US20100132922A1 - Vapor chamber and cooling device having the same - Google Patents
Vapor chamber and cooling device having the same Download PDFInfo
- Publication number
- US20100132922A1 US20100132922A1 US12/325,533 US32553308A US2010132922A1 US 20100132922 A1 US20100132922 A1 US 20100132922A1 US 32553308 A US32553308 A US 32553308A US 2010132922 A1 US2010132922 A1 US 2010132922A1
- Authority
- US
- United States
- Prior art keywords
- vapor chamber
- heat
- shell
- chamber
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/006—Tubular elements; Assemblies of tubular elements with variable shape, e.g. with modified tube ends, with different geometrical features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/06—Tubular elements of cross-section which is non-circular crimped or corrugated in cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
Definitions
- the present invention in general relates to a vapor chamber, and in particular, to a vapor chamber having non-planar surfaces and a cooling device having the vapor chamber.
- Vapor chambers and heat pipes are elements that apply phase change of the working fluid to reach a fast heat transfer.
- a vapor chamber can achieve a heat transfer via surface contact.
- this prior vapor chamber has a shell 11 a , a capillary tissue 12 a and a working fluid 13 a .
- a hollow chamber 103 a is formed in the shell 11 a .
- the capillary tissue 12 a is arranged in the hollow chamber 103 a .
- the working fluid 13 a is injected into and filled in the hollow chamber 103 a .
- the vapor chamber 10 a has a heat-absorbing section 101 a and a heat-releasing section 102 a , in which the heat-absorbing section 101 a is formed at a partial area of the vapor chamber 10 a , while the heat-releasing section 102 a is formed at another partial area of the vapor chamber 10 a .
- the surfaces of the heat-absorbing section 101 a and the heat-releasing section 102 a are respectively shown as a plane shape.
- the invention is mainly to provide a vapor chamber which has a stronger structural strength and superior anti-deforming ability by designing a non-planar shape for each two corresponding surfaces of the shell at the heat-releasing section, such that the using life of the vapor chamber is prolonged.
- the invention is to provide a vapor chamber which has a stronger structural strength and superior anti-deforming ability by designing a first surface and a second surface respectively as a non-planar surface, such that the using life of the vapor chamber is prolonged.
- a vapor chamber provided by the invention includes a shell, a capillary tissue, a working fluid, a heat-absorbing section and a heat-releasing section.
- a hollow chamber is formed in the shell.
- the capillary tissue is arranged and accommodated in the hollow chamber.
- the working fluid is injected into and filled in the hollow chamber.
- the heat-absorbing section is formed at a partial area of the vapor chamber, while the heat-releasing section is formed at another partial area of the vapor chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively shown as a non-planar shape.
- a vapor chamber provided by the invention includes a shell, a capillary tissue and a working fluid.
- a hollow chamber is formed in the shell, an external part of which includes a flat section and an extension section connected the flat section.
- the extension section has a first surface and a second surface formed at a corresponding side of the first surface. The first surface and the second surface are all non-planar surfaces.
- the capillary tissue is arranged and accommodated in the hollow chamber.
- the working fluid is injected into and filled in the hollow chamber.
- the invention is to provide a vapor chamber and a cooling device having the vapor chamber and, since two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape, both vapor chamber and cooling fins have larger contact area, thus that the heat-transferring effectiveness is enhanced significantly.
- the invention is to provide a cooling device having vapor chamber, including a cooler and a vapor chamber.
- the cooler includes a plurality of cooling fins, which are interspaced to each other.
- the vapor chamber includes a shell, a capillary tissue, a working fluid, a heat-absorbing section and a heat-releasing section.
- a hollow chamber is formed in the shell.
- the capillary tissue is arranged and accommodated in the hollow chamber.
- the working fluid is injected into and filled in the hollow chamber.
- the heat-absorbing section is formed at a partial area of the vapor chamber, while the heat-releasing section is formed at another partial area of the vapor chamber and is arranged by passing through the cooling fins. Two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape.
- FIG. 1 is a perspective view of a prior vapor chamber
- FIG. 2 is a perspective view of a vapor chamber according to the present invention.
