 have different depths in cooperation with the metal platforms 2 of different heights, so that when the metal platforms 2 are positioned in the positioning grooves 51, the exposed upper surfaces 21 of the metal platforms 2 are aligned with the working plane 50 of the positioning tool 5. The specific configuration of the plurality of metal stages 2 and the plurality of positioning grooves 51 will be described in detail later.
As shown in fig. 3, the normal temperature curing thermal conductive adhesive 211 is applied on the upper surface 21 of at least one metal platform 2 (step S20). In this embodiment, the sizing step is performed by dispensing, screen printing, gluing or spraying. Furthermore, because the exposed upper surface 21 of the metal platform 2 is aligned with the working plane 50 of the positioning tool 5, the application of glue can be facilitated, i.e. the exposed upper surface 21 of the metal platform 2 is aligned and flat with the working plane 50 of the positioning tool 5, and can be performed on a smooth surface when, for example, screen printing is performed.
As shown in fig. 4, the heat sink 1 is stacked on the working plane 50 of the positioning tool 5 (step S30), the heat sink 1 includes a heat sink 11 and a plurality of heat dissipating fins 12, the heat sink 11 has a first surface 111 and a second surface 112 opposite to each other, and the second surface 112 is in close contact with the upper surface 21 of at least one metal platform 2.
As shown in fig. 5, the heat spreader 1 and the positioning tool 5 are pressed (step S40). In this example, the pressing time is 10 to 15 minutes. In this embodiment, the pressing step is performed by means of a dovetail clip or a weight press. Here, the heat sink 1 and the positioning tool 5 are clamped by using the dovetail clamp as an example, and the dovetail clamp is used to continuously apply the pressure to the heat sink 1 and the positioning tool 5, so as to improve the fixing effect of the heat sink 1 and the metal platform 2. In addition, an automated assembly process can also be realized by pressing the heat sink 1 and the positioning tool 5 by a robot, for example.
As shown in fig. 6, the heat sink 1 and the positioning tool 5 are detached (step S50), and the normal temperature curing heat conductive adhesive 211 is adhered between the upper surface 21 and the second surface 112. For example, the heat sink 1 and the positioning tool 5 are clamped by using a dovetail clamp, and after the heat conducting adhesive 211 is cured at normal temperature, so that the metal platform 2 is fixed on the second surface 112 of the heat sink 11, the dovetail clamp can be detached from the heat sink 1 and the positioning tool 5, and then the heat sink 1 and the positioning tool 5 are detached from each other.
Specifically, the assembly method of the heat dissipation device 100 includes loading the metal platform 2 into the positioning tool 5, applying the heat-conducting glue 211 which is cured at normal temperature to the exposed upper surface 21 of the metal platform 2, and then overlapping the heat sink 1 on the positioning tool 5 and applying pressure for 10-15 minutes to fix the metal platform 2 on the heat sink 1, so that the heat sink 1 and the positioning tool 5 can be detached. The metal platform 2 is assembled to the radiator 1 through the normal-temperature curing heat-conducting adhesive 211, the heat-conducting adhesive does not need to be cured through an external heating source, and the assembly of the metal platform 2 and the radiator 1 is completed only by applying pressure to the surface curing, so that the quick and convenient effect is achieved, and the processing and material costs are reduced.
Referring to fig. 7, fig. 7 is a schematic front view illustrating an assembly method of a heat dissipation device according to an embodiment. In the present embodiment, the number of the at least one metal platform 2 is two and has different thicknesses, and the number of the at least one positioning groove 51 is two and has different depths. Specifically, two chips with different heights are arranged on the motherboard, two metal platforms 2 with different thicknesses are arranged for matching the chips, for example, the motherboard is provided with a higher chip and a lower chip, in order to enable the heat sink 1 to be smoothly arranged on the chips, a higher metal platform 2 and a lower metal platform 2 are arranged, the higher metal platform 2 corresponds to the lower chip, and the lower metal platform 2 corresponds to the higher chip. In the filling step, in order to align the upper surface 21 of each metal platform 2 with the working plane 50 after the positioning tool 5 is filled with two metal platforms 2 with different thicknesses, two positioning slots 51 with different depths are also provided, wherein the higher metal platform 2 corresponds to the deeper positioning slot 51, and the lower metal platform 2 corresponds to the shallower positioning slot 51. In the present embodiment, at least one metal platform 2 includes an aluminum block, for example, the metal platform 2 is an aluminum block, and when there are two metal platforms 2, both of the two metal platforms 2 may be, for example, aluminum blocks, or one of the two metal platforms is an aluminum block and the other metal platform is made of a different material.
