US20070267177A1 - Juxtaposing Structure For Heated Ends Of Heat Pipes - Google Patents

Juxtaposing Structure For Heated Ends Of Heat Pipes Download PDF

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Publication number
US20070267177A1
US20070267177A1 US11/383,719 US38371906A US2007267177A1 US 20070267177 A1 US20070267177 A1 US 20070267177A1 US 38371906 A US38371906 A US 38371906A US 2007267177 A1 US2007267177 A1 US 2007267177A1
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United States
Prior art keywords
heat
heated
heat pipe
juxtaposing
adjacent
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Abandoned
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US11/383,719
Inventor
Kuo-Len Lin
Wen-Jung Liu
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CpuMate Inc
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CpuMate Inc
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Publication date
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Priority to US11/383,719 priority Critical patent/US20070267177A1/en
Assigned to CPUMATE INC. reassignment CPUMATE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, KUO-LEN, LIU, WEN-JUNG
Publication of US20070267177A1 publication Critical patent/US20070267177A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding

Definitions

  • the present invention relates to a juxtaposing structure for the heated ends of a plurality of heat pipes, and in particular to a portion of the heat pipe for thermally connecting to a heat-generating electronic element (i.e., the heated end).
  • a heated surface having a larger area can be formed by means of juxtaposing a plurality of heat pipes.
  • a heat pipe can be applied to the heat-dissipating device of electronic products.
  • One end of the heat pipe is thermally connected to the heat-generating electronic element, and the other end thereof penetrates through a plurality of heat-dissipating fins.
  • the heat generated by the heat-generating electronic element can be transmitted to each heat-dissipating fin via the heat pipe to gradually dissipate the heat and lower the temperature.
  • the heat accumulated among each heat-dissipating fin can be rapidly dissipated via a heat-dissipating fan, thereby to achieve an excellent heat-dissipating effect.
  • the cross section of the heat pipe is formed into a circular pipe and the surface area is not large enough after being pressed flat. Therefore, in conventional art, the heat pipe is connected to a heat-conducting plate and then the heat-conducting plate adheres to the surface of the heat-generating electronic element.
  • the heat-conducting plate is usually made of copper, which is heavy and expensive. If the aluminum is used, the heat-conducting performance will be affected due to the bad heat conductivity of aluminum.
  • the heated end of the heat pipe may be unable to completely cover the upper surface of the heat-generating electronic element.
  • the heat pipe may be broken during the pressing operation because of the insufficient thickness of the pipe.
  • the inventor proposes the present invention to overcome the above problems based on his expert experiences and deliberate researches.
  • the present invention is to provide a juxtaposing structure for the heated ends of a plurality of heat pipes, in which the heated end of the heat pipe can directly contact with the heat-generating electronic element and the heated end has a larger area for completely covering and adhering to the upper surface of the heat-generating electronic element.
  • the present invention provides a juxtaposing structure for the heated ends of a plurality of heat pipes, which comprises a plurality of heat pipes.
  • Each heat pipe has a heated end.
  • the surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and side curved surfaces formed between both sides of the two planes. Side curved surfaces of any two adjacent heat pipes adjoin and abut against each other.
  • a heat-conducting medium is filled between any two adjacent side curved surfaces to bind these two surfaces.
  • a connecting surface is formed on the heat-conducting medium to be flush with the planes adjacent to both sides thereof. With the combination of each lower plane and the adjacent connecting surfaces, a heated surface having a larger area can be formed.
  • FIG. 1 is a partially exploded perspective n view of the present invention
  • FIG. 2 is a partially assembled perspective n view of the present invention
  • FIG. 3 is a cross-sectional perspective view of the line 3 - 3 in FIG. 2 ;
  • FIG. 4 is a schematic plan view of the first embodiment of the present invention.
  • FIG. 5 is a schematic plan view of the second embodiment of the present invention.
  • FIG. 6 is a cross-sectional perspective view of the line 6 - 6 in FIG. 5 ;
  • FIG. 7 is a schematic plan view of the third embodiment of the present invention.
  • FIG. 1 is a partially exploded perspective n view of the present invention.
  • FIG. 2 is a partially assembled perspective n view of the present invention.
  • FIG. 3 is a cross-sectional perspective view of the line 3 - 3 in FIG. 2 .
  • the present invention provides a juxtaposing structure for the heated ends of a plurality of heat pipes. After the heated ends 10 of a plurality of heat pipes 1 are juxtaposed, the heated end 10 of each heat pipe 1 together forms a heated surface having a larger area, so that the heated surface can adhere to the heat-generating electronic element 4 such as a central processing unit (CPU), as shown in FIG. 4 .
  • the heated area of the heated surface formed by the heated end 10 of each heat pipe 1 is substantially identical to the area of the upper surface of the heat-generating electronic element 4 to be adhered, thereby to completely cover and adhere thereto.
  • each heat pipe 1 can be formed into a straight pipe, a slightly curved pipe in the middle part (as shown in FIG. 4 ), an upright U-lettered shape (as shown in FIG. 5 ) or a side-lay U-lettered shape (as shown in FIG. 7 ). Further, each heat pipe has a heated end 10 and at least one condensed end 11 .
  • the heated end 10 is not necessarily to be either end of the heat pipe but can be the middle part of the heat pipe 1 .
  • a heat-conducting section 12 is connected between the heated end 10 and the condensed end 11 of each heat pipe 1 , thereby to constitute the heat pipe 1 .
  • the heated end 10 of each heat pipe 1 is slightly pressed flat, so that the surface of the heated end 10 of each heat pipe 1 has an upper and a lower planes 100 facing to each other and side curved surfaces 101 between both sides of the two planes 100 .
  • the heated ends 10 of those heat pipes 1 are juxtaposed and the side curved surfaces 101 of any two adjacent heat pipes 1 adjoin and abut against each other.
  • a heat-conducting medium 2 is filled between any two adjacent side curved surfaces 101 .
  • the heat-conducting medium 2 can be solders such as tin for integrally binding heat pipes 1 together.
  • a connecting surface 20 is formed on the heat-conducting medium 2 to be flush with the adjacent planes 100 on both sides. With the combination of each lower plane 100 and the adjacent connecting surfaces 20 , a heated surface having a larger area can be formed for thermally contacting with and adhering to the heat-generating electronic element 4 .
  • each heat pipe 1 is formed into a straight pipe or the heat-conducting section 12 is slightly curved.
  • the condensed end 11 of each heat pipe 1 commonly penetrates through a plurality of heat-dissipating fins 3 .
  • each heat pipe 1 is juxtaposed and bound together by the heat-conducting medium 2 , and further each heat pipe 1 can directly adhere to the upper surface of the heat-generating electronic element 4 .
  • each heat pipe 1 can directly conduct and dissipate the heat generated by the heat-generating electronic element 4 .
  • FIG. 5 is a schematic plan view of the second embodiment of the present invention
  • FIG. 6 is a cross-sectional perspective view of the line 6 - 6 in FIG. 5
  • each heat pipe 1 is formed into an upright U-lettered shape.
  • the heated end 10 of each heat pipe 1 is located at the bottom of the U-lettered shape, and both ends of the U-lettered shape extending upwardly are used as the condensed ends 11 .
  • Both condensed ends 11 also penetrate through a plurality of heat-dissipating fins 3 .
  • the heated end 10 of the heat pipe 1 is not necessary to be either end portion of the pipe.
  • the heated end 10 can be also located in the middle part of the pipe.
  • the present embodiment can also achieve the same object as that in the first embodiment.
  • each heat pipe 1 is formed into a side-lay U-lettered shape.
  • the heated end 10 of each heat pipe 1 is located at one extending end of the U-lettered shape, and the condensed end 11 is located at the other extending end of the U-lettered shape.
  • the condensed end 11 penetrates through a plurality of heat-dissipating fins 3 .
  • the present invention indeed achieves the desired effects and overcomes the drawbacks of prior art by employing the above structures. Therefore, the present invention involves the novelty and inventive steps, and conforms to the requirements for a utility model patent.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A juxtaposing structure for the heated ends of a plurality of heat pipes includes a plurality of heat pipes. Each heat pipe has a heated end. The surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and side curved surfaces formed between both sides of the two planes. Side curved surfaces of any two adjacent heat pipes adjoin and abut against each other. A heat-conducting medium is filled between any two adjacent side curved surfaces to bind these two surfaces. A connecting surface is formed on the heat-conducting medium to be flush with the planes adjacent to both sides thereof. With the combination of each lower plane and the adjacent connecting surfaces, a heated surface having a larger area can be formed.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a juxtaposing structure for the heated ends of a plurality of heat pipes, and in particular to a portion of the heat pipe for thermally connecting to a heat-generating electronic element (i.e., the heated end). A heated surface having a larger area can be formed by means of juxtaposing a plurality of heat pipes.
  • 2. Description of Prior Art
  • Generally, a heat pipe can be applied to the heat-dissipating device of electronic products. One end of the heat pipe is thermally connected to the heat-generating electronic element, and the other end thereof penetrates through a plurality of heat-dissipating fins. With the excellent heat conductivity of the heat pipe, the heat generated by the heat-generating electronic element can be transmitted to each heat-dissipating fin via the heat pipe to gradually dissipate the heat and lower the temperature. Further, the heat accumulated among each heat-dissipating fin can be rapidly dissipated via a heat-dissipating fan, thereby to achieve an excellent heat-dissipating effect.
  • The cross section of the heat pipe is formed into a circular pipe and the surface area is not large enough after being pressed flat. Therefore, in conventional art, the heat pipe is connected to a heat-conducting plate and then the heat-conducting plate adheres to the surface of the heat-generating electronic element. However, such method causes the heat pipe unable to directly contact with the heat-generating electronic element and thus it is difficult to exhibit the optimal performance. Further, the heat-conducting plate is usually made of copper, which is heavy and expensive. If the aluminum is used, the heat-conducting performance will be affected due to the bad heat conductivity of aluminum. Therefore, a method is proposed, in which the heat pipe is pressed to form the heated end of the heat pipe into a flat surface so as to facilitate the adhesion to the upper surface of the heat-generating electronic element, as disclosed in Taiwan Patent Publication No. M248231 entitled “Heat-Dissipating Device For Heat Pipe”.
  • However, in the above-mentioned method, if the surface area after pressing is not large enough, the heated end of the heat pipe may be unable to completely cover the upper surface of the heat-generating electronic element. On the other hand, if a larger area is to be pressed out, the heat pipe may be broken during the pressing operation because of the insufficient thickness of the pipe.
  • In view of the above, the inventor proposes the present invention to overcome the above problems based on his expert experiences and deliberate researches.
    • SUMMARY OF THE INVENTION
  • The present invention is to provide a juxtaposing structure for the heated ends of a plurality of heat pipes, in which the heated end of the heat pipe can directly contact with the heat-generating electronic element and the heated end has a larger area for completely covering and adhering to the upper surface of the heat-generating electronic element.
  • The present invention provides a juxtaposing structure for the heated ends of a plurality of heat pipes, which comprises a plurality of heat pipes. Each heat pipe has a heated end. The surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and side curved surfaces formed between both sides of the two planes. Side curved surfaces of any two adjacent heat pipes adjoin and abut against each other. A heat-conducting medium is filled between any two adjacent side curved surfaces to bind these two surfaces. A connecting surface is formed on the heat-conducting medium to be flush with the planes adjacent to both sides thereof. With the combination of each lower plane and the adjacent connecting surfaces, a heated surface having a larger area can be formed.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
  • FIG. 1 is a partially exploded perspective n view of the present invention;
  • FIG. 2 is a partially assembled perspective n view of the present invention;
  • FIG. 3 is a cross-sectional perspective view of the line 3-3 in FIG. 2;
  • FIG. 4 is a schematic plan view of the first embodiment of the present invention;
  • FIG. 5 is a schematic plan view of the second embodiment of the present invention;
  • FIG. 6 is a cross-sectional perspective view of the line 6-6 in FIG. 5; and
  • FIG. 7 is a schematic plan view of the third embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • In order to make the Examiner better understand the characteristics and the technical contents of the present invention, a detailed description relating to the present invention will be made with reference to the accompanying drawings. However, it should be understood that the drawings are illustrative but not used to limit the scope of the present invention.
  • FIG. 1 is a partially exploded perspective n view of the present invention. FIG. 2 is a partially assembled perspective n view of the present invention. FIG. 3 is a cross-sectional perspective view of the line 3-3 in FIG. 2. The present invention provides a juxtaposing structure for the heated ends of a plurality of heat pipes. After the heated ends 10 of a plurality of heat pipes 1 are juxtaposed, the heated end 10 of each heat pipe 1 together forms a heated surface having a larger area, so that the heated surface can adhere to the heat-generating electronic element 4 such as a central processing unit (CPU), as shown in FIG. 4. The heated area of the heated surface formed by the heated end 10 of each heat pipe 1 is substantially identical to the area of the upper surface of the heat-generating electronic element 4 to be adhered, thereby to completely cover and adhere thereto.
  • According to the above, each heat pipe 1 can be formed into a straight pipe, a slightly curved pipe in the middle part (as shown in FIG. 4), an upright U-lettered shape (as shown in FIG. 5) or a side-lay U-lettered shape (as shown in FIG. 7). Further, each heat pipe has a heated end 10 and at least one condensed end 11. The heated end 10 is not necessarily to be either end of the heat pipe but can be the middle part of the heat pipe 1. A heat-conducting section 12 is connected between the heated end 10 and the condensed end 11 of each heat pipe 1, thereby to constitute the heat pipe 1.
  • With reference to FIGS. 1 to 3, in the present invention, the heated end 10 of each heat pipe 1 is slightly pressed flat, so that the surface of the heated end 10 of each heat pipe 1 has an upper and a lower planes 100 facing to each other and side curved surfaces 101 between both sides of the two planes 100. The heated ends 10 of those heat pipes 1 are juxtaposed and the side curved surfaces 101 of any two adjacent heat pipes 1 adjoin and abut against each other. A heat-conducting medium 2 is filled between any two adjacent side curved surfaces 101. The heat-conducting medium 2 can be solders such as tin for integrally binding heat pipes 1 together. Further, a connecting surface 20 is formed on the heat-conducting medium 2 to be flush with the adjacent planes 100 on both sides. With the combination of each lower plane 100 and the adjacent connecting surfaces 20, a heated surface having a larger area can be formed for thermally contacting with and adhering to the heat-generating electronic element 4.
  • As show in FIG. 4, it is a schematic plan view of the first embodiment of the present invention. In this embodiment, each heat pipe 1 is formed into a straight pipe or the heat-conducting section 12 is slightly curved. The condensed end 11 of each heat pipe 1 commonly penetrates through a plurality of heat-dissipating fins 3. According to the figure, it is apparent that each heat pipe 1 is juxtaposed and bound together by the heat-conducting medium 2, and further each heat pipe 1 can directly adhere to the upper surface of the heat-generating electronic element 4. With this arrangement, each heat pipe 1 can directly conduct and dissipate the heat generated by the heat-generating electronic element 4.
  • FIG. 5 is a schematic plan view of the second embodiment of the present invention, and FIG. 6 is a cross-sectional perspective view of the line 6-6 in FIG. 5. In this embodiment, each heat pipe 1 is formed into an upright U-lettered shape. The heated end 10 of each heat pipe 1 is located at the bottom of the U-lettered shape, and both ends of the U-lettered shape extending upwardly are used as the condensed ends 11. Both condensed ends 11 also penetrate through a plurality of heat-dissipating fins 3. According to the present embodiment, the heated end 10 of the heat pipe 1 is not necessary to be either end portion of the pipe. Depending on the curved construction and different applications of the heat pipe 1, the heated end 10 can be also located in the middle part of the pipe. The present embodiment can also achieve the same object as that in the first embodiment.
  • As show in FIG. 7, it is a schematic plan view of the third embodiment of the present invention. In this embodiment, each heat pipe 1 is formed into a side-lay U-lettered shape. The heated end 10 of each heat pipe 1 is located at one extending end of the U-lettered shape, and the condensed end 11 is located at the other extending end of the U-lettered shape. Similarly, the condensed end 11 penetrates through a plurality of heat-dissipating fins 3.
  • Therefore, with the above construction, the juxtaposing structure for the heated ends of a plurality of heat pipes in accordance with the present invention can be obtained.
  • According to the above, the present invention indeed achieves the desired effects and overcomes the drawbacks of prior art by employing the above structures. Therefore, the present invention involves the novelty and inventive steps, and conforms to the requirements for a utility model patent.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still be occurred to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (5)

1. A juxtaposing structure for heated ends of heat pipes, comprising a plurality of heat pipes, each heat pipe having a heated end, a surface of the heated end of each heat pipe having an upper and a lower planes facing to each other and side curved surfaces formed between both sides of two planes,
wherein the side curved surfaces of any two adjacent heat pipes adjoin and abut against each other, a heat-conducting medium is filled between any two adjacent side curved surfaces to bind the two surfaces, a connecting surface is formed on the heat-conducting medium to be flush with planes adjacent to both sides thereof, thereby to form a heated surface having a larger area with a combination of each lower plane and adjacent connecting surfaces.
2. The juxtaposing structure according to claim 1, wherein each heat pipe is formed into a straight pipe.
3. The juxtaposing structure according to claim 1, wherein each heat pipe is formed into an upright U-lettered shape, and the heated end of each heat pipe is located at the bottom of the U-lettered shape.
4. The juxtaposing structure according to claim 1, wherein each heat pipe is formed into a side-lay U-lettered shape, and the heated end of each heat pipe is located at an extending end of the U-lettered shape.
5. The juxtaposing structure according to claim 1, wherein the heat-conducting medium is solders.
US11/383,719 2006-05-16 2006-05-16 Juxtaposing Structure For Heated Ends Of Heat Pipes Abandoned US20070267177A1 (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080216990A1 (en) * 2007-03-07 2008-09-11 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20100132922A1 (en) * 2008-12-01 2010-06-03 Meyer Iv George Anthony Vapor chamber and cooling device having the same
US20100242952A1 (en) * 2009-03-26 2010-09-30 Meyer Iv George Anthony Solar power system with tower type heat dissipating structure
EP2298490A1 (en) 2009-09-18 2011-03-23 Cpumate Inc. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
CN101990384A (en) * 2009-08-05 2011-03-23 鈤新科技股份有限公司 Heat conducting structure with coplanar heated parts and manufacturing method thereof, and radiator with heat conducting structure
US20110114293A1 (en) * 2009-11-16 2011-05-19 Kuo-Len Lin Manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes
US20130098584A1 (en) * 2009-09-18 2013-04-25 Golden Sun News Techniques Co., Ltd. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
US20180372424A1 (en) * 2017-06-21 2018-12-27 Microsoft Technology Licensing, Llc Vapor chamber that emits a non-uniform radiative heat flux
EP3367037B1 (en) * 2017-02-24 2020-07-15 Toyota Jidosha Kabushiki Kaisha Heat exchanger, heat exchange method using heat exchanger, heat transport system using heat exchanger, and heat transport method using heat transport system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960866A (en) * 1996-11-15 1999-10-05 Furukawa Electric Co., Ltd Method for manufacturing cooling unit comprising heat pipes and cooling unit
US20060037738A1 (en) * 2004-08-23 2006-02-23 Inventec Corporation Heat-dissipating device with heat pipe
US20070000646A1 (en) * 2005-07-02 2007-01-04 Chun-Chi Chen Heat dissipation device with heat pipe
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960866A (en) * 1996-11-15 1999-10-05 Furukawa Electric Co., Ltd Method for manufacturing cooling unit comprising heat pipes and cooling unit
US20060037738A1 (en) * 2004-08-23 2006-02-23 Inventec Corporation Heat-dissipating device with heat pipe
US20070000646A1 (en) * 2005-07-02 2007-01-04 Chun-Chi Chen Heat dissipation device with heat pipe
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080216990A1 (en) * 2007-03-07 2008-09-11 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US7597134B2 (en) * 2007-03-07 2009-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
US20080316707A1 (en) * 2007-06-22 2008-12-25 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7548426B2 (en) * 2007-06-22 2009-06-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US20100132922A1 (en) * 2008-12-01 2010-06-03 Meyer Iv George Anthony Vapor chamber and cooling device having the same
US8011361B2 (en) * 2009-03-26 2011-09-06 Celsia Technologies Taiwan, Inc. Solar power system with tower type heat dissipating structure
US20100242952A1 (en) * 2009-03-26 2010-09-30 Meyer Iv George Anthony Solar power system with tower type heat dissipating structure
CN101990384A (en) * 2009-08-05 2011-03-23 鈤新科技股份有限公司 Heat conducting structure with coplanar heated parts and manufacturing method thereof, and radiator with heat conducting structure
EP2298490A1 (en) 2009-09-18 2011-03-23 Cpumate Inc. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
US20130098584A1 (en) * 2009-09-18 2013-04-25 Golden Sun News Techniques Co., Ltd. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
US8484845B2 (en) 2009-09-18 2013-07-16 Cpumate Inc. Method of manufacturing a heat conducting structure having a coplanar heated portion
US8978742B2 (en) * 2009-09-18 2015-03-17 Cpumate Inc. Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
US20110114293A1 (en) * 2009-11-16 2011-05-19 Kuo-Len Lin Manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes
EP3367037B1 (en) * 2017-02-24 2020-07-15 Toyota Jidosha Kabushiki Kaisha Heat exchanger, heat exchange method using heat exchanger, heat transport system using heat exchanger, and heat transport method using heat transport system
US20180372424A1 (en) * 2017-06-21 2018-12-27 Microsoft Technology Licensing, Llc Vapor chamber that emits a non-uniform radiative heat flux

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