CN112672604A

CN112672604A - Vapor chamber, case, and electronic device

Info

Publication number: CN112672604A
Application number: CN202011529684.6A
Authority: CN
Inventors: 王雪锋
Original assignee: Oppo Chongqing Intelligent Technology Co Ltd
Current assignee: Oppo Chongqing Intelligent Technology Co Ltd
Priority date: 2020-12-22
Filing date: 2020-12-22
Publication date: 2021-04-16
Anticipated expiration: 2040-12-22
Also published as: CN112672604B

Abstract

The embodiment of the application discloses a soaking plate, a shell and an electronic device. The vapor chamber comprises a first plate body, a second plate body, a condensation and backflow structure and a heat conducting element. The second plate body is connected with the first plate body. The second plate body includes a first surface and a second surface. The first surface and the second surface are opposite. The first surface and the first plate body enclose a cavity. The condensation reflux structure is arranged in the cavity. A plurality of thermally conductive elements are disposed on the second surface. The plurality of heat conducting elements are distributed at intervals. The heat conducting element includes a housing and a phase change material contained in the housing. The phase change material of the heat conducting element can absorb and release a large amount of heat in the phase change process, so that the heat of the soaking plate can be quickly dissipated, and the heat conducting capacity of the soaking plate is improved.

Description

Vapor chamber, case, and electronic device

Technical Field

The application relates to the technical field of mobile terminals, in particular to a vapor chamber, a shell and an electronic device.

Background

As the power consumption of terminals such as mobile phones and tablet computers increases, the amount of heat generated by the terminals also increases. In order to rapidly dissipate heat generated from the terminal to the outside of the terminal, a soaking plate is applied to the terminal. The soaking plate can release the heat of the hot end of the terminal after being brought to the cold end, so that the heat of the hot end and the cold end of the terminal is exchanged, the purpose of heat diffusion is realized, and the heat concentration of the terminal is avoided. Therefore, how to improve the heat conductivity of the soaking plate is a subject of study.

Disclosure of Invention

The embodiment of the application provides a vapor chamber, a shell and an electronic device.

The embodiment of the application provides a soaking plate, the soaking plate includes first plate body, second plate body, condensation reflux structure and heat-conducting element. The second plate body is connected with the first plate body. The second plate body includes a first surface and a second surface. The first surface and the second surface are opposite. The first surface and the first plate body enclose a cavity. The condensation reflux structure is arranged in the cavity. A plurality of thermally conductive elements are disposed on the second surface. The plurality of heat conducting elements are distributed at intervals. The heat conducting element includes a housing and a phase change material contained in the housing.

The shell provided by the embodiment of the application is used for an electronic device, and the shell comprises a body and an upper-appeal soaking plate. The body comprises a substrate and a side wall connected to the edge of the substrate; the soaking plate is embedded in the substrate.

The embodiment of the application provides an electronic device, which comprises the shell and the heat-generating component. The heat generating part is arranged on the soaking plate and the surface opposite to the heat conducting element.

The embodiment of the application provides a pair of soaking plate, shell and electronic device, heat-conducting element's phase change material can absorb and release a large amount of heats at the in-process of phase transition to can dispel the heat of soaking plate relatively fast, improve the heat conductivility of soaking plate.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic sectional view of a soaking plate according to an embodiment of the present application;

fig. 2 is a schematic partial sectional view of a soaking plate according to an embodiment of the present application;

FIG. 3 is an exploded schematic view of a vapor chamber according to an embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of a thermally conductive element according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of the electronic device of FIG. 5 along the direction C-C in accordance with an embodiment of the present application;

fig. 7 is an exploded schematic view of an electronic device according to an embodiment of the present application.

Description of the main element symbols:

the vapor chamber 10, the first plate body 11, the first heat conduction layer 111, the second heat conduction layer 112, the cavity 113, the second plate body 12, the first surface 121, the second surface 122, the third heat conduction layer 123, the fourth heat conduction layer 124, the recess 125, the support 126, the condensation and reflow structure 13, the heat conduction element 14, the case 141, the phase change material 142, the case 20, the body 21, the substrate 211, the mounting hole 2111, the side wall 212, the electronic device 30, the heat generating component 31, the battery 311, the chip 312, and the main board 313.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1 to 3, the embodiment of the present invention provides a vapor chamber 10, wherein the vapor chamber 10 includes a first plate 11, a second plate 12, a condensation/reflow structure 13, and a heat conducting element 14. The second plate 12 is connected to the first plate 11, the second plate 12 includes a first surface 121 and a second surface 122 opposite to each other, and the first surface 121 and the first plate 11 enclose a cavity 113. The condensate return structure 13 is disposed within the cavity 113. A plurality of heat conducting elements 14 are disposed on the second surface 122, the plurality of heat conducting elements 14 are spaced apart, and the heat conducting elements 14 include a housing and a phase change material, the phase change material being contained in the housing.

Specifically, the soaking plate 10 includes a first plate body 11 and a second plate body 12 that are connected to each other. The second plate 12 includes a first surface 121 and a second surface 122, wherein a surface of the second plate 12 contacting the first plate 11 is the first surface 121, and the first surface 121 of the second plate 12 and the first plate 11 enclose a cavity 113.

Disposed within the cavity 113 is a condensate return structure 13, which condensate return structure 13 may generally include a capillary structure. The capillary structure is formed by sintering a metal wire layer and a metal powder film together, and the material of the capillary structure generally selects metal with higher thermal conductivity, such as copper, aluminum, gold, silver, titanium and the like. Preferably, metallic copper is now used most. In the embodiment of the application, the capillary structure and the first plate body 11 can be connected into a whole through sintering, and the capillary structure and the inner wall of the soaking plate 10 assembly are used for heat transmission, storing liquid and providing the effect of the capillary force for liquid backflow.

The cavity 113 stores a cooling liquid, which absorbs or releases latent heat of phase change when the phase of the cooling liquid changes, and the design of the soaking plate 10 utilizes this principle. The inner wall of the soaking plate 10 is provided with a condensation reflux structure 13, when heat is conducted from a heat source to the soaking plate 10, the packaged cooling liquid in the cavity starts to generate gasification phenomenon after being heated in the environment with low vacuum degree, absorbs the heat and flows to the cold end, condenses and releases the heat after encountering cold, and then returns to the heat source end through the capillary action of the condensation reflux structure 13 on the inner wall of the cavity 113, so that the soaking effect is achieved. Further, the cavity 113 is in a negative pressure state, and the cavity 113 is mainly used for preventing the coolant from flowing away, maintaining the vacuum negative pressure state, and playing a certain role in deformation resistance.

It should be noted that the above terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 4, the heat conducting element 14 includes a shell 141 and a phase change material 142. Specifically, the phase change material 142 is a substance that changes the state of the substance and provides latent heat when the temperature is constant. During the phase transition, the phase change material 142 is accompanied by a large amount of heat absorption and heat release and a constant temperature during the phase transition. The type of phase change material 142 may generally be paraffin.

In order to maintain the shape of the phase change material 142 and prevent the phase change material 142 from losing, so as to prolong the service life of the phase change material 142, the phase change material 142 may be wrapped by a shell 141 to form the heat conducting element 14, wherein the shell 141 may be made of graphite. The heat conducting elements 14 are spaced apart from each other on the second surface 122 of the heat conducting element 14, and since the temperature of the heat conducting element 14 is always constant during the phase change process of absorbing and releasing a large amount of heat, the vapor chamber 10 and the phase change material 142 are used in combination, so as to further enhance the heat dissipation capability of the vapor chamber 10.

The thermally conductive element 14 may be a phase change microcapsule. The phase change microcapsule is a shell 141 formed by wrapping a layer of polymer film with stable performance outside a phase change material 142. The particle size of the phase-change microcapsules is typically in the range of 2 μm to 1000 μm, while the thickness of the shell 141 is typically in the range of 0.2 μm to 10 μm. In the phase change microcapsule, during the phase change process, the phase change material 142 as the core undergoes solid-liquid phase transition, while the shell 141 remains in the solid state, so the phase change microcapsule is also a solid particle in a macroscopic view. After the phase change microcapsules are formed, the stability of the phase change material 142 is enhanced.

As discussed above, when the heat-conducting element 14 is a phase-change microcapsule, the heat-conducting element 14 is small in size and is in a powder form. At this point, the thermally conductive element 14 is generally disposed on the second surface 12 in a mass or sheet. The heat conducting element 14 may be adhesively secured to the second surface 12 by a heat-dissipating adhesive.

In some embodiments, the second surface 122 is formed with a plurality of spaced apart grooves 125. The heat conducting element 14 is arranged in the recess 125. Illustratively, the grooves 125 may be a profiling of the vapor chamber 10.

Specifically, the second plate body 12 is stamped to form the groove 125. The press working is a forming method in which an external force is applied to a plate material or the like by a press machine to plastically deform the plate material, thereby obtaining a workpiece having a desired shape and size. In this way, the second plate body 12 is formed by a relatively general processing technique, such as stamping, and the processing cost of the relatively general processing technique is relatively low, so that the processing cost of the soaking plate 10 is reduced.

The plurality of grooves 125 formed on the second surface 122 by stamping at intervals not only increases the surface area of the second plate 12, but also the grooves 125 can accommodate the heat conducting element 14 which absorbs a large amount of heat and keeps the temperature unchanged, thereby greatly improving the heat dissipation performance of the vapor chamber 10.

In some embodiments, a plurality of support 126 protrusions are formed corresponding to the first surface 121 of the groove 125, and the support 126 protrusions are abutted against the first plate body 11.

Specifically, the second plate 12 is provided with supports 126, the supports 126 may be distributed on the second plate 12 in an array manner, and when the second plate 12 and the first plate 11 are hermetically connected to form the cavity 113, the supports 126 form a protective effect in the cavity 113 to prevent the cavity 113 of the soaking plate 10 from being deformed due to compression. In order to ensure that the support 126 can well play a role in shaping the support 126, the support 126 is protruded to abut against the first plate body 11, thereby ensuring the strength of the whole soaking plate 10.

In some embodiments, the first plate body 11 may include a first heat conduction layer 111 and a second heat conduction layer 112 arranged in a stacked manner, the second heat conduction layer 112 is connected to the second plate body 12, and the heat conductivity of the second heat conduction layer 112 is greater than that of the first heat conduction layer 111.

The first plate body 11 is formed by laminating a first heat conducting layer 111 and a second heat conducting layer 112, wherein the heat conducting layer away from the cavity 113 is the first heat conducting layer 111. The second heat conductive layer 112 is connected to the second plate body 12. The first layer 111 may be a stainless steel layer and the second layer 112 may be a copper layer. That is to say, the first plate body 11 may be a metal composite plate, the strength of the metal composite plate is high, and the first plate body 11 may be produced by industrial continuous rolling at high temperature and high pressure under an oxygen-free condition.

The second heat conducting layer 112 has a thermal conductivity greater than that of the first heat conducting layer 111, so that the vapor chamber 10 can spread heat quickly due to the greater thermal conductivity of the second heat conducting layer 112. In addition, the specific heat capacity of the stainless steel is larger than that of the copper, so that when the soaking plate 10 absorbs more heat, the temperature rise of the soaking plate 10 is smaller, the temperature rise of the soaking plate 10 is reduced, and the heat dissipation capacity of the soaking plate 10 is further enhanced.

In some embodiments, the thickness of the second thermally conductive layer 112 is less than the thickness of one thermally conductive layer.

Specifically, the thickness ratio of the first heat conduction layer 111 to the second heat conduction layer 112 can be arbitrarily adjusted according to actual requirements. The thickness of the second heat conducting layer 112 is smaller than that of the first heat conducting layer 111, so that the subsequent welding sealing of the second heat conducting layer 112 and the second plate body 12 can be facilitated.

In some embodiments, the second plate body 12 may include a third heat conduction layer 123 and a fourth heat conduction layer 124 arranged in a stacked manner, the fourth heat conduction layer 124 is connected to the first plate body 11, and the heat conductivity of the fourth heat conduction layer 124 is greater than that of the third heat conduction layer 123.

The second plate body 12 is formed by the third heat conducting layer 123 being laminated with the fourth heat conducting layer 124, wherein the heat conducting layer further away from the cavity 113 is the third heat conducting layer 123. The third heat conducting layer 123 is connected to the first plate body 11. The third layer 123 may be a stainless steel layer and the fourth layer 124 may be a copper layer. That is, the second plate body 12 may be a metal composite plate having high strength, and the second plate body 12 may be produced by high-temperature and high-pressure continuous rolling under an oxygen-free condition.

The first plate body 11 and the second plate body 12 made of the metal composite material are not easy to deform, and the first plate body 11 and the second plate body 12 are not easy to deform when dealing with external acting forces such as bending, twisting and stretching and internal pressures such as internal working medium solidification and expansion, so that the service life of the soaking plate 10 is prolonged.

The thermal conductivity of the fourth layer 124 is greater than the thermal conductivity of the third layer 123, so that the vapor chamber 10 can spread heat quickly due to the greater thermal conductivity of the fourth layer 124. In addition, because the specific heat capacity of the stainless steel is larger than that of the copper, when the soaking plate 10 absorbs more heat, the temperature rise of the soaking plate 10 is smaller, so that the temperature rise of the soaking plate 10 is reduced, and the heat dissipation capacity of the soaking plate 10 is further enhanced.

In certain embodiments, the thickness of the fourth heat conductive layer 124 is less than the thickness of the third heat conductive layer 123.

Specifically, the thickness ratio of the third heat conduction layer 123 to the fourth heat conduction layer 124 can be arbitrarily adjusted according to actual requirements. The thickness of the fourth heat conducting layer 124 is smaller than that of the third heat conducting layer 123, so that the subsequent welding sealing of the fourth heat conducting layer 124 and the first plate body 11 can be facilitated.

The second layer 112 and the fourth layer 124 may be made of copper, since they are made of the same material. The first plate body 11 and the second plate body 12 may be thermally diffusion welded together using conventional copper paste to form a sealed cavity 113 for holding the structure 13 and coolant.

In some embodiments, the condensate return structure 13 is attached to the first plate 11.

Specifically, the condensation reflux structure 13 is connected with the first plate 11 as a whole by sintering, and performs heat transmission with the inner wall of the soaking plate 10 assembly, stores liquid and provides the effect of capillary force of liquid reflux.

In some embodiments, the plurality of heat conducting elements 14 are formed in multiple groups and arranged in an array.

Specifically, the plurality of heat conducting elements 14 may be arranged in the grooves 125 of the second plate 12 in a rectangular array, so that the phase change material of the heat conducting elements 14 can absorb and release a large amount of heat during the phase change process, and thus the heat of the vapor chamber 10 can be dissipated quickly, and the heat conducting capability of the vapor chamber 10 is improved.

Referring to fig. 5 and 6, the present embodiment provides a housing 20 for an electronic device 30. The outer shell 20 includes a body 21 and the above described soaking plate 10. The body 21 includes a base 211 and sidewalls 212. The soaking plate 10 is embedded in the substrate 211. The electronic device 30 includes a housing and a heat generating part 31. The heat generating member 31 is provided on the opposite side of the soaking plate 10 from the heat conductive member 14.

Specifically, the housing 20 may serve as an exterior component of the electronic device 30. The housing 20 includes a body 21 and a soaking plate 10, the body 21 includes a substrate 211 and a sidewall 212, and the sidewall 212 is connected to an edge of the substrate 211. Wherein, the substrate 211 can be provided with an installation groove or a through hole, which is convenient for the embedding of the soaking plate 10. The soaking plate 10 and the substrate 211 are integrally connected, and specifically, the connecting manner of the soaking plate 10 and the substrate 211 includes any one or more of riveting, bonding, welding, lapping and metal encapsulation.

Referring to fig. 7, the present embodiment provides an electronic device 30, and the electronic device 30 includes a housing 20 and a heat generating member 31. The heat generating member 31 is provided on the opposite side of the soaking plate 10 from the heat conductive member 14.

In the embodiment of the present disclosure, the vapor chamber 10 and the housing 20 may be used in an electronic device 30, and the electronic device 30 is an electronic device such as a mobile phone, a tablet computer, and a smart wearable device. The electronic device 30 includes a housing 20 and a heat generating part 31.

Specifically, the heat generating part 31 may include at least one of a battery 311, a chip 312, and a main board 313. The chip 312 is a heat-generating component such as a central processing unit and an image processor. The chip 312 may be attached to the main board 313. The substrate 211 may have a mounting hole 2111 formed therein, and the chip 312 may contact the thermal chamber 10 through the mounting hole 2111. A groove may be formed in the substrate 211 to receive the battery 311. Thus, the battery 311, the chip 312 and the main board 313 can be tightly attached to the substrate 211, so that the whole electronic device 30 has a compact structure.

In addition, after the electronic device 30 is used for a long time, the battery 311, the chip 312 and the main board 313 in the electronic device 30 generate a large amount of heat because the electronic device 30 is continuously operated. Because the soaking plate 10 is tightly attached to the battery 311, the chip 312 and the main board 313, the heat sources of the battery 311, the chip 312 and the main board 313 can be radiated to the periphery in time through the soaking plate 10 and finally radiated to the atmosphere, so that the use performance of the electronic device 311 is improved, and the use experience of a user is improved. The soaking plate 10 has two side surfaces, namely a surface provided with the first plate 11 and a surface provided with the heat conducting element 14, wherein the heat generating part 31 is arranged on the soaking plate 10 and on the opposite side of the heat conducting element 14. In some embodiments, the battery 311, the chip 312 and the main board 313 are located on the same side of the soaking plate 10, i.e. away from the heat conducting element 14, so as to avoid the heat conducting element 14 from adversely affecting the battery and ensure the stability of the electronic device 30.

The phase change material of the heat conducting element 14 can absorb and release a large amount of heat during the phase change process, so that the heat of the soaking plate 10 can be quickly dissipated, and the heat conducting capacity of the soaking plate 10 is improved. The vapor chamber 10 can release the heat of the heat generating component 31 of the electronic device 30 after being brought to the cold end, so that the heat of the hot end and the cold end of the electronic device 30 is exchanged, the purpose of heat diffusion is realized, and further the heat concentration of the electronic device 30 is avoided.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A vapor chamber, comprising:

a first plate body;

the second plate body is connected with the first plate body and comprises a first surface and a second surface which are opposite, and a cavity is formed by the first surface and the first plate body in a surrounding mode;

a condensing reflux structure disposed within the cavity; and

a plurality of thermally conductive elements disposed on the second surface, the thermally conductive elements including a housing and a phase change material contained in the housing.

2. The soaking plate according to claim 1, wherein the second surface is formed with a plurality of grooves disposed at intervals, and the heat conducting member is disposed in the grooves.

3. The heat spreader of claim 2, wherein the grooves are profiled of the heat spreader.

4. The soaking plate according to claim 3, wherein a plurality of supporting protrusions are formed on the first surface corresponding to the grooves, the supporting protrusions abutting on the first plate body.

5. The vapor chamber of claim 1, wherein the first plate comprises a first heat conducting layer and a second heat conducting layer arranged in a stacked manner, the second heat conducting layer is connected with the second plate, and the heat conductivity of the second heat conducting layer is greater than that of the first heat conducting layer.

6. The heat spreader of claim 5, wherein the thickness of the second thermally conductive layer is less than the thickness of the first thermally conductive layer.

7. The vapor chamber of claim 1, wherein the second plate comprises a third heat conducting layer and a fourth heat conducting layer arranged in a stacked manner, the fourth heat conducting layer is connected with the first plate, and the heat conductivity of the fourth heat conducting layer is greater than that of the third heat conducting layer.

8. The heat spreader of claim 1, wherein the thickness of the fourth thermally conductive layer is less than the thickness of the third thermally conductive layer.

9. The soaking plate according to claim 1, wherein the condensate return structure is attached to the first plate body.

10. The vapor chamber of claim 1, wherein the plurality of heat conductive elements are formed in a plurality of sets, the plurality of sets being arranged in an array.

11. A housing for an electronic device, the housing comprising:

a body including a base plate and a sidewall connected to an edge of the base plate; and

the heat spreader of any of claims 1-10, embedded in the substrate.

12. An electronic device, comprising:

the housing of claim 11; and

the heat-generating component is arranged on the soaking plate and the surface opposite to the heat-conducting element.