As shown in fig. 7, in the present embodiment, the working plane 50 further includes a positioning structure 501, and in the stacking step, as shown in fig. 4, the heat sink 1 is stacked on the working plane 50 by abutting against the positioning structure 501. For example, the positioning structure 501 has a similar shape as the heat sink 1, so that the heat sink 1 can be embedded in the positioning tool 5. In the present embodiment, the positioning structure 501 refers to a positioning protrusion. That is, as shown in fig. 7, the positioning structure 501 is a convex wall 502, and the wall 502 surrounds the working plane 50, so that the heat sink 1 can be inserted into the positioning tool 5 along the wall 502.
Please refer to fig. 8. FIG. 8 is an exploded view of a heat sink according to one embodiment. The heat dissipation device 100 includes a heat sink 1 and a metal platform 2. By assembling the metal platform 2 on the heat sink 1, the heat sink 100 can be matched with a chip on a motherboard. The heat sink 100 can be assembled, for example, by the heat sink assembly method described above.
In the present embodiment, the assembled heat sink 1 includes a heat sink 11 and a plurality of heat dissipation fins 12, the heat sink 11 has a first surface 111 and a second surface 112 opposite to the first surface, and the heat dissipation fins 12 are respectively disposed upright on the first surface 111. In the present embodiment, the heat dissipation fins 12 are disposed parallel to each other.
The metal platform 2 includes an upper surface 21 and a lower surface 22 opposite to each other, the upper surface 21 is provided with a normal temperature curing heat-conducting adhesive 211, and the normal temperature curing heat-conducting adhesive 211 is adhered between the upper surface 21 and the second surface 112.
In the present embodiment, the heat dissipation device 100 further includes a metal boss 3 and a thermal conductive adhesive 311, wherein the thermal conductive adhesive 311 is adhered between the metal boss 3 and the second surface 112. In the present embodiment, the metal boss 3 and the metal platform 2 have different thicknesses. Specifically, the motherboard is configured with two chips with different heights, and is configured with metal platforms 2 and metal bosses 3 with different thicknesses in order to match the chips, for example, the motherboard is configured with a higher chip and a shorter chip, and is configured with a higher metal platform and a lower metal boss 3 in order to enable the heat sink 1 to be smoothly placed on the chip, wherein the metal platform 2 corresponds to the shorter chip, and the metal boss 3 corresponds to the higher chip. In the present embodiment, the metal platform 3 and the metal platform 2 are both aluminum blocks, for example, the metal platform 2 and the metal platform 3 may both be aluminum blocks, or one of the metal platform 2 and the metal platform 3 is an aluminum block and the other is made of a different material.
In the present embodiment, the heat conductive adhesive 311 and the normal temperature curing heat conductive adhesive 211 are made of the same material. That is, the heat conductive adhesive 311 has the same properties as the normal temperature curing heat conductive adhesive 211, and the heat conductive adhesive 311 can be cured at normal temperature without being heated by a heat source. In another embodiment, the thermal conductive adhesive 311 may also be made of a material different from the normal temperature curing thermal conductive adhesive 211.
In summary, according to an embodiment of the present invention, an assembly method of a heat dissipation apparatus 100 and the heat dissipation apparatus 100 are provided, the assembly method of the heat dissipation apparatus 100 includes loading the metal platform 2 into the positioning tool 5, applying a normal temperature curing heat-conducting glue 211 on the exposed upper surface 21 of the metal platform 2, and then laminating the heat sink 1 on the positioning tool 5 and applying pressure for 10-15 minutes to fix the metal platform 2 on the heat sink 1, so that the heat sink 1 can be detached from the positioning tool 5. The metal platform 2 is assembled to the radiator 1 through the normal-temperature curing heat-conducting adhesive 211, the heat-conducting adhesive does not need to be cured through an external heating source, and the assembly of the metal platform 2 and the radiator 1 is completed only by applying pressure to the surface curing, so that the quick and convenient effect is achieved, and the processing and material costs are reduced.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (13)
1. A method of assembling a heat sink, comprising:
filling at least one metal platform on a positioning tool, wherein the positioning tool comprises a working plane, at least one positioning groove is concavely arranged on the working plane, and the at least one metal platform is filled into the at least one positioning groove for positioning and exposes an upper surface;
applying a normal temperature curing heat-conducting adhesive on the upper surface of the at least one metal platform;
stacking a heat sink on the working plane of the positioning tool, wherein the heat sink comprises a heat sink sheet and a plurality of heat sink fins, the heat sink sheet has a first surface and a second surface opposite to each other, and the second surface is attached to and contacted with the upper surface of the at least one metal platform;
pressing on the heat sink and the positioning tool; and
and detaching the radiator and the positioning tool, wherein the normal-temperature curing heat-conducting adhesive is adhered between the upper surface and the second surface.
2. The method of claim 1, wherein in the filling step, the number of the at least one metal platform is two and has different thicknesses, and the number of the at least one positioning groove is two and has different depths.
3. The method of claim 1, wherein in the filling step, the at least one metal platform comprises an aluminum block.
4. The method for assembling a heat dissipating device of claim 1, wherein the step of applying glue is performed by dispensing, screen printing, gluing or spraying.
5. The method of claim 1, wherein in the step of stacking, the work plane further includes a positioning structure, and the heat sink is stacked on the work plane against the positioning structure.
6. The method of claim 5, wherein the positioning structure is a positioning protrusion in the stacking step.
7. The method of claim 1, wherein the pressing step is performed by dovetail clip clamping or weight pressing.
8. A heat dissipating device, comprising:
the radiator comprises a radiating fin and a plurality of radiating fins, wherein the radiating fin is provided with a first surface and a second surface which are opposite, and the radiating fins are respectively vertically arranged on the first surface; and
and the metal platform comprises an upper surface and a lower surface which are opposite, wherein the upper surface is provided with a normal-temperature curing heat-conducting adhesive which is fixedly adhered between the upper surface and the second surface.
9. The heat dissipating device of claim 8, further comprising a metal boss and a thermally conductive adhesive, wherein the thermally conductive adhesive is adhered between the metal boss and the second surface.
10. The heat dissipating device of claim 9, wherein the metal boss and the metal platform are of different thicknesses.
11. The heat dissipating device of claim 9, wherein the metal boss and the metal platform are both aluminum blocks.
12. The heat dissipating device as claimed in claim 9, wherein the heat conducting adhesive and the room temperature curing heat conducting adhesive are made of the same material.
13. The heat dissipating device of claim 8, wherein the heat dissipating fins are disposed parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110678195.5A CN115500043A (en) | 2021-06-18 | 2021-06-18 | Heat sink assembling method and heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110678195.5A CN115500043A (en) | 2021-06-18 | 2021-06-18 | Heat sink assembling method and heat sink |
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| Publication Number | Publication Date |
|---|---|
| CN115500043A true CN115500043A (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110678195.5A Pending CN115500043A (en) | 2021-06-18 | 2021-06-18 | Heat sink assembling method and heat sink |
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| JP2004363184A (en) * | 2003-06-02 | 2004-12-24 | Grand Power Sources Inc | Method of forming heat sink and its structure |
| TWI285083B (en) * | 2006-03-21 | 2007-08-01 | Coretronic Corp | Multi-chips heat radiator |
| TW200744436A (en) * | 2006-05-25 | 2007-12-01 | Adlink Technology Inc | Layered thermal conductive interface |
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| CN205037804U (en) * | 2015-09-15 | 2016-02-17 | 吴嘉昇 | Heat radiator structure |
| CN106211713A (en) * | 2016-08-02 | 2016-12-07 | 江苏兆能电子有限公司 | A kind of assembling radiating plate |
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| TWM612720U (en) * | 2021-01-25 | 2021-06-01 | 京業電子股份有限公司 | Heat dissipation module and electronic device |
-
2021
- 2021-06-18 CN CN202110678195.5A patent/CN115500043A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363184A (en) * | 2003-06-02 | 2004-12-24 | Grand Power Sources Inc | Method of forming heat sink and its structure |
| TWI285083B (en) * | 2006-03-21 | 2007-08-01 | Coretronic Corp | Multi-chips heat radiator |
| TW200744436A (en) * | 2006-05-25 | 2007-12-01 | Adlink Technology Inc | Layered thermal conductive interface |
| CN204191083U (en) * | 2014-11-21 | 2015-03-04 | 深圳市宾利达智能科技有限公司 | Sucrose automatic business processing control system |
| CN205037804U (en) * | 2015-09-15 | 2016-02-17 | 吴嘉昇 | Heat radiator structure |
| CN106211713A (en) * | 2016-08-02 | 2016-12-07 | 江苏兆能电子有限公司 | A kind of assembling radiating plate |
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