US20110168359A1

US20110168359A1 - Heat-dissipating plate

Info

Publication number: US20110168359A1
Application number: US12/830,587
Authority: US
Inventors: Chun-Hung Lin; Chang-Yin Chen
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Development Corp
Priority date: 2010-01-08
Filing date: 2010-07-06
Publication date: 2011-07-14
Also published as: TWM382478U

Abstract

A heat-dissipating plate includes a casing and partition insert. The casing has surrounding walls with wick structures therein, and the inner surface of the walls defines a receiving compartment. The partition is disposed in the receiving compartment. The partition has a plurality of hole, a plurality of flanges protruding from an edge of the holes respectively. Each of flanges has a plurality of arc-shaped flange-rim extending outward to support the inner surface of the surrounding wall.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat-dissipating plate, and more particularly to a novel heat-dissipating device including flattened tube coupled to a plate structure having stamped holes to achieve good thermal conductivity.
2. Description of Related Arts
A Flat heat pipe is usually made of copper sheet and configured into closed hollow casing, in which the hollow portion is vacuum and filled with working fluids. A wick structure is formed on an inner wall of the casing. However, during the vacuuming process, it is difficult to control the plane surface of the heat pipe. Thus, a supporting structure is usually inserted into the hollow casing to maintain the plane surface of the heat pipe. Some conventional supporting structure uses a copper net having a wavy-shaped supporting surface formed thereon to support the upper and the bottom walls of the hollow casing. Other conventional supporting structures employ a plurality of supporting columns fixed therein.
However, the copper net requires treatments to form a plurality of wavy supporting structure thereon to be used as a supporting structure. Thus, the required manufacturing process becomes more complex. On the other had, if supporting columns are used as the supporting structure, a soldering process is required to couple the columns to an upper and a lower wall of the heat pipe. The coupling process is also inconvenient and incurs high production costs.
Because of the technical limitations described above, the applicant strives via experience and academic research to develop the instant disclosure, which can effectively improve the limitations described above.

SUMMARY OF THE INVENTION

The main object of the present invention is to provide a heat-dissipating plate, which includes a partition being punched, and a flattened casing received the partition therein.
Another object of the present invention is to provide the partition which is punched to form a plurality of arc-shaped flanges. The flanges are expanded outward to support an inner wall of the casing for a well thermal-conductivity.
One more object of the present invention is to provide the partition having the flanges, which is arc-shaped and expanded outward, so that it will not damage the casing.
A further object of the present invention is to provide the partition having the arc-shaped and outward-expanding flanges, which assembled with a plurality of conductive-columns to prop the inner wall of the casing, thus achieving well thermal-conductivity.
Through the above-mentioned assembly, the present invention can alter the specification pattern to achieve the purpose of being suitable for various mounting holes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of first embodiment according to the present invention;

FIG. 2 is a partial perspective view of a partition of the first embodiment according to the present invention;

FIG. 3 is a side view of the partition of the first embodiment according to the present invention;

FIG. 4 is a cross-sectional view of the first embodiment before flattened according to the present invention;

FIG. 5 is a cross-sectional view of the first embodiment after flattened according to the present invention;

FIG. 6 is an exploded perspective view of second embodiment according to the present invention;

FIG. 7 is a partial perspective view of a partition and conductive-columns of the second embodiment according to the present invention;

FIG. 8 is a side view of the partition and the conductive-columns of the second embodiment according to the present invention;

FIG. 9 is a cross-sectional view of the second embodiment before flattened according to the present invention; and

FIG. 10 is a cross-sectional view of the second embodiment after flattened according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The features and technology of the present invention can be further understood by reference to the following detailed description when taken in conjunction with the accompanying drawings, and the accompanying drawings are provided only for reference and illustration and not for limiting the present invention.
FIG. 1 shows a first embodiment according to the instant disclosure. The instant disclosure is a heat-dissipating plate 1 including a casing 11 and a partition 12.
The casing 11 has surrounding walls 111. The walls 111 are formed with a wick structure 111 a therein. The inner surface of the walls 111 defines a receiving compartment 112. A working fluid, such as water . . . etc., is filled in the receiving compartment 112.
The partition 12 is a plate-like insert layer disposed in the receiving compartment 112, and is formed with a plurality of holes 121 on the surface. The holes 121 are densely distributed on the surface of the partition 12, forming a net-like structure. The partition 12 is made of metals of good conductivity, such as copper.
Please refer to FIGS. 2 and 3. The partition 12 has a plurality of flange 122 protruding from the edge of the holes 121. A preferable way to form the flanges 122 is by punching the partition 12. The flanges 122 could protrude toward either side of the partition. Each of the flanges 122 has flange-rims 122 a expanded outward from an outer rim thereof. The flange-rims 122 a are arc-shaped and pressed against the surrounding walls 111 of the casing upon installation. In the instant embodiment shown in FIGS. 2 and 3, the flanges 122 are protruded from the whole edge of the holes 121, and is substantially divided into four pieces. However, the flanges could protrude from partial edge of the holes 121. In other words, the flanges also could protrude from the edge of the holes 121 in two or more opposite pieces.
When the heat-dissipating plate 1 is attached to a heat-producing element (not shown), the inner wall 111 at a bottom (one lateral side) can quickly transfer the heat to the flanges 122 on one side of the partition. The heat is then transferred to each of the flange-rims 122 a, and finally to the surrounding walls 111 of the casing 11, achieving good heat-dissipating efficiency. Further, the holes 121 would provide passage for the working fluid, such as water vapor. Thus, the structure of the present disclosure is concise, the manufacturing process is simple, and the production coast is reduced.
Please refer to FIG. 4. The casing 11 could be a flattened elliptic tube. The partition 12 can be disposed directly in the receiving compartment 112 of the flattened elliptic tube. The elliptic tube is then flattened, vacuumed, filled with working fluid, and finally sealed to complete the heat-dissipating plate structure. As shown in FIG. 5, the elliptic tube is processed into a flat-shaped casing enclosing the partition. Because the protruding flanges 122 have rounded arc-shaped flange-rims 122 a, the inner walls of the casing 11 will not be damaged when pressed against the partition 12.
Please refer to FIG. 6, a second embodiment according to the present invention is shown. The instant disclosure includes a casing 11, a partition 12 and a plurality of conductive-columns 13 disposed against the inner wall of the flanges 122.
The casing 11 has surrounding walls 111. The walls are formed with a wick structure 111 a on an inner surface thereof. The inner surface of the walls 111 defines a receiving compartment 112.
As shown in FIGS. 7 and 8, the partition 12 is a plate-like insert layer disposed in the receiving compartment 112 identical to the first embodiment. The partition 12 has a plurality of flanges 122 protruding from the edge of the holes 121. A preferable way to form the flanges 122 is by punching the partition 12. The flanges 122 could protrude toward either side of the partition 12. The flanges 122 has flange-rims 122 a expanded outward from an outer rim thereof. The flange-rims 122 a are arc-shaped.
The conductive-columns 13 have wick structures around its periphery thereon, and are disposed respectively into the holes 121. Each of the conductive-columns 13 has a top and bottom end to prop the walls 111 of the casing 11. Because the flange-rims 122 a are arc-shaped and expanded outward, the conductive-columns 13 can be conveniently disposed in the holes 121. Further, the conductive-columns 13 could be disposed in all or part of the holes 121. The quantity of the conductive-columns 13 is not limited.
Therefore, after the heat-dissipating plate 1 is coupled to a heat-producing element (not shown), the outer surface of the wall 111 on one side of the casing 11 will quickly conduct the generated heat through each of the conductive columns 13 to the other side of the casing, achieving effective heat dissipation.
When the columns 13 are disposed only in a portion of the partition holes 121, the holes 121 without the conductive-columns 13 will serve as passageways for the vapor of the working fluid generated from the heat exchange process. Thus, the structure of this instant disclosure is simple yet effective, and the manufacturing cost is reduced.
Another embodiment of manufacturing process, as shown in FIG. 9. The casing 11 could be flattened elliptic tube. The partition 12, which have conductive-columns 13 therein, could be directly disposed in the receiving compartment 112 of the elliptic tube. The elliptic tube is then flattened, vacuumed, filled with working fluid, and finally sealed to complete the heat plate structure. As shown FIG. 10, the elliptic tube 11 is processed into a flat-shaped casing enclosing the partition. The protruding conductive-columns 13 have rounded edges to prevent damaging the inner walls of the casing 11 when pressed against the partition 12.
The efficacy and the characteristics of the present invention are:
1. The instant disclosure provides a heat-dissipating plate, a new kind of flat heat pipe, which is inserted with the partition to support the casing. It is easily to control the horizontal level of the surfaces of the heat-dissipating plate. Thus, the heat-dissipating plate can be mounted with a heat-producing element well.
2. The partition is a good supporter for the casing of heat-dissipating plate, and can strengthen the heat-dissipating plate.
3. The manufacturing process of the heat-dissipating plate is easier. It can be easily started from a flattened elliptic tube as the casing, and insert the partition into the casing. Then, to proceed to other processes for achieving the heat-dissipating plate, such as flattening, vacuuming, infusing working fluid, and sealing openings . . . etc.
While the present invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the present invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.

Claims

1. A heat-dissipating plate, comprising:

a casing having surrounding walls,

wherein the walls are formed with wick structure therein,

wherein the inner surface of the walls defines a receiving compartment; and

a partition being disposed in the receiving compartment, wherein the partition has a plurality of holes and a plurality of flanges protruding from an edge of the holes respectively, wherein each of the flanges has at least one arc-shaped flange-rim expanded outward therefrom to prop the inner surface of the surrounding wall of the casing.

2. The heat-dissipating plate of claim 1, wherein the casing is flattened-shaped.

3. The heat-dissipating plate of claim 1, wherein the partition is a copper plate having a net-structure on the surface.

4. The heat-dissipating plate of claim 1, wherein the flanges are formed by a punching method to the partition.

5. The heat-dissipating plate of claim 1, wherein the flanges protrude toward either side of the partition surface.

6. A heat-dissipating plate, comprising:

a casing having surrounding walls,

wherein the walls are formed with wick structure therein,

wherein the inner surface of the walls defines a receiving compartment;

a partition being disposed in the receiving compartment, wherein the partition has a plurality of holes and a plurality of flanges protruding from an edge of the holes respectively, wherein each of the flanges has at least one arc-shaped flange-rim expanding outward therefrom; and

a plurality of conductive-columns assembled in the holes, wherein each conductive column has a top and a bottom end to respectively prop the walls of the casing.

7. The heat-dissipating plate of claim 6, wherein the casing is flattened-shaped.

8. The heat-dissipating plate of claim 6, wherein the partition is a copper plate having a net-structure.

9. The heat-dissipating plate of claim 6, wherein the flanges are formed by a punching method on the partition.

10. The heat-dissipating plate of claim 6, wherein the flanges protrude toward either side of the partition surface.

11. The heat-dissipating plate of claim 6, wherein the conductive-columns are formed with wick structure.