- FIG. 3 is a top sectional view of a vapor chamber according to the present invention.
- FIG. 4 is a perspective view of a cooler according to the present invention.
- FIG. 5 is a side sectional view of a cooler according to the present invention during an operational status
- FIG. 6 is a top sectional view of a cooler according to the present invention during an operational status
- FIG. 7 is a perspective view of another embodiment of the vapor chamber of the invention.
- FIG. 8 is a top sectional view of another embodiment of the vapor chamber of the invention.
- FIG. 9 is a perspective view of a further embodiment of the vapor chamber of the invention.
- FIG. 2 through FIG. 4 respectively show a perspective view, a top sectional view of a vapor chamber and a perspective view of a cooling device according to the present invention.
- the invention is to provide a vapor chamber and a cooling device having the vapor chamber.
- the vapor chamber 10 includes a shell 11 , a capillary tissue 12 , a working fluid 13 , a heat-absorbing section and a heat-releasing section 102 .
- a hollow chamber 103 is formed in the shell 11 .
- the capillary tissue 12 is arranged and accommodated in the hollow chamber 103 .
- the working fluid 13 is injected into and filled in the hollow chamber 103 .
- the heat-absorbing section 101 is formed at a partial area of the vapor chamber 10
- the heat-releasing section 102 is formed at another partial area of the vapor chamber 10
- the heat-absorbing section 101 is a flat section
- the heat-releasing section 102 is connected to the flat section via an extension section.
- Two corresponding surfaces 1021 of the shell 11 at the heat-releasing section 102 are respectively designed as a non-planar shape.
- the two corresponding surfaces 1021 are further distinguished into a first surface 1022 and a second surface 1023 .
- These two corresponding surfaces 1021 i.e. the first surface 1022 and the second surface 1023
- a cooling device having vapor chamber 10 includes a vapor chamber 10 and a cooler 20 .
- the cooler 20 includes a plurality of cooling fins 21 that are inter-spaced to each other by alignment.
- the cooling fin 21 is configured a ring wall 211 around the circumference of the through-holes 22 respectively.
- Two neighboring cooling fins 21 are inter-abutted to each other via the ring wall 211 .
- the heat-releasing section 102 is arranged by passing through the cooling fins 21 .
- the shape of the through-hole 22 corresponds to that of these two corresponding surfaces 1021 .
- the vapor chamber 10 is shown as a “U” shape, however, not limited to this kind of pattern only. Since the first surface 1022 and the second surface 1023 are respectively shown as a non-planar shape (in this embodiment, being an arch shape projected outwardly) so, when the heat-releasing section 102 passes through the cooling fins 21 and connects thereto, the surface 1021 shown as an arch shape can contact the cooling fins 21 with larger area. In addition, the compatibility between the heat-releasing section 102 and the cooling fins 21 is improved without worrying the problem of machining flatness. In the meantime, a better cooling effectiveness can also be achieved by configuring the heat-releasing section 102 as a non-planar shape.
- FIG. 5 and FIG. 6 respectively showing a side sectional view and a top sectional view of a cooling device according to the present invention during operational status.
- the heat-absorbing section 101 is connected by adhesion onto a heating element 41 on a circuit board 40 .
- the waste heat generated from the heating element 41 is transferred to the heat-absorbing section 13 , then to the heat-releasing section 102 , and finally to the cooling fins 21 .
- the surface 1021 i.e. the first surface 1022 and the second surface 1023
- the contacting area between the heat-releasing section and the cooling fin 21 is larger, such that a better effectiveness of heat transfer can be achieved.
- FIG. 7 and FIG. 8 respectively showing a perspective view and a top sectional view of a vapor chamber according to another embodiment of the present invention.
- the surface 1021 i.e. the first surface 1022 and the second surface 1023
- the corrugated surface 1021 and the cooling fin 21 please refer to FIG. 4 , such that an effectiveness same as that o f above embodiment can be achieved as well.
- FIG. 9 showing a perspective view of a vapor chamber according to a further embodiment of the present invention.
- the vapor chamber 10 is shown as an “L” shape.
- different shapes of vapor chamber 10 can be chosen according to practically needed requirement, but the surface 1021 of the heat-releasing section has to be designed as a non-planar shape.
- the invention is an indispensable product of novelty indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness for completely fulfilling the applying merits of a new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention in general relates to a vapor chamber, and in particular, to a vapor chamber having non-planar surfaces and a cooling device having the vapor chamber.
- 2. Description of Prior Art
- Vapor chambers and heat pipes, comprehensively applied as the cooling devices in the information industry, are elements that apply phase change of the working fluid to reach a fast heat transfer. In particular, a vapor chamber can achieve a heat transfer via surface contact.
- As shown in
FIG. 1 , which is a perspective outer view of vapor chamber according to the prior arts, this prior vapor chamber has ashell 11 a, acapillary tissue 12 a and a workingfluid 13 a. In this case, ahollow chamber 103 a is formed in theshell 11 a. Thecapillary tissue 12 a is arranged in thehollow chamber 103 a. The workingfluid 13 a is injected into and filled in thehollow chamber 103 a. Thevapor chamber 10 a has a heat-absorbingsection 101 a and a heat-releasingsection 102 a, in which the heat-absorbingsection 101 a is formed at a partial area of thevapor chamber 10 a, while the heat-releasingsection 102 a is formed at another partial area of thevapor chamber 10 a. Particularly, the surfaces of the heat-absorbingsection 101 a and the heat-releasingsection 102 a are respectively shown as a plane shape. - However, there are still some drawbacks for this kind of prior vapor chamber in terms of practical usage. For example, the heat-transferring ability will become superior if the thickness of the
shell 11 a of thevapor chamber 10 a becomes thinner, so the current design of the thickness of theshell 11 a has a trend of thinness. However, when thevapor chamber 10 a transfers heat, a high pressure will be formed therein due to phase change, which easily creates a deforming or collapsing phenomenon on the surfaces ofshell 11 a. Since the surfaces of the heat-releasingsection 102 a of commonly prior vapor chamber are shown as plane type, so its structural strength is not strong enough to resist the deformation caused by high inner pressure. Therefore, the surfaces of the heat-releasingsection 102 a are easily collapsed or deformed, making thevapor chamber 10 a damaged. - Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.
- The invention is mainly to provide a vapor chamber which has a stronger structural strength and superior anti-deforming ability by designing a non-planar shape for each two corresponding surfaces of the shell at the heat-releasing section, such that the using life of the vapor chamber is prolonged.
- Secondly, the invention is to provide a vapor chamber which has a stronger structural strength and superior anti-deforming ability by designing a first surface and a second surface respectively as a non-planar surface, such that the using life of the vapor chamber is prolonged.
- Therefore, a vapor chamber provided by the invention includes a shell, a capillary tissue, a working fluid, a heat-absorbing section and a heat-releasing section. According to the invention, a hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. The heat-absorbing section is formed at a partial area of the vapor chamber, while the heat-releasing section is formed at another partial area of the vapor chamber. Two corresponding surfaces of the shell at the heat-releasing section are respectively shown as a non-planar shape.
- Again, a vapor chamber provided by the invention includes a shell, a capillary tissue and a working fluid. A hollow chamber is formed in the shell, an external part of which includes a flat section and an extension section connected the flat section. The extension section has a first surface and a second surface formed at a corresponding side of the first surface. The first surface and the second surface are all non-planar surfaces. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber.
- Furthermore, the invention is to provide a vapor chamber and a cooling device having the vapor chamber and, since two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape, both vapor chamber and cooling fins have larger contact area, thus that the heat-transferring effectiveness is enhanced significantly.
- Finally, the invention is to provide a cooling device having vapor chamber, including a cooler and a vapor chamber. The cooler includes a plurality of cooling fins, which are interspaced to each other. The vapor chamber includes a shell, a capillary tissue, a working fluid, a heat-absorbing section and a heat-releasing section. A hollow chamber is formed in the shell. The capillary tissue is arranged and accommodated in the hollow chamber. The working fluid is injected into and filled in the hollow chamber. The heat-absorbing section is formed at a partial area of the vapor chamber, while the heat-releasing section is formed at another partial area of the vapor chamber and is arranged by passing through the cooling fins. Two corresponding surfaces of the shell at the heat-releasing section are respectively designed as a non-planar shape.
- The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a perspective view of a prior vapor chamber; -
FIG. 2 is a perspective view of a vapor chamber according to the present invention; -
FIG. 3 is a top sectional view of a vapor chamber according to the present invention; -
FIG. 4 is a perspective view of a cooler according to the present invention; -
FIG. 5 is a side sectional view of a cooler according to the present invention during an operational status; -
FIG. 6 is a top sectional view of a cooler according to the present invention during an operational status; -
FIG. 7 is a perspective view of another embodiment of the vapor chamber of the invention; -
FIG. 8 is a top sectional view of another embodiment of the vapor chamber of the invention; and -
FIG. 9 is a perspective view of a further embodiment of the vapor chamber of the invention. - In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
- Please refer to
FIG. 2 throughFIG. 4 , which respectively show a perspective view, a top sectional view of a vapor chamber and a perspective view of a cooling device according to the present invention. The invention is to provide a vapor chamber and a cooling device having the vapor chamber. Thevapor chamber 10 includes ashell 11, acapillary tissue 12, a workingfluid 13, a heat-absorbing section and a heat-releasingsection 102. According to a preferable embodiment, ahollow chamber 103 is formed in theshell 11. Thecapillary tissue 12 is arranged and accommodated in thehollow chamber 103. The workingfluid 13 is injected into and filled in thehollow chamber 103. - The heat-absorbing
section 101 is formed at a partial area of thevapor chamber 10, while the heat-releasingsection 102 is formed at another partial area of thevapor chamber 10. In this case, the heat-absorbingsection 101 is a flat section, and the heat-releasingsection 102 is connected to the flat section via an extension section. Two correspondingsurfaces 1021 of theshell 11 at the heat-releasingsection 102 are respectively designed as a non-planar shape. In addition, the twocorresponding surfaces 1021 are further distinguished into afirst surface 1022 and asecond surface 1023. These two corresponding surfaces 1021 (i.e. thefirst surface 1022 and the second surface 1023) are respectively configured as an arch shape projected outwardly, but not limited to this kind of shape only. Since the arch structure can convert pressures imposed vertically on the surfaces into pressures in alignment along the arch lines, the structural strength of this kind of arch structure is stronger than that of common planar structure, so is the anti-deforming ability. - In addition, a cooling device having
vapor chamber 10 includes avapor chamber 10 and a cooler 20. The cooler 20 includes a plurality of coolingfins 21 that are inter-spaced to each other by alignment. There are two through-holes 22 arranged at each coolingfin 21, however, not limited to this kind of pattern only. Again, the coolingfin 21 is configured aring wall 211 around the circumference of the through-holes 22 respectively. Two neighboring coolingfins 21 are inter-abutted to each other via thering wall 211. The heat-releasingsection 102 is arranged by passing through the coolingfins 21. The shape of the through-hole 22 corresponds to that of these twocorresponding surfaces 1021. - In this embodiment, the
vapor chamber 10 is shown as a “U” shape, however, not limited to this kind of pattern only. Since thefirst surface 1022 and thesecond surface 1023 are respectively shown as a non-planar shape (in this embodiment, being an arch shape projected outwardly) so, when the heat-releasingsection 102 passes through the coolingfins 21 and connects thereto, thesurface 1021 shown as an arch shape can contact the coolingfins 21 with larger area. In addition, the compatibility between the heat-releasingsection 102 and the coolingfins 21 is improved without worrying the problem of machining flatness. In the meantime, a better cooling effectiveness can also be achieved by configuring the heat-releasingsection 102 as a non-planar shape. - Please refer to
FIG. 5 andFIG. 6 , respectively showing a side sectional view and a top sectional view of a cooling device according to the present invention during operational status. The heat-absorbingsection 101 is connected by adhesion onto aheating element 41 on acircuit board 40. The waste heat generated from theheating element 41 is transferred to the heat-absorbingsection 13, then to the heat-releasingsection 102, and finally to the coolingfins 21. It can be seen obviously from theFIG. 6 that, since the surface 1021 (i.e. thefirst surface 1022 and the second surface 1023) is shown as an arch shape, the contacting area between the heat-releasing section and the coolingfin 21 is larger, such that a better effectiveness of heat transfer can be achieved. - Please refer to
FIG. 7 andFIG. 8 , respectively showing a perspective view and a top sectional view of a vapor chamber according to another embodiment of the present invention. In this embodiment, the surface 1021 (i.e. thefirst surface 1022 and the second surface 1023) is shown as a corrugated shape. There is also a larger contacting area existing between thecorrugated surface 1021 and the cooling fin 21 (please refer toFIG. 4 ), such that an effectiveness same as that o f above embodiment can be achieved as well. - Please refer to
FIG. 9 , showing a perspective view of a vapor chamber according to a further embodiment of the present invention. InFIG. 9 , thevapor chamber 10 is shown as an “L” shape. However, different shapes ofvapor chamber 10 can be chosen according to practically needed requirement, but thesurface 1021 of the heat-releasing section has to be designed as a non-planar shape. - According to the aforementioned structure, a vapor chamber and a cooling device having the vapor chamber are thus obtained.
- Summarizing aforementioned description, the invention is an indispensable product of novelty indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness for completely fulfilling the applying merits of a new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
- However, the aforementioned description is only a number preferable embodiments according to the present invention, not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/325,533 US20100132922A1 (en) | 2008-12-01 | 2008-12-01 | Vapor chamber and cooling device having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/325,533 US20100132922A1 (en) | 2008-12-01 | 2008-12-01 | Vapor chamber and cooling device having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100132922A1 true US20100132922A1 (en) | 2010-06-03 |
Family
ID=42221733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/325,533 Abandoned US20100132922A1 (en) | 2008-12-01 | 2008-12-01 | Vapor chamber and cooling device having the same |
Country Status (1)
Country | Link |
---|---|
US (1) | US20100132922A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100242952A1 (en) * | 2009-03-26 | 2010-09-30 | Meyer Iv George Anthony | Solar power system with tower type heat dissipating structure |
US20120080177A1 (en) * | 2010-09-30 | 2012-04-05 | Zhongshan Weiqiang Technology Co., Ltd | High-power finless heat dissipation module |
US20120227933A1 (en) * | 2011-03-10 | 2012-09-13 | Cooler Master Co., Ltd. | Flat heat pipe with sectional differences and method for manufacturing the same |
US20140055954A1 (en) * | 2012-08-23 | 2014-02-27 | Asia Vital Components Co., Ltd. | Heat pipe structure, and thermal module and electronic device using same |
US20150009624A1 (en) * | 2013-07-08 | 2015-01-08 | Birchbridge Incorporated | Stackable cooling rail based system |
CN107306488A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat radiation module |
USD907752S1 (en) * | 2016-08-26 | 2021-01-12 | Danfoss Micro Channel Heat Exchanger (Jiaxing) Co., Ltd. | Heat exchanger |
US10999952B1 (en) * | 2020-01-02 | 2021-05-04 | Taiwan Microloops Corp. | Vapor chamber and manufacturing method thereof |
US11169474B2 (en) | 2018-06-18 | 2021-11-09 | Hewlett-Packard Development Company, L.P. | Vapor chamber based structure for cooling printing media processed by fuser |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
US4953632A (en) * | 1987-12-09 | 1990-09-04 | Fujikura Ltd. | Heat pipe and method of manufacturing the same |
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
US20070267177A1 (en) * | 2006-05-16 | 2007-11-22 | Kuo-Len Lin | Juxtaposing Structure For Heated Ends Of Heat Pipes |
-
2008
- 2008-12-01 US US12/325,533 patent/US20100132922A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
US4953632A (en) * | 1987-12-09 | 1990-09-04 | Fujikura Ltd. | Heat pipe and method of manufacturing the same |
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
US20070267177A1 (en) * | 2006-05-16 | 2007-11-22 | Kuo-Len Lin | Juxtaposing Structure For Heated Ends Of Heat Pipes |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100242952A1 (en) * | 2009-03-26 | 2010-09-30 | Meyer Iv George Anthony | Solar power system with tower type heat dissipating structure |
US8011361B2 (en) * | 2009-03-26 | 2011-09-06 | Celsia Technologies Taiwan, Inc. | Solar power system with tower type heat dissipating structure |
US20120080177A1 (en) * | 2010-09-30 | 2012-04-05 | Zhongshan Weiqiang Technology Co., Ltd | High-power finless heat dissipation module |
US20120227933A1 (en) * | 2011-03-10 | 2012-09-13 | Cooler Master Co., Ltd. | Flat heat pipe with sectional differences and method for manufacturing the same |
US20140055954A1 (en) * | 2012-08-23 | 2014-02-27 | Asia Vital Components Co., Ltd. | Heat pipe structure, and thermal module and electronic device using same |
US9273909B2 (en) * | 2012-08-23 | 2016-03-01 | Asia Vital Components Co., Ltd. | Heat pipe structure, and thermal module and electronic device using same |
US20150009624A1 (en) * | 2013-07-08 | 2015-01-08 | Birchbridge Incorporated | Stackable cooling rail based system |
CN107306488A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat radiation module |
USD907752S1 (en) * | 2016-08-26 | 2021-01-12 | Danfoss Micro Channel Heat Exchanger (Jiaxing) Co., Ltd. | Heat exchanger |
USD910821S1 (en) | 2016-08-26 | 2021-02-16 | Danfoss Micro Channel Heat Exchanger (Jiaxing) Co., Ltd. | Heat exchanger |
US11169474B2 (en) | 2018-06-18 | 2021-11-09 | Hewlett-Packard Development Company, L.P. | Vapor chamber based structure for cooling printing media processed by fuser |
US10999952B1 (en) * | 2020-01-02 | 2021-05-04 | Taiwan Microloops Corp. | Vapor chamber and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100132922A1 (en) | Vapor chamber and cooling device having the same | |
US20100139894A1 (en) | Heat sink with vapor chamber | |
US20110005725A1 (en) | Plate type heat pipe and heat sink using the same | |
US7983043B2 (en) | Heat dissipation device | |
US20120111541A1 (en) | Plate type heat pipe and heat sink using the same | |
US10451355B2 (en) | Heat dissipation element | |
US7451806B2 (en) | Heat dissipation device with heat pipes | |
US20120222839A1 (en) | Heat pipe assembly | |
JP4871597B2 (en) | Thermal management system and method for electronic assemblies | |
US9273909B2 (en) | Heat pipe structure, and thermal module and electronic device using same | |
US20140138057A1 (en) | Structure of low-profile heat pipe | |
US20070169919A1 (en) | Heat pipe type heat dissipation device | |
TWI804784B (en) | Three-dimensional heat transmission device | |
US11143460B2 (en) | Vapor chamber structure | |
CA2778369C (en) | Method for manufacturing a heat-pipe-type heat-dissipating device | |
US20130043005A1 (en) | Heat dissipation element with mounting structure | |
TWM524501U (en) | Heat dissipation device with reinforcement support structure | |
US20100243212A1 (en) | Non-flat vapor chamber with stiffening plate | |
US8985196B2 (en) | Heat dissipation device with mounting structure | |
TWI604172B (en) | Vapor chamber | |
US20060207747A1 (en) | Isothermal plate heat-dissipating device | |
JP3168433U (en) | Radiator | |
US20110277965A1 (en) | Fin and heat sink having the same | |
WO2019056506A1 (en) | Thin type heat uniformizing plate formed by stamping process | |
TWI641309B (en) | Heat dissipation element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORAGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;REEL/FRAME:021905/0412 Effective date: 20081001 |
|
AS | Assignment |
Owner name: CELSIA TECHNOLOGIES TAIWAN, INC.,TAIWAN Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA PREVIOUSLY RECORDED ON REEL 021905 FRAME 0412. ASSIGNOR(S) HEREBY CONFIRMS THE GEORGE ANTHONY MEYER IV;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;REEL/FRAME:021964/0233 Effective date: 20081001 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |