CN202150451U

CN202150451U - Temperature-uniforming plate structure

Info

Publication number: CN202150451U
Application number: CN201120181513U
Authority: CN
Inventors: 楊修维; 翁明泰
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-05-31
Filing date: 2011-05-31
Publication date: 2012-02-22
Anticipated expiration: 2021-05-31

Abstract

The utility model relates to a temperature-uniforming plate structure includes a temperature-uniforming plate body. The temperature-uniforming plate body includes a first plate body and a second plate body. The first plate body and the second plate body cover each other correspondingly. The temperature-uniforming plate body is provided with a cyclic area and a connection area. The cyclic area connects with connection area and a cavity is defined by the cyclic area and the connection area together. The cavity is provided with working fluid. The cyclic area is provided with a first capillary structure. The connection area is provided with a second capillary structure. Thus, the temperature-uniforming plate can be in any bending shape and the inner capillary structures are not damaged when the temperature-uniforming plate is in any bending shape.

Description

Equalizing plate structure

Technical field

The utility model is about a kind of equalizing plate structure, refers to that especially being arranged at temperature-uniforming plate with the capillary structure with flexural property desires the bending moulding place, does not destroy the equalizing plate structure of the capillary structure of inside when making the temperature-uniforming plate bending moulding.

Background technology

With existing electronic equipment gradually with frivolous as the demand of bragging about, so various elements all must be dwindled its size thereupon, the thermal change that produces but the dimension shrinks of electronic equipment is followed becomes the major obstacle of electronic equipment and system enhancement performance.The semiconductor dimensions that no matter forms electronic component is constantly dwindled, and still requires to increase performance constantly.

When semiconductor dimensions is dwindled, heat flux increases as a result, and it only is all increases of heat with the challenge of product cooling that heat flux increases cause, overheated because the increase of heat flux causes at different time and the meeting of different length size, possibly cause electronic failure or damage.

The temperature-uniforming plate that needs different size and kenel in the occasion of difference use; And along with the difference of using, then temperature-uniforming plate is also essential cooperates this pyrotoxin to do bending or other are special formed, but its inside of temperature-uniforming plate has capillary structure; When temperature-uniforming plate is imposed the external force plastotype; Then can make the inner capillary structure of temperature-uniforming plate be damaged, and then influence efficient, severe patient even the inefficacy of the circulation of internal work fluid vapour-liquid because of plastotype.

So, by on can learn known equalizing plate structure and unfavorable or can't carry out bending moulding, and if need process special formed then the need earlier with upper cover body and lower cover bending forming in advance, the knot capillary structure that reburns, its manufacturing process is real to be numerous and diverse and cost is higher; So known technology has disadvantage:

1. finished product can't bend moulding;

2. cost is higher;

3. processing procedure is comparatively numerous and diverse.

The utility model content

The main purpose of the utility model is providing a kind of equalizing plate structure that imposes the bending moulding.

For reaching above-mentioned purpose, the utility model system proposes a kind of equalizing plate structure, and be to comprise: a body, said body have one first plate body and one second plate body, and correspondence covers this body of composition.

Said body has one first plate body and one second plate body; And correspondence covers this body of composition; This body has a race way and a bonding pad, and this race way connects this bonding pad and defines a chamber jointly, and has working fluid in this chamber; This race way has one first capillary structure, and said bonding pad has one second capillary structure.

The structure system that sees through the utility model can improve the shortcoming that can't impose bending and moulding after the known temperature-uniforming plate moulding, and the elasticity that promotes the temperature-uniforming plate moulding.

Description of drawings

Fig. 1 system is the three-dimensional exploded view of equalizing plate structure first embodiment of the utility model;

Fig. 2 system is the three-dimensional combination figure of equalizing plate structure first embodiment of the utility model;

Fig. 3 system is the A-A cutaway view of equalizing plate structure first embodiment of the utility model;

Fig. 4 system is the enforcement aspect sketch map of equalizing plate structure first embodiment of the utility model;

Fig. 5 system is the three-dimensional exploded view of equalizing plate structure second embodiment of the utility model;

Fig. 6 system is the three-dimensional combination figure of equalizing plate structure second embodiment of the utility model;

Fig. 7 system is the enforcement sketch map of equalizing plate structure second embodiment of the utility model;

Fig. 8 a system is the supporting bracket stereogram of the utility model;

Fig. 8 b system is the supporting bracket stereogram of the utility model;

Fig. 8 c system is the supporting bracket stereogram of the utility model;

Fig. 9 system is the application sketch map of the utility model equalizing plate structure;

Figure 10 system is the application sketch map of the utility model equalizing plate structure.

The main element symbol description

Temperature-uniforming plate 1

Body 11

First plate body 111

Second plate body 112

Race way 113

First circulation portions 1131

Second circulation portions 1132

The 3rd circulation portions 1133

First angle 1134

Second angle 1135

Bonding pad 114

First connecting portion 1141

Second connecting portion 1142

Chamber 115

First capillary structure 116

Sintered powder 1161

Support cylinder 1162

Second capillary structure 117

Supporting bracket 1171

Support cylinder 1172

Radiating part 118

Heat-sink unit 2

Working fluid 3

Embodiment

Characteristic on above-mentioned purpose of the utility model and structure thereof and the function will be explained according to appended graphic preferred embodiment.

Seeing also Fig. 1, Fig. 2, Fig. 3, Fig. 4, is to be three-dimensional decomposition and constitutional diagram and the A-A section and enforcement aspect sketch map of equalizing plate structure first embodiment of the utility model, and as shown in the figure, said temperature-uniforming plate 1 structure is to comprise: a body 11;

Said body 11 has one first plate body 111 and one second plate body 112, and correspondence covers this body 11 of composition.

This body 11 has a race way 113 and a bonding pad 114; This race way 113 connects this bonding pad 114 and defines a chamber 115 jointly; And have working fluid 3 in this chamber 115, and this race way 113 has one first capillary structure 116, and said bonding pad 114 has one second capillary structure 117.

Said first capillary structure 116 is by a sintered powder and a plurality of support cylinder is formed and binding each other, and said support column system is that powder sintered post and copper post are wherein arbitrary.

See also Fig. 5, Fig. 6, Fig. 7, Fig. 8 a, Fig. 8 b, Fig. 8 c; System is three-dimensional decomposition and constitutional diagram and the supporting bracket stereogram of equalizing plate structure second embodiment of the utility model; As shown in the figure; Present embodiment system is identical with the aforementioned first embodiment part-structure; So then repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that this bonding pad 114 has more one first connecting portion 1141 and one second connecting portion 1142 for said race way 113 has more one first circulation portions 1131 and one second circulation portions 1132 and one the 3rd circulation portions 1133; Said first connecting portion 1141 is located at this first and second circulation portions 1131, between 1132, this second connecting portion 1142 is located at this second and third circulation portions 1132, between 1133.

Said first, second and

third circulation portions

1131,1132,1133 is provided with aforementioned first capillary structure 116, and said first and second connecting

portion

1141,1142 is provided with aforementioned second capillary structure 117.

Said first capillary structure 116 is to be made up of and binding each other a sintered

powder

1161 and 1162 of a plurality of support cylinders, said support cylinder 1162 be for powder sintered post and copper post wherein arbitrary.

Said second capillary structure 117 is to combine support cylinders 1172 wherein arbitrary for supporting bracket 1171 and supporting bracket 1171.

Supporting bracket 1171 is that to have the sheet material (shown in Fig. 8 b) and a wave plate body (shown in Fig. 8 c) of concavo-convex body wherein arbitrary for grid body (shown in Fig. 8 a) and surface.

1131,1132 of said first and second circulation portions have one

first angle

1134, and 1131,1132 of said second and third circulation portions have one second angle 1135, and said first and

second angle

1134,1135 is spent less than 90 greater than 0 degree.

See also Fig. 9, Figure 10; System is for the application sketch map of the utility model equalizing plate structure, and as shown in the figure, said body 11 has more a radiating part 118; This radiating part 118 butt joints one heat-sink unit 2; Said heat-sink unit 2 is wherein arbitrary for radiator and radiating fin group, and present embodiment system as explanation, but is not limited in this kind material with the radiating fin group.

Claims

1. an equalizing plate structure is characterized in that, comprising:

One body; Have one first plate body and one second plate body, and correspondence covers and form this body, this body has a race way and a bonding pad; This race way connects this bonding pad and defines a chamber jointly; And have working fluid in this chamber, and this race way has one first capillary structure, and said bonding pad has one second capillary structure.

2. equalizing plate structure as claimed in claim 1; It is characterized in that; Said race way has more one first circulation portions and one second circulation portions and one the 3rd circulation portions; This bonding pad has more one first connecting portion and one second connecting portion, and said first connecting portion is located between this first and second circulation portions, and this second connecting portion is located between this second and third circulation portions; Said first, second and third circulation portions is provided with aforementioned first capillary structure; Said first and second connecting portion is provided with aforementioned second capillary structure, and said first capillary structure is by a sintered powder and a plurality of support cylinder is formed and binding each other, and said support column system is that powder sintered post and copper post are wherein arbitrary.

3. equalizing plate structure as claimed in claim 1 is characterized in that, said first capillary structure is to be formed and linked each other by a sintered powder and a plurality of support cylinder, and said support column system is that powder sintered post and copper post are wherein arbitrary.

4. equalizing plate structure as claimed in claim 2 is characterized in that, has one first angle between said first and second circulation portions, has one second angle between said second and third circulation portions, and said first and second angle is spent less than 90 greater than 0 degree.

5. equalizing plate structure as claimed in claim 1 is characterized in that, also has a radiating part, and this radiating part docks a heat-sink unit.

6. equalizing plate structure as claimed in claim 5 is characterized in that, said heat-sink unit is to be that radiator and radiating fin group are wherein arbitrary.

7. equalizing plate structure as claimed in claim 1 is characterized in that, said second capillary structure is to be that supporting bracket and supporting bracket combine support cylinder wherein arbitrary.

8. equalizing plate structure as claimed in claim 7 is characterized in that, said supporting bracket system is wherein arbitrary for sheet material and wave plate body that grid body and surface have concavo-convex body.

9. equalizing plate structure as claimed in claim 7 is characterized in that, said support column system is powder sintered post.