US20110214841A1 - Flat heat pipe structure - Google Patents
Flat heat pipe structure Download PDFInfo
- Publication number
- US20110214841A1 US20110214841A1 US12/717,932 US71793210A US2011214841A1 US 20110214841 A1 US20110214841 A1 US 20110214841A1 US 71793210 A US71793210 A US 71793210A US 2011214841 A1 US2011214841 A1 US 2011214841A1
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- US
- United States
- Prior art keywords
- pipe
- capillary structure
- heat pipe
- flat heat
- evaporation portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Definitions
- the present invention generally relates to heat conducting components, in particular to a flat heat pipe with a capillary structure.
- Heat pipe is a heat conducting component that achieves a quick heat dissipation effect by means of a change of liquid and vapor phases and generally comes with an evaporation portion at an end of the heat pipe and a condensation portion at another end of the heat pipe to produce a temperature difference. If the evaporation portion receives heat, a working fluid in the evaporation portion can be vaporized quickly due to the vacuum condition inside the heat pipe, and the heat can be conducted to the condensation portion having a lower temperature through the heat pipe.
- the heat at the condensation portion can be dissipated from an external heat dissipating component (such as a heat dissipating fin), so that the vaporized working fluid can resume its original liquid phase and return to the evaporation portion through a capillary structure disposed on an internal wall of the heat pipe, and the cycle can be repeated to achieve the effect of conducting heat.
- an external heat dissipating component such as a heat dissipating fin
- the heat pipe is designed in a flat shape.
- the space in the flat heat pipe becomes much smaller after the heat pipe is pressed, and the space is just large enough for installing the capillary structure and related supporting components only.
- the working fluid is heated at the evaporation portion and changed into a vapor phase, the reduced space in the heat pipe may cause difficulties for the working fluid to conduct heat to the condensation portion.
- the present invention discloses a flat heat pipe structure comprising a flat pipe, a radial capillary structure, and an axial capillary structure, wherein the pipe has a flat containing space for sealing and storing a working fluid, and the pipe is formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls and provided for enclosing and defining the containing space, and the pipe further has an evaporation portion, and the radial capillary structure is situated in the evaporation portion, and radially surrounded and attached onto the two bottom walls and the two sidewalls, and the axial capillary structure is extended in a lengthwise direction of the pipe, installed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure is extended to the evaporation portion of the pipe and coupled to the radial capillary structure.
- FIG. 1 is an exploded view of a preferred embodiment of the present invention
- FIG. 2 is a perspective view a preferred embodiment of the present invention
- FIG. 3 is a cross-sectional view of FIG. 2 ;
- FIG. 4 is a schematic view of an application of a preferred embodiment of the present invention.
- FIG. 5 is a cross-sectional view of another preferred embodiment of the present invention.
- the flat heat pipe structure has a heat pipe 1 comprising a flat pipe 10 , a radial capillary structure 11 , and an axial capillary structure 12 .
- the pipe 10 also has a flat containing space 100 therein, and the pipe 10 is formed by two opposite bottom walls 101 and two sidewalls 102 laterally and respectively disposed on the two bottom walls 101 and provided for enclosing and defining the containing space 100 .
- the radial and axial capillary structures 11 , 12 are attached onto an internal wall of the containing space 100 of the pipe 10 , and an appropriate quantity of working fluid (not shown in the figure) is sealed and stored in the pipe 10 .
- the pipe 10 includes an evaporation portion 103 disposed at any end (or a distal end), or in the middle section of the pipe 10 .
- the pipe 10 may have a plurality of evaporation portions 103 as well.
- the radial capillary structure 11 is situated in the evaporation portion 103 of the pipe 10 , and radially surrounded and attached onto the two bottom walls 101 and the two sidewalls 102 .
- the radial capillary structure 11 can be made of a metal mesh or a sintered powder.
- the axial capillary structure 12 is extended along a lengthwise direction of the pipe 10 , installed in the containing space 100 , and attached onto one of the sidewalls 102 .
- the axial capillary structure 12 is stacked and integrated with the radial capillary structure 11 for facilitating the sealing and storage of the working fluid in the pipe 10 , such that the working fluid can flow smoothly between the radial and axial capillary structures 11 , 12 .
- the axial capillary structure 12 can be a strip-shaped fiber bundle, a metal mesh rolled into a strip-shape or a powder sintered into a strip shape, or a ditch formed on one of the sidewalls 102 .
- the flat heat pipe structure in accordance with the present invention can be achieved.
- the evaporation portion 103 of the heat pipe 1 is in contact with a heat source 2 , and an end of the heat pipe 1 away from the evaporation portion 103 includes a plurality of heat dissipating fins 3 connected with one another.
- the heat source 2 generates heat and the working fluid in the radial capillary structure 11 of the heat pipe 1 starts vaporizing, the vaporized working fluid conducts heat to each heat dissipating fin 3 through the containing space 100 since the radial capillary structure 11 is situated on the evaporation portion 103 only.
- the axial capillary structure 12 is provided for returning the working fluid in the liquid state to the evaporation portion 103 . Even though the containing space in the flat heat pipe is relatively small and narrow, the installation relation of the radial and axial capillary structures 11 , 12 can avoid a possible situation of the vaporized working fluid and the liquid-phase working fluid from flowing towards each other, so as to facilitate a smooth cycle of the change of liquid and vapor phases of the working fluid in the heat pipe 1 .
- the axial capillary structure 12 is extended to an end of the heat pipe away from the evaporation portion 13 , and the flat heat pipe structure further includes a coupling section 120 attached onto a distal surface of the pipe 10 of the heat pipe 1 , such that the backflow of working fluid in the liquid state can be conducted along the coupling section 120 and attached by the axial capillary structure 12 to facilitate the backflow of the working fluid in the liquid state.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A flat heat pipe structure includes a flat pipe, a radial capillary structure and an axial capillary structure. The pipe has a containing space for sealing and storing a working fluid, and the pipe is formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls, and the pipe further has an evaporation portion, and the radial capillary structure is situated in the evaporation portion and radially surrounded and attached onto the two bottom walls and two sidewalls, and the axial capillary structure is extended in a lengthwise direction of the pipe, disposed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure is extended to the evaporation portion of the pipe and coupled to the radial capillary structure.
Description
- The present invention generally relates to heat conducting components, in particular to a flat heat pipe with a capillary structure.
- Heat pipe is a heat conducting component that achieves a quick heat dissipation effect by means of a change of liquid and vapor phases and generally comes with an evaporation portion at an end of the heat pipe and a condensation portion at another end of the heat pipe to produce a temperature difference. If the evaporation portion receives heat, a working fluid in the evaporation portion can be vaporized quickly due to the vacuum condition inside the heat pipe, and the heat can be conducted to the condensation portion having a lower temperature through the heat pipe. Now, the heat at the condensation portion can be dissipated from an external heat dissipating component (such as a heat dissipating fin), so that the vaporized working fluid can resume its original liquid phase and return to the evaporation portion through a capillary structure disposed on an internal wall of the heat pipe, and the cycle can be repeated to achieve the effect of conducting heat.
- To minimize the occupying space and meet the desired thin and compact design requirements of an electronic product, the heat pipe is designed in a flat shape. However, the space in the flat heat pipe becomes much smaller after the heat pipe is pressed, and the space is just large enough for installing the capillary structure and related supporting components only. When the working fluid is heated at the evaporation portion and changed into a vapor phase, the reduced space in the heat pipe may cause difficulties for the working fluid to conduct heat to the condensation portion.
- In view of the foregoing shortcomings of the conventional flat heat pipe structure, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally designed and developed a feasible flat heat pipe structure to overcome the shortcomings of the prior art.
- Therefore, it is a primary objective of the present invention to provide a flat heat pipe structure that makes use of the installation relation of radial and axial capillary structures to reserve sufficient space for a heat conduction path of a vaporized working fluid inside a heat pipe, so as to avoid any possible hindrance to the change of vapor and liquid phases of a working fluid.
- To achieve the foregoing objectives, the present invention discloses a flat heat pipe structure comprising a flat pipe, a radial capillary structure, and an axial capillary structure, wherein the pipe has a flat containing space for sealing and storing a working fluid, and the pipe is formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls and provided for enclosing and defining the containing space, and the pipe further has an evaporation portion, and the radial capillary structure is situated in the evaporation portion, and radially surrounded and attached onto the two bottom walls and the two sidewalls, and the axial capillary structure is extended in a lengthwise direction of the pipe, installed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure is extended to the evaporation portion of the pipe and coupled to the radial capillary structure.
- To make it easier for the examiner to understand the objects, characteristics and effects of this invention, we use preferred embodiments together with the attached drawings for the detailed description of the invention.
-
FIG. 1 is an exploded view of a preferred embodiment of the present invention; -
FIG. 2 is a perspective view a preferred embodiment of the present invention; -
FIG. 3 is a cross-sectional view ofFIG. 2 ; -
FIG. 4 is a schematic view of an application of a preferred embodiment of the present invention; and -
FIG. 5 is a cross-sectional view of another preferred embodiment of the present invention. - The technical characteristics and contents of the present invention will become apparent with the following detailed description accompanied with related drawings. The drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.
- With reference to
FIGS. 1 and 2 for an exploded view and a perspective view of a flat heat pipe structure in accordance with a preferred embodiment of the present invention respectively, the flat heat pipe structure has aheat pipe 1 comprising aflat pipe 10, a radialcapillary structure 11, and an axialcapillary structure 12. - The
pipe 10 also has aflat containing space 100 therein, and thepipe 10 is formed by twoopposite bottom walls 101 and twosidewalls 102 laterally and respectively disposed on the twobottom walls 101 and provided for enclosing and defining the containingspace 100. The radial and axialcapillary structures space 100 of thepipe 10, and an appropriate quantity of working fluid (not shown in the figure) is sealed and stored in thepipe 10. Thepipe 10 includes anevaporation portion 103 disposed at any end (or a distal end), or in the middle section of thepipe 10. Of course, thepipe 10 may have a plurality ofevaporation portions 103 as well. - The radial
capillary structure 11 is situated in theevaporation portion 103 of thepipe 10, and radially surrounded and attached onto the twobottom walls 101 and the twosidewalls 102. The radialcapillary structure 11 can be made of a metal mesh or a sintered powder. - In
FIG. 3 , the axialcapillary structure 12 is extended along a lengthwise direction of thepipe 10, installed in the containingspace 100, and attached onto one of thesidewalls 102. When the axialcapillary structure 12 is extended to theevaporation portion 103 of thepipe 10, the axialcapillary structure 12 is stacked and integrated with the radialcapillary structure 11 for facilitating the sealing and storage of the working fluid in thepipe 10, such that the working fluid can flow smoothly between the radial and axialcapillary structures capillary structure 12 can be a strip-shaped fiber bundle, a metal mesh rolled into a strip-shape or a powder sintered into a strip shape, or a ditch formed on one of thesidewalls 102. - With the aforementioned structure, the flat heat pipe structure in accordance with the present invention can be achieved.
- In
FIG. 4 , theevaporation portion 103 of theheat pipe 1 is in contact with aheat source 2, and an end of theheat pipe 1 away from theevaporation portion 103 includes a plurality ofheat dissipating fins 3 connected with one another. When theheat source 2 generates heat and the working fluid in the radialcapillary structure 11 of theheat pipe 1 starts vaporizing, the vaporized working fluid conducts heat to eachheat dissipating fin 3 through the containingspace 100 since the radialcapillary structure 11 is situated on theevaporation portion 103 only. After the condensation effect of eachheat dissipating fin 3 take place to resume the working fluid into a liquid state, the axialcapillary structure 12 is provided for returning the working fluid in the liquid state to theevaporation portion 103. Even though the containing space in the flat heat pipe is relatively small and narrow, the installation relation of the radial and axialcapillary structures heat pipe 1. - With reference to
FIG. 5 for a cross-sectional view of a flat heat pipe structure in accordance with another preferred embodiment of the present invention, the axialcapillary structure 12 is extended to an end of the heat pipe away from the evaporation portion 13, and the flat heat pipe structure further includes acoupling section 120 attached onto a distal surface of thepipe 10 of theheat pipe 1, such that the backflow of working fluid in the liquid state can be conducted along thecoupling section 120 and attached by the axialcapillary structure 12 to facilitate the backflow of the working fluid in the liquid state. - In summation of the description above, the present invention improves over the prior art and complies with the patent application requirements, and thus is duly filed for patent application. While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Claims (11)
1. A flat heat pipe structure, comprising:
a flat pipe, including a flat containing space formed therein, and containing a working fluid, and the pipe being formed by two opposite bottom walls and two sidewalls laterally and respectively disposed on the two bottom walls, and provided for enclosing and defining the containing space, and the pipe further having an evaporation portion;
a radial capillary structure, disposed in the evaporation portion of the pipe, and radially surrounded and attached onto the two bottom walls and the two sidewalls; and
an axial capillary structure, extended along a lengthwise direction of the pipe, disposed in the containing space, and attached onto one of the sidewalls, and the axial capillary structure being extended to the evaporation portion of the pipe and coupled to the radial capillary structure.
2. The flat heat pipe structure of claim 1 , wherein the evaporation portion of the pipe is situated at an end of the pipe.
3. The flat heat pipe structure of claim 1 , wherein the evaporation portion of the pipe is situated at a middle section of the pipe.
4. The flat heat pipe structure of claim 1 , wherein the evaporation portion of the pipe comes with a plurality, and the evaporation portions are situated at any end or a middle section of the pipe.
5. The flat heat pipe structure of claim 1 , wherein the radial capillary structure is a metal mesh.
6. The flat heat pipe structure of claim 1 , wherein the radial capillary structure is made of a sintered powder.
7. The flat heat pipe structure of claim 1 , wherein the axial capillary structure is a strip-shaped fiber bundle.
8. The flat heat pipe structure of claim 1 , wherein the axial capillary structure is formed by rolling a metal mesh into a strip shape.
9. The flat heat pipe structure of claim 1 , wherein the axial capillary structure is a powder sintered into a strip shape.
10. The flat heat pipe structure of claim 1 , wherein the axial capillary structure is a ditch formed on one of the sidewalls.
11. The flat heat pipe structure of claim 1 , wherein the axial capillary structure further includes a coupling section extended from the axial capillary structure and attached onto a distal surface of the pipe.
Priority Applications (1)
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US12/717,932 US20110214841A1 (en) | 2010-03-04 | 2010-03-04 | Flat heat pipe structure |
Applications Claiming Priority (1)
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US12/717,932 US20110214841A1 (en) | 2010-03-04 | 2010-03-04 | Flat heat pipe structure |
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US20110214841A1 true US20110214841A1 (en) | 2011-09-08 |
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US12/717,932 Abandoned US20110214841A1 (en) | 2010-03-04 | 2010-03-04 | Flat heat pipe structure |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110174465A1 (en) * | 2010-01-15 | 2011-07-21 | Furui Precise Component (Kunshan) Co., Ltd. | Flat heat pipe with vapor channel |
US20130233519A1 (en) * | 2012-03-09 | 2013-09-12 | Foxconn Technology Co., Ltd. | Flat heat pipe |
US20130248152A1 (en) * | 2012-03-22 | 2013-09-26 | Foxconn Technology Co., Ltd. | Heat pipe with one wick structure supporting another wick structure in position |
US20160153722A1 (en) * | 2014-11-28 | 2016-06-02 | Delta Electronics, Inc. | Heat pipe |
US9618275B1 (en) * | 2012-05-03 | 2017-04-11 | Advanced Cooling Technologies, Inc. | Hybrid heat pipe |
US20170160018A1 (en) * | 2015-12-04 | 2017-06-08 | Tai-Sol Electronics Co., Ltd. | Heat pipe with fiber wick structure |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
EP3447382A1 (en) * | 2017-08-25 | 2019-02-27 | Delavan, Inc. | Heat transfer arrangements and method of making heat transfer arrangements |
CN110657696A (en) * | 2018-06-28 | 2020-01-07 | 泰硕电子股份有限公司 | Temperature equalizing plate for forming liquid-vapor channel by using capillary structure and salient points |
WO2020018484A1 (en) * | 2018-07-18 | 2020-01-23 | Thermal Corp. | Heat pipes having wick structures with variable permeability |
US11454456B2 (en) | 2014-11-28 | 2022-09-27 | Delta Electronics, Inc. | Heat pipe with capillary structure |
Citations (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3613774A (en) * | 1969-10-08 | 1971-10-19 | Sanders Associates Inc | Unilateral heat transfer apparatus |
US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
US3700028A (en) * | 1970-12-10 | 1972-10-24 | Noren Products Inc | Heat pipes |
US3714981A (en) * | 1971-02-03 | 1973-02-06 | Noren Prod Inc | Heat shield assembly |
US3749962A (en) * | 1972-03-24 | 1973-07-31 | Us Navy | Traveling wave tube with heat pipe cooling |
US3754594A (en) * | 1972-01-24 | 1973-08-28 | Sanders Associates Inc | Unilateral heat transfer apparatus |
US3911547A (en) * | 1972-10-26 | 1975-10-14 | Euratom | Process for the production of porous tubes having small pores |
US4162394A (en) * | 1977-07-12 | 1979-07-24 | Faccini Ernest C | Auxiliary evaporator for dual mode heat pipes |
US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US4683940A (en) * | 1986-07-16 | 1987-08-04 | Thermacore, Inc. | Unidirectional heat pipe |
US5029389A (en) * | 1987-12-14 | 1991-07-09 | Hughes Aircraft Company | Method of making a heat pipe with improved end cap |
US5123982A (en) * | 1990-06-29 | 1992-06-23 | The United States Of American As Represented By The United States Department Of Energy | Process of making cryogenically cooled high thermal performance crystal optics |
US5737923A (en) * | 1995-10-17 | 1998-04-14 | Marlow Industries, Inc. | Thermoelectric device with evaporating/condensing heat exchanger |
US20010047859A1 (en) * | 1997-12-08 | 2001-12-06 | Yoshio Ishida | Heat pipe and method for processing the same |
US6397935B1 (en) * | 1995-12-21 | 2002-06-04 | The Furukawa Electric Co. Ltd. | Flat type heat pipe |
US20020124995A1 (en) * | 2001-03-09 | 2002-09-12 | Seok-Hwan Moon | Heat pipe having woven-wire wick and straight-wire wick |
US20020170705A1 (en) * | 2001-05-15 | 2002-11-21 | Samsung Electronics Co., Ltd. | Evaporator of CPL cooling apparatus having fine wick structure |
US6874568B2 (en) * | 2002-07-26 | 2005-04-05 | Tai-Sol Electronics Co., Ltd. | Bottom fixation type integrated circuit chip cooling structure |
US6880626B2 (en) * | 2002-08-28 | 2005-04-19 | Thermal Corp. | Vapor chamber with sintered grooved wick |
US20050092467A1 (en) * | 2003-10-31 | 2005-05-05 | Hon Hai Precision Industry Co., Ltd. | Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe |
US20050167086A1 (en) * | 2003-06-26 | 2005-08-04 | Rosenfeld John H. | Brazed wick for a heat transfer device and method of making same |
US20050230085A1 (en) * | 2002-02-26 | 2005-10-20 | Mikros Manufacturing, Inc. | Capillary condenser/evaporator |
US20050247436A1 (en) * | 2004-04-23 | 2005-11-10 | Hul-Chun Hsu | Wick structure of heat pipe |
US20050269064A1 (en) * | 2004-06-02 | 2005-12-08 | Hul-Chun Hsu | Planar heat pipe structure |
US20060162905A1 (en) * | 2005-01-27 | 2006-07-27 | Hul-Chun Hsu | Heat pipe assembly |
US7086454B1 (en) * | 2005-03-28 | 2006-08-08 | Jaffe Limited | Wick structure of heat pipe |
US20070006993A1 (en) * | 2005-07-08 | 2007-01-11 | Jin-Gong Meng | Flat type heat pipe |
US20070114008A1 (en) * | 2005-11-18 | 2007-05-24 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070130769A1 (en) * | 2002-09-03 | 2007-06-14 | Moon Seok H | Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing |
US20070204974A1 (en) * | 2005-07-22 | 2007-09-06 | Ramesh Gupta | Heat pipe with controlled fluid charge |
US20070240858A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20070240857A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with capillary wick |
US20070246194A1 (en) * | 2006-04-21 | 2007-10-25 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20070251673A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat pipe with non-metallic type wick structure |
US20070267178A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070267179A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick and method of making the same |
US20070277963A1 (en) * | 2006-06-02 | 2007-12-06 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070284089A1 (en) * | 2006-05-31 | 2007-12-13 | Intel Corporation | Method, apparatus and system for carbon nanotube wick structures |
US20070295485A1 (en) * | 2006-06-21 | 2007-12-27 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070295494A1 (en) * | 2006-06-26 | 2007-12-27 | Celsia Technologies Korea Inc. | Flat Type Heat Transferring Device and Manufacturing Method of the Same |
US20070295484A1 (en) * | 2006-06-23 | 2007-12-27 | Hua-Hsin Tsai | Superconducting tube |
US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
US20080164010A1 (en) * | 2007-01-09 | 2008-07-10 | Shung-Wen Kang | Loop heat pipe with flat evaportor |
US20080185128A1 (en) * | 2005-04-19 | 2008-08-07 | Seok Hwan Moon | Flat Plate-Type Heat Pipe |
US20080185127A1 (en) * | 2007-02-06 | 2008-08-07 | Hul-Chun Hsu | Heat pipe body assembly having wick structure and method for disposing wick structure |
US20080210407A1 (en) * | 2005-01-06 | 2008-09-04 | Celsia Technologies Korea Inc. | Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick |
US20080245511A1 (en) * | 2007-04-09 | 2008-10-09 | Tai-Sol Electronics Co., Ltd. | Flat heat pipe |
US20080283223A1 (en) * | 2007-05-16 | 2008-11-20 | Industrial Technology Research Institute | Heat Dissipation System With A Plate Evaporator |
US20090071633A1 (en) * | 2007-09-13 | 2009-03-19 | Forcecon Technology Co., Ltd. | Heat pipe structure |
US20090084526A1 (en) * | 2007-09-28 | 2009-04-02 | Foxconn Technology Co., Ltd. | Heat pipe with composite wick structure |
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US7594537B2 (en) * | 2006-02-17 | 2009-09-29 | Foxconn Technology Co., Ltd. | Heat pipe with capillary wick |
US20120048516A1 (en) * | 2010-08-27 | 2012-03-01 | Forcecon Technology Co., Ltd. | Flat heat pipe with composite capillary structure |
US20120175084A1 (en) * | 2011-01-09 | 2012-07-12 | Chin-Hsing Horng | Heat pipe with a radial flow shunt design |
US20120180995A1 (en) * | 2011-01-18 | 2012-07-19 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and method of manufacturing same |
-
2010
- 2010-03-04 US US12/717,932 patent/US20110214841A1/en not_active Abandoned
Patent Citations (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3613774A (en) * | 1969-10-08 | 1971-10-19 | Sanders Associates Inc | Unilateral heat transfer apparatus |
US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
US3700028A (en) * | 1970-12-10 | 1972-10-24 | Noren Products Inc | Heat pipes |
US3714981A (en) * | 1971-02-03 | 1973-02-06 | Noren Prod Inc | Heat shield assembly |
US3754594A (en) * | 1972-01-24 | 1973-08-28 | Sanders Associates Inc | Unilateral heat transfer apparatus |
US3749962A (en) * | 1972-03-24 | 1973-07-31 | Us Navy | Traveling wave tube with heat pipe cooling |
US3911547A (en) * | 1972-10-26 | 1975-10-14 | Euratom | Process for the production of porous tubes having small pores |
US4162394A (en) * | 1977-07-12 | 1979-07-24 | Faccini Ernest C | Auxiliary evaporator for dual mode heat pipes |
US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
US4674565A (en) * | 1985-07-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe wick |
US4683940A (en) * | 1986-07-16 | 1987-08-04 | Thermacore, Inc. | Unidirectional heat pipe |
US5029389A (en) * | 1987-12-14 | 1991-07-09 | Hughes Aircraft Company | Method of making a heat pipe with improved end cap |
US5123982A (en) * | 1990-06-29 | 1992-06-23 | The United States Of American As Represented By The United States Department Of Energy | Process of making cryogenically cooled high thermal performance crystal optics |
US5737923A (en) * | 1995-10-17 | 1998-04-14 | Marlow Industries, Inc. | Thermoelectric device with evaporating/condensing heat exchanger |
US6397935B1 (en) * | 1995-12-21 | 2002-06-04 | The Furukawa Electric Co. Ltd. | Flat type heat pipe |
US20010047859A1 (en) * | 1997-12-08 | 2001-12-06 | Yoshio Ishida | Heat pipe and method for processing the same |
US20020179288A1 (en) * | 1997-12-08 | 2002-12-05 | Diamond Electric Mfg. Co., Ltd. | Heat pipe and method for processing the same |
US20020124995A1 (en) * | 2001-03-09 | 2002-09-12 | Seok-Hwan Moon | Heat pipe having woven-wire wick and straight-wire wick |
US20020170705A1 (en) * | 2001-05-15 | 2002-11-21 | Samsung Electronics Co., Ltd. | Evaporator of CPL cooling apparatus having fine wick structure |
US20050230085A1 (en) * | 2002-02-26 | 2005-10-20 | Mikros Manufacturing, Inc. | Capillary condenser/evaporator |
US6874568B2 (en) * | 2002-07-26 | 2005-04-05 | Tai-Sol Electronics Co., Ltd. | Bottom fixation type integrated circuit chip cooling structure |
US6880626B2 (en) * | 2002-08-28 | 2005-04-19 | Thermal Corp. | Vapor chamber with sintered grooved wick |
US20070130769A1 (en) * | 2002-09-03 | 2007-06-14 | Moon Seok H | Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing |
US20120175086A1 (en) * | 2003-06-26 | 2012-07-12 | Rosenfeld John H | Heat transfer device and method of making same |
US20050167086A1 (en) * | 2003-06-26 | 2005-08-04 | Rosenfeld John H. | Brazed wick for a heat transfer device and method of making same |
US20050189091A1 (en) * | 2003-06-26 | 2005-09-01 | Rosenfeld John H. | Brazed wick for a heat transfer device and method of making same |
US20050205243A1 (en) * | 2003-06-26 | 2005-09-22 | Rosenfeld John H | Brazed wick for a heat transfer device and method of making same |
US20050092467A1 (en) * | 2003-10-31 | 2005-05-05 | Hon Hai Precision Industry Co., Ltd. | Heat pipe operating fluid, heat pipe, and method for manufacturing the heat pipe |
US20050247436A1 (en) * | 2004-04-23 | 2005-11-10 | Hul-Chun Hsu | Wick structure of heat pipe |
US20050269064A1 (en) * | 2004-06-02 | 2005-12-08 | Hul-Chun Hsu | Planar heat pipe structure |
US7275588B2 (en) * | 2004-06-02 | 2007-10-02 | Hul-Chun Hsu | Planar heat pipe structure |
US20080210407A1 (en) * | 2005-01-06 | 2008-09-04 | Celsia Technologies Korea Inc. | Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick |
US20060162905A1 (en) * | 2005-01-27 | 2006-07-27 | Hul-Chun Hsu | Heat pipe assembly |
US7086454B1 (en) * | 2005-03-28 | 2006-08-08 | Jaffe Limited | Wick structure of heat pipe |
US20080185128A1 (en) * | 2005-04-19 | 2008-08-07 | Seok Hwan Moon | Flat Plate-Type Heat Pipe |
US20070006993A1 (en) * | 2005-07-08 | 2007-01-11 | Jin-Gong Meng | Flat type heat pipe |
US20070204974A1 (en) * | 2005-07-22 | 2007-09-06 | Ramesh Gupta | Heat pipe with controlled fluid charge |
US20070114008A1 (en) * | 2005-11-18 | 2007-05-24 | Foxconn Technology Co., Ltd. | Heat pipe |
US7594537B2 (en) * | 2006-02-17 | 2009-09-29 | Foxconn Technology Co., Ltd. | Heat pipe with capillary wick |
US20070240858A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20070240857A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with capillary wick |
US20070246194A1 (en) * | 2006-04-21 | 2007-10-25 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20070251673A1 (en) * | 2006-04-28 | 2007-11-01 | Foxconn Technology Co., Ltd. | Heat pipe with non-metallic type wick structure |
US20070267178A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070267179A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick and method of making the same |
US7802362B2 (en) * | 2006-05-19 | 2010-09-28 | Foxconn Technology Co., Ltd. | Method of making heat pipe having composite capillary wick |
US20070284089A1 (en) * | 2006-05-31 | 2007-12-13 | Intel Corporation | Method, apparatus and system for carbon nanotube wick structures |
US20070277963A1 (en) * | 2006-06-02 | 2007-12-06 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070295485A1 (en) * | 2006-06-21 | 2007-12-27 | Foxconn Technology Co., Ltd. | Heat pipe |
US20070295484A1 (en) * | 2006-06-23 | 2007-12-27 | Hua-Hsin Tsai | Superconducting tube |
US20070295494A1 (en) * | 2006-06-26 | 2007-12-27 | Celsia Technologies Korea Inc. | Flat Type Heat Transferring Device and Manufacturing Method of the Same |
US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
US20080164010A1 (en) * | 2007-01-09 | 2008-07-10 | Shung-Wen Kang | Loop heat pipe with flat evaportor |
US20080185127A1 (en) * | 2007-02-06 | 2008-08-07 | Hul-Chun Hsu | Heat pipe body assembly having wick structure and method for disposing wick structure |
US20080245511A1 (en) * | 2007-04-09 | 2008-10-09 | Tai-Sol Electronics Co., Ltd. | Flat heat pipe |
US20080283223A1 (en) * | 2007-05-16 | 2008-11-20 | Industrial Technology Research Institute | Heat Dissipation System With A Plate Evaporator |
US20090071633A1 (en) * | 2007-09-13 | 2009-03-19 | Forcecon Technology Co., Ltd. | Heat pipe structure |
US20090084526A1 (en) * | 2007-09-28 | 2009-04-02 | Foxconn Technology Co., Ltd. | Heat pipe with composite wick structure |
US7845394B2 (en) * | 2007-09-28 | 2010-12-07 | Foxconn Technology Co., Ltd. | Heat pipe with composite wick structure |
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US20120048516A1 (en) * | 2010-08-27 | 2012-03-01 | Forcecon Technology Co., Ltd. | Flat heat pipe with composite capillary structure |
US20120175084A1 (en) * | 2011-01-09 | 2012-07-12 | Chin-Hsing Horng | Heat pipe with a radial flow shunt design |
US20120180995A1 (en) * | 2011-01-18 | 2012-07-19 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and method of manufacturing same |
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