TWM560615U - Heat dissipating device - Google Patents

Abstract

The present invention discloses a heat dissipating device including a first heat pipe, a second heat pipe, and a vapor chamber. The first heat pipe has a first open end and a first closed end. The second heat pipe has a second open end and a second closed end. In which, the first open end of the first heat pipe and the second open end of the second heat pipe extend into the vapor chamber through the same hole of the vapor chamber.

Description

Radiator

This case is about a heat dissipation device, especially a heat dissipation device combining a heat pipe and a temperature equalizing plate.

With the rapid development of computers and various electronic devices and the convenience they bring, modern people have become accustomed to using time. However, when computers and various electronic devices are operated for a long time, their The disadvantage that the heat cannot be dissipated in time is also accompanied. In order to effectively solve the problem of high heat generation, many composite heat dissipation devices have been proposed to have multiple advantages and exert better heat dissipation efficiency, for example, a combination of a heat pipe and a vapor chamber.

Please refer to FIGS. 1 and 2. FIG. 1 is a conceptual diagram of a conventional heat dissipation device. FIG. 2 is a conceptual diagram of the first heat pipe and the second heat pipe of the heat dissipation device shown in FIG. The heat dissipation device 1 includes a temperature equalizing plate 10, a first heat pipe 11, a second heat pipe 12, and a fluid medium 13, and the first heat pipe 11 and the second heat pipe 12 are respectively Since the first opening 101 and the second opening 102 of the temperature equalizing plate 10 are inserted into the temperature equalizing plate 10, the temperature equalizing plate 10 is in fluid communication with the first heat pipe 11 and the second heat pipe 12, and the fluid medium 13 is filled in the temperature equalizing plate 10 1. The first heat pipe 11 and the second heat pipe 12 flow in them; after the heat dissipation device 1 is in thermal contact with a heat source (not shown), the fluid medium 13 filled in it will continuously undergo liquid-vapor two-phase changes And the heat energy is transferred to the outside through the heat dissipation fins 2 (shown only by dotted boxes in FIG. 2) in thermal contact with the first heat pipe 11 and the second heat pipe 12.

In particular, there is a distance D1 between the first heat pipe 11 and the second heat pipe 12. In order for both the first heat pipe 11 and the second heat pipe 12 to be in thermal contact with the heat dissipation fin 2, the heat dissipation fin 2 must have at least a distance greater than the distance The length of D1 is D2, but this leads to the fact that the heat dissipation fin 2 cannot be effectively miniaturized, which further affects the flexibility of the space arrangement of the heat dissipation device 1. In addition, in the manufacturing process of the heat dissipation device 1, the gap between the first opening 101 of the temperature equalizing plate 10 and the first heat pipe 11 needs to be closed, and between the second opening 102 of the temperature equalizing plate 10 and the second heat pipe 12 The gap must also be closed, making the process too cumbersome.

As can be seen from the above description, the conventional heat sink 1 has room for improvement.

The main purpose of this creation is to provide a heat dissipation device with space configuration flexibility and simplified manufacturing process.

In a preferred embodiment, the present invention provides a heat dissipation device, including Including: a first heat pipe with a first closed end and a first open end; a second heat pipe with a second closed end and a second open end; and a soaking plate with at least one opening; wherein The first open end of the first heat pipe and the second open end of the second heat pipe are inserted into the temperature equalizing plate through the same opening.

In a preferred embodiment, the first open end of the first heat pipe and the second open end of the second heat pipe are arranged next to each other.

In a preferred embodiment, the first heat pipe and the second heat pipe are in common thermal contact with a heat dissipating element, and the thermal contact section on the first heat pipe corresponding to the heat dissipating element and the second heat pipe are in contact with the The corresponding thermal contact sections of the heat dissipation elements are arranged next to each other.

In a preferred embodiment, the heat dissipation element is a heat dissipation fin.

In a preferred embodiment, the temperature equalizing plate includes an upper shell and a lower shell, and the upper shell and the lower shell together form a chamber.

In a preferred embodiment, the upper casing has the at least one opening; or the lower casing has the at least one opening; or the upper casing and the lower casing jointly form the at least one opening.

In a preferred embodiment, the temperature equalizing plate includes a plurality of supporting parts, and the supporting parts are disposed between the upper casing and the lower casing.

In a preferred embodiment, each of the supporting parts is made of metal material.

In a preferred embodiment, the temperature equalizing plate includes a capillary structure of the temperature equalizing plate.

