US20130228312A1

US20130228312A1 - Heat dissipation base and method of manufacturing same

Info

Publication number: US20130228312A1
Application number: US13/409,115
Authority: US
Inventors: Chun-Ming Wu
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2012-03-01
Filing date: 2012-03-01
Publication date: 2013-09-05

Abstract

A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipation base, and more particularly to a heat dissipation base that can be manufactured at lowered cost and has largely reduced overall weight. The present invention also relates to a method of manufacturing the above-described heat dissipation base.

BACKGROUND OF THE INVENTION

The currently available electronic devices have higher and higher computing speed. As a result, electronic elements in these high-computing-speed electronic devices produce more heat during operation thereof. The produced heat must be dissipated from the electronic devices with the aid of heat dissipation elements. Some heat dissipation elements are arranged at a central area in a protective enclosure of the electronic devices, and the heat produced by the electronic elements and absorbed by the heat dissipation elements tends to accumulate in the protective enclosure without being effectively dissipated into external environment. Therefore, heat pipes are utilized as heat transfer elements to transfer the produced heat to a distant location outside the protective enclosure for dissipation.
According to the currently available techniques, the heat pipe could not be directly associated with a heat-producing electronic element. That is, the heat pipe must be stably in contact with or connected to a heat source via at least a base for transferring the heat produced by the heat source to a distant location. The base according to the prior art is mainly made of a heat conducting metal material, such as an aluminum material, a copper material and the like, and is provided with a hole or a groove. The heat pipe is fixedly received in the hole or the groove on the base by way of tight fitting, scarf joining, adhesive bonding, or welding, so that the heat produced by the heat source and absorbed by the base is further absorbed and transferred to a located location by the heat pipe.
While the metal-made base has good heat conductivity and can be mass-produced, it requires high material cost and is heavy to cause difficulty in transport.
In brief, the conventional heat dissipation base has the following disadvantages: (1) high manufacturing cost; (2) heavy in weight; and (3) inconvenient for moving.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide a heat dissipation base that has reduced overall weight.
Another object of the present invention is to provide a method for manufacturing a heat dissipation base at lowered cost.
To achieve the above and other objects, the heat dissipation base according to the present invention includes a heat conducting element and a main body. The heat conducting element has a first surface and an opposite second surface. The main body has a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is partially embedded in the first side of the main body with the second surface being flush with the recess. The main body is made of a polymeric material; and the heat conducting element and the main body are associated with each other by way of insert molding.
To achieve the above and other objects, the method of manufacturing heat dissipation base according to the present invention includes the steps of providing a heat conducting element and at least one heat pipe; forming a base main body around the heat conducting element by molding; and fixedly attaching the heat pipe to one surface of the heat conducting element.
The heat dissipation base manufactured with the method according to the present invention has the following advantages: (1) reduced overall weight; and (2) lowered manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

FIG. 1 is an exploded perspective view of a heat dissipation base according to a first embodiment of the present invention;

FIG. 2 is an assembled view of FIG. 1;

FIG. 3 is an exploded perspective view of a heat dissipation base according to a second embodiment of the present invention;

FIG. 4 is an assembled view of FIG. 3;

FIG. 5 is an assembled perspective view of a heat dissipation base according to a third embodiment of the present invention;

FIG. 6 is a sectional view of a heat dissipation base according to a fourth embodiment of the present invention;

FIG. 7 is an assembled perspective view of a heat dissipation base according to a fifth embodiment of the present invention;

FIG. 8 is a sectional view of a heat dissipation base according to a sixth embodiment of the present invention;

FIG. 9 is an exploded perspective view of a heat dissipation base according to a seventh embodiment of the present invention; and

FIG. 10 is a flowchart showing the steps included in a method of manufacturing a heat dissipation base according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of a heat dissipation base 1 according to a first embodiment of the present invention. As shown, in the first embodiment, the heat dissipation base 1 includes a heat conducting element 11 and a main body 12. The heat conducting element 11 has a first surface 111 and an opposite second surface 112. The main body 12 has a recess 121, a first side 122, and an opposite second side 123. The recess 121 is communicable with both of the first and the second side 122, 123. The heat conducting element 11 is set in the first side 122 of the main body 12 with the second surface 112 of the heat conducting element 11 being flush with the recess 121. The main body 12 is made of a polymeric material, and the heat conducting element 11 is integrally associated with the main body 12 by way of insert molding.
The heat conducting element 11 can be made of a copper material, an aluminum material, a stainless steel material, a graphite material, or any heat conducting alloy material. In the illustrated embodiment of the present invention, the heat conducting element 11 is made of a copper material but not necessarily limited thereto.
FIGS. 3 and 4 are exploded and assembled perspective views, respectively, of a heat dissipation base according to a second embodiment of the present invention. As shown, the heat dissipation base in the second embodiment is generally structurally similar to the first embodiment, except that, in the second embodiment, the recess 121 further includes an open top side 1211 and a bottom side 1212, and that at least one arm portion 13 is provided at boundaries between the second side 123 and the open top side 1211 of the recess 121 to extend over across the open top side 1211. The arm portion 13 serves to provide a radially hold-down force against a heat pipe 2 received in the recess 121, so that the heat pipe 2 and the heat conducting element 11 are more tightly associated with each other.
FIG. 5 is an assembled perspective view of a heat dissipation base according to a third embodiment of the present invention. As shown, the heat dissipation base in the third embodiment is generally structurally similar to the first embodiment, except that, in the third embodiment, the recess 121 further includes an open top side 1211, a bottom side 1212, and a fixing element 14. The fixing element 14 extends over across the open top side 1211 of the recess 121 and serves to exert a radial force against a heat pipe 2 received in the recess 121, so that the heat pipe 2 and the heat conducting element 11 are more tightly associated with each other.
Please refer to FIG. 6 that is a sectional view of a heat dissipation base according to a fourth embodiment of the present invention. As shown, the heat dissipation base in the fourth embodiment is generally structurally similar to the first embodiment, except that, in the fourth embodiment, the recess 121 further includes a heat pipe 2. The heat pipe 2 is received in the recess 121, and has at least one flat side fitly bearing on the second surface 112 of the heat conducting element 11. Further, a heat-conducting medium 3 is provided between the heat pipe 2 and the heat conducting element 11.
Please refer to FIG. 7 that is a perspective view of a heat dissipation base according to a fifth embodiment of the present invention. As shown, the heat dissipation base in the fifth embodiment is generally structurally similar to the first embodiment, except that, in the fifth embodiment, the main body 12 further has a third side 124 and an opposite fourth side 125. The third side 124 and the fourth side 125 respectively have at least one mounting member 4 connected thereto.
FIG. 8 is a sectional view of a heat dissipation base according to a sixth embodiment of the present invention. As shown, the heat dissipation base in the sixth embodiment is generally structurally similar to the first embodiment, except that, in the sixth embodiment, the heat conducting element 11 is further provided along an outer periphery thereof with a connecting section 113. The connecting section 113 can have a roughened surface, an uneven surface, a hooked surface, a corrugated surface or a toothed surface, so as to ensure stable and secured connection of the heat conducting element 11 to the main body 12.
FIG. 9 is an exploded perspective view of a heat dissipation base according to a seventh embodiment of the present invention. As shown, the heat dissipation base in the seventh embodiment is generally structurally similar to the first embodiment, except that, in the seventh embodiment, the heat conducting element 11 is provided on the second surface 112 with at least one sunken section 1123. A heat pipe 2 can be received in the sunken section 1123.
FIG. 10 is a flowchart showing steps S1, S2 and S3 included in a method according to the present invention for manufacturing a heat dissipation base. Please refer to FIG. 10 along with FIGS. 1 to 9.
In the step S1, a heat conducting element and at least one heat pipe are provided.
More specifically, a heat conducting element 11 and at least one heat pipe 2 are prepared. The heat conducting element 11 is made of a material with good heat conductivity, such as a copper material and an aluminum material; and is preferably made of a copper material.
In the step S2, a base main body is formed around the heat conducting element by molding.
More specifically, a base main body 12 is formed around the heat conducting element 11 by way of injection molding, such that the heat conducting element 11 is partially embedded in one side of the base main body 12. The base main body 12 is made of a plastic material.
In the step S3, the heat pipe is fixedly attached to one surface of the heat conducting element.
More specifically, attach one side of the heat pipe 2 to one surface of the heat conducting element 11, and fixedly connect the heat pipe 2 to the heat conducting element 11 through mechanical processing, such as tight fitting, scarf joining, adhesive bonding or welding.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims

What is claimed is:

1. A heat dissipation base, comprising:

a heat conducting element having a first surface and an opposite second surface; and

a main body having a recess, a first side, and an opposite second side; and the recess being communicable with both of the first and the second side; and

wherein the heat conducting element is set in the first side of the main body with the second surface of the heat conducting element being flush with the recess; the main body is made of a polymeric material; and the heat conducting element is integrally associated with the main body by way of insert molding.

2. The heat dissipation base as claimed in claim 1, wherein the heat conducting element is made of a material selected from the group consisting of a copper material, an aluminum material, a stainless steel material, and a graphite material.

3. The heat dissipation base as claimed in claim 1, wherein the recess further includes an open top side and a bottom side, and the main body further has at least one arm portion provided at boundaries between the second side and the open top side of the recess to extend over across the open top side.

4. The heat dissipation base as claimed in claim 1, further comprising a fixing element extending over across the recess.

5. The heat dissipation base as claimed in claim 1, further comprising a heat pipe received in the recess; and the heat pipe having at least one flat side bearing on the second surface of the heat conducting element.

6. The heat dissipation base as claimed in claim 5, wherein the heat pipe and the heat conducting element have a heat conducting medium provided between them.

7. The heat dissipation base as claimed in claim 1, wherein the main body further has a third side and an opposite fourth side; and the third and the fourth side respectively having at least one mounting member connected thereto.

8. The heat dissipation base as claimed in claim 1, wherein the heat conducting element further has a connecting section provided along an outer periphery thereof; and the connecting section having an outer surface selected from the group consisting of a roughened surface, an uneven surface, a hooked surface, a corrugated surface, and a toothed surface.

9. The heat dissipation base as claimed in claim 1, wherein the heat conducting element is provided on the second surface with at least one sunken section.

10. A method of manufacturing heat dissipation base, comprising the following steps: providing a heat conducting element and at least one heat pipe; forming a base main body around the heat conducting element by molding; and fixedly attaching the heat pipe to one surface of the heat conducting element.

11. The method of manufacturing heat dissipation base as claimed in claim 10, wherein the heat pipe is fixedly attached to the heat conducting element through mechanical processing.

12. The method of manufacturing heat dissipation base as claimed in claim 11, wherein the mechanical processing is selected from the group consisting of tight fitting, scarf joining, adhesive-bonding, and welding.

13. The method of manufacturing heat dissipation base as claimed in claim 10, wherein the base main body is formed around the heat conducting element by way of injection molding.

14. The method of manufacturing heat dissipation base as claimed in claim 10, wherein the base main body is made of a plastic material.