US20120222839A1 - Heat pipe assembly - Google Patents

Heat pipe assembly Download PDF

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Publication number
US20120222839A1
US20120222839A1 US13/176,725 US201113176725A US2012222839A1 US 20120222839 A1 US20120222839 A1 US 20120222839A1 US 201113176725 A US201113176725 A US 201113176725A US 2012222839 A1 US2012222839 A1 US 2012222839A1
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United States
Prior art keywords
heat pipe
heat
transfer block
pipe assembly
groove
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Abandoned
Application number
US13/176,725
Inventor
Tsung-Hsien Huang
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Individual
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Individual
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Publication of US20120222839A1 publication Critical patent/US20120222839A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements

Definitions

  • the instant disclosure relates to a heat dissipating structure; more particularly, to a heat pipe assembly.
  • a heat-transfer block is often used with heat pipes to enhance heat transfer performance.
  • a soldering material is often employed.
  • solder-less press-fit method may be employed to affix heat pipes to respective heat pipe grooves of the heat-transfer block.
  • These heat pipe grooves may be configured to provide arched or oval cross sections. When the heat pipes are forced into respective heat pipe grooves, the heat pipes are pressed fitted to prevent accidental separation. However, because the heat pipe grooves have arched or oval cross sections, the heat pipes tend to be loosened or forced out of position accidentally in absence of the soldering or adhesive materials.
  • the oval-shaped heat pipe grooves force these heat pipes to be spaced further apart from one another. Due to such limitation, the heat pipes cannot be closely arranged. On the other hand, if the soldering material or paste is opted to secure the heat pipes, the following issues may occur. If not enough soldering material or paste is available, the heat pipes may be loosely attached. However, if too much soldering material or paste is applied, the excessive amount would overflow the grooves as an eyesore to the users. Other disadvantages include the increase in material and manufacturing costs.
  • the inventor strives via industrial experience and academic research to develop the instant disclosure, which can effectively improve the limitations as described above.
  • the instant disclosure has been accomplished under the circumstances in view. It is one object of the instant disclosure to provide a heat pipe assembly, Without using the soldering material, heat pipes can be press-fitted into respective heat pipe grooves to prevent displacements.
  • the heat pipe grooves can be semi-circularly arched to group the heat pipes effectively.
  • the heat pipe assembly comprises a heat-transfer block and at least one heat pipe press-fitted thereon.
  • the heat-transfer block has a surface, wherein a heat pipe groove is concavedly formed thereon.
  • a fixing rib protrudes from the heat pipe groove, and the heat pipe is press-fitted to the heat pipe groove. The fixing rib impresses into the surface of the heat pipe in forming an impression thereon, thus securing the heat pipe.
  • FIG. 1 is an assembled view of the instant disclosure.
  • FIG. 2 is an assembling view of a heat pipe assembly for a first embodiment of the instant disclosure.
  • FIG. 3 is an assembled view of heat pipes with a heat-transfer block for the first embodiment of the instant disclosure before flattening.
  • FIG. 4 is an assembled view of the heat pipes with the heat-transfer block for the first embodiment of the instant disclosure after flattening.
  • FIG. 5 is a schematic view of heat pipes with a heat-transfer block before assembling for a second embodiment of the instant disclosure.
  • FIG. 6 is a schematic view of heat pipes with a heat-transfer block after assembling for the second embodiment of the instant disclosure.
  • FIG. 7 is a schematic view of heat pipes with a heat-transfer block before assembling for a third embodiment of the instant disclosure.
  • FIG. 8 is a schematic view of heat pipes with a heat-transfer block after assembling for the third embodiment of the instant disclosure.
  • FIG. 9 is a schematic view of heat pipes with a heat-transfer block after assembling for a fourth embodiment of the instant disclosure.
  • FIG. 1 shows a heat pipe assembly of the instant disclosure.
  • the heat pipe assembly comprises a heat-transfer block 1 and at least one heat pipe 2 press-fitted thereon for improving heat transfer.
  • the heat-transfer block 1 can be made of copper, aluminum, or other materials with good thermal conductivity.
  • the heat-transfer block 1 having at least a bottom surface 10 for affixing to a heat source and a top surface 11 formed oppositely, may act as a base of a heat sink.
  • the heat pipe 2 is secured to the bottom surface 10 of the heat-transfer block 1 , and the top surface 11 of the heat-transfer block 1 is further mounted with a plurality of heat-dissipating fins 3 , thereby forming a heat sink.
  • a plurality of heat pipe grooves 12 are formed concavedly on the bottom surface 10 of the heat-transfer block 1 in equal number to the heat pipes 2 .
  • the cross section of each heat pipe groove 12 is arched in such a way of being approximately larger than a semi-circle for press-fitting the heat pipe 2 .
  • At least one fixing rib 120 is protruded from each heat pipe groove 12 .
  • the fixing rib 120 extends longitudinally along the length of the heat pipe groove 12 .
  • the fixing rib 120 When the heat pipes 2 are forced into the respective heat pipe grooves 12 , the fixing rib 120 is forced to abut and impress into the corresponding heat pipe 2 , thus forming an impression 20 thereon.
  • the original contact area of each arched heat pipe groove 12 is no longer rounded, which also prevents the displacement or loosening of the heat pipes 2 from the heat pipe grooves 2 .
  • the fixing ribs 120 allow the heat pipes 2 to be disposed directly onto the heat-transfer block 1 securely in a solder-less press-fit manner. Further, the exposed portion of each heat pipe 2 is flattened in forming a heat-absorbing surface 21 .
  • the heat-absorbing surfaces 21 can be formed coplanarly with the bottom surface 10 of the heat-transfer block 1 to contact the heat source smoothly.
  • FIGS. 5 and 6 show a second embodiment of the instant disclosure.
  • This second embodiment is substantially similar to the aforesaid first embodiment with the exception that the second embodiment comprises a plurality of fixing ribs 120 spaced apart from each other. Based on the number of the fixing rib 120 , the fixing ribs 120 are evenly spread. By means of increasing the number of the fixing ribs 120 , connection stability between the heat pipes 2 and the heat-transfer block 1 is enhanced.
  • FIGS. 7 and 8 illustrate a third embodiment of the instant disclosure.
  • This third embodiment is substantially similar to the aforesaid second embodiment with the exception that the fixing ribs 120 according to this third embodiment are disposed near the corner or two opposite corners of the heat pipe grooves 12 to enhance connection stability between the heat pipes 2 and the heat-transfer block 1 , wherein the fixing ribs 120 abut inward against the heat pipes 2 .
  • FIG. 9 illustrates a heat pipe assembly in accordance with a fourth embodiment of the instant disclosure.
  • This fourth embodiment is a combination of the aforesaid second and third embodiments, having the advantages of both embodiments.
  • the instant disclosure is able to achieve the pre-determined objectives and resolve issues facing by conventional heat pipe assemblies.
  • the instant disclosure has novelty and non-obviousness in conforming to the requirements for patent application. Therefore, the present patent application is submitted to obtain a patent for protecting the intellectual property right of the inventor.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

A heat pipe assembly includes a heat-transfer block and at least one heat pipe press-fitted thereon. The heat-transfer block has a surface. A heat pipe groove is formed concavedly on the surface. A fixing rib is protruded from the heat pipe groove. The heat pipe is press-fitted to the heat pipe groove, and the fixing rib impresses into the heat pipe in forming an impression thereon. Thus, the heat pipe is tightly secured onto the heat-transfer block.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention
  • The instant disclosure relates to a heat dissipating structure; more particularly, to a heat pipe assembly.
  • (b) Description of the Prior Art
  • A heat-transfer block is often used with heat pipes to enhance heat transfer performance. When securing heat pipes to respective heat pipe grooves of the heat-transfer block, a soldering material is often employed. Alternatively, solder-less press-fit method may be employed to affix heat pipes to respective heat pipe grooves of the heat-transfer block. These heat pipe grooves may be configured to provide arched or oval cross sections. When the heat pipes are forced into respective heat pipe grooves, the heat pipes are pressed fitted to prevent accidental separation. However, because the heat pipe grooves have arched or oval cross sections, the heat pipes tend to be loosened or forced out of position accidentally in absence of the soldering or adhesive materials. Further, for more than one heat pipe, the oval-shaped heat pipe grooves force these heat pipes to be spaced further apart from one another. Due to such limitation, the heat pipes cannot be closely arranged. On the other hand, if the soldering material or paste is opted to secure the heat pipes, the following issues may occur. If not enough soldering material or paste is available, the heat pipes may be loosely attached. However, if too much soldering material or paste is applied, the excessive amount would overflow the grooves as an eyesore to the users. Other disadvantages include the increase in material and manufacturing costs.
  • To address the above issues, the inventor strives via industrial experience and academic research to develop the instant disclosure, which can effectively improve the limitations as described above.
    • SUMMARY OF THE INVENTION
  • The instant disclosure has been accomplished under the circumstances in view. It is one object of the instant disclosure to provide a heat pipe assembly, Without using the soldering material, heat pipes can be press-fitted into respective heat pipe grooves to prevent displacements. The heat pipe grooves can be semi-circularly arched to group the heat pipes effectively.
  • To achieve this and other objects of the instant disclosure, the heat pipe assembly comprises a heat-transfer block and at least one heat pipe press-fitted thereon. The heat-transfer block has a surface, wherein a heat pipe groove is concavedly formed thereon. A fixing rib protrudes from the heat pipe groove, and the heat pipe is press-fitted to the heat pipe groove. The fixing rib impresses into the surface of the heat pipe in forming an impression thereon, thus securing the heat pipe.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an assembled view of the instant disclosure.
  • FIG. 2 is an assembling view of a heat pipe assembly for a first embodiment of the instant disclosure.
  • FIG. 3 is an assembled view of heat pipes with a heat-transfer block for the first embodiment of the instant disclosure before flattening.
  • FIG. 4 is an assembled view of the heat pipes with the heat-transfer block for the first embodiment of the instant disclosure after flattening.
  • FIG. 5 is a schematic view of heat pipes with a heat-transfer block before assembling for a second embodiment of the instant disclosure.
  • FIG. 6 is a schematic view of heat pipes with a heat-transfer block after assembling for the second embodiment of the instant disclosure.
  • FIG. 7 is a schematic view of heat pipes with a heat-transfer block before assembling for a third embodiment of the instant disclosure.
  • FIG. 8 is a schematic view of heat pipes with a heat-transfer block after assembling for the third embodiment of the instant disclosure.
  • FIG. 9 is a schematic view of heat pipes with a heat-transfer block after assembling for a fourth embodiment of the instant disclosure.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The various objects and advantages of the instant disclosure will be more readily understood from the following detailed description when read in conjunction with the appended drawings. However, the appended drawings are for references and explanation purposes only, therefore are not used to restrict the scope of the instant disclosure.