In a preferred embodiment, the capillary structure of the temperature equalizing plate is formed by sintering metal powder, woven mesh or fiber bundle.

In a preferred embodiment, the temperature equalizing plate includes a liquid injection port.

In a preferred embodiment, the heat dissipation device further includes a fluid medium filled in the first heat pipe, the second heat pipe, and the temperature equalizing plate.

In a preferred embodiment, at least one of the first heat pipe and the second heat pipe further has a heat pipe capillary structure.

1‧‧‧radiating device

2‧‧‧cooling fins

3‧‧‧radiating device

4‧‧‧Cooling components

10‧‧‧average temperature plate

11‧‧‧The first heat pipe

12‧‧‧The second heat pipe

13‧‧‧ fluid medium

30‧‧‧average temperature plate

31‧‧‧The first heat pipe

32‧‧‧Second heat pipe

33‧‧‧ fluid medium

101‧‧‧ First opening

102‧‧‧Second opening

301‧‧‧ opening

302‧‧‧Upper case

303‧‧‧Lower shell

304‧‧‧Capillary structure

305‧‧‧Support

306‧‧‧Injection port

311‧‧‧The first closed end

312‧‧‧First open end

313‧‧‧Capillary structure of the first heat pipe

314‧‧‧thermal contact section

321‧‧‧Second closed end

322‧‧‧Second open end

323‧‧‧Capillary structure of the second heat pipe

324‧‧‧thermal contact section

Figure 1: Schematic diagram of the structure of a conventional heat sink.

FIG. 2 is a conceptual diagram showing that the first heat pipe and the second heat pipe of the heat dissipation device shown in FIG. 1 are in thermal contact with the heat dissipation fins.

FIG. 3 is a schematic diagram of the appearance of the heat dissipation device of the present invention in a preferred embodiment.

Fig. 4 is a schematic diagram of the internal structure of the heat pipe and the temperature equalizing plate shown in Fig. 3.

FIG. 5 is a conceptual diagram showing that the first heat pipe and the second heat pipe of the heat dissipation device shown in FIG. 3 are in thermal contact with the heat dissipation element.

Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of the appearance and structure of a heat dissipation device in a preferred embodiment. FIG. 4 is a schematic diagram of the internal structure of the heat pipe and the temperature equalizing plate shown in FIG. 3. The heat sink 3 includes a first heat pipe 31, a second heat pipe 32, and a temperature equalizing plate 30. The first heat pipe 31 has a first closed end 311 and a first open end 312, and the second heat pipe 32 has a second closed end 321 and a first Two open ends 322; wherein, the temperature equalizing plate 30 has an opening 301, when the first heat pipe 31, the second heat pipe 32 and the temperature equalizing plate 30 are assembled, the first open end 312 of the first heat pipe 31 and the second heat pipe 32 The second open end 322 will be inserted from the same opening 301 of the temperature equalizing plate 30. In addition, the shapes of the first heat pipe 31 and the second heat pipe 32 may be the same or different depending on actual application requirements (such as space consideration or positional relationship with the heat dissipation element), for example, the first heat pipe 31 and the second heat pipe 32 may be one The heat pipe in the shape of a letter, or the first heat pipe 31 is a heat pipe in a shape of a line, and the second heat pipe 32 is a heat pipe in the shape of an L.

In the preferred embodiment, the first heat pipe 31 is further provided with a first heat pipe capillary structure 313, and the first heat pipe capillary structure 313 extends outward from the first open end 312 of the first heat pipe 31 and protrudes from the first heat pipe 31, and the second heat pipe 32 is also provided with a second heat pipe capillary structure 323, and the second heat pipe capillary structure 323 extends outward from the second open end 322 of the second heat pipe 32 and protrudes beyond the second heat pipe 32 ; Among them, in the material of the first heat pipe capillary structure 313 and the second heat pipe capillary structure 323, this creation can choose capillaries such as metal braided mesh, fiber bundle or powder sintering, especially the capillary structure formed by powder sintering It is less likely to deform in shape and is suitable as a capillary structure extending outwards.

Moreover, in the preferred embodiment, the temperature equalizing plate 30 includes an upper housing 302 and a lower housing 303, which together form a chamber, and the lower housing 303 forms the opening 301; wherein, the temperature equalizing plate 30 The inner bottom surface of the lower housing 303 is formed with a temperature-regulating plate capillary structure 304, and the temperature-regulating plate capillary structure 304 can be sintered from powder, woven mesh or fiber bundle, and the first heat pipe capillary structure 313 and the second heat pipe capillary structure 323 respectively, because the first heat pipe 31 and the second heat pipe 32 are inserted into the temperature equalizing plate 30, they can be extended into the chamber of the temperature equalizing plate 30 and contact the capillary structure 304 of the temperature equalizing plate. In addition, the combination of the upper housing 302 and the lower housing 303 of the temperature equalizing plate 30 can be completed by brazing or a common metal edge-sealing process, and the opening 301 of the housing 303 below the temperature equalizing plate 30 and the first The gap between the heat pipe 31 and the second heat pipe 32 can be closed by means of pressing, bonding glue or solder filling.

Furthermore, in the present preferred embodiment, the first open end 312 of the first heat pipe 31 and the second open end 322 of the second heat pipe 32 are arranged next to each other, and the temperature equalizing plate 30 further includes a plurality of support portions 305, and The supporting portions 305 are disposed between the upper housing 302 and the lower housing 303, and are vertically installed on the capillary structure 304 of the temperature equalizing plate and extend toward the upper housing 302 to prevent the temperature equalizing plate 30 from being at a normal temperature or a high temperature Deformed. Preferably, but not limited to this, each support portion 305 is a powder pillar or a solid pillar made of metal material.

Furthermore, in the preferred embodiment, the temperature equalizing plate 30 is in fluid communication with the first heat pipe 31 and the second heat pipe 32, and the heat sink 3 further includes a liquid injection port 306. When the first heat pipe 31, the first After the second heat pipe 32 is connected to the temperature equalizing plate 30, subsequent vacuuming and liquid injection procedures are performed, so that the fluid medium 33 (see FIG. 5) is filled into the first heat pipe 31, the second heat pipe 32, and the In the temperature equalizing plate 30, the fluid medium 33 can flow in the first heat pipe 31, the second heat pipe 32, and the temperature equalizing plate 30.

Please refer to FIG. 5, which is a conceptual diagram illustrating that the first heat pipe and the second heat pipe of the heat dissipation device shown in FIG. 3 are in thermal contact with the heat dissipation element. After the heat dissipation device 3 is in thermal contact with a heat source (not shown), the fluid medium 33 filled therein will continuously undergo a cycle of two-phase change of liquid vapor, and by thermal contact with the first heat pipe 31 and the second heat pipe 32 The heat dissipation element transfers heat energy to the outside. In the preferred embodiment, the heat dissipation element 4 is a heat dissipation fin, but it is not limited thereto.

Among them, since the first heat pipe 31 and the second heat pipe 32 of the present invention are inserted into the temperature equalizing plate 30 from the same opening 301 of the temperature equalizing plate 30, the thermal contact section 314 and the first The thermal contact sections 324 on the second heat pipes 32 corresponding to the heat dissipating elements 4 can be arranged next to each other without a gap, so that the size of the heat dissipating elements 4 can be in thermal contact with the first heat pipe 31 and the second heat pipe 32 at the same time without being too large In this way, the size of the heat dissipation element 4 can be effectively miniaturized, thereby increasing the flexibility of the space arrangement of the heat dissipation device 3. On the other hand, since the plurality of heat pipes of the original heat dissipation device 3 can share the same opening of the temperature equalizing plate 30, the number of openings of the temperature equalizing plate 30 can be reduced, thereby simplifying the relationship between each heat pipe and the corresponding opening on the temperature equalizing plate 30 The gap closing procedure, so that the process quality and product reliability of the heat dissipation device 3 can be effectively improved, and has practical industrial use value.

It is added that the thermal contact mentioned in this article refers to the contact with heat conduction, which includes at least two embodiments of direct contact and indirect contact. Of course, it is not excluded that the two are very close but Implementations that are not really touched by the structure. In terms of direct contact, it can be, for example, the direct bonding of two components, such as the direct connection between the heat sink 3 and the heat source, and the direct connection between the first heat pipe 31 and the heat sink 4 Or the second heat pipe 32 is directly attached to the heat dissipating element 4; for indirect contact, for example, a thermally conductive medium may be provided between the two elements, such as a thermally conductive paste (not shown), but not as described above limit.

In addition, the above are only examples, the shell shape of the temperature equalizing plate 30, the formation of the opening of the temperature equalizing plate 30, the material of the first heat pipe capillary structure 313 and the second heat pipe capillary structure 323, and the temperature equalizing plate capillary structure 304 Forming method, forming position, and relative positional relationship among the three, relative positional relationship between the first heat pipe 31 and the second heat pipe 32, the material of the supporting column of the temperature equalizing plate 30, the upper case 302 and the lower case of the temperature equalizing plate 30 The combination of the body 303, the gap between the opening of the housing 303 under the temperature equalizing plate 30 and the gap between the first heat pipe 31 and the second heat pipe 32, and the position of the liquid injection port 306 are not limited to the above or the drawings. Those skilled in the art can make any equal design changes based on actual application requirements.

For example, although the temperature equalizing plate 30 of the above heat dissipation device 3 takes the plate-shaped upper housing 302 and the lower housing 303 having a recessed space as examples, the design may be changed to the upper housing of the temperature equalizing plate 30 302 and the lower casing 303 are symmetrical structures, and both have concave inner spaces, and the opening 301 for connecting with the first heat pipe 31 and the second heat pipe 32 is formed on the upper casing 302, or on the upper Both the casing 302 and the lower casing 303 have partial openings, so that the first heat pipe 31 and the second heat pipe 32 can be sandwiched together. For another example, the design may be changed such that the capillary structure 304 of the temperature equalizing plate is formed on the inner top surface of the upper housing 302; for another example, the design may be changed such that the first closed end 311 of the first heat pipe 31 is first used as Liquid injection port, the method is to make both ends of the first heat pipe 31 are open ends, and use the open end away from the temperature equalizing plate 30 as the liquid injection port, until the liquid injection is completed After completion, it is closed again to become the first closed end 311 of the first heat pipe 31.

For another example, although the temperature equalizing plate 30 of the heat dissipation device 3 in the figure only depicts a single opening 301 and the opening 301 is only for two heat pipes 31 and 32 to pass therethrough, those skilled in the art can use the above embodiments. Inspired by the change of the design of the heat dissipation device, the temperature equalizing plate has a plurality of openings through which the heat supply pipe passes, and the number of heat pipes through which each opening passes is determined according to the actual application requirements, not two. limit.

The above-mentioned embodiments are only illustrative for explaining the principle and effect of the creation, and explaining the technical features of the creation, rather than limiting the protection scope of the creation. Anyone who is familiar with this technology can make changes or equal arrangements that can be easily completed without violating the technical principles and spirit of this creation, which are within the scope of this creation. Therefore, the scope of protection of the rights of this creation should be as listed below in the scope of patent application.

Claims (13)

A heat dissipation device includes: a first heat pipe with a first closed end and a first open end; a second heat pipe with a second closed end and a second open end; and a temperature equalizing plate with at least An opening; wherein, the first open end of the first heat pipe and the second open end of the second heat pipe are inserted into the temperature equalizing plate through the same opening. The heat dissipation device as described in item 1 of the patent application scope, wherein the first open end of the first heat pipe and the second open end of the second heat pipe are arranged next to each other. The heat dissipation device as described in item 1 of the patent application scope, wherein the first heat pipe and the second heat pipe are in common thermal contact with a heat dissipation element, and the thermal contact section on the first heat pipe corresponding to the heat dissipation element and the The thermal contact sections on the second heat pipe corresponding to the heat dissipating element are arranged next to each other. The heat dissipation device as described in item 3 of the patent application scope, wherein the heat dissipation element is a heat dissipation fin. The heat dissipation device as described in item 1 of the patent application scope, wherein the temperature equalizing plate includes an upper casing and a lower casing, and the upper casing and the lower casing together form a chamber. The heat dissipation device as described in item 5 of the patent application scope, wherein the upper casing has the at least one opening; or the lower casing has the at least one opening; or the upper casing and the lower casing together form the At least one opening. The heat dissipation device as described in item 5 of the patent application scope, wherein the temperature equalizing plate includes a plurality of support portions, and the support portions are disposed between the upper housing and the lower housing. The heat dissipation device as described in item 7 of the patent application scope, wherein each of the supporting parts is made of metal material. The heat dissipation device as described in item 1 of the patent application scope, wherein the temperature equalizing plate includes a capillary structure of the temperature equalizing plate. The heat dissipation device as described in item 9 of the patent application scope, wherein the capillary structure of the temperature equalizing plate is formed by sintering metal powder, woven mesh or fiber bundle. The heat dissipation device as described in item 1 of the patent application, wherein the temperature equalizing plate includes a liquid injection port. The heat dissipation device as described in item 1 of the patent application scope further includes a fluid medium filled in the first heat pipe, the second heat pipe and the temperature equalizing plate. The heat dissipation device as described in item 1 of the patent application scope, wherein at least one of the first heat pipe and the second heat pipe further has a heat pipe capillary structure.