US20110240256A1 - Heat dissipater mounting structure - Google Patents
Heat dissipater mounting structure Download PDFInfo
- Publication number
- US20110240256A1 US20110240256A1 US12/662,210 US66221010A US2011240256A1 US 20110240256 A1 US20110240256 A1 US 20110240256A1 US 66221010 A US66221010 A US 66221010A US 2011240256 A1 US2011240256 A1 US 2011240256A1
- Authority
- US
- United States
- Prior art keywords
- heat
- heat plate
- mounting structure
- retention members
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.
Description
- The present invention relates to a heat dissipater mounting structure, and in particular to a heat dissipater mounting structure that helps spreading stress and thus realizes stable and secure mounting and enhance the performance of heat transfer.
- A personal computer or a notebook computer often suffers accumulation of heat due to long time operation. One of the commonly known solutions is to add a heat plate for dissipation of the heat. A heat plate shows the characteristics of high heat transfer rate, light weight, and simple structure, and is capable of transfer of a great amount of heat without consuming electrical power.
- The conventional way of mounting a heat plate is to position the heat plate directly on an electronic device that generates heat. The heat plate is further provided with a radiator. The heat plate forms a hollow interior vacuum chamber, in which a capillary structure is formed and a working fluid is received. Through circulation of the working fluid that repeatedly converts between two phases through the capillary structure, the heat generated by the electronic device is transferred to the radiator, so that the heat generated during the operation of the electronic device can be dissipated to the surroundings. However, in a long course of use, a heat plate is subjected to thermal expansion due to the heat applied thereto. Since the heat plate is often secured to an electronic device through bolts that are set at corners of the heat plate. Stresses that are induced may get concentrated at the corners, making the heat plate that is subjected to thermal expansion warped. As a result, stably and securely mounting the heat plate to the electronic device can be no longer held, leading to deterioration or loss of the performance of heat transfer of the heat plate.
- Thus, the present invention aims to provide a heat dissipater mounting structure that helps spreading the stresses induced therein to enhance the convenience of use thereof.
- An objective of the present invention is to provide a heat dissipater mounting structure, which provides the efficacies of spreading stress induced therein, stable and secure mounting, and enhanced performance of heat transfer.
- To realize the above objective, the present invention provides a heat dissipater mounting structure, comprising at least a radiator, which is positioned on a surface of a heat plate, and a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate. Fasteners are applied to secure the retention members to the heat plate. The retention members have a unique structure that helps spreading stress, stably mounting, and effectively enhancing the performance of heat transfer.
- The present invention will be apparent to those skilled in the art by reading the following description of preferred embodiments thereof with reference to the drawings, in which:
-
FIG. 1 is a perspective view showing a heat dissipater mounting structure in accordance with a first embodiment of the present invention; -
FIG. 2 is an exploded view of the heat dissipater mounting structure in accordance with the first embodiment of the present invention; -
FIG. 3 is a perspective view showing a heat dissipater mounting structure in accordance with a second embodiment of the present invention; and -
FIG. 4 is an exploded view of the heat dissipater mounting structure in accordance with the second embodiment of the present invention. - With reference to the drawings and in particularly to
FIGS. 1 and 2 , which respectively show a perspective view and an exploded view of a heat dissipater mounting structure in accordance with a first embodiment of the present invention, the heat dissipater mounting structure of the present invention comprises aheat plate 100, at least oneradiator 200, and a plurality ofretention members 300, provided for mounting on an electronic device to dissipate heat generated by the operation of the electronic device. - The
heat plate 100 forms a plurality offirst mounting holes 110. Theheat plate 100 forms a hollow interior vacuum chamber in which a capillary structure is mounted and a working fluid is received, whereby circulation of the working fluid that changes between two phases thereof through the capillary structure formed inside theheat plate 100 effectively transfers and thus dissipate heat from a heat source and thus reduces the temperature of the heat source. - The
radiator 200 is positioned on a surface of theheat plate 100. In the embodiment illustrated, theradiator 200 comprises a plurality of stacked heat dissipation fins, or alternatively heat pipes can be included, or further alternatively, a combination of heat dissipation fins and heat pipes can be used. - The
retention members 300 are set on side margin portions of the surface of theheat plate 100. A plurality of fasteners 400 (such asbolts 410 and C clips 420) is provided for fixing theretention members 300 to theheat plate 100 in a locked manner. In the embodiment illustrated, the surface of theheat plate 100 has a plurality of side margin portions (four side margin portions, for example). Theretention members 300 are selectively set on any one of the side margin portions. For example, tworetention members 300 are respectively set on two opposite side margin portions of the surface of theheat plate 100; alternatively, threeretention members 300 are set on three consecutive side margin portions of the surface of theheat plate 100 to form a U-shaped arrangement. Theretention members 300 form a plurality ofsecond mounting holes 310 respectively corresponding to thefirst mounting holes 110. Eachretention member 300 comprises twoinclined sections 301 and aflat section 302, so that the twoinclined sections 301 are respectively connected to opposite ends of theflat section 302, preferably in a symmetric manner, to form a unique structure of theretention member 300 according to the present invention. Thesecond mounting holes 310 are respectively defined in theinclined sections 301. Theflat section 302 is positionable, in a tight engagement manner, on the surface of theheat plate 100. - To use the heat dissipater mounting structure of the present invention, the
radiator 200 is first positioned on the surface of theheat plate 100, and two opposite side margin portions of the surface of theheat plate 100 each receive aretention member 300 positioned thereon. Theretention member 300 has twoinclined sections 301 and aflat section 302. The twoinclined sections 301 are respectively connected to opposite ends of theflat section 302. Theinclined sections 301 formsecond mounting holes 310. Theflat section 302 is positionable on the surface of theheat plate 100 in a tight engagement manner.Fasteners 400 are respectively put through thefirst mounting holes 110 formed in theheat plate 100 and thesecond mounting holes 310 formed in theretention members 300 to secure theretention members 300 and theheat plate 100 together in a locked manner, whereby when theheat plate 100 is set on an electronic device, theheat plate 100 transfers the heat generated by the operation of the electronic device to theradiator 200 for further dissipation of the heat. Further, due to the unique structure of theretention member 300, theflat section 302 of theretention member 300 is flat set on and in tight engagement with theheat plate 100 for spreading stress induced therein so that warping of theheat plate 100 is prevented, stably and securely mounting theheat plate 100 to the electronic device is ensured, and the performance of heat dissipation of theheat plate 100 is enhanced. - Referring to
FIGS. 3 and 4 , which respectively show a perspective view and an exploded view of a heat dissipater mounting structure according to a second embodiment of the present invention, the second embodiment is substantially similar to the first embodiment but they are different in that theheat plate 100 of the second embodiment comprises anextension section 120, and theradiator 200 is positioned on theextension section 120. Theheat plate 100 has a surface having at least two opposite side margin portions on whichretention members 300 are mounted. A pad 500 (for example an elongate pad) is provided between eachretention member 300 and the surface of theheat plate 100 to support theflat section 302 of theretention member 300 to rest thereon. Thepad 500 enhances spreading of stress induced on the heat plate. - To summarize, the present invention provides a heat dissipater mounting structure, which arranges at least one
radiator 200 on a surface of aheat plate 100 and sets a plurality ofretention members 300 on side margin portions of the surface of theheat plate 100 with theretention members 300 being secured to theheat plate 100 in a locked manner. With a unique structure of theretention member 300, theretention member 300 helps spreading stress induced in theheat plate 100 during the use thereof, so that theheat plate 100 can be stably and securely mounted to an electronic device and the performance of heat transfer of theheat plate 100 is enhanced. - Although the present invention has been described with reference to the preferred embodiments thereof, it is apparent to those skilled in the art that a variety of modifications and changes may be made without departing from the scope of the present invention which is intended to be defined by the appended claims.
Claims (9)
1. A heat dissipater mounting structure, comprising:
a heat plate;
at least one radiator, which is positioned on a surface of the heat plate; and
a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate and comprises a plurality of fasteners that secures the retention members to the heat plate.
2. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the surface of the heat plate comprises a plurality of side margin portions and wherein two retention members are respectively set on two opposite side margin portions of the surface of the heat plate.
3. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the heat plate comprises an extension section on which the radiator is positioned.
4. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the heat plate forms a plurality of first mounting holes, the retention members forming a plurality of second mounting holes corresponding to the first mounting holes, the fasteners being respectively received through the first mounting holes and the second mounting holes to secure the retention members to the heat plate.
5. The mounting structure of heat dissipation device as claimed in claim 4 , wherein each of the retention members comprises two inclined sections and a flat section, the two inclined sections being respectively connected to two opposite ends of the flat section, the inclined sections forming the second mounting holes, the flat section being positionable on the surface of the heat plate.
6. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the fasteners comprise bolts and C clips.
7. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the radiator comprises a plurality of stacked heat dissipation fins or heat pipes.
8. The mounting structure of heat dissipation device as claimed in claim 1 , wherein the radiator comprises a plurality of stacked heat dissipation fins and heat pipes.
9. The mounting structure of heat dissipation device as claimed in claim 1 , wherein a pad is arranged between each of the retention members and the surface of the heat plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/662,210 US20110240256A1 (en) | 2010-04-06 | 2010-04-06 | Heat dissipater mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/662,210 US20110240256A1 (en) | 2010-04-06 | 2010-04-06 | Heat dissipater mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110240256A1 true US20110240256A1 (en) | 2011-10-06 |
Family
ID=44708265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/662,210 Abandoned US20110240256A1 (en) | 2010-04-06 | 2010-04-06 | Heat dissipater mounting structure |
Country Status (1)
Country | Link |
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US (1) | US20110240256A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10213139B2 (en) | 2015-05-14 | 2019-02-26 | Abbott Diabetes Care Inc. | Systems, devices, and methods for assembling an applicator and sensor control device |
US10674944B2 (en) | 2015-05-14 | 2020-06-09 | Abbott Diabetes Care Inc. | Compact medical device inserters and related systems and methods |
US11071478B2 (en) | 2017-01-23 | 2021-07-27 | Abbott Diabetes Care Inc. | Systems, devices and methods for analyte sensor insertion |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6882534B2 (en) * | 2003-01-06 | 2005-04-19 | Waffer Tech. Co. | Fastening device for heat slug |
US20060181850A1 (en) * | 2005-02-15 | 2006-08-17 | Wang Frank | Heatsink module for electronic device |
US20080128111A1 (en) * | 2006-12-01 | 2008-06-05 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
US7414850B2 (en) * | 2006-07-14 | 2008-08-19 | Foxconn Technology Co., Ltd. | Heat dissipation module for electronic device |
-
2010
- 2010-04-06 US US12/662,210 patent/US20110240256A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6882534B2 (en) * | 2003-01-06 | 2005-04-19 | Waffer Tech. Co. | Fastening device for heat slug |
US20060181850A1 (en) * | 2005-02-15 | 2006-08-17 | Wang Frank | Heatsink module for electronic device |
US7414850B2 (en) * | 2006-07-14 | 2008-08-19 | Foxconn Technology Co., Ltd. | Heat dissipation module for electronic device |
US20080128111A1 (en) * | 2006-12-01 | 2008-06-05 | Foxconn Technology Co., Ltd. | Heat dissipation device with heat pipes |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10213139B2 (en) | 2015-05-14 | 2019-02-26 | Abbott Diabetes Care Inc. | Systems, devices, and methods for assembling an applicator and sensor control device |
US10674944B2 (en) | 2015-05-14 | 2020-06-09 | Abbott Diabetes Care Inc. | Compact medical device inserters and related systems and methods |
US11071478B2 (en) | 2017-01-23 | 2021-07-27 | Abbott Diabetes Care Inc. | Systems, devices and methods for analyte sensor insertion |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KUNSHAN JUE-CHOUNG ELECTRONICS CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, YU-PO;KUO, TUNG-JUNG;REEL/FRAME:024241/0746 Effective date: 20100224 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |