CN109874268A - Heat-sink unit manufacturing method - Google Patents
Heat-sink unit manufacturing method Download PDFInfo
- Publication number
- CN109874268A CN109874268A CN201811428710.9A CN201811428710A CN109874268A CN 109874268 A CN109874268 A CN 109874268A CN 201811428710 A CN201811428710 A CN 201811428710A CN 109874268 A CN109874268 A CN 109874268A
- Authority
- CN
- China
- Prior art keywords
- heat
- plate
- conducting piece
- sink unit
- lower plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of heat-sink unit manufacturing method of the present invention, one is provided first with upper, the mold of lower die, the lower die is equipped with one and is installed with recess portion and an at least groove, then it provides on one, lower plate, one capillary structure and at least a heat-conducting piece, an at least heat-conducting piece is placed in an at least groove and the lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and by this, lower die carries out heating pressing, then through on this, after lower die heating pressing, while so that the upper plate lid in the lower die is closed lower plate one plate body of composition, one upper surface of an at least heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected.
Description
Technical field
The present invention relates to a kind of heat-sink unit manufacturing method, espespecially a kind of saving processing procedure process and disposable completion heat dissipation are single
The processing of member and the heat-sink unit manufacturing method for effectively reaching excellent in heat dissipation effect.
Background technique
Mobile device, PC, server, communication machine box or other systems or device are all because operation efficiency mentions at present
It rises, and heat caused by its internal heating element (such as, but not limited to chip) is also with promotion, and existing electronic equipment
Function is more and more polynary, and motherboard is equipped with various heater elements.Temperature-uniforming plate made of copper material (Vaporchamber) is
A kind of heat transfer application in larger range face and face, temperature-uniforming plate system are in the shell (or plate body) of square type shape, enclosure interior chamber
Capillary structure is arranged in inner wall, and the enclosure interior is filled with working fluid, and the one side (heating surface) of the shell is enabled to be sticked
Heat caused by the heater element is adsorbed on the heater element, so that the working fluid of liquid is evaporated to steam state, heat is conducted
To the other side (cryosurface) of the shell, the working fluid of the steam state is condensed into liquid after being cooled down, the working fluid of the liquid
Heating surface is back to by gravity or capillary structure again and continues steam-condensate circulating, effectively to achieve the effect that temperature uniforming heat radiation, temperature-uniforming plate
Thermal contact conductance area it is larger, be different from the point-to-point heat exchange pattern of heat pipe, thus be suitble to heating area larger or it is plural away from
From closer heater element.
However, the design of electronic circuits of existing substrate, the height that will form the heater element that need to be radiated may be than surrounding
Or neighbouring resistance, capacitor or other passive devices are also low, therefore existing heat dissipation element such as radiator, heat pipe, temperature-uniforming plate,
Loop hot-pipe etc. is difficult to effective directly attach completely and contacts to heater element, causes whole heat conduction efficiency bad and scattered
The bad problem of heat.
Summary of the invention
A purpose of the invention, provide it is a kind of can be used to highly relatively around or nearby electron element it is also low fever member
The manufacturing method for the heat-sink unit that the heater element of part or plural different height is effectively radiated
Another object of the present invention, provide it is a kind of can reach save processing procedure process and it is disposable complete heat-sink unit plus
The heat-sink unit manufacturing method of work.
Another object of the present invention is providing a kind of heat-sink unit for can reach and saving cost and increasing whole speed of production
Manufacturing method.
In order to achieve the above object, the present invention is providing a kind of heat-sink unit manufacturing method characterized by comprising
A mold is provided, which is equipped with a upper mold and a lower die, which is equipped with one and is installed with recess portion, this is installed with recess portion tool
There is at least one groove recessed from the bottom side for being installed with recess portion；
A upper plate, a lower plate, a capillary structure and an at least heat-conducting piece are provided, at least a heat-conducting piece is placed on this extremely by this
In a few groove and the lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and by this,
Lower die carries out heating pressing；And
It, should while so that the upper plate lid in the lower die is closed lower plate one plate body of composition after the upper and lower mould heating pressing
One upper surface of an at least heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected.
The heat-sink unit manufacturing method, in which: after upper and lower mould heating pressing, make on this in the lower die
While plate, lower plate and its interior capillary structure are at a plate body, a upper surface of an at least heat-conducting piece in face of the plate body
A step is further included after the step of being integrally connected on one outer surface of lower plate；To one work of filling in an opening of the plate body
Liquid, and sealing operation is vacuumized and carried out to the plate body.
The heat-sink unit manufacturing method, in which: an at least heat-conducting piece has a heat-absorbent surface and a heat transfer face, should
An at least heat transfer face is the upper surface of an at least heat-conducting piece, which is a lower surface of an at least heat-conducting piece.
The heat-sink unit manufacturing method, in which: provide aforementioned upper plate, lower plate, capillary structure and this at least one is thermally conductive
An at least heat-conducting piece is placed in an at least groove and the lower plate, the capillary structure, the upper plate is sequentially placed on this by part
Lower die is installed in recess portion, and the step of carrying out heating pressing by the upper and lower mould also includes: providing an at least binding medium
Layer, an at least binding medium layer are formed on the outer surface of the lower plate by vapor deposition, sputter, any mode of plating, and
An at least heat-conducting piece is placed in an at least groove and is formed with the lower plate, the capillary of an at least binding medium layer
Structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and an at least binding medium layer is enabled to be located at the appearance of the plate body
Face and heating pressing is carried out between this at least upper surface of a heat-conducting piece, and through the upper and lower mould.
The heat-sink unit manufacturing method, in which: after upper and lower mould heating pressing, make on this in the lower die
While plate lid closes the lower plate and constitutes the plate body, the outer surface of at least upper surface of a heat-conducting piece and the lower plate in face of the plate body
The step of being integrally connected also includes: after the upper and lower mould heating pressing, the upper plate lid in the lower die being made to close the lower plate structure
Simultaneously at the plate body, it enables at least binding medium layer of the outer surface of the lower plate of the plate body thereon and at least one is thermally conductive in face of this
The upper surface of part is integrally connected.
The heat-sink unit manufacturing method, in which: provide aforementioned upper plate, lower plate, capillary structure and this at least one is thermally conductive
An at least heat-conducting piece is placed in an at least groove and the lower plate, the capillary structure, the upper plate is sequentially placed on this by part
Lower die is installed in recess portion, and the step of carrying out heating pressing by the upper and lower mould also includes: providing an at least binding medium
Layer, an at least binding medium layer are formed on the one of an at least heat-conducting piece by vapor deposition, sputter, any mode of plating
On surface, and at least heat-conducting piece for being formed with an at least binding medium layer is placed in an at least groove and under this
Plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and enabling an at least binding medium layer be located at should
At least the upper surface of a heat-conducting piece and heating pressing is carried out between the outer surface of the plate body, and through the upper and lower mould.
The heat-sink unit manufacturing method, in which: after upper and lower mould heating pressing, make on this in the lower die
While plate lid closes the lower plate and constitutes the plate body, the outer surface of at least upper surface of a heat-conducting piece and the lower plate in face of the plate body
The step of being integrally connected also includes: after the upper and lower mould heating pressing, the upper plate lid in the lower die being made to close the lower plate structure
Simultaneously at the plate body, at least binding medium layer of the upper surface of an at least heat-conducting piece thereon and the lower plate for facing the plate body
Outer surface be integrally connected.
The heat-sink unit manufacturing method, in which: the plate body is equipped with a chamber, is filled with a working solution in the chamber
Body, and on the outer surface of the lower plate have an at least combined area, and an at least combined area for the outer surface of the lower plate with face
The heat transfer face of an at least heat-conducting piece combines.
The heat-sink unit manufacturing method, in which: an at least binding medium layer is a nickel coating, a tin coating and one
Copper plate is any.
The heat-sink unit manufacturing method, in which: the plate body and an at least heat-conducting piece are not same material.
The heat-sink unit manufacturing method, in which: the plate body and an at least heat-conducting piece are metal material or ceramic material
Matter, the metal material are that copper, aluminium, stainless steel and titanium matter are any, and the ceramic material is silicon nitride, zirconium oxide and oxygen
It is any to change aluminium.
The heat-sink unit manufacturing method, in which: the mold is graphite jig.
The heat-sink unit manufacturing method, in which: the plate body is a temperature-uniforming plate or a hot plate.
The heat-sink unit manufacturing method, in which: the capillary structure is mesh grid or corpus fibrosum.
The present invention also provides a kind of heat-sink unit manufacturing methods characterized by comprising
A mold is provided, which is equipped with a upper mold and a lower die, which is equipped with one and is installed with recess portion, this is installed with recess portion tool
There is at least one groove recessed from the bottom side for being installed with recess portion；
There is provided a upper plate, a lower plate, one be formed in the upper and lower plate at least one or secondly inside on capillary structure
And an at least heat-conducting piece, which is placed in an at least groove and the upper and lower plate is sequentially placed under this
Mould is installed in recess portion, and carries out heating pressing by the upper and lower mould；And
After the upper and lower mould heating pressing, while so that the upper plate lid in the lower die is closed the lower plate one plate body of composition,
One upper surface of an at least heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected.
The heat-sink unit manufacturing method, in which: after upper and lower mould heating pressing, make on this in the lower die
While plate lid closes the lower plate one plate body of composition, outside a upper surface of an at least heat-conducting piece and the one of the lower plate for facing the plate body
It also include a step after the step of surface is integrally connected；To one working fluid of filling in an opening of the plate body, and to this
Plate body vacuumizes and carries out sealing operation, to constitute a heat-sink unit.
The heat-sink unit manufacturing method, in which: the upper plate, the lower plate are provided, are previously formed in the upper and lower plate extremely
Few one or secondly capillary structure and an at least heat-conducting piece on inside, is placed on an at least groove for an at least heat-conducting piece
The interior and upper and lower plate is sequentially placed on being installed in recess portion of the lower die, and the step of carrying out heating pressing by the upper and lower mould is also
Include: an at least binding medium layer is provided, which passes through vapor deposition, sputter, any mode shape of plating
An at least knot is placed in an at least groove and is formed on the outer surface of the lower plate, and by an at least heat-conducting piece
The lower plate and the upper plate for closing dielectric layer are sequentially placed on being installed in recess portion of the lower die, and enabling this, at least a binding medium layer is located at
The outer surface of the plate body and heating pressing is carried out between this at least upper surface of a heat-conducting piece, and through the upper and lower mould.
The heat-sink unit manufacturing method, in which: after upper and lower mould heating pressing, make on this in the lower die
While plate lid closes the lower plate one plate body of composition, outside a upper surface of an at least heat-conducting piece and the one of the lower plate for facing the plate body
The step of surface is integrally connected also includes: after the upper and lower mould heating pressing, closing the upper plate lid in the lower die under this
Plate constitutes the plate body simultaneously, and at least one leads at least binding medium layer of the outer surface of the lower plate of the plate body thereon with this is faced
The upper surface of warmware is integrally connected.
The heat-sink unit manufacturing method, in which: an at least heat-conducting piece has a heat-absorbent surface and a heat transfer face, should
An at least heat transfer face is the upper surface of an at least heat-conducting piece, which is a lower surface of an at least heat-conducting piece,
And the plate body is equipped with a chamber, is filled with a working fluid in the chamber, and combine on the outer surface of the lower plate at least one
Area, and an at least combined area for the outer surface of the lower plate is combined with the heat transfer face in face of an at least heat-conducting piece.
The heat-sink unit manufacturing method, in which: an at least binding medium layer is a nickel coating, a tin coating and one
Copper plate is any.
The heat-sink unit manufacturing method, in which: the ontology and an at least heat-conducting piece are not same material.
The heat-sink unit manufacturing method, in which: the ontology and an at least heat-conducting piece are metal material or ceramic material
Matter, the metal material are that copper, aluminium, stainless steel and titanium matter are any, and the ceramic material is silicon nitride, zirconium oxide and oxygen
It is any to change aluminium.
The heat-sink unit manufacturing method, in which: the mold is graphite jig.
The heat-sink unit manufacturing method, in which: the plate body is a temperature-uniforming plate or a hot plate.
The heat-sink unit manufacturing method, in which: the capillary structure be sintering body of powder groove or it is aforementioned it is any with
Whisker combination.
Therefore, the design of the various embodiments described above this heat-sink unit manufacturing method through the invention allows up to disposable
It completes the processing of heat-sink unit and saves processing procedure process, and also effectively reach the effect saved cost and increase whole speed of production
Fruit.
Detailed description of the invention
Fig. 1 is the flow diagram of the first embodiment of the present invention.
Figure 1A is the heat-sink unit implementing procedure aspect schematic diagram of the first embodiment of the present invention.
Fig. 2 is the stereoscopic schematic diagram of heat-sink unit of the invention.
Fig. 3 is that of the invention heat in the heat-sink unit implementing procedure aspect of an embodiment through upper and lower mould presses signal
Figure.
Fig. 4 is the flow diagram of the second embodiment of the present invention.
Fig. 4 A is the heat-sink unit implementing procedure aspect schematic diagram of the second embodiment of the present invention.
Fig. 4 B is the stereoscopic schematic diagram of another heat-sink unit of the invention.
Fig. 5 is the flow diagram of the third embodiment of the present invention.
Fig. 5 A is the heat-sink unit implementing procedure aspect schematic diagram of the third embodiment of the present invention.
Fig. 6 is the flow diagram of the fourth embodiment of the present invention.
Fig. 6 A is the heat-sink unit implementing procedure aspect schematic diagram of the fourth embodiment of the present invention.
Description of symbols: heat-sink unit 1；Plate body 10；Upper plate 101；Lower plate 102；Combined area 1021；Chamber 103；Capillary
Structure 105；Heat-conducting piece 13；Heat-absorbent surface 131；Heat transfer face 132；Binding medium layer 14；Mold 2；Upper mold 21；Lower die 22；It is installed with
Recess portion 221；Groove 2211.
Specific embodiment
Above-mentioned purpose and its structure of the invention and characteristic functionally, the preferred embodiment according to institute's accompanying drawings is given
Explanation.
The present invention provides a kind of heat-sink unit manufacturing method, please refers to the process that Fig. 1 is the first embodiment of the present invention and shows
It is intended to；Figure 1A is the heat-sink unit implementing procedure aspect schematic diagram of the first embodiment of the present invention；Fig. 2 is heat dissipation list of the invention
The stereoscopic schematic diagram of member；Fig. 3 is that of the invention heat in the heat-sink unit implementing procedure aspect of an embodiment through upper and lower mould is pressed
Close schematic diagram.As shown, the heat-sink unit manufacturing method of the present embodiment is to by a plate body 10 of same material and at least
One heat-conducting piece 13 combines the method for being integrally formed a heat-sink unit 1, and this method includes the following steps:
(S1) mold is provided, which is equipped with a upper mold and a lower die, which is equipped with one and is installed with recess portion, this is installed with recessed
Portion has at least one groove recessed from the bottom side for being installed with recess portion；
A mold 2 is provided, which is expressed as graphite jig 2 in the present embodiment, which is equipped with a upper mold 21 and one
The lower die 22 of the corresponding upper mold 21, and the lower die 22 is equipped with one and is installed with recess portion 221, this is installed with 221 system of recess portion from the lower die 22
The recessed composition in upside, and this is installed with recess portion 221 with an at least groove 2211, which is installed with recess portion 221 from this
Downside direction recessed composition of the bottom side towards the lower die 22.A groove 2211 is indicated in the present embodiment, it is aforementioned thermally conductive to be installed with
Part 13, in when it is implemented, the quantity of the groove 2211 is cooperated according to the quantity of aforementioned heat-conducting piece 13.
(S2) upper plate, a lower plate, a capillary structure and an at least heat-conducting piece are provided, at least a heat-conducting piece is placed on by this
In an at least groove and the lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and pass through
The upper and lower mould carries out heating pressing；
One upper plate 101, a lower plate 102, a capillary structure 105 and an at least heat-conducting piece 13 are provided, first put heat-conducting piece 13
After setting in the groove 2211 of the lower die 22, the lower plate 102, capillary structure 105 and upper plate 101 are sequentially then put into the appearance
If in recess portion 221, enabling an outer surface system of the lower plate 102 in the lower die 22 in face of a upper surface of the heat-conducting piece 13, (i.e. this is led
One heat transfer face 132 of warmware 13), and the lower plate 102 is located at the top of the heat-conducting piece 13 and the capillary structure 105 is located at this
Between upper and lower plate 101,102, heating pressing is then carried out by the upper and lower mould 21,22.Wherein aforementioned capillary structure 105 is optional
It is selected as mesh grid or corpus fibrosum, is expressed as mesh grid in the capillary structure 105 of the present embodiment, which is expressed as a reality
Heart heat-conducting block, and the heat-conducting piece 13 can in advance according to the heater element because of high and low fall caused by nearby electron element (in figure not
Show) it designs, the whole height (or thickness) of the heat-conducting piece 13 is adjusted, makes the heat-conducting piece 13 that can directly attach contact and is sent out corresponding
On thermal element, to achieve the effect that thermally conductive and heat dissipation.
And the upper plate, lower plate 101,102 and 13 system of heat-conducting piece are all same material, the same material can be divided into identical
Metal material (such as copper, aluminium, stainless steel and titanium matter are any) or identical ceramic material (such as silicon nitride (Si3N4), oxidation
Zirconium (ZrO2) and aluminium oxide (Al2O3) any), and in the upper plate of the present embodiment, lower plate 101,102 (i.e. the plate body 10) table
It is shown as copper material and heat-conducting piece 13 explains for copper material.And the heat-conducting piece 13 has a heat-absorbent surface 131 and aforementioned heat transfer face
132, it is expressed as upper surface in the heat transfer face 132 of the heat-conducting piece 13 of the present embodiment, which is expressed as lower surface, should
(such as running gear, servomechanism, leads to PC heat-absorbent surface 131 (i.e. the lower surface of heat-conducting piece 13) with a corresponding electronic equipment
Believe cabinet or other systems or device；Do not show in figure) in heater element be mutually sticked contact, to absorb the heat of the heater element
Amount, the heat transfer face 132 are conducted to receive the heat of the heat-absorbent surface 131 to radiating in the lower plate 102 of the plate body 10.
In an embodiment, which changes with heat-conducting piece 13 is designed as identical ceramic material
Matter (such as silicon nitride (Si3N4), zirconium oxide (ZrO2) and aluminium oxide (Al2O3) any), such as the upper and lower plate is silicon nitride material
Matter, the heat-conducting piece 13 are silicon nitride material.
(S3) after the upper and lower mould heating pressing, so that the upper plate lid in the lower die is closed lower plate and constitute the same of a plate body
When, a upper surface of an at least heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected；
After the heating pressing of upper and lower mould 21,22, so that the upper plate 101 in the lower die 22 is covered conjunction lower plate 102 and connect and compose plate body
While 10, the upper surface (i.e. heat transfer face 132) of the heat-conducting piece 13 in face of the outer surface of the plate body 10 (i.e. lower plate 102
Outer surface) it is integrally connected the composition heat-sink unit 1.And the plate body 10 is expressed as a temperature-uniforming plate in the present embodiment, and should
Plate body 10 is equipped with a chamber 103, is filled with a working fluid (such as pure water) in the chamber 103, which is equipped with aforementioned capillary
Structure 105, in when it is implemented, the plate body 10 can also be a hot plate.
And there is an at least combined area 1021 on the outer surface of the lower plate 102 of the plate body 10, an at least combined area 1021
Be expressed as the corresponding heat-conducting piece 13 in combined area 1021 in the present embodiment, for example, the lower plate 102 outer surface a knot
Area 1021 is closed to be integrated as being integrally formed the heat-sink unit 1, and this reality with the heat transfer face 132 in face of a heat-conducting piece 13
The quantity of the combined area 1021 and heat-conducting piece 13 of applying example is not limited to said one quantity.In an embodiment, aforementioned combined area
1021 and heat-conducting piece 13 can design the heat-conducting piece 13 for being changed to two or more combined areas 1021 with corresponding two or more, in other words,
It is exactly that the cooperating number of quantity and the corresponding heat-conducting piece 13 of aforementioned combined area 1021 closes, and the height of heat-conducting piece 13 simultaneously is (or thick
Degree) it is matched with the heater element for directly contacting attaching, such as refering to Fig. 3, two combined areas 1021 are corresponding to combine two differences
The heat-conducting piece of height enables the heat-conducting piece 13 of two different height directly contact the heater element of two different height respectively, so
The heater element of heater element or plural different height that can be also low to highly relatively surrounding or nearby electron element is effectively led
Heat and the effect of heat dissipation.
(S4) to one working fluid of filling in an opening of the plate body, and sealing operation is vacuumized and carried out to the plate body.
After being packed into working fluid to the opening (not shown) of the plate body 10, and the plate body 10 is vacuumized and sealed
Mouth operation, makes the chamber 103 in the plate body 10 reach vacuum state, enables the working fluid can be in steam-condensate circulating in the chamber 103.
Therefore, the design of the method through the invention, can be by the upper and lower plate of aforementioned capillary structure 105 and same material
101,102 processing for disposably completing the heat-sink unit 1 with heat-conducting piece 13 (disposably complete upper plate 101, lower plate 102, hair
Fine texture 105 combines the processing procedure for being integrally formed heat-sink unit 1 with heat-conducting piece 13), processing procedure process and increasing are saved effectively to reach
Add the effect of whole speed of production, and also effectively achievees the effect that save cost.In addition, by the lower die 22 of the mold 2
It is installed in recess portion 221 and groove 2211 to be installed with respectively and fixes the upper and lower plate 101,102 and heat-conducting piece 13, make the heat-conducting piece 13
Heat transfer face 132 can be accurately incorporated on 1021 position of combined area of the lower plate 102 of the plate body 10, and opposite makes the heat-conducting piece
13 can accurately be incorporated on the outer surface of its corresponding inner cavity chamber 103 of the lower plate 102, to obtain preferable radiating efficiency.In addition,
1021 position of combined area of the lower plate 102 of the plate body 10 is the position that antipyretic heater element is needed in accurate corresponding electronic equipment
Set, by virtue of this invention the method can make the heat-conducting piece 13 heat transfer face 132 can entirely accurate be incorporated in the combined area of lower plate 102
It does not move on 1021 and not partially, effectively allows the entire heat-absorbent surface 131 (i.e. the lower surface of heat-conducting piece 13) of heat-conducting piece 13 can be completely smooth
It directly contacts in the heater element whole surface, effectively to reach promotion heat conduction efficiency.
Please refer to the flow diagram that Fig. 4 is the second embodiment of the present invention；Fig. 4 A is the second embodiment of the present invention
Heat-sink unit implementing procedure aspect schematic diagram；Fig. 4 B is the stereoscopic schematic diagram of another heat-sink unit of the invention.As shown, this
The heat-sink unit manufacturing method of embodiment is mainly by the scattered method of manufacturing cells of aforementioned first embodiment on disposable processing procedure
So that the upper and lower plate 101,102 of same material is combined one with heat-conducting piece 13 and capillary structure 105, changes and be designed as disposable
The one of unlike material upper and lower plate 101,102 can be combined one with an at least heat-conducting piece 13 and a capillary structure 105 on processing procedure
Body, with constitute a heat-sink unit 1 method, the method for the present embodiment include the following steps: wherein the present embodiment step S1,
S4 is identical as step S1, S4 of aforementioned first embodiment, therefore no longer repeats again；And the step S2 of the present embodiment and aforementioned first
The step S2 difference of embodiment is: providing aforementioned upper plate, lower plate, capillary structure and an at least heat-conducting piece, at least one leads by this
Warmware is placed in an at least groove and the lower plate, capillary structure and upper plate are sequentially placed on being installed in recess portion of the lower die,
And the step of carrying out heating pressing by the upper and lower mould, also includes: providing the not upper and lower plate 101 of same material, 102, capillary knot
Structure 105 and heat-conducting piece 13 and at least a binding medium layer 14, wherein the upper and lower plate 101,102 and heat-conducting piece 13 are not identical material
Matter, the not same material can be divided into different metal material (such as copper, aluminium, stainless steel and titanium matter are any) or not phase
Same ceramic material (such as silicon nitride (Si3N4), zirconium oxide (ZrO2) and aluminium oxide (Al2O3) any), and in the present embodiment
Upper and lower plate 101,102 (i.e. the plate body 10) be expressed as titanium matter and heat-conducting piece 13 explains for copper material, and in the present embodiment
Upper and lower plate 101,102 and capillary structure 105 and heat-conducting piece 13 between the upper and lower plate 101,102 part-structure and
The upper and lower plate 101,102 and the capillary structure 105 between the upper and lower plate 101,102 of connection pass and aforementioned first embodiment
And the part-structure and connection relationship of heat-conducting piece 13 are identical, therefore do not repeat mutually exist together again herein.
And an at least binding medium layer 14 is formed in the lower plate 102 by vapor deposition, sputter, any mode of plating
On outer surface, and an at least binding medium layer 14 is a nickel coating, a tin coating and a copper plate are any, and aforementioned knot
Closing dielectric layer 14 indicates that a binding medium layer 14 is as copper facing series of strata are formed in the lower plate with sputtering way in the present embodiment
Illustrate on the combined area 1021 of outer surface, then aforementioned heat-conducting piece 13 is placed in the groove 2211, and be formed with the combination
What the lower plate 102 of dielectric layer 14, capillary structure 105 and upper plate 101 were sequentially placed on the lower die 22 of the mold 2 is installed with recess portion 221
It is interior, at this point, the binding medium layer 14 is located at the outer surface of the lower plate 102 and upper surface (the i.e. heat transfer for facing the heat-conducting piece 13
Face 132) between, and heating pressing is carried out by the upper and lower mould 21,22.In an embodiment, which, which changes, is designed as
Nickel coating (or tin coating) by be deposited or be electroplated it is any in a manner of be formed in the plate body 10 outer surface combined area 1021 on.
In another embodiment, which is designed as the pottery of not same material with heat-conducting piece 13
Porcelain material (such as silicon nitride (Si3N4), zirconium oxide (ZrO2) and aluminium oxide (Al2O3) any), such as the upper and lower plate 101,
102 (i.e. plate bodys 10) are silicon nitride material, which is oxidation aluminium material.In another embodiment, the upper and lower plate 101,
102 are designed as different metal material and ceramic material with heat-conducting piece 13, such as the upper and lower plate 101,102 is aluminium oxide
(Al2O3) material and these heat-conducting pieces 1312a be copper material.
And the step S3 of the present embodiment and the step S3 difference of aforementioned first embodiment are: through the upper and lower mould heating pressure
After conjunction, while making the upper plate lid in the lower die close lower plate to constitute a plate body, a upper surface of an at least heat-conducting piece with
The step of being integrally connected in face of an outer surface of the lower plate of the plate body also includes: after the heating pressing of upper and lower mould 21,22,
While so that the lid conjunction of upper plate 101 lower plate 102 in the lower die 22 is connected and composed plate body 10, the appearance of the lower plate 102 of the plate body 10
The aforementioned binding medium layer 14 of face thereon is integrally connected with the upper surface (i.e. heat transfer face 132) in face of the heat-conducting piece 13,
In the present embodiment be the binding medium layer 14 that is formed on the combined area 1021 for indicating the outer surface of the lower plate 102 with it is thermally conductive in face of this
The heat transfer face 132 of part 13 combines, to constitute the heat-sink unit 1.In another embodiment, the binding medium layer 14 is in step
The heat transfer face 132 that design is formed in the heat-conducting piece 13 by vapor deposition, sputter, any mode of plating can also be changed in S2 and S3
On, and at least heat-conducting piece 13 for being formed with an at least binding medium layer 14 is placed in an at least groove 2211 and
The lower plate 102, the capillary structure 105 and upper plate 101 are sequentially placed on being installed in recess portion 221 of the lower die 22, enable this at least one
Binding medium layer 14 is located at at least upper surface of a heat-conducting piece 13 and between the outer surface of the plate body 10, and by should
Upper and lower mould 21,22 carries out heating pressing (such as step S2), then after the heating pressing of upper and lower mould 21,22, makes the heat-conducting piece 13
Heat transfer face 132 (i.e. the upper surface of heat-conducting piece 13) binding medium layer 14 thereon and the outer surface phase that faces the lower plate 102
Be combined as a whole (such as step S3).
Therefore, the outer surface and face of the plate body 10 are set in mold 2 by virtue of this invention using aforementioned binding medium layer 14
To heating pressing together between the heat transfer face 132 of heat-conducting piece 13 so that can by the upper and lower plate of capillary structure and different material and
Heat-conducting piece 13 disposably complete the heat-sink unit 1 processing (disposably complete the upper plate, lower plate, capillary structure, in conjunction with Jie
Matter layer 14 and heat-conducting piece 13 combine the processing procedure for being integrally formed heat-sink unit 1), effectively to reach saving processing procedure process and increase whole
The effect of body speed of production, and also effectively achieve the effect that save cost and heat passes to that efficiency is good and excellent in heat dissipation effect.
Please refer to the flow diagram that Fig. 5 is the third embodiment of the present invention；Fig. 5 A is the third embodiment of the present invention
Heat-sink unit implementing procedure aspect schematic diagram, and be aided with refering to Fig. 2 formula.As shown, the heat-sink unit manufacturer of the present embodiment
The capillary structure 105 of the scattered method of manufacturing cells of aforementioned first embodiment is mainly that a single element is placed on above and below by method
Between plate 101,102, be replaced as the capillary structure 105 being directly previously formed in upper and lower plate 101,102 at least one or its
On two inside namely the method for the present embodiment is disposably make on processing procedure the upper plate 101 for being formed with capillary structure 105 and/
Or it is formed with the lower plate 102 of another capillary structure 105 and heat-conducting piece 13 is all integrated as one for same material, described in constituting
The method of heat-sink unit 1, this method include the following steps: the step S1 of wherein the present embodiment mold 2 (comprising upper and lower mould 21,
22) structure of the step S1 mold 2 (including upper and lower mould 21,22) of structure and connection relationship and aforementioned first embodiment and company
Junction relationship is identical, therefore no longer repeats again.
And the same section of the step S2 of the step S2 and aforementioned first embodiment of the present embodiment no longer state again by enumeration, two
Person's step S2 difference is: provide a upper plate, a lower plate, one be formed in the upper and lower plate at least one or secondly inside on
Capillary structure and an at least heat-conducting piece, wherein the upper and lower plate 101,102 of the present embodiment and the material and structure of heat-conducting piece 13 and
Connection relationship is identical as the material and structure and connection relationship of the upper and lower plate 101,102 of aforementioned first embodiment and heat-conducting piece 13,
And the upper plate 101 and lower plate 102 in the present embodiment expression be formed on respective inside respectively in advance capillary structure 105 with
Another capillary structure 105, and the capillary structure 105 and another capillary structure 105 are a sintering body of powder, are with sintering processing point
It is not formed on the inside of the upper and lower plate 101,102, an at least heat-conducting piece 13 is then placed on an at least groove 2211
Interior and inside is formed with the lower plate 102 of another capillary structure 105 and the upper plate 101 that inside is formed with capillary structure is sequentially placed on
The lower die 22 is installed in recess portion 221, and carries out heating pressing by the upper and lower mould 21,22.In an embodiment, capillary structure
105 are alternatively chosn to a groove or groove combines with whisker or sintering body of powder with whisker.
Then step S3, S4 of the present embodiment are identical as step S3, S4 of first embodiment, are no longer described in detail again.
Please refer to the flow diagram that Fig. 6 is the fourth embodiment of the present invention；Fig. 6 A is the fourth embodiment of the present invention
Heat-sink unit implementing procedure aspect schematic diagram, and be aided with refering to Fig. 4 B formula.As shown, as shown, the heat dissipation of the present embodiment
The capillary structure 105 of the scattered method of manufacturing cells of aforementioned second embodiment is mainly that a single element is put by method of manufacturing cells
It sets between upper and lower plate 101,102, is replaced as directly having been formed on the capillary structure 105 in upper and lower plate 101,102 in advance
At least one or secondly inside on namely the method system of the present embodiment disposably make to be formed with capillary structure 105 on processing procedure
Upper plate 101 and/or be formed with the lower plate 102 of another capillary structure 105 and heat-conducting piece 13 is all same material using combining
Dielectric layer 14 combines one, and the method to constitute the heat-sink unit 1, this method includes the following steps: wherein the present embodiment
Step S1 mold 2 (include upper and lower mould 21,22) structure and connection relationship and aforementioned second embodiment step S1 mould
The structure and connection relationship of tool 2 (including upper and lower mould 21,22) are identical, therefore are no longer described in detail again.
And the same section of the step S2 of the step S2 and aforementioned second embodiment of the present embodiment no longer state again by enumeration, two
Person's step S2 difference is: provide a upper plate, a lower plate, one be formed in the upper and lower plate at least one or secondly inside on
Capillary structure and an at least heat-conducting piece and an at least binding medium layer, aforementioned heat-conducting piece 13 is then placed on the groove 2211
Interior and inside is formed with another capillary structure 105 and outer surface is formed with the lower plate 102 and inside shape of the binding medium layer 14
It is sequentially placed on being installed in recess portion 221 of the lower die 22 at the upper plate 101 for having capillary structure 105, enables 14, the binding medium layer
In the outer surface of the plate body 10 and between the upper surface of the heat-conducting piece 13, and heating pressure is carried out by the upper and lower mould 21,22
It closes.The wherein knot of the capillary structure 105 of the structure and connection relationship and aforementioned third embodiment of the capillary structure 105 of the present embodiment
Structure and connection relationship are identical.
Then step S3, S4 of the present embodiment are identical as step S3, S4 of second embodiment, are no longer described in detail again.
Therefore, the design of each above-described embodiment the method through the invention, so that can effectively reach disposable completes heat dissipation
The processing and saving processing procedure process of unit, and also effectively achieve the effect that save cost and increase whole speed of production.
Claims (25)
1. a kind of heat-sink unit manufacturing method characterized by comprising
A mold is provided, which is equipped with a upper mold and a lower die, which is equipped with one and is installed with recess portion, this, which is installed with recess portion, has extremely
Few groove recessed from the bottom side for being installed with recess portion；
One upper plate, a lower plate, a capillary structure and an at least heat-conducting piece are provided, by an at least heat-conducting piece be placed on this at least one
In groove and the lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, and pass through the upper and lower mould
Carry out heating pressing；And
After the upper and lower mould heating pressing, while so that the upper plate lid in the lower die is closed lower plate one plate body of composition, this is at least
One upper surface of one heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected.
2. heat-sink unit manufacturing method according to claim 1, it is characterised in that: after the upper and lower mould heating pressing, make
While the upper plate, lower plate and its interior capillary structure in the lower die are at a plate body, an at least heat-conducting piece one on table
A step is further included after the step of being integrally connected on face and an outer surface of the lower plate for facing the plate body；To the one of the plate body
A working fluid is filled in opening, and sealing operation is vacuumized and carried out to the plate body.
3. heat-sink unit manufacturing method according to claim 1, it is characterised in that: an at least heat-conducting piece has a heat absorption
Face and a heat transfer face, an at least heat transfer face be an at least heat-conducting piece the upper surface, the heat-absorbent surface be this at least one
A lower surface of heat-conducting piece.
4. heat-sink unit manufacturing method according to claim 1, it is characterised in that: provide aforementioned upper plate, lower plate, capillary knot
Structure and an at least heat-conducting piece, by an at least heat-conducting piece be placed in an at least groove and the lower plate, the capillary structure, should
Upper plate is sequentially placed on being installed in recess portion of the lower die, and the step of carrying out heating pressing by the upper and lower mould also includes: providing
An at least binding medium layer, an at least binding medium layer are formed in the lower plate by vapor deposition, sputter, any mode of plating
Outer surface on, and an at least heat-conducting piece is placed in an at least groove and is formed with an at least binding medium layer
The lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, enable an at least binding medium layer position
Heating pressing is carried out in the outer surface of the plate body and between this at least upper surface of a heat-conducting piece, and through the upper and lower mould.
5. heat-sink unit manufacturing method according to claim 4, it is characterised in that: after the upper and lower mould heating pressing, make
While the upper plate lid in the lower die closes the lower plate and constitutes the plate body, this at least the upper surface of a heat-conducting piece with face the plate
The step of outer surface of the lower plate of body is integrally connected also includes: after the upper and lower mould heating pressing, making being somebody's turn to do in the lower die
Upper plate lid closes the lower plate and constitutes the plate body simultaneously, enable at least binding medium layer of the outer surface of the lower plate of the plate body thereon with
Upper surface in face of an at least heat-conducting piece is integrally connected.
6. heat-sink unit manufacturing method according to claim 1, it is characterised in that: provide aforementioned upper plate, lower plate, capillary knot
Structure and an at least heat-conducting piece, by an at least heat-conducting piece be placed in an at least groove and the lower plate, the capillary structure, should
Upper plate is sequentially placed on being installed in recess portion of the lower die, and the step of carrying out heating pressing by the upper and lower mould also includes: providing
An at least binding medium layer, an at least binding medium layer are formed in this at least by vapor deposition, sputter, any mode of plating
On one upper surface of one heat-conducting piece, and by be formed with an at least binding medium layer this at least a heat-conducting piece is placed on this at least
In one groove and the lower plate, the capillary structure and the upper plate are sequentially placed on being installed in recess portion of the lower die, enable an at least knot
Close dielectric layer and be located at at least upper surface of a heat-conducting piece and between the outer surface of the plate body, and pass through the upper and lower mould into
Row heating pressing.
7. heat-sink unit manufacturing method according to claim 6, it is characterised in that: after the upper and lower mould heating pressing, make
While the upper plate lid in the lower die closes the lower plate and constitutes the plate body, this at least the upper surface of a heat-conducting piece with face the plate
The step of outer surface of the lower plate of body is integrally connected also includes: after the upper and lower mould heating pressing, making being somebody's turn to do in the lower die
Upper plate lid closes the lower plate and constitutes the plate body simultaneously, at least binding medium layer of the upper surface of an at least heat-conducting piece thereon with
Outer surface in face of the lower plate of the plate body is integrally connected.
8. heat-sink unit manufacturing method according to claim 3, it is characterised in that: the plate body is equipped with a chamber, the chamber
Inside be filled with a working fluid, and on the outer surface of the lower plate have an at least combined area, and the outer surface of the lower plate this extremely
A few combined area is combined with the heat transfer face in face of an at least heat-conducting piece.
9. heat-sink unit manufacturing method according to claim 1, it is characterised in that: at least a binding medium layer is a plating for this
Nickel layer, a tin coating and a copper plate are any.
10. heat-sink unit manufacturing method according to claim 1, it is characterised in that: the plate body and an at least heat-conducting piece
For not same material.
11. heat-sink unit manufacturing method according to claim 1, it is characterised in that: the plate body and an at least heat-conducting piece
For metal material or ceramic material, the metal material is that copper, aluminium, stainless steel and titanium matter are any, the ceramic material
It is any for silicon nitride, zirconium oxide and aluminium oxide.
12. heat-sink unit manufacturing method according to claim 1, it is characterised in that: the mold is graphite jig.
13. heat-sink unit manufacturing method according to claim 1, it is characterised in that: the plate body is a temperature-uniforming plate or a heat
Plate.
14. heat-sink unit manufacturing method according to claim 1, it is characterised in that: the capillary structure is mesh grid or fibre
Tie up body.
15. a kind of heat-sink unit manufacturing method characterized by comprising
A mold is provided, which is equipped with a upper mold and a lower die, which is equipped with one and is installed with recess portion, this, which is installed with recess portion, has extremely
Few groove recessed from the bottom side for being installed with recess portion；
There is provided a upper plate, a lower plate, one be formed in the upper and lower plate at least one or secondly inside on capillary structure and extremely
A few heat-conducting piece, which is placed in an at least groove and the upper and lower plate is sequentially placed on the lower die
It is installed in recess portion, and heating pressing is carried out by the upper and lower mould；And
After the upper and lower mould heating pressing, while so that the upper plate lid in the lower die is closed the lower plate one plate body of composition, this is extremely
One upper surface of a few heat-conducting piece and an outer surface of the lower plate in face of the plate body are integrally connected.
16. heat-sink unit manufacturing method according to claim 15, it is characterised in that: after the upper and lower mould heating pressing,
Make the upper plate lid in the lower die close the lower plate constitute a plate body while, a upper surface of an at least heat-conducting piece with face
It also include a step after the step of one outer surface of the lower plate of the plate body is integrally connected；To filling in an opening of the plate body
One working fluid, and sealing operation is vacuumized and carried out to the plate body, to constitute a heat-sink unit.
17. heat-sink unit manufacturing method according to claim 15, it is characterised in that: provide the upper plate, lower plate, aforementioned
It is formed in the upper and lower plate at least one or secondly capillary structure and an at least heat-conducting piece on inside, at least one is thermally conductive by this
Part is placed in an at least groove and the upper and lower plate is sequentially placed on being installed in recess portion of the lower die, and passes through the upper and lower mould
The step of carrying out heating pressing also includes: providing an at least binding medium layer, an at least binding medium layer is by being deposited, splashing
It plates, any mode is electroplated is formed on the outer surface of the lower plate, and an at least heat-conducting piece is placed on this at least one is recessed
It in slot and is formed with this at least the lower plate of a binding medium layer and the upper plate is sequentially placed on being installed in recess portion of the lower die, enable
An at least binding medium layer is located at the outer surface of the plate body and between this at least upper surface of a heat-conducting piece, and by being somebody's turn to do
Upper and lower mould carries out heating pressing.
18. heat-sink unit manufacturing method according to claim 17, it is characterised in that: after the upper and lower mould heating pressing,
Make the upper plate lid in the lower die close the lower plate constitute a plate body while, a upper surface of an at least heat-conducting piece with face
The step of one outer surface of the lower plate of the plate body is integrally connected also includes: after the upper and lower mould heating pressing, making the lower die
The interior upper plate lid closes the lower plate and constitutes the plate body simultaneously, at least binding medium of the outer surface of the lower plate of the plate body thereon
Layer is integrally connected with the upper surface in face of an at least heat-conducting piece.
19. heat-sink unit manufacturing method according to claim 15, it is characterised in that: an at least heat-conducting piece has one to inhale
Hot face and a heat transfer face, an at least heat transfer face be an at least heat-conducting piece the upper surface, the heat-absorbent surface be this at least
A lower surface of one heat-conducting piece, and the plate body is equipped with a chamber, and a working fluid, and the appearance of the lower plate are filled in the chamber
There is an at least combined area, and an at least combined area for the outer surface of the lower plate and the heat for facing an at least heat-conducting piece on face
Conducting surface combines.
20. heat-sink unit manufacturing method according to claim 15, it is characterised in that: at least a binding medium layer is one for this
Nickel coating, a tin coating and a copper plate are any.
21. heat-sink unit manufacturing method according to claim 15, it is characterised in that: the ontology and an at least heat-conducting piece
For not same material.
22. heat-sink unit manufacturing method according to claim 15, it is characterised in that: the ontology and an at least heat-conducting piece
For metal material or ceramic material, the metal material is that copper, aluminium, stainless steel and titanium matter are any, the ceramic material
It is any for silicon nitride, zirconium oxide and aluminium oxide.
23. heat-sink unit manufacturing method according to claim 15, it is characterised in that: the mold is graphite jig.
24. heat-sink unit manufacturing method according to claim 15, it is characterised in that: the plate body is a temperature-uniforming plate or a heat
Plate.
25. heat-sink unit manufacturing method according to claim 15, it is characterised in that: the capillary structure is sintering body of powder
Or it groove or aforementioned any is combined with whisker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428710.9A CN109874268B (en) | 2018-11-27 | 2018-11-27 | Manufacturing method of heat dissipation unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811428710.9A CN109874268B (en) | 2018-11-27 | 2018-11-27 | Manufacturing method of heat dissipation unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109874268A true CN109874268A (en) | 2019-06-11 |
| CN109874268B CN109874268B (en) | 2020-11-10 |
Family
ID=66916985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811428710.9A Active CN109874268B (en) | 2018-11-27 | 2018-11-27 | Manufacturing method of heat dissipation unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109874268B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110455104A (en) * | 2019-08-22 | 2019-11-15 | 广东工业大学 | A kind of encapsulation of channel type soaking plate and test equipment |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1936481A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and radiating model group |
| CN101203116A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Air tightness cavity and moulding method, heat radiating device using the air tightness cavity |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| TW201104201A (en) * | 2009-07-24 | 2011-02-01 | Foxconn Tech Co Ltd | Heat dissipation device and manufacturing method thereof |
| CN104006689A (en) * | 2013-02-27 | 2014-08-27 | 象水国际股份有限公司 | Plate type heat pipe and manufacturing method thereof |
| CN107371353A (en) * | 2017-07-28 | 2017-11-21 | 陈豪 | A kind of preparation technology of the temperature-uniforming plate with radiating fin |
| US20180259268A1 (en) * | 2017-03-10 | 2018-09-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-layer wick structures with surface enhancement and fabrication methods |
-
2018
- 2018-11-27 CN CN201811428710.9A patent/CN109874268B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1936481A (en) * | 2005-09-23 | 2007-03-28 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and radiating model group |
| CN101203116A (en) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | Air tightness cavity and moulding method, heat radiating device using the air tightness cavity |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| TW201104201A (en) * | 2009-07-24 | 2011-02-01 | Foxconn Tech Co Ltd | Heat dissipation device and manufacturing method thereof |
| CN104006689A (en) * | 2013-02-27 | 2014-08-27 | 象水国际股份有限公司 | Plate type heat pipe and manufacturing method thereof |
| US20180259268A1 (en) * | 2017-03-10 | 2018-09-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-layer wick structures with surface enhancement and fabrication methods |
| CN107371353A (en) * | 2017-07-28 | 2017-11-21 | 陈豪 | A kind of preparation technology of the temperature-uniforming plate with radiating fin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110455104A (en) * | 2019-08-22 | 2019-11-15 | 广东工业大学 | A kind of encapsulation of channel type soaking plate and test equipment |
| CN112672604A (en) * | 2020-12-22 | 2021-04-16 | Oppo（重庆）智能科技有限公司 | Vapor chamber, case, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109874268B (en) | 2020-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10551129B2 (en) | Semiconductor device assembly with vapor chamber | |
| CN206556484U (en) | A kind of new type superthin soaking plate | |
| CN101754656B (en) | Uniform temperature plate | |
| CN109314093A (en) | With the semiconductor device assemblies for wearing mould cooling duct | |
| TWI382507B (en) | Semiconductor package | |
| CN101986424A (en) | Diffusion bonding circuit submount directly to vapor chamber | |
| CN107275319B (en) | LED chip flat heat pipe integrated packaging structure and preparation method thereof | |
| US20130008634A1 (en) | Heat dissipation unit and manufacturing method thereof and thermal module thereof | |
| CN109874268A (en) | Heat-sink unit manufacturing method | |
| CN110425918A (en) | A kind of ultrathin flexible flat-plate heat pipe | |
| CN205430849U (en) | Flexible even temperature plate | |
| CN110285699A (en) | A kind of compound temperature-uniforming plate and its manufacturing method | |
| TW200532158A (en) | Heat-dissipating module | |
| WO2020248905A1 (en) | Wafer-level 3d stacked microchannel heat dissipation structure and manufacturing method therefor | |
| CN109906017A (en) | Heat-sink unit | |
| CN100557367C (en) | A kind of large power plate integral type phase change heat-radiation method and radiator | |
| CN110828398A (en) | Integrated soaking substrate for power semiconductor module packaging and manufacturing method thereof | |
| CN205488104U (en) | Ultra -thin heat conduction component and ultra -thin heat conduction component of buckling | |
| CN104215106A (en) | Vapor chamber with heat conducting block and manufacturing method thereof | |
| WO2021073492A1 (en) | Vacuum soaking plate with supporting structure and terminal | |
| CN209517822U (en) | Heat-sink unit | |
| WO2021263037A1 (en) | Systems and methods of improving thermal management of heat-generation components | |
| TW200928689A (en) | Heat sink | |
| TWM560615U (en) | Heat dissipating device | |
| CN207854383U (en) | Radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |