CN103209569A - Radiating base and manufacturing method thereof - Google Patents
Radiating base and manufacturing method thereof Download PDFInfo
- Publication number
- CN103209569A CN103209569A CN2012100130913A CN201210013091A CN103209569A CN 103209569 A CN103209569 A CN 103209569A CN 2012100130913 A CN2012100130913 A CN 2012100130913A CN 201210013091 A CN201210013091 A CN 201210013091A CN 103209569 A CN103209569 A CN 103209569A
- Authority
- CN
- China
- Prior art keywords
- conducting element
- heat conducting
- cooling base
- sidepiece
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiating base which comprises a heat conduction element and a body. The heat conduction element is provided with a first lateral face and a second lateral face. The body is provided with a groove portion, a first lateral portion and a second lateral portion. The groove portion is communicated with the first lateral portion and the second lateral portion. The heat conduction element is embedded in the first lateral portion of the body, and the second lateral face of the heat conduction element corresponds to the groove portion. The heat conduction element and the body are formed and combined in an integral wrapping injection mode. Therefore, the aims of reducing cost and reducing weight can be achieved.
Description
Technical field
The present invention relates to technical field of electronic equipment, relate in particular to a kind of cooling base and manufacture method thereof.
Background technology
Existing electronic equipment is along with the instruction cycle is more and more faster; the heat that its internal electronic element produces is then higher relatively; so need heat dissipation element to dispel the heat at these electronic components; but because the part heat dissipation element is to be arranged at position central in the electronic equipment to be subjected to electronic device shell protection; so its heat that produces is gathered in easily in the electronic device shell and can't dispels the heat to outdiffusion; Given this problem; someone characteristic by utilizing the long-range conduction heat sources of heat pipe conducts to the electronic device shell outside with heat and dispels the heat as heat-conduction component.
Yet, the application of known technology at present, this heat pipe can't be directly and electronic building brick do combination, when using heat pipe as thermal transmission element, still must be combined with the thermal source contact or with thermal source by at least one pedestal, can make heat pipe firmly be incorporated on this thermal source and be able to the heat that conduction heat sources produces, and the pedestal of known technology is mainly made by the metal material with thermal conductive property such as materials such as aluminium material and copper material, again by offer in this pedestal hole or groove with close-fitting, interlocking, gluing and or mode such as welding do in conjunction with the transmission heat with this heat pipe.
Though the pedestal of metal material has the advantage that the conduction heat is preferable and can make in a large number fast, its material cost is higher, and so weight is heavier inconvenient in the carrying transportation.
So prior art has following shortcoming:
1. cost is higher;
2. weight is heavier;
3. carrying inconvenience.
Summary of the invention
Embodiment of the invention problem to be solved provides a kind of cooling base that alleviates overall weight, and a kind of manufacture method of the cooling base that reduces production costs also is provided in addition.
For achieving the above object, the invention provides a kind of cooling base, be to comprise: a heat conducting element, a body;
Described heat conducting element has first side and second side;
Described body has a slot part and first sidepiece and second sidepiece, this slot part is communicated with this first and second sidepiece, this heat conducting element is embedded at first sidepiece of this body, and second side of this heat conducting element is corresponding with this slot part, described body is macromolecule material, and this heat conducting element and this body series are adopted the one bag and penetrated the mode moulding.
For achieving the above object, the present invention also provides a kind of manufacture method of cooling base, comprises the steps:
One heat conducting element and at least one heat pipe are provided;
In this heat conducting element week side moulding one base body;
Aforementioned heat pipe is fixed in aforementioned heat conducting element one side.
By cooling base of the present invention and manufacture method thereof, not only can reduce the weight of cooling base, more can significantly reduce production costs; So compared with prior art, have following advantage:
1. weight reduction;
2. reduce production costs.
Description of drawings
Fig. 1 is the first embodiment three-dimensional exploded view of cooling base of the present invention;
Fig. 2 is the first embodiment three-dimensional combination figure of cooling base of the present invention;
Fig. 3 is the second embodiment three-dimensional exploded view of cooling base of the present invention;
Fig. 4 is the second embodiment three-dimensional combination figure of cooling base of the present invention;
Fig. 5 is the 3rd embodiment stereogram of cooling base of the present invention;
Fig. 6 is the 4th embodiment cutaway view of cooling base of the present invention;
Fig. 7 is the 5th embodiment stereogram of cooling base of the present invention;
Fig. 8 is the 6th embodiment cutaway view of cooling base of the present invention;
Fig. 9 is the 7th embodiment three-dimensional exploded view of cooling base of the present invention;
Figure 10 is the manufacture method flow chart of steps of cooling base of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described further.
As shown in Figure 1, 2, decompose and constitutional diagram for first embodiment of cooling base of the present invention is three-dimensional, cooling base 1 of the present invention comprises: a heat conducting element 11, a body 12;
Described heat conducting element 11 has first side 111 and second side 112;
Described body 12 has a slot part 121 and first sidepiece 122 and second sidepiece 123, this slot part 121 is communicated with this first and second sidepiece 122,123, this heat conducting element 11 is embedded at first sidepiece 122 of this body 12, and second side 112 of this heat conducting element 11 is corresponding with this slot part 121, described body 12 is macromolecule material, and this heat conducting element 11 is to take the one bag to penetrate the mode moulding with this body 12.
The material of described heat conducting element 11 be copper material and aluminium material and stainless steel and graphite material and tool heat conduction the alloy material wherein any, present embodiment is with copper material as an illustration, is not limited but do not regard it as.
As Fig. 3, shown in 4, decompose and constitutional diagram for second embodiment of cooling base of the present invention is three-dimensional, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only not existing together of present embodiment and aforementioned first embodiment has more an open sides 1211 and a bottom side 1212 for described slot part 121, described second sidepiece 123 is provided with at least one arm 13 with these open sides 1211 intersections, this arm 13 is across this open sides 1211, described arm 13 can make this heat pipe 2 be able to more tight secure bond with this heat-conductive assembly 11 to these heat pipe 2 work one suppressions radially.
As shown in Figure 5, the 3rd embodiment stereogram for cooling base of the present invention, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only not existing together of present embodiment and aforementioned first embodiment has more an open sides 1211 and a bottom side 1212 and a retaining element 14 for described slot part 121, this retaining element 14 is striden open sides 1211 tops of being located at this slot part 121, described retaining element 14 can press to the radial direction of this heat pipe 2, it is fixing with this heat conducting element 11 that this heat pipe 2 is able to this body 12, and strengthen the degree of combining closely of 11 of this heat pipe 2 and this heat conducting elements more.
As shown in Figure 6, the 4th embodiment cutaway view for cooling base of the present invention, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that described slot part 121 has more a heat pipe 2, described heat pipe 2 is located at this slot part 121, and these heat pipe 2 at least one sides are flat and are sticked with second side 112 of this heat conducting element 11, and 11 of described heat pipe 2 and this heat conducting elements have a heat-conducting medium 3.
As shown in Figure 7, the 5th embodiment stereogram for cooling base of the present invention, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that described body 12 has more the 3rd sidepiece 124 and the 4th sidepiece 125, and described third and fourth sidepiece 124,125 connects at least one fixed part 4 respectively.
As shown in Figure 8, the 6th embodiment cutaway view for cooling base of the present invention, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that described heat conducting element 11 has more a joint portion 113, this heat conducting element 11 all sides are located in this joint portion 113, and described joint portion 113 can be rough-shape, concavo-convex, collude shape, wavy and saw chi shape etc. can be in order to strengthen the design of body 12 and heat conducting element 11 firm combinations.
As shown in Figure 9, the 7th embodiment three-dimensional exploded view for cooling base of the present invention, present embodiment is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only not existing together of present embodiment and aforementioned first embodiment is that second side 112 of described heat conducting element 11 has at least one recess 1123, and described heat pipe 2 is to be located in this recess 1123.
As shown in figure 10, be the manufacture method flow chart of steps of cooling base of the present invention, as shown in the figure, the manufacture method of cooling base of the present invention comprises the steps:
Step S1 a: heat conducting element and at least one heat pipe are provided;
Be to prepare a heat conducting element 11 and at least one heat pipe 2, described heat conducting element 11 is preferable with copper material again for having the material of preferable thermal conductive property wherein as materials such as copper material and aluminium materials.
Step S2: in base body of this heat conducting element week side moulding;
Be by in the mode of ejection formation in base body 12 of these heat conducting element 11 all side moulding, and these heat conducting element 11 part-structures are embedded at a side of this base body 12, this base body 12 is plastic material.
Step S3 a: side that aforementioned heat pipe is fixed in aforementioned heat conducting element.
[main element symbol description]
First side 111
Recess 1123
The 3rd sidepiece 124
The 4th sidepiece 125
Retaining element 14
Heat-conducting medium 3
Fixed part 4
Claims (15)
1. a cooling base is characterized in that, comprising:
A heat conducting element has first side and second side;
A body, have a slot part and first sidepiece and second sidepiece, this slot part is communicated with this first and second sidepiece, this heat conducting element is embedded at first sidepiece of this body, and second side of this heat conducting element is corresponding with this slot part, described body is macromolecule material, and this heat conducting element and this body one bag are penetrated moulding.
2. cooling base according to claim 1 is characterized in that, the material of wherein said heat conducting element is wherein any of copper material, aluminium material, stainless steel and graphite material.
3. cooling base according to claim 1 is characterized in that wherein said slot part has more an open sides and a bottom side, and described second sidepiece and this open sides intersection are provided with at least one arm, and this arm is across this open sides.
4. cooling base according to claim 1 is characterized in that wherein also having a retaining element, and this retaining element is striden and is located at this slot part top.
5. cooling base according to claim 1 is characterized in that wherein also having a heat pipe, and described heat pipe is located at this slot part, and at least one side of this heat pipe is flat and is sticked with second side of this heat conducting element.
6. as cooling base as described in the claim 5, it is characterized in that having a heat-conducting medium between wherein said heat pipe and this heat conducting element.
7. cooling base according to claim 1 is characterized in that wherein said body has more the 3rd sidepiece and the 4th sidepiece, and described third and fourth sidepiece connects at least one fixed part respectively.
8. cooling base according to claim 1 is characterized in that wherein said heat conducting element has more a joint portion, and this heat conducting element week side is located in this joint portion, and described joint portion is to be matsurface.
9. cooling base according to claim 1 is characterized in that second side of wherein said heat conducting element has at least one recess.
10. as cooling base as described in the claim 8, it is characterized in that, wherein said joint portion system is concave-convex surface, collude shape, wavy and saw chi shape wherein any.
11. the manufacture method of a cooling base is characterized in that, comprises the steps:
A heat conducting element and at least one heat pipe are provided;
In base body of this heat conducting element week side moulding;
Aforementioned heat pipe is fixed in aforementioned heat conducting element one side.
12. the manufacture method as cooling base as described in the claim 11 is characterized in that, wherein aforementioned heat pipe is fixed in this step system of aforementioned heat conducting element one side with machining.
13. the manufacture method as cooling base as described in the claim 12 is characterized in that, wherein said this machining can be close-fitting, interlocking, gluing and or welding wherein any.
14. the manufacture method as cooling base as described in the claim 11 is characterized in that, base body of wherein said this heat conducting element week side moulding is with the moulding of injection molding method institute.
15. the manufacture method as cooling base as described in the claim 11 is characterized in that wherein said base body is plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100130913A CN103209569A (en) | 2012-01-16 | 2012-01-16 | Radiating base and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100130913A CN103209569A (en) | 2012-01-16 | 2012-01-16 | Radiating base and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103209569A true CN103209569A (en) | 2013-07-17 |
Family
ID=48756605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100130913A Pending CN103209569A (en) | 2012-01-16 | 2012-01-16 | Radiating base and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103209569A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648985A (en) * | 2019-09-23 | 2020-01-03 | 奇鋐科技股份有限公司 | Heat transfer member reinforcing structure |
| CN110708931A (en) * | 2019-09-23 | 2020-01-17 | 奇鋐科技股份有限公司 | Heat transfer element reinforcing structure |
| CN110800386A (en) * | 2017-07-03 | 2020-02-14 | 三菱电机株式会社 | Heat sink |
| US11719491B2 (en) | 2019-10-29 | 2023-08-08 | Asia Vital Components Co., Ltd. | Heat transfer member reinforcement structure |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2775835Y (en) * | 2005-01-25 | 2006-04-26 | 珍通科技股份有限公司 | Heat pipe radiator |
| CN2909804Y (en) * | 2006-05-24 | 2007-06-06 | 林正兴 | Radiation module base |
| CN101196771A (en) * | 2006-12-07 | 2008-06-11 | 双鸿科技股份有限公司 | Heat radiating device of notebook computer and its production method |
| JP2008306010A (en) * | 2007-06-08 | 2008-12-18 | Fujitsu Ltd | Heat radiating device, and manufacturing method of heat radiating device |
| TWM357183U (en) * | 2008-12-12 | 2009-05-11 | Asia Vital Components Co Ltd | Heat-dissipation module |
| CN201393359Y (en) * | 2009-02-26 | 2010-01-27 | 富准精密工业(深圳)有限公司 | Heat radiation device and base thereof |
| CN202058722U (en) * | 2011-03-23 | 2011-11-30 | 奇鋐科技股份有限公司 | Structure of heat radiation module |
| CN102693950A (en) * | 2011-03-23 | 2012-09-26 | 奇鋐科技股份有限公司 | Radiation module structure and manufacture method thereof |
| CN202652791U (en) * | 2012-01-16 | 2013-01-02 | 奇鋐科技股份有限公司 | Heat radiating base |
-
2012
- 2012-01-16 CN CN2012100130913A patent/CN103209569A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2775835Y (en) * | 2005-01-25 | 2006-04-26 | 珍通科技股份有限公司 | Heat pipe radiator |
| CN2909804Y (en) * | 2006-05-24 | 2007-06-06 | 林正兴 | Radiation module base |
| CN101196771A (en) * | 2006-12-07 | 2008-06-11 | 双鸿科技股份有限公司 | Heat radiating device of notebook computer and its production method |
| JP2008306010A (en) * | 2007-06-08 | 2008-12-18 | Fujitsu Ltd | Heat radiating device, and manufacturing method of heat radiating device |
| TWM357183U (en) * | 2008-12-12 | 2009-05-11 | Asia Vital Components Co Ltd | Heat-dissipation module |
| CN201393359Y (en) * | 2009-02-26 | 2010-01-27 | 富准精密工业(深圳)有限公司 | Heat radiation device and base thereof |
| CN202058722U (en) * | 2011-03-23 | 2011-11-30 | 奇鋐科技股份有限公司 | Structure of heat radiation module |
| CN102693950A (en) * | 2011-03-23 | 2012-09-26 | 奇鋐科技股份有限公司 | Radiation module structure and manufacture method thereof |
| CN202652791U (en) * | 2012-01-16 | 2013-01-02 | 奇鋐科技股份有限公司 | Heat radiating base |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110800386A (en) * | 2017-07-03 | 2020-02-14 | 三菱电机株式会社 | Heat sink |
| CN110800386B (en) * | 2017-07-03 | 2021-03-02 | 三菱电机株式会社 | Heat sink |
| CN110648985A (en) * | 2019-09-23 | 2020-01-03 | 奇鋐科技股份有限公司 | Heat transfer member reinforcing structure |
| CN110708931A (en) * | 2019-09-23 | 2020-01-17 | 奇鋐科技股份有限公司 | Heat transfer element reinforcing structure |
| US11719491B2 (en) | 2019-10-29 | 2023-08-08 | Asia Vital Components Co., Ltd. | Heat transfer member reinforcement structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103209569A (en) | Radiating base and manufacturing method thereof | |
| CN202352650U (en) | Finned water-cooling plate | |
| CN102555340B (en) | A kind of high heat dissipation membrane composite structure and manufacture method thereof | |
| CN102810521B (en) | Equalizing plate structure and manufacture method thereof | |
| CN100543973C (en) | The radiator of no base | |
| CN106152598A (en) | Semiconductor refrigeration system | |
| CN202652791U (en) | Heat radiating base | |
| US20130228312A1 (en) | Heat dissipation base and method of manufacturing same | |
| CN203177705U (en) | Bend type uniform temperature thermal conductive plate | |
| CN102555311B (en) | Interactive fin structure type high heat dissipation membrane and manufacturing method thereof | |
| CN205028894U (en) | Gear shaping formula welding heat pipe cooling ware | |
| CN202150451U (en) | Temperature-uniforming plate structure | |
| CN202603133U (en) | Air cooling heat-dissipation sectional bar special for electrical equipment | |
| CN102778156A (en) | Thin heat tube structure and manufacturing method thereof | |
| CN202601607U (en) | Heat radiator | |
| CN202524706U (en) | Heat-radiating module structure | |
| CN104661488B (en) | The manufacture method of radiating module | |
| JP5466676B2 (en) | Heat dissipation unit structure | |
| CN202073888U (en) | Fastening piece with high heat dissipation property | |
| CN102855945B (en) | Heat radiation module structure and manufacturing method thereof | |
| CN202133323U (en) | High heat-radiation diaphragm of interactive fin structure | |
| CN202071443U (en) | Composite structure of high heat dissipation film | |
| CN202354012U (en) | Assembly structure of heat conducting seat and heat pipes with raised heating surfaces | |
| CN102562747A (en) | Fastener with high heat dispersion performance and manufacture method thereof | |
| CN201995274U (en) | Radiating module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130717 |