TWM612720U - Heat dissipation module and electronic device - Google Patents

Abstract

A heat dissipation module including a heat pipe, a heat sink, and an adhesive layer is provided. The heat sink is located on the heat pipe. The adhesive layer is disposed between the heat pipe and the heat sink and used for bonding the heat sink and the heat pipe, and the adhesive layer is composed of organic silicon glue and is a room temperature curing adhesive layer. An electronic device is also provided.

Description

Heat dissipation module and electronic device

The present invention relates to a heat dissipation module and an electronic device, and particularly to a heat dissipation module and an electronic device including a heat pipe and a heat sink.

With the development of science and technology, for the design and development of electronic devices, when high performance is required, electronic devices will inevitably generate more heat than before. Therefore, heat dissipation has become an indispensable function of electronic devices. Furthermore, a heat sink is often joined to a heat pipe to form a heat dissipation module and applied to an electronic device to meet the heat dissipation requirement of the electronic device, thereby improving its reliability.

However, the adhesive layer used to join the heat sink and the heat pipe often cannot have both bonding and thermal conductivity. For example, the adhesive layer with better joining ability usually has poor thermal conductivity, or the adhesive layer with better thermal conductivity Generally, the bonding ability is poor, and additional devices (such as heating devices) are often required to complete the bonding process, so the production efficiency is low and the better product reliability cannot be achieved.

The present invention provides a heat dissipation module and an electronic device, which can achieve better product reliability while improving production efficiency.

A heat dissipation module created by the new model includes a heat pipe, a heat sink and an adhesive layer. The heat sink is located on the heat pipe. The subsequent layer is arranged between the heat pipe and the heat sink and used for joining the heat sink and the heat pipe, wherein the adhesive layer is composed of organic silicon glue as the main body and is a room temperature curing type adhesive layer.

In an embodiment of the present invention, no external heat source for heating the adhesive layer is provided in the state where the adhesive layer is joined to the heat sink and the heat pipe.

In an embodiment of the present invention, the bonding strength of the aforementioned adhesive layer is at least greater than or equal to 1.4 MPa, and the thermal conductivity is at least greater than 1 Wm ^-1 K ^-1 .

In an embodiment of the present invention, the thickness of the aforementioned adhesive layer is less than or equal to 0.5 mm.

In an embodiment of the present invention, the aforementioned thickness is greater than or equal to 0.2 mm.

In an embodiment of the present invention, the curing temperature of the aforementioned adhesive layer is less than 130°C.

In an embodiment of the present invention, the surface curing time mentioned above is between 5 and 15 minutes.

In an embodiment of the present invention, the above-mentioned heat pipe is embedded in the heat sink.

An electronic device created by the present invention includes a heating element and the above-mentioned heat dissipation module, wherein the heat dissipation module is disposed on the heating element.

In an embodiment of the present invention, the above-mentioned heating element includes a power supply on the motherboard.

Based on the above, the present invention applies a room temperature curing adhesive layer composed of silicone rubber to the heat dissipation module, and uses it to join the heat sink and the heat pipe. In this way, the silicone rubber is used as the main body. The adhesive layer can simultaneously have good bonding and thermal conductivity, effectively fix the heat sink and the heat pipe and serve as a good heat transfer medium, while the room temperature curing type adhesive layer can omit the heating device, so this new creation applies the above-mentioned heat dissipation The electronic device of the module can achieve better product reliability while improving production efficiency.

In order to make the above-mentioned features and advantages of the new creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

Hereinafter, reference numerals will be added to describe in detail the preferred embodiments of the present invention, and the descriptions will be illustrated with diagrams. Where possible, unnecessary components will be omitted for clarity.

The directional terms used herein (for example, up, down, right, left, front, back, top, bottom) are only used as a reference drawing and are not intended to imply absolute orientation.

FIG. 1 is a schematic diagram of an assembly of an electronic device according to an embodiment of the invention. Fig. 2 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Fig. 3 is a schematic diagram of an assembly of a heat dissipation module according to an embodiment of the present invention.

1 to 3, in this embodiment, the electronic device 100 includes a heating element 110 and a heat dissipation module 120, wherein the heat dissipation module 120 is disposed on the heating element 110, so the heat emitted by the heating element 110 can be dissipated through The module 120 conducts heat to meet the heat dissipation requirement of the electronic device 100. The heating element 110 may be an element that generates heat during operation of the electronic device 100. For example, as shown in FIGS. 1 and 2, the heating element 110 is the power supply 114 on the motherboard 112, but the invention is not limited to this In other embodiments not shown, the heating element 110 may be a chip in an electronic device.

Furthermore, as shown in FIG. 3, the heat dissipation module 120 of this embodiment includes a heat pipe 122, a heat sink 124, and a bonding layer 126. The heat sink 124 is located on the heat pipe 122, and the bonding layer 126 is disposed on the heat pipe 122. And the heat sink 124 and used to join the heat sink 124 and the heat pipe 122. In addition, the adhesive layer 126 may be composed of organic silicon glue to effectively fix the heat sink and the heat pipe and serve as a good heat transfer medium with both good bonding and thermal conductivity. On the other hand, the adhesive layer 126 may be a room temperature curing adhesive layer to omit the heating device. Therefore, applying the adhesive layer 126 to the heat dissipation module 120 and then applying the heat dissipation module 120 to the electronic device 100 can improve At the same time of production efficiency, it can achieve better product reliability.

In some embodiments, the room temperature curing adhesive layer 126 is, for example, the adhesive layer 126 is bonded to the heat sink 124 and the heat pipe 122 without an external heat source for heating the adhesive layer 126. In other words, the adhesive layer 126 is bonded over the entire During the process, no additional heating device will be configured to improve production efficiency, but the invention is not limited to this.

In some embodiments, compared to the bonding material (such as solder) that requires metal surface treatment, the bonding layer 126 of this embodiment can omit the metal surface treatment, so that the production efficiency can be further improved, but the invention is not limited to this.

In some embodiments, the thermal conductivity is poor compared to the bonding material (such as epoxy resin (Epoxy), etc.), bonding strength of the adhesive layer 126 of the present embodiment is at least not less than 1.4MPa, a thermal conductivity greater than at least 1 Wm ^{- 1} K ^-1 , so it can have both good bonding and thermal conductivity at the same time to effectively fix the heat sink and the heat pipe and serve as a good heat transfer medium, but the invention is not limited to this. Here, the bonding strength is measured according to the test standard of GB/T-11211, and the thermal conductivity is measured according to the test standard of ASTM D5470.

Furthermore, in some embodiments, the bonding strength of the adhesive layer 126 may be 1.4 MPa, 1.5 MPa, or 1.6 MPa, and the thermal conductivity may be 1.5 Wm ^-1 K ^-1 , but the invention is not limited to this. The bonding strength and thermal conductivity of the layer 126 can be determined according to actual design requirements. As long as the bonding strength of the subsequent layer 126 is at least 1.4MPa and the thermal conductivity is at least 1 Wm ^-1 K ^{-1, it} belongs to the present invention. The scope of protection.

In some embodiments, the thickness of the adhesive layer 126 also affects its bonding and thermal conductivity effects. For example, the thickness of the adhesive layer 126 can achieve better results when the thickness is less than or equal to 0.5 mm and greater than or equal to 0.2 mm. The present invention is not limited to this, and the thickness of the adhesive layer 126 can be adjusted according to its actual composition and design requirements.

In some embodiments, the curing temperature of the adhesive layer 126 is less than 130° C., in other words, the curing temperature of the adhesive layer 126 may be lower than the curing temperature reached by the additional heating device. Furthermore, the curing temperature of the adhesive layer 126 is, for example, less than 60° C., but the invention is not limited to this.

In some embodiments, the curing time of the surface of the adhesive layer 126 is between 5 and 15 minutes, so the waiting time for curing during the bonding process can be greatly reduced, and thus the production efficiency can be further improved, but the invention is not limited to this. Here, the definition of surface curing is to achieve surface curing as long as the surface is skinned and does not stick to the hands.

In some embodiments, the adhesive layer 126 is a one-component adhesive layer, in other words, the adhesive layer 126 is not a two-component adhesive layer, which does not require additional mixing during use, that is, there is no need to configure the ratio of silicone and curing agent ( Such as the configuration of AB glue), so it can be convenient to use, but the creation of the new type is not limited to this.

In some embodiments, the heat sink 124 may include grooves corresponding to the heat pipe 122, so that the heat pipe 122 can be embedded in the heat sink 124, wherein the adhesive layer 126 may be disposed between the grooves of the heat pipe 122 and the heat pipe 122 , But the creation of the new model is not limited to this.

In some embodiments, the subsequent layer 126 may optionally add other filler materials, such as a polymer material, to improve its bonding and thermal conductivity, but the invention is not limited to this.

In some embodiments, the heat pipe 122 is, for example, a metal pipe, and the material of the heat pipe 122 is, for example, copper, and the copper can be optionally surface-treated. In addition, the heat sink 124 is, for example, a heat sink fin, and the material of the heat sink 124 is, for example, aluminum, but the invention is not limited to this. The types and materials of the heat pipe 122 and the heat sink 124 can be selected according to actual design requirements .

In some embodiments, the heat dissipation module 120 may optionally include another heat dissipation element 128 according to actual design requirements to improve the heat dissipation capability of the heat dissipation module 120. The heat dissipation element 128 is, for example, a heat dissipation fin. The creation is not limited to this, and the heat sink 128 can also be omitted from the heat dissipation module 120.

In some embodiments, as shown in FIGS. 1 and 2, the heat sink 124 is fixed on the motherboard 112 by rivet posts (not shown), screws 130 and thermal pads (not shown), wherein the rivet posts and The thermal pad is located on the surface of the heat sink facing the motherboard 112. In addition, the heat sink 128 can be fixed on the motherboard 112 by a push pin 140, but the invention is not limited to this. The heat sink 124 and the heat sink 128 can be fixed on the motherboard 112 by any suitable method. . Here, since the heat sink 128 can be selectively configured, it is omitted to be shown in FIG. 3.

It should be noted that the various test standards described in the above embodiments are well known to those skilled in the art, and will not be repeated here. In addition, the present invention does not limit the composition and ratio of the adhesive layer, as long as it is composed of organosilicone and can be a room temperature curing type, it is the scope of protection of the new invention.

In summary, the present invention applies a room temperature curing adhesive layer composed of silicone rubber as the main body to the heat dissipation module, and uses it to join the heat sink and the heat pipe. In this way, the silicone rubber is used as the main body. The formed adhesive layer can simultaneously have good bonding and thermal conductivity, effectively fix the heat sink and the heat pipe and serve as a good heat transfer medium, while the room temperature curing type adhesive layer can omit the heating device, so the new creative application The above-mentioned electronic device of the heat dissipation module can achieve better product reliability while improving production efficiency.

Although the creation of this new type has been disclosed in the above embodiments, it is not intended to limit the creation of this new type. Anyone with ordinary knowledge in the technical field can make some changes and changes without departing from the spirit and scope of the creation of the new type. Retouching, therefore, the scope of protection for the creation of this new model shall be subject to the scope of the attached patent application.

100: electronic device 110: heating element 112: Motherboard 114: Power 120: cooling module 122: Heat pipe 124: Heat sink 126: Next layer 128: heat sink 130: screw 140: push pin

FIG. 1 is a schematic diagram of an assembly of an electronic device according to an embodiment of the invention. Fig. 2 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Fig. 3 is a schematic diagram of an assembly of a heat dissipation module according to an embodiment of the present invention.

120: cooling module

122: Heat pipe

124: Heat sink

126: Next layer

Claims (10)

A heat dissipation module includes: Heat pipe A heat sink located on the heat pipe; and The adhesive layer is arranged between the heat pipe and the heat sink and used to join the heat sink and the heat pipe, wherein the adhesive layer is composed of organic silicon glue and is a room temperature curing type adhesive layer . The heat dissipation module according to claim 1, wherein an external heat source for heating the adhesive layer is not provided in a state where the adhesive layer joins the heat sink and the heat pipe. The heat dissipation module according to claim 1, wherein the bonding strength of the adhesive layer is at least 1.4 MPa or more, and the thermal conductivity is at least greater than 1 Wm ^-1 K ^-1 . The heat dissipation module according to claim 1, wherein the thickness of the adhesive layer is less than or equal to 0.5 mm. The heat dissipation module according to claim 4, wherein the thickness is greater than or equal to 0.2 mm. The heat dissipation module according to claim 1, wherein the curing temperature of the adhesive layer is less than 130°C. The heat dissipation module according to claim 1, wherein the curing time of the surface of the adhesive layer is between 5 and 15 minutes. The heat dissipation module according to claim 1, wherein the heat pipe is embedded in the heat sink. An electronic device, including: Heating element; and The heat dissipation module according to any one of claim 1 to claim 8 is configured on the heating element. The electronic device according to claim 9, wherein the heating element includes a power supply on the motherboard.

Images