  • Please refer to FIG. 1, which shows a heat pipe assembly of the instant disclosure. The heat pipe assembly comprises a heat-transfer block 1 and at least one heat pipe 2 press-fitted thereon for improving heat transfer.
  • The heat-transfer block 1 can be made of copper, aluminum, or other materials with good thermal conductivity. The heat-transfer block 1, having at least a bottom surface 10 for affixing to a heat source and a top surface 11 formed oppositely, may act as a base of a heat sink. According to this embodiment, the heat pipe 2 is secured to the bottom surface 10 of the heat-transfer block 1, and the top surface 11 of the heat-transfer block 1 is further mounted with a plurality of heat-dissipating fins 3, thereby forming a heat sink.
  • Please refer to FIG. 2 in conjunction with FIG. 1. A plurality of heat pipe grooves 12 are formed concavedly on the bottom surface 10 of the heat-transfer block 1 in equal number to the heat pipes 2. However, it is to be understood that the design of the heat pipe grooves 12 at the bottom surface 10 of the heat-transfer block 1 is simply an example but not a limitation. The cross section of each heat pipe groove 12 is arched in such a way of being approximately larger than a semi-circle for press-fitting the heat pipe 2. At least one fixing rib 120 is protruded from each heat pipe groove 12. The fixing rib 120 extends longitudinally along the length of the heat pipe groove 12.
  • Please refer to FIGS. 3 and 4 and FIGS. 1 and 2 again. When the heat pipes 2 are forced into the respective heat pipe grooves 12, the fixing rib 120 is forced to abut and impress into the corresponding heat pipe 2, thus forming an impression 20 thereon. By virtue of the fixing rib 120, the original contact area of each arched heat pipe groove 12 is no longer rounded, which also prevents the displacement or loosening of the heat pipes 2 from the heat pipe grooves 2. When the soldering material is not being used, the fixing ribs 120 allow the heat pipes 2 to be disposed directly onto the heat-transfer block 1 securely in a solder-less press-fit manner. Further, the exposed portion of each heat pipe 2 is flattened in forming a heat-absorbing surface 21. The heat-absorbing surfaces 21 can be formed coplanarly with the bottom surface 10 of the heat-transfer block 1 to contact the heat source smoothly.
  • Please refer to FIGS. 5 and 6, which show a second embodiment of the instant disclosure. This second embodiment is substantially similar to the aforesaid first embodiment with the exception that the second embodiment comprises a plurality of fixing ribs 120 spaced apart from each other. Based on the number of the fixing rib 120, the fixing ribs 120 are evenly spread. By means of increasing the number of the fixing ribs 120, connection stability between the heat pipes 2 and the heat-transfer block 1 is enhanced.
  • Please refer to FIGS. 7 and 8, which illustrate a third embodiment of the instant disclosure. This third embodiment is substantially similar to the aforesaid second embodiment with the exception that the fixing ribs 120 according to this third embodiment are disposed near the corner or two opposite corners of the heat pipe grooves 12 to enhance connection stability between the heat pipes 2 and the heat-transfer block 1, wherein the fixing ribs 120 abut inward against the heat pipes 2.
  • FIG. 9 illustrates a heat pipe assembly in accordance with a fourth embodiment of the instant disclosure. This fourth embodiment is a combination of the aforesaid second and third embodiments, having the advantages of both embodiments.
  • Based on the preceding structures, the heat pipe assembly of the instant disclosure is obtained.
  • In summary, the instant disclosure is able to achieve the pre-determined objectives and resolve issues facing by conventional heat pipe assemblies. The instant disclosure has novelty and non-obviousness in conforming to the requirements for patent application. Therefore, the present patent application is submitted to obtain a patent for protecting the intellectual property right of the inventor.
  • The descriptions illustrated supra set forth simply the preferred embodiments of the instant disclosure; however, the characteristics of the instant disclosure are by no means restricted thereto. All changes, alternations, or modifications conveniently considered by those skilled in the art are deemed to be encompassed within the scope of the instant disclosure delineated by the following claims.

Claims (10)

1. A heat pipe assembly, comprising:
a heat-transfer block having a surface, a heat pipe groove being formed concavedly thereon, a fixing rib being protruded from the heat pipe groove; and
a heat pipe press-fitted to the heat pipe groove, the heat pipe being impressed by the fixing rib in forming an corresponding impression.
2. The heat pipe assembly as claimed in claim 1, wherein the surface is a bottom surface of the heat-transfer block.
3. The heat pipe assembly as claimed in claim 1, wherein the heat pipe groove of the heat-transfer block is arched slightly larger than semi-circularly shaped.
4. The heat pipe assembly as claimed in claim 1, wherein the heat pipe groove has more than one fixing rib formed thereon.
5. The heat pipe assembly as claimed in claim 4, wherein the fixing ribs on the heat pipe groove are spaced apart from one another.
6. The heat pipe assembly as claimed in claim 1, 4 or 5, wherein the fixing rib extends longitudinally along the length of the corresponding heat pipe groove.
7. The heat pipe assembly as claimed in claim 1, 4 or 5, wherein the fixing rib is disposed adjacent to one corner of the corresponding heat pipe groove.
8. The heat pipe assembly as claimed in claim 4 or 5, wherein the fixing ribs are disposed near respective corners of the heat pipe groove.
9. The heat pipe assembly as claimed in claim 1, wherein the number of the heat pipe is increased to more than one, and wherein an equal number of the heat pipe groove is formed on the heat-transfer block.
10. The heat pipe assembly as claimed in claim 1, wherein the heat pipe and the heat-transfer block are kept in direct contact.
US13/176,725 2011-03-04 2011-07-05 Heat pipe assembly Abandoned US20120222839A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110052123.6 2011-03-04
CN2011100521236A CN102121801A (en) 2011-03-04 2011-03-04 Limiting combination structure of heat pipe and heat conduction seat

Publications (1)

Publication Number Publication Date
US20120222839A1 true US20120222839A1 (en) 2012-09-06

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US13/176,725 Abandoned US20120222839A1 (en) 2011-03-04 2011-07-05 Heat pipe assembly

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US (1) US20120222839A1 (en)
JP (1) JP3170757U (en)
KR (1) KR200466266Y1 (en)
CN (1) CN102121801A (en)
DE (1) DE202011050698U1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120124999A1 (en) * 2009-02-12 2012-05-24 Commissariat A L'energie Atomique Et Aux Energies Alternatives Solar collector, and an elextrical energy generation plant including such solar colectors
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
CN106535559A (en) * 2015-09-15 2017-03-22 奇鋐科技股份有限公司 Combined heat radiation unit
CN107027265A (en) * 2016-01-29 2017-08-08 奇鋐科技股份有限公司 Heat dissipation module assembly structure and manufacturing method thereof
US20170252878A1 (en) * 2016-03-04 2017-09-07 Asia Vital Components Co., Ltd. Manufacturing method of thermal module assembling structure
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
US10132571B2 (en) * 2015-10-06 2018-11-20 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit
US10190830B2 (en) * 2016-03-04 2019-01-29 Asia Vital Components Co., Ltd. Thermal module assembling structure
US20200391266A1 (en) * 2020-08-28 2020-12-17 Intel Corporation Extruded heat pipe
US20220051907A1 (en) * 2019-05-09 2022-02-17 Zalman Tech Co., Ltd. Method of fabricating electronic component cooling apparatus including heat pipes and heat transfer block
US20220346276A1 (en) * 2021-04-27 2022-10-27 Asia Vital Components Co., Ltd. Thermal module
US12146714B2 (en) * 2022-01-28 2024-11-19 Asia Vital Components Co., Ltd. Heat dissipation device assembly
US12215934B2 (en) * 2022-01-28 2025-02-04 Asia Vital Components Co., Ltd. Thermal module structure
US12446192B2 (en) * 2021-04-27 2025-10-14 Asia Vital Components Co., Ltd. Thermal module

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CN104717870B (en) * 2013-12-12 2017-12-15 奇鋐科技股份有限公司 Heat radiation module combined structure
CN106486434B (en) * 2015-08-26 2020-03-31 奇鋐科技股份有限公司 Heat sink and method for manufacturing the same
CN106705551A (en) * 2017-01-09 2017-05-24 合肥美的电冰箱有限公司 Refrigerator side plate and refrigerator
CN114423232A (en) * 2017-04-28 2022-04-29 株式会社村田制作所 Vapor chamber, heat dissipation device, and electronic device
CN107333345B (en) * 2017-08-08 2023-04-14 上海金洛安全装备有限公司 Adsorption clamping heating member
KR102711106B1 (en) * 2022-05-03 2024-09-27 주식회사 쿨링스 A module for heat dissipation and a method of manufacturing heat dissipation module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2017154A (en) * 1934-09-15 1935-10-15 Charles A Criqui Valve seat construction for engines and the like
US5472243A (en) * 1994-05-17 1995-12-05 Reynolds Metals Company Fluted tube joint
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US20090049691A1 (en) * 2006-05-12 2009-02-26 Chih-Hung Cheng Method for embedding heat pipe into heat-conducting seat
US20090194255A1 (en) * 2008-02-04 2009-08-06 Tsung-Hsien Huang Cooler device
US7610948B2 (en) * 2007-07-25 2009-11-03 Tsung-Hsien Huang Cooler module
US20100319899A1 (en) * 2009-06-23 2010-12-23 Shuji Yokoyama Heat sink and method of manufacture thereof
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof
US20110042042A1 (en) * 2009-08-24 2011-02-24 Kim Jong Man Radiating package module for exothermic element
US7950445B2 (en) * 2007-07-25 2011-05-31 Golden Sun News Techniques Co., Ltd. Combined assembly of fixing base and heat pipe

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100450660C (en) * 2005-12-20 2009-01-14 陈世明 Method for press forming heat pipe and radiating fin
JP2008307552A (en) * 2007-06-12 2008-12-25 Nippon Light Metal Co Ltd Heat exchanger manufacturing method and heat exchanger
TW200821811A (en) * 2008-01-11 2008-05-16 Chung-Shian Huang Heat dissipation device without a base
KR200451504Y1 (en) * 2008-01-11 2010-12-17 충-시엔 후앙 Cooler Module without Base Panel
CN101674716B (en) * 2008-09-11 2013-05-01 深圳市超频三科技有限公司 Heat-pipe type radiator and manufacturing method thereof
CN201993016U (en) * 2011-03-04 2011-09-28 东莞汉旭五金塑胶科技有限公司 Limiting combination structure of heat pipe and heat conduction seat

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2017154A (en) * 1934-09-15 1935-10-15 Charles A Criqui Valve seat construction for engines and the like
US5472243A (en) * 1994-05-17 1995-12-05 Reynolds Metals Company Fluted tube joint
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US20090049691A1 (en) * 2006-05-12 2009-02-26 Chih-Hung Cheng Method for embedding heat pipe into heat-conducting seat
US7610948B2 (en) * 2007-07-25 2009-11-03 Tsung-Hsien Huang Cooler module
US7950445B2 (en) * 2007-07-25 2011-05-31 Golden Sun News Techniques Co., Ltd. Combined assembly of fixing base and heat pipe
US20090194255A1 (en) * 2008-02-04 2009-08-06 Tsung-Hsien Huang Cooler device
US20100319899A1 (en) * 2009-06-23 2010-12-23 Shuji Yokoyama Heat sink and method of manufacture thereof
US20110005727A1 (en) * 2009-07-07 2011-01-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module and manufacturing method thereof
US20110042042A1 (en) * 2009-08-24 2011-02-24 Kim Jong Man Radiating package module for exothermic element

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120124999A1 (en) * 2009-02-12 2012-05-24 Commissariat A L'energie Atomique Et Aux Energies Alternatives Solar collector, and an elextrical energy generation plant including such solar colectors
US9027347B2 (en) * 2009-02-12 2015-05-12 Sophia Antipolis Energie Developpement Solar collector, and an electrical energy generation plant including such solar collectors
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
US8746325B2 (en) * 2011-03-22 2014-06-10 Tsung-Hsien Huang Non-base block heat sink
CN106535559A (en) * 2015-09-15 2017-03-22 奇鋐科技股份有限公司 Combined heat radiation unit
US10132571B2 (en) * 2015-10-06 2018-11-20 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit
CN107027265A (en) * 2016-01-29 2017-08-08 奇鋐科技股份有限公司 Heat dissipation module assembly structure and manufacturing method thereof
US10016859B2 (en) * 2016-03-04 2018-07-10 Asia Vital Components Co., Ltd. Manufacturing method of thermal module assembling structure
US20170252878A1 (en) * 2016-03-04 2017-09-07 Asia Vital Components Co., Ltd. Manufacturing method of thermal module assembling structure
US10190830B2 (en) * 2016-03-04 2019-01-29 Asia Vital Components Co., Ltd. Thermal module assembling structure
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
US10772235B2 (en) * 2016-12-09 2020-09-08 Cooler Master Technology Inc. Heat sink and manufacturing method thereof
US20220051907A1 (en) * 2019-05-09 2022-02-17 Zalman Tech Co., Ltd. Method of fabricating electronic component cooling apparatus including heat pipes and heat transfer block
US20200391266A1 (en) * 2020-08-28 2020-12-17 Intel Corporation Extruded heat pipe
US12303957B2 (en) * 2020-08-28 2025-05-20 Intel Corporation Extruded heat pipe
US20220346276A1 (en) * 2021-04-27 2022-10-27 Asia Vital Components Co., Ltd. Thermal module
US12446192B2 (en) * 2021-04-27 2025-10-14 Asia Vital Components Co., Ltd. Thermal module
US12146714B2 (en) * 2022-01-28 2024-11-19 Asia Vital Components Co., Ltd. Heat dissipation device assembly
US12215934B2 (en) * 2022-01-28 2025-02-04 Asia Vital Components Co., Ltd. Thermal module structure

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JP3170757U (en) 2011-09-29
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CN102121801A (en) 2011-07-13
KR20120006356U (en) 2012-09-12

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