CN102693950A

CN102693950A - Radiation module structure and manufacture method thereof

Info

Publication number: CN102693950A
Application number: CN2011100913158A
Authority: CN
Inventors: 巫俊铭
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-03-23
Filing date: 2011-04-12
Publication date: 2012-09-26

Abstract

The invention relates to a radiation module structure and a manufacture method thereof. The radiation module structure comprises a plastic layer and at least one heat pipe, wherein the plastic player is provided with at least one groove and a lock part, the groove is internally provided with the heat pipe, the radiation module is assembled with an object to be radiated through the lock part, and the heat pipe is used for conducting the heat of the object to be radiated. Due to the plastic layer, the entire weight of the radiation module can be greatly reduced, and the manufacture material cost can be lowered.

Description

Heat radiation modular structure and manufacturing approach thereof

Technical field

The present invention refers to a kind of heat radiation modular structure and manufacturing approach thereof that reduces heat radiation module overall weight and reduce the manufactured materials cost especially relevant for a kind of heat radiation module.

Background technology

Because the progress in science and technology epoch; The operational effectiveness of electronic building brick is increasingly high; To such an extent as to the functional requirement to heat-sink unit also increases thereupon; Known heat-sink unit all significantly adopts the radiating fin group of stacking-type in order to increase heat radiation function, and constantly research and development improvement on radiating fin; Therefore dynamical heat-sink unit has been one of most important research and development emphasis of industrial circle today; Be provided with heat-sink unit and see through said heat-sink unit again or in said electronic building brick top said electronic building brick is dispelled the heat, said heat-sink unit is generally radiator or radiating fin correspondence and mixes a radiator fan and carry out heat radiation work, further sees through heat pipe and is connected in series said heat-sink unit and thermal source is guided at a distance dispels the heat.

With the main frame is example; The heat that its central interior processing unit (CPU) is produced accounts for major part; In addition, CPU when heat gradually rising can cause and carry out usefulness and reduce, and when accumulation of heat is higher than its allowable limit; Will force computer down, severe patient more may cause the damage phenomenon; And, for solving the problem of electromagenetic wave radiation, normally seal said main frame, so that how the heat energy of CPU and other heating spare part (or claiming assembly) is derived fast with the cabinet housing, become an important topic.

And its heat radiation module of general old technology mainly has a conductive sole plate and at least one heat pipe; Said conductive sole plate is integrally formed and be formed with plural fixing hole in side with metal material; And said conductive sole plate can be fixed said heat pipe and can its module that dispels the heat be fixed on the object of waiting to dispel the heat; To be attached at the object and carry out heat conduction of waiting to dispel the heat via said heat pipe; Be attached at said wait to dispel the heat object and heat conduction to heat pipe again or by said conductive sole plate, in order to do utilizing the heat radiation module to reach the effect of heat radiation.

Yet; Because electronic installation requires frivolous day by day in order to carrying now; Therefore under the narrow and small day by day situation of electronic installation volume, the heat-sink unit that is used for the electronic component heat radiation also needs frivolous and lightweight with it, but it is heavier via the integrally formed weight that radiating bottom plate formed of metal material; And in its manufacture process, use the spent material cost of metal material high, so known technology has disadvantage:

1. the Heavy Weight that is shaped of metal material;

2. the material cost that expends is high.

Therefore, how to solve above-mentioned problem of commonly using and disappearance, the inventor who is this case desires most ardently the direction place person that research improves with the relevant manufacturer that is engaged in the industry.

Summary of the invention

Main purpose of the present invention is providing a kind of heat radiation modular structure and manufacturing approach thereof that reduces heat radiation module overall weight.

Another object of the present invention is providing a kind of heat radiation modular structure and manufacturing approach thereof that reduces the manufactured materials cost.

For reaching above-mentioned purpose; The present invention proposes a kind of heat radiation modular structure, comprises: a plastic layer and at least one heat pipe, and side of said plastic layer has at least one groove and has at least one locking part in dual-side; Said groove then is formed with a closed side and an open sides; And be provided with said heat pipe in the said groove, said heat pipe two ends have a heat absorbing end and a radiating end respectively, and said heat absorbing end has a contact-making surface and an embedding face; The said embedding face system said closed side of corresponding combination, and the corresponding said open sides of said contact-making surface.

For achieving the above object, the present invention also proposes a kind of heat radiation module making method, comprises the following step: at least one heat pipe at first is provided; And on said heat pipe, be formed with a plastic layer; Sing the contact-making surface of open sides so that said plastic layer is coated in the heat absorbing end of heat pipe and is formed with one, and be formed with at least one locking part in dual-side corresponding to heat absorbing end.

Therefore above-mentioned heat radiation modular structure and heat radiation module making method make said heat radiation module be mounted on desire heat radiation object smoothly through the locking part, and reach the effect person that can reduce heat radiation module overall weight and reduce the manufactured materials cost by forming of its plastic layer; So the present invention has advantage:

1. effectively reach the overall weight lightweight;

2. reduce the manufactured materials cost.

Description of drawings

Fig. 1 is the stereogram of preferred embodiment of the present invention;

Fig. 2 is the cutaway view of preferred embodiment of the present invention;

Fig. 3 is the flow chart of preferred embodiment of the present invention;

Fig. 4 is the stereogram of another preferred embodiment of the present invention;

Fig. 5 is the cutaway view of another preferred embodiment of the present invention;

Fig. 6 is the flow chart of another preferred embodiment of the present invention;

Fig. 7 is the present invention's stereogram of a preferred embodiment again;

Fig. 8 is the present invention's cutaway view one of a preferred embodiment again;

Fig. 9 is the present invention's cutaway view two of a preferred embodiment again;

Figure 10 is the cutaway view of the another preferred embodiment of the present invention.

Figure 11 is the cutaway view of the another preferred embodiment of the present invention.

[primary clustering symbol description]

Heat radiation module 10

Plastic layer 20

Groove 21

Closed side 211

Open sides 212

Bottom surface 22

Locking part 23

Heat pipe 30

Heat absorbing end 31

Contact-making surface 311

Embedding face 312

Metal level 40

Locking part 41

Embodiment

Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be explained according to appended graphic preferred embodiment.

See also Fig. 1, Fig. 2 and shown in Figure 3; Be the present invention the dispel the heat stereogram, cutaway view of modular structure and the method flow diagram of heat radiation module making method; In a preferred embodiment of the present invention; Said heat radiation module 10 structures comprise: plastic layer 20 and at least one

heat pipe

30, and 20 1 sides of said plastic layer have at least one groove 21 and a bottom surface 22, and are formed with plural locking part 23 in dual-side; Said groove 21 has a closed side 211 and an open sides 212; And said heat pipe 30 is to see through said open sides 212 to be provided with and to be attached at said closed side 211, and said heat pipe 30 two ends have a heat absorbing end 31 and a radiating end (not shown) respectively, and said heat absorbing end 31 bottoms have a contact-making surface 311 and the top has an embedding face 312; Said embedding face 312 is the corresponding said closed side 211 that combines; And said contact-making surface 311 is corresponding said open sides 212, is the plane in contact-making surface described in the present embodiment 311, and said contact-making surface 311 is arranged at said open sides 212 and extends said bottom surface 22;

Said heat radiation module 10 is mounted on treats heat-dissipating thing and when dispelling the heat; Be to be attached at the said heat-dissipating thing of treating with the contact-making surface 311 of heat pipe 30 in heat absorbing end 31 positions; Then its heat radiation module 10 is locked in via locked assembly collocation spring (not shown) by the locking part 23 of dual-side and treats on the heat-dissipating thing; And then reach the heat energy of being treated heat-dissipating thing by heat pipe 30 conduction, and the while can reduce heat radiation module 10 overall weight and the effect that can reduce the manufactured materials cost.

As stated, the dispel the heat manufacturing approach system of module 10 of the present invention comprises the following step:

Step SP11: at least one heat pipe is provided;

Step SP12: on said heat pipe, be formed with a plastic layer;

Step SP13: make said plastic layer be coated in the heat absorbing end of heat pipe and be formed with the contact-making surface of an open sides corresponding to heat absorbing end.

Step as stated; At first be provided with at least one heat pipe 30; Said heat pipe 30 two ends have said heat absorbing end 31 and radiating end respectively; Said heat absorbing end 31 has said contact-making surface 311 and embedding face 312, and on said heat absorbing end 31, is formed with said plastic layer 20 with plastics injection molding mode, and makes plastic layer 20 correspond to heat absorbing end 31 positions to be formed with said groove 21 and locking part 23; And said groove 21 is formed with said closed side 211 and open sides 212 and bottom surface 22; Said closed side 211 is corresponding said embedding face 312, and said open sides 212 corresponding contact-making surfaces 311 and extend each other with said bottom surface 22 are connected, and said locking part 23 is locked in said heat radiation module and treats on the heat-dissipating thing via the locked assembly spring (not shown) of arranging in pairs or groups again; Treat the heat energy of heat-dissipating thing to reach, and can reach the effect that reduces heat radiation module 10 overall weight and can reduce the manufactured materials cost via heat pipe 30 conduction.

See also Fig. 4, Fig. 5 and shown in Figure 6 again; Be another preferred embodiment of the present invention; Said its overall structure and assembly linking relationship are roughly identical with last embodiment; In this something in common that repeats no more, to compare last embodiment in the present embodiment and do not exist together for said heat radiation module 10 has more a metal level 50, said metal level 50 is embedded in the said plastic layer 20; And said metal level 50 is arranged at contact-making surface 311 positions and the corresponding open sides 212 of heat absorbing end 31, and said metal level 50 1 sides extend the bottom surface 22 of said plastic layer 20 simultaneously;

And then said heat radiation module 10 is mounted on treat heat-dissipating thing and is to be attached at the said heat-dissipating thing of treating when dispelling the heat with metal level 50; Treat that to absorb the heat energy of heat-dissipating thing is conducting to heat pipe 30 via metal level 50; And its heat radiation module 10 is locked in by the locking part 23 of both sides to be treated on the heat-dissipating thing; And then reach the heat energy of being treated heat-dissipating thing by heat pipe 30 conduction, and the while can reduce heat radiation module 10 overall weight and the effect that can reduce the manufactured materials cost.

As stated, the dispel the heat manufacturing approach of module 10 of the present invention comprises following another step:

Step SP21: at least one heat pipe and a metal level are provided;

Step SP22: on said heat pipe and metal level, be formed with a plastic layer;

Step SP23: make said plastic layer be coated in the heat absorbing end and the metal level of heat pipe and be formed with contact-making surface and the metal level of an open sides corresponding to heat absorbing end.

Step as stated; At first be provided with at least one heat pipe 30 and a metal level 40; Said heat pipe 30 two ends have said heat absorbing end 31 and radiating end respectively; And on said heat absorbing end 31 and metal level 40, be formed with said plastic layer 20, and make plastic layer 20 correspond to heat absorbing end 31 positions to have said groove 21 and locking part 23, and said groove 21 is formed with said closed side 211 and open sides 212 and bottom surface 22 with the plastics injection molding; Said closed side 211 corresponding said embedding faces 312; And said open sides 212 corresponding contact-making surfaces 311 and metal level 40 1 sides, and said metal level 40 opposite sides extend the bottom surface 22 of said plastic layer 20 simultaneously, treat on the heat-dissipating thing so that said locking part 23 is locked in; And treat the heat energy of heat-dissipating thing by heat pipe 30 conduction, and can reach the effect that reduces heat radiation module 10 overall weight and can reduce the manufactured materials cost.

See also Fig. 7, Fig. 8 and shown in Figure 9 again; Be a preferred embodiment more of the present invention; Said its overall structure and assembly linking relationship are roughly identical with last embodiment; Repeat no more at this; Comparing last embodiment does not in the present embodiment exist together for forming the locking part 23 (seeing also shown in Figure 5) that at least one locking part 41 alternative previous embodiment is formed by plastic layer 20 via said metal level 40; Said locking part 41 exposes to said plastic layer 20, and said metal level 40 is contact-making surface 311 positions and the corresponding open sides 212 that is arranged at heat absorbing end 31, and said metal level 40 1 sides extend the bottom surface 22 of said plastic layer 20 simultaneously; And said locking part 41 is locked in said heat radiation module 10 via locked assembly collocation spring (not shown) and treats on the heat-dissipating thing; And then said heat radiation module 10 is mounted on treat heat-dissipating thing and is to be attached at the said heat-dissipating thing of treating with metal level 40 when dispelling the heat, treat the heat energy of heat-dissipating thing with reaching, and can reduce heat radiation module 10 overall weight and the effect that can reduce the manufactured materials cost simultaneously by heat pipe 30 conduction; And for example shown in the 9th figure; Said locking part 41 can be has the shell fragment pattern moulding that angle is extended; So that said locking part 41 with respect to plastic layer 20 producing the effect of bullet once behind the pressure pressing, and then reach heat radiation module 10 and be assembled in and can reduce the cost that needs with the elastic parts assembling when treating heat-dissipating thing.

See also again shown in the 10th figure and the 11st figure; Be another preferred embodiment of the present invention; Said its overall structure and assembly linking relationship are roughly identical with another embodiment, repeat no more at this, compare another embodiment in the present embodiment and do not exist together and be arranged at 30 of plastic layer 20 and heat pipes for said metal level 40; And the embedding face 312 of its heat pipe 30 in heat absorbing end 31 positions is and the said closed side 211 of metal level 40 corresponding combinations; And said contact-making surface 311 corresponding said open sides 212 and extend each other by 40 one-tenth one horizontal planes of said contact-making surface 311 and said metal level and with said bottom surface 22 and to be connected, and can reach equally to be locked in via said locking part 23 to treat on the heat-dissipating thing; And treat the heat energy of heat-dissipating thing by heat pipe 30 conduction, and reach the effect that reduces heat radiation module 10 overall weight and can reduce the manufactured materials cost.

The above; Be merely a best specific embodiment of the present invention, but characteristic of the present invention is not limited thereto, anyly is familiar with said art in field of the present invention; Can think easily and variation or modification, all should be encompassed in the following claim of the present invention.

Claims

One kind the heat radiation modular structure, it is characterized in that said heat radiation modular structure comprises:

A plastic layer, said plastic layer is formed with at least one groove, and said groove has a closed side and an open sides; And

At least one heat pipe has a heat absorbing end and a radiating end, and said heat absorbing end has one and connects

Touch face and an embedding face, corresponding said closed side, the corresponding said open sides of said contact-making surface of combining of said embedding face.
2. heat radiation modular structure as claimed in claim 1 is characterized in that, said plastic layer more is formed with a bottom surface.
3. heat radiation modular structure as claimed in claim 1 is characterized in that, also has a metal level, and said metal level is embedded in the plastic layer.
4. heat radiation modular structure as claimed in claim 3 is characterized in that said metal level is arranged between plastic layer and heat pipe.
5. heat radiation modular structure as claimed in claim 3 is characterized in that, said plastic layer is arranged at heat pipe one side, and said metal series of strata are arranged at the heat pipe opposite side.
6. heat radiation modular structure as claimed in claim 1 is characterized in that said plastic layer also is formed with at least one locking part.
7. heat radiation modular structure as claimed in claim 3 is characterized in that said metal level has at least one locking part, and said locking part exposes to said plastic layer.
8. heat radiation modular structure as claimed in claim 1 is characterized in that, plastic layer is a plastics one injection molding.
9. the manufacturing approach of the module that dispels the heat is characterized in that, comprises the following step:

At least one heat pipe is provided;

On said heat pipe, be formed with a plastic layer;

Make said plastic layer be coated in the heat absorbing end of heat pipe and be formed with the contact-making surface of an open sides corresponding to heat absorbing end.
10. heat radiation module making method as claimed in claim 9 is characterized in that, when said plastic layer is shaped, is formed with at least one locking part in side.
11. heat radiation module making method as claimed in claim 9 is characterized in that, when said plastic layer was shaped, one side place more was formed with a bottom surface in heat pipe.
12. heat radiation module making method as claimed in claim 9 is characterized in that, when said plastic layer is shaped, more provides a metal level and is arranged at heat pipe one side.
13. heat radiation module making method as claimed in claim 12 is characterized in that said metal level is arranged between plastic layer and heat pipe.
14. heat radiation module making method as claimed in claim 12 is characterized in that, said metal series of strata are with respect to said basal surface position place.
15. heat radiation module making method as claimed in claim 12 is characterized in that, said metal series of strata expose to said plastic layer and have at least one locking part.
16. heat radiation module making method as claimed in claim 9 is characterized in that, plastic layer is a plastics one injection molding.