US20070251673A1 - Heat pipe with non-metallic type wick structure - Google Patents

Heat pipe with non-metallic type wick structure Download PDF

Info

Publication number
US20070251673A1
US20070251673A1 US11/309,569 US30956906A US2007251673A1 US 20070251673 A1 US20070251673 A1 US 20070251673A1 US 30956906 A US30956906 A US 30956906A US 2007251673 A1 US2007251673 A1 US 2007251673A1
Authority
US
United States
Prior art keywords
section
wick
heat pipe
casing
condensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/309,569
Inventor
Chuen-Shu Hou
Chao-Nien Tung
Tay-Jian Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Technology Co Ltd
Original Assignee
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Technology Co Ltd filed Critical Foxconn Technology Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOU, CHUEN-SHU, LIU, TAY-JIAN, TUNG, CHAO-NIEN
Publication of US20070251673A1 publication Critical patent/US20070251673A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

  • the present invention relates generally to a heat transfer apparatus, and more particularly to a heat pipe having a capillary wick made of non-metallic material.
  • heat pipes can transfer heat rapidly and therefore are widely used in various fields for heat dissipation purposes.
  • heat pipes are commonly used to transfer heat from heat-generating electronic components, such as central processing units (CPUs), to heat dissipating devices, such as heat sinks.
  • a heat pipe in accordance with the related art generally includes a sealed casing made of thermally conductive material with a working fluid contained in the casing. The working fluid is employed to carry heat from one end of the casing, typically called the “evaporating section”, to the other end of the casing, typically called the “condensing section”.
  • the working fluid receives heat from the electronic component and evaporates. Then, the generated vapor moves towards the condensing section of the heat pipe under the vapor pressure gradient between the two sections.
  • the condensing section the vapor is condensed to liquid state by releasing its latent heat to, for example, a heat sink attached to the condensing section. Thus, the heat is removed from the electronic component.
  • a capillary wick is generally provided on an inner surface of the casing in order to accelerate the return of the liquid.
  • the liquid is drawn back to the evaporating section by a capillary force developed by the capillary wick.
  • the capillary wick may be a plurality of fine grooves defined in its lengthwise direction of the casing, a fine-mesh wick, or a layer of sintered metal or ceramic powders.
  • these capillary wicks are generally made of metal material. These metallic-type capillary wicks generally cannot provide a low cost and a lightweight advantage to the heat pipes. Besides, the oxidation problem of the metal material may change surface tension of the metallic-type capillary wick, whereby quality of the heat pipes is difficult to control. Moreover, porosity of the metallic-type capillary wick is limited during manufacturing of the metallic-type capillary wick and, accordingly, the heat transfer efficiency of the heat pipe cannot be enhanced to a satisfied level.
  • a heat pipe in accordance with a preferred embodiment of the present invention includes a metal casing and a capillary wick arranged on an inner surface of the casing.
  • the casing has an evaporating section, a condensing section and a central section between the evaporating and condensing sections.
  • the capillary wick arranged at the central section is made of non-metallic material. The capillary wick at the central section of the casing provides a low cost and a lightweight to the heat pipe.
  • FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention
  • FIG. 2 is a longitudinal cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention
  • FIG. 3 is a longitudinal cross-sectional view of a heat pipe in accordance with a third embodiment of the present invention.
  • FIG. 4 is a longitudinal cross-sectional view of a heat pipe in accordance with a fourth embodiment of the present invention.
  • FIG. 5 is a longitudinal cross-sectional view of a heat pipe in accordance with a fifth embodiment of the present invention.
  • FIG. 1 illustrates a heat pipe in accordance with a first embodiment of the present invention.
  • the heat pipe comprises a metallic casing 100 and a capillary wick 200 arranged on an inner wall of the casing 100 .
  • a column-shaped vapor passage 300 is enclosed by an inner surface of the capillary wick 200 in a center of the casing 100 .
  • the casing 100 comprises an evaporating section 400 at one end, a condensing section 600 at an opposite end thereof, and a central section (i.e., adiabatic section) 500 located between the evaporating section 400 and the condensing section 600 .
  • the casing 100 is made of highly thermally conductive materials such as copper or copper alloys and filled with a working fluid (not shown) therein, which acts as a heat carrier for carrying thermal energy from the evaporating section 400 to the condensing section 600 .
  • Heat that needs to be dissipated is first transferred to the evaporating section 400 of the casing 100 to cause the working fluid therein to evaporate. Then, the heat is carried by the working fluid in the form of vapor to the condensing section 600 where the heat is released to ambient environment, thus condensing the vapor into liquid.
  • the condensed liquid is then brought back via the capillary wick 200 to the evaporating section 400 where it is again available for evaporation.
  • the capillary wick 200 is a composite wick and comprises a first wick segment 240 arranged at the evaporating section 400 , a second wick segment 250 located at the central section 500 which is made by organic material with macromolecule and a third wick segment 260 arranged at the condensing section 600 .
  • the first wick segment 240 and the third wick segment 260 each are a sintered-type wick or a mesh-type wick.
  • the capillary pore size of the first wick segment 240 is smaller than that of the third wick segment 260 and the porosity of the first wick segment 240 is larger than that of the third wick segment 260 so that the first wick segment 240 can contain more working fluid than the third wick segment 260 .
  • the second wick segment 250 is made of non-metallic material such as plastics, resin or a combination of plastics and resin so as to reduce weight of the heat pipe and enable the heat pipe to have a low cost.
  • the capillary pore size of the second wick segment 250 can be effectively controlled during manufacturing of the second wick segment 250 .
  • the porosity of the second wick segment 250 can be increased to increase the total porosity of the capillary wick 200 . Since more working fluid can be received in the heat pipe in accordance with the present invention, heat exchange between the heat pipe and a heat-generating electronic component such as a CPU can be improved and the heat transfer efficiency of the heat pipe can be enhanced, accordingly.
  • the capillary wick 200 has different characteristics at different sections of the heat pipe.
  • the third wick segment 260 has a relatively larger capillary pore size and therefore provides a relatively lower flow resistance to the condensed liquid to flow therethrough, and meanwhile, the first wick segment 240 has a relatively smaller average capillary pore size and accordingly develops a relatively larger capillary force to the liquid.
  • the third wick segment 260 reduces the flow resistance the condensed liquid encounters when flowing through the condensing and central sections 600 , 500 , and the first wick segment 240 has a large capillary force and therefore the liquid is then rapidly drawn back to the evaporating section 400 from the central section 500 as the liquid reaches to a position adjacent to the evaporating section 400 .
  • the condensed liquid is returned back from the condensing section 600 in an accelerated manner. After the condensed liquid is returned back to the evaporating section 400 , another phase-change cycle of the working fluid will then begin.
  • the thermal transfer cycle of the working fluid is accelerated and therefore the total heat transfer capacity of the heat pipe is enhanced.
  • other organic material such as wood fiber or cotton is feasible to make the second wick segment 250 .
  • FIG. 2 illustrates a heat pipe in accordance with a second embodiment of the present invention.
  • Main differences between the first and second embodiments are that a whole of the capillary wick 210 in the second embodiment is made of non-metallic material. As a result, the heat pipe can be very light. Additionally, formation of the capillary wick 210 does not require a high temperature process such as sintering; thus, oxidation of the metal casing can be avoided.
  • the other structure of the heat pipe of the second embodiment is similar to that of the first embodiment.
  • FIG. 3 illustrates a heat pipe in accordance with a third embodiment of the present invention.
  • a tube 700 is attached with an inner surface of the capillary wick 210 at the central section 510 of the casing 110 .
  • the vapor passage 310 is separated from the capillary wick 210 by the tube 700 . Because of an arrangement of the tube 700 attached on the capillary wick 210 at the central section 510 of the casing 110 , the vapor flows only along the vapor passage 310 toward the condensing section 610 and the liquid flows only in the capillary wick 210 towards the evaporating section 410 when they flow in the central section 510 .
  • the vapor and the liquid in the central section 510 are separated by the tube 700 , which can avoid the adverse contact between the vapor and liquid, wherein the vapor and the liquid flow in opposite directions.
  • the condensed working fluid from the condensing section 610 can smoothly reach the evaporating section 410 and is prevented from being heated by the high temperature vapor at the central section 510 .
  • Abilities of heat-absorption and heat-dissipation of the working fluid of the heat pipe is further enhanced and heat-transfer efficiency of the heat pipe is accordingly further improved.
  • FIG. 4 illustrates a heat pipe in accordance with a fourth embodiment of the present invention.
  • a thickness of the capillary wick 220 from the central section 520 to the condensing section 620 of the casing 120 is gradually decreased along a longitudinal direction of the casing 120 and the vapor passage 320 enclosed by the capillary wick 220 corresponding to the central section 520 and the condensing section 620 , is gradually increased in the longitudinal direction of the casing 120 .
  • the thinnest part of the capillary wick 220 is at the condensing section 620 of the casing 120 so as to provide a low flow resistance for the condensed liquid.
  • the working fluid in vapor at the condensing section 620 is quickly condensed and enters the capillary wick 220 .
  • the thickness of the capillary wick 220 at the evaporating section 420 is uniform.
  • the capillary wick 220 at the evaporating section 420 provides a large capillary wick force and absorbs more of the working fluid at the evaporating section 420 .
  • FIG. 5 illustrates a heat pipe in accordance with a fifth embodiment of the present invention.
  • a thickness of the capillary wick 230 at the central and condensing sections 530 , 630 of the casing 130 is uniform and thinner than that at the evaporating section 430 of the casing 130 .
  • the thickness of the capillary wick 230 at the evaporating section 430 is also uniform.
  • the vapor passage 330 enclosed by the capillary wick 230 at the central section 530 and the condensing section 630 has a diameter which is larger than that at the evaporating section 430 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe includes a casing (100) and a capillary wick (200) received in the casing. The casing has an evaporating section (400), a condensing section (600) and a central section (500) between the evaporating section and the condensing section. The capillary wick arranged at the central section is made of non-metallic material. The capillary wick at the central section of the casing provides a low cost and a lightweight to the heat pipe.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to a heat transfer apparatus, and more particularly to a heat pipe having a capillary wick made of non-metallic material.
  • DESCRIPTION OF RELATED ART
  • As a heat transfer apparatus, heat pipes can transfer heat rapidly and therefore are widely used in various fields for heat dissipation purposes. For example, in the electronics field, heat pipes are commonly used to transfer heat from heat-generating electronic components, such as central processing units (CPUs), to heat dissipating devices, such as heat sinks. A heat pipe in accordance with the related art generally includes a sealed casing made of thermally conductive material with a working fluid contained in the casing. The working fluid is employed to carry heat from one end of the casing, typically called the “evaporating section”, to the other end of the casing, typically called the “condensing section”. Specifically, when the evaporating section of a heat pipe is thermally attached to a heat-generating electronic component, the working fluid receives heat from the electronic component and evaporates. Then, the generated vapor moves towards the condensing section of the heat pipe under the vapor pressure gradient between the two sections. In the condensing section, the vapor is condensed to liquid state by releasing its latent heat to, for example, a heat sink attached to the condensing section. Thus, the heat is removed from the electronic component.
  • In order to rapidly return the condensed liquid back from the condensing section to the evaporating section to start another cycling of evaporation and condensation, a capillary wick is generally provided on an inner surface of the casing in order to accelerate the return of the liquid. In particular, the liquid is drawn back to the evaporating section by a capillary force developed by the capillary wick. The capillary wick may be a plurality of fine grooves defined in its lengthwise direction of the casing, a fine-mesh wick, or a layer of sintered metal or ceramic powders.
  • However, these capillary wicks are generally made of metal material. These metallic-type capillary wicks generally cannot provide a low cost and a lightweight advantage to the heat pipes. Besides, the oxidation problem of the metal material may change surface tension of the metallic-type capillary wick, whereby quality of the heat pipes is difficult to control. Moreover, porosity of the metallic-type capillary wick is limited during manufacturing of the metallic-type capillary wick and, accordingly, the heat transfer efficiency of the heat pipe cannot be enhanced to a satisfied level.
  • In view of the above-mentioned disadvantage of the heat pipe, there is a need for a heat pipe having good heat transfer.
  • SUMMARY OF THE INVENTION
  • A heat pipe in accordance with a preferred embodiment of the present invention includes a metal casing and a capillary wick arranged on an inner surface of the casing. The casing has an evaporating section, a condensing section and a central section between the evaporating and condensing sections. The capillary wick arranged at the central section is made of non-metallic material. The capillary wick at the central section of the casing provides a low cost and a lightweight to the heat pipe.
  • Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present apparatus and method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus and method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is a longitudinal cross-sectional view of a heat pipe in accordance with a first embodiment of the present invention;
  • FIG. 2 is a longitudinal cross-sectional view of a heat pipe in accordance with a second embodiment of the present invention;
  • FIG. 3 is a longitudinal cross-sectional view of a heat pipe in accordance with a third embodiment of the present invention;
  • FIG. 4 is a longitudinal cross-sectional view of a heat pipe in accordance with a fourth embodiment of the present invention; and
  • FIG. 5 is a longitudinal cross-sectional view of a heat pipe in accordance with a fifth embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 illustrates a heat pipe in accordance with a first embodiment of the present invention. The heat pipe comprises a metallic casing 100 and a capillary wick 200 arranged on an inner wall of the casing 100. A column-shaped vapor passage 300 is enclosed by an inner surface of the capillary wick 200 in a center of the casing 100. The casing 100 comprises an evaporating section 400 at one end, a condensing section 600 at an opposite end thereof, and a central section (i.e., adiabatic section) 500 located between the evaporating section 400 and the condensing section 600. The casing 100 is made of highly thermally conductive materials such as copper or copper alloys and filled with a working fluid (not shown) therein, which acts as a heat carrier for carrying thermal energy from the evaporating section 400 to the condensing section 600. Heat that needs to be dissipated is first transferred to the evaporating section 400 of the casing 100 to cause the working fluid therein to evaporate. Then, the heat is carried by the working fluid in the form of vapor to the condensing section 600 where the heat is released to ambient environment, thus condensing the vapor into liquid. The condensed liquid is then brought back via the capillary wick 200 to the evaporating section 400 where it is again available for evaporation.
  • The capillary wick 200 is a composite wick and comprises a first wick segment 240 arranged at the evaporating section 400, a second wick segment 250 located at the central section 500 which is made by organic material with macromolecule and a third wick segment 260 arranged at the condensing section 600. The first wick segment 240 and the third wick segment 260 each are a sintered-type wick or a mesh-type wick. The capillary pore size of the first wick segment 240 is smaller than that of the third wick segment 260 and the porosity of the first wick segment 240 is larger than that of the third wick segment 260 so that the first wick segment 240 can contain more working fluid than the third wick segment 260. The second wick segment 250 is made of non-metallic material such as plastics, resin or a combination of plastics and resin so as to reduce weight of the heat pipe and enable the heat pipe to have a low cost. The capillary pore size of the second wick segment 250 can be effectively controlled during manufacturing of the second wick segment 250. The porosity of the second wick segment 250 can be increased to increase the total porosity of the capillary wick 200. Since more working fluid can be received in the heat pipe in accordance with the present invention, heat exchange between the heat pipe and a heat-generating electronic component such as a CPU can be improved and the heat transfer efficiency of the heat pipe can be enhanced, accordingly.
  • In this embodiment, the capillary wick 200 has different characteristics at different sections of the heat pipe. The third wick segment 260 has a relatively larger capillary pore size and therefore provides a relatively lower flow resistance to the condensed liquid to flow therethrough, and meanwhile, the first wick segment 240 has a relatively smaller average capillary pore size and accordingly develops a relatively larger capillary force to the liquid. As a result, the third wick segment 260 reduces the flow resistance the condensed liquid encounters when flowing through the condensing and central sections 600, 500, and the first wick segment 240 has a large capillary force and therefore the liquid is then rapidly drawn back to the evaporating section 400 from the central section 500 as the liquid reaches to a position adjacent to the evaporating section 400. The condensed liquid is returned back from the condensing section 600 in an accelerated manner. After the condensed liquid is returned back to the evaporating section 400, another phase-change cycle of the working fluid will then begin. Thus, as a whole, the thermal transfer cycle of the working fluid is accelerated and therefore the total heat transfer capacity of the heat pipe is enhanced. Alternatively, other organic material, such as wood fiber or cotton is feasible to make the second wick segment 250.
  • FIG. 2 illustrates a heat pipe in accordance with a second embodiment of the present invention. Main differences between the first and second embodiments are that a whole of the capillary wick 210 in the second embodiment is made of non-metallic material. As a result, the heat pipe can be very light. Additionally, formation of the capillary wick 210 does not require a high temperature process such as sintering; thus, oxidation of the metal casing can be avoided. The other structure of the heat pipe of the second embodiment is similar to that of the first embodiment.
  • FIG. 3 illustrates a heat pipe in accordance with a third embodiment of the present invention. Main differences between the third and second embodiments are that in the third embodiment a tube 700 is attached with an inner surface of the capillary wick 210 at the central section 510 of the casing 110. The vapor passage 310 is separated from the capillary wick 210 by the tube 700. Because of an arrangement of the tube 700 attached on the capillary wick 210 at the central section 510 of the casing 110, the vapor flows only along the vapor passage 310 toward the condensing section 610 and the liquid flows only in the capillary wick 210 towards the evaporating section 410 when they flow in the central section 510. The vapor and the liquid in the central section 510 are separated by the tube 700, which can avoid the adverse contact between the vapor and liquid, wherein the vapor and the liquid flow in opposite directions. Thus, the condensed working fluid from the condensing section 610 can smoothly reach the evaporating section 410 and is prevented from being heated by the high temperature vapor at the central section 510. Abilities of heat-absorption and heat-dissipation of the working fluid of the heat pipe is further enhanced and heat-transfer efficiency of the heat pipe is accordingly further improved.
  • FIG. 4 illustrates a heat pipe in accordance with a fourth embodiment of the present invention. Main differences between the fourth and second embodiments are that in the fourth embodiment a thickness of the capillary wick 220 from the central section 520 to the condensing section 620 of the casing 120 is gradually decreased along a longitudinal direction of the casing 120 and the vapor passage 320 enclosed by the capillary wick 220 corresponding to the central section 520 and the condensing section 620, is gradually increased in the longitudinal direction of the casing 120. The thinnest part of the capillary wick 220 is at the condensing section 620 of the casing 120 so as to provide a low flow resistance for the condensed liquid. The working fluid in vapor at the condensing section 620 is quickly condensed and enters the capillary wick 220. The thickness of the capillary wick 220 at the evaporating section 420 is uniform. The capillary wick 220 at the evaporating section 420 provides a large capillary wick force and absorbs more of the working fluid at the evaporating section 420.
  • FIG. 5 illustrates a heat pipe in accordance with a fifth embodiment of the present invention. Main differences between the fifth and fourth embodiments are that in the fifth embodiment a thickness of the capillary wick 230 at the central and condensing sections 530, 630 of the casing 130 is uniform and thinner than that at the evaporating section 430 of the casing 130. The thickness of the capillary wick 230 at the evaporating section 430 is also uniform. The vapor passage 330 enclosed by the capillary wick 230 at the central section 530 and the condensing section 630 has a diameter which is larger than that at the evaporating section 430.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (19)

1. A heat pipe comprising:
a metal casing containing a working fluid therein, the casing comprising an evaporating section at one end and a condensing section at an opposite end thereof, and a central section located between the evaporating section and the condensing section;
a capillary wick arranged on an inner wall of the casing and comprising a first wick segment corresponding to the evaporating section, a second wick segment corresponding to the central section and a third wick segment corresponding to the condensing section; and
a vapor passage formed inside of the casing and enclosed by the capillary wick; wherein the second wick segment arranged at the central section of the casing is made of non-metallic material.
2. The heat pipe of claim 1, wherein the non-metallic material is an organic material.
3. The heat pipe of claim 1, wherein the non-metallic material is one of plastics, resin, wood fiber and cotton.
4. The heat pipe of claim 1, wherein the first wick segment arranged at the evaporating section is a sintered-type wick and the third wick segment arranged at the condensing section is one of a sintered-type wick and a mesh-type wick.
5. The heat pipe of claim 4, wherein a capillary pore size of the first wick segment at the evaporating section is smaller than that of the third wick segment at the condensing section.
6. The heat pipe of claim 1, wherein the first and third wick segments arranged at the evaporating and condensing sections of the casing are also made of non-metallic material.
7. The heat pipe of claim 1, further comprising a tube attached with an inner surface of the second wick segment at the central section of the casing.
8. The heat pipe of claim 6, wherein thicknesses of the second and third wick segments from the central section to the condensing section of the casing are gradually decreased and a diameter of the vapor passage is gradually increased therealong.
9. The heat pipe of claim 6, wherein thicknesses of the second and third wick segments corresponding to the central and condensing sections of the casing are thinner than a thickness of the first wick segment corresponding to the evaporating section of the casing.
10. The heat pipe of claim 9, wherein the vapor passage corresponding to the central and condensing sections of the casing has a diameter which is larger than that corresponding to the evaporating section of the casing.
11. The heat pipe of claim 10, wherein the thicknesses of the second and third wick segments corresponding to the central and condensing sections of the casing are uniform.
12. A heat pipe comprising:
a metallic, tubular casing having an evaporating section for receiving heat, a condensing section for releasing the heat and an adiabatic section between the evaporating and condensing sections; and
a capillary wick arranged on an inner wall of the casing;
wherein at least a part of the capillary wick corresponding to one of the evaporating, condensing and adiabatic sections of the casing is made of non-metallic material.
13. The heat pipe of claim 12, wherein the part of the capillary wick is correspondent to the adiabatic section of the casing.
14. The heat pipe of claim 12, wherein a whole the capillary wick is made of non-metallic material.
15. The heat pipe of claim 14, wherein a tube is attached to an inner face of the capillary wick at a portion thereof corresponding to the adiabatic section.
16. The heat pipe of claim 14, wherein the capillary wick at the adiabatic and condensing sections has a gradually decreased thickness along a direction from the adiabatic section toward the condensing section.
17. The heat pipe of claim 14, wherein the capillary wick at the adiabatic and condensing sections has a thickness smaller than that at the evaporating section.
18. The heat pipe of claim 12, wherein the non-metallic material is chosen from one of plastics and resin.
19. The heat pipe of claim 12, wherein the non-metallic material is chosen from one of wood fiber and cotton.
US11/309,569 2006-04-28 2006-08-24 Heat pipe with non-metallic type wick structure Abandoned US20070251673A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200610060511.8 2006-04-28
CNB2006100605118A CN100480612C (en) 2006-04-28 2006-04-28 Heat pipe

Publications (1)

Publication Number Publication Date
US20070251673A1 true US20070251673A1 (en) 2007-11-01

Family

ID=38647238

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/309,569 Abandoned US20070251673A1 (en) 2006-04-28 2006-08-24 Heat pipe with non-metallic type wick structure

Country Status (2)

Country Link
US (1) US20070251673A1 (en)
CN (1) CN100480612C (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100139893A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber
US20100212870A1 (en) * 2009-02-26 2010-08-26 Furui Precise Component (Kunshan) Co., Ltd. Flat heat pipe
US20100266864A1 (en) * 2009-04-16 2010-10-21 Yeh-Chiang Technology Corp. Ultra-thin heat pipe
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
US20110296811A1 (en) * 2010-06-03 2011-12-08 Rolls-Royce Plc Heat transfer arrangement for fluid-washed surfaces
US20130233519A1 (en) * 2012-03-09 2013-09-12 Foxconn Technology Co., Ltd. Flat heat pipe
US20140138059A1 (en) * 2012-11-20 2014-05-22 Lockheed Martin Corporation Heat pipe with axial wick
US20140150997A1 (en) * 2012-11-30 2014-06-05 Industrial Technology Research Institute Heat pipe and processing method thereof
US20140166244A1 (en) * 2012-12-17 2014-06-19 Foxconn Technology Co., Ltd. Flat heat pipe and method for manufacturing the same
US20140166245A1 (en) * 2012-12-14 2014-06-19 Foxconn Technology Co., Ltd. Flat heat spreader and method for manufacturing the same
US20140174085A1 (en) * 2012-12-21 2014-06-26 Elwha LLC. Heat engine
US20140174086A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat engine system
WO2014099806A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat pipe
US20140290914A1 (en) * 2013-03-26 2014-10-02 Asustek Computer Inc. Heat pipe structure
US20160010927A1 (en) * 2014-07-14 2016-01-14 Fujikura Ltd. Heat transport device
US9603233B2 (en) 2010-11-11 2017-03-21 Schlumberger Technology Corporation Particle accelerator with a heat pipe supporting components of a high voltage power supply
US9752832B2 (en) 2012-12-21 2017-09-05 Elwha Llc Heat pipe
JP6302116B1 (en) * 2017-04-12 2018-03-28 古河電気工業株式会社 heat pipe
EP3319096A1 (en) * 2016-11-07 2018-05-09 Premo, S.L. A compact magnetic power unit
US10337730B2 (en) * 2013-09-05 2019-07-02 Pro-Iroda Industries, Inc. Wick of flame device
WO2020252555A1 (en) * 2019-06-17 2020-12-24 Huawei Technologies Co., Ltd Heat transfer device and method for manufacturing such a heat transfer device
WO2022097417A1 (en) * 2020-11-04 2022-05-12 株式会社村田製作所 Heat spreading device
US20220187025A1 (en) * 2020-12-15 2022-06-16 Champ Tech Optical (Foshan) Corporation Heat pipe, method for manufacturing the same, and device
US20220266772A1 (en) * 2021-02-19 2022-08-25 Volvo Truck Corporation Noise shield arrangement comprising a thermally conductive element
CN115348805A (en) * 2022-08-16 2022-11-15 昆明理工大学 Gradual-change type liquid absorption core flat micro heat pipe and preparation method thereof
US20230087840A1 (en) * 2018-07-18 2023-03-23 Aavid Thermal Corp. Heat pipes having wick structures with variable permeability

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102829659B (en) * 2012-08-22 2014-04-02 华南理工大学 Micro-crack flat heat pipe and manufacturing method thereof
CN108871025A (en) * 2018-07-04 2018-11-23 江苏凯唯迪科技有限公司 A kind of flaring heat pipe and preparation method thereof
CN108827050A (en) * 2018-07-04 2018-11-16 江苏凯唯迪科技有限公司 A kind of heat pipe of different tube diameters and preparation method thereof
CN111473669B (en) * 2020-04-07 2021-03-16 西安交通大学 Liquid metal high-temperature heat pipe
CN112197629B (en) * 2020-09-03 2021-08-24 华东师范大学 Carbon-based capillary core and preparation method and application thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184477A (en) * 1977-05-03 1980-01-22 Yuan Shao W Solar heating and storage
US5603375A (en) * 1991-02-01 1997-02-18 Commonwealth Scientific And Industrial Research Organisation Heat transfer device
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
US6564860B1 (en) * 2000-05-16 2003-05-20 Swales Aerospace Evaporator employing a liquid superheat tolerant wick
US20060162906A1 (en) * 2005-01-21 2006-07-27 Chu-Wan Hong Heat pipe with screen mesh wick structure
US20060162907A1 (en) * 2005-01-21 2006-07-27 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
US20060283575A1 (en) * 2005-06-16 2006-12-21 Yuh-Cheng Chemical Ltd. Heat pipe
US20070056712A1 (en) * 2005-09-09 2007-03-15 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20070102143A1 (en) * 2005-11-04 2007-05-10 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20070193723A1 (en) * 2006-02-17 2007-08-23 Foxconn Technology Co., Ltd. Heat pipe with capillary wick
US20070240858A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070246194A1 (en) * 2006-04-21 2007-10-25 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1015409B (en) * 1973-08-14 1977-05-10 Jermyn T PERFECTED DEVICE FOR HEAT CONDUCTIVE
CN100344931C (en) * 2003-12-05 2007-10-24 鸿富锦精密工业(深圳)有限公司 Heat pipe
CN2704925Y (en) * 2004-06-07 2005-06-15 华音电器股份有限公司 Improved radiator structure of hot pipe
CN2735283Y (en) * 2004-09-15 2005-10-19 大连熵立得传热技术有限公司 Heat pipe heat column with conical wick

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184477A (en) * 1977-05-03 1980-01-22 Yuan Shao W Solar heating and storage
US5603375A (en) * 1991-02-01 1997-02-18 Commonwealth Scientific And Industrial Research Organisation Heat transfer device
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
US6564860B1 (en) * 2000-05-16 2003-05-20 Swales Aerospace Evaporator employing a liquid superheat tolerant wick
US20060162906A1 (en) * 2005-01-21 2006-07-27 Chu-Wan Hong Heat pipe with screen mesh wick structure
US20060162907A1 (en) * 2005-01-21 2006-07-27 Foxconn Technology Co., Ltd. Heat pipe with sintered powder wick
US20060283575A1 (en) * 2005-06-16 2006-12-21 Yuh-Cheng Chemical Ltd. Heat pipe
US20070056712A1 (en) * 2005-09-09 2007-03-15 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20070102143A1 (en) * 2005-11-04 2007-05-10 Delta Electronics, Inc. Heat dissipation module and heat pipe thereof
US20070193723A1 (en) * 2006-02-17 2007-08-23 Foxconn Technology Co., Ltd. Heat pipe with capillary wick
US20070240858A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070246194A1 (en) * 2006-04-21 2007-10-25 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100139893A1 (en) * 2008-12-10 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber
US20100212870A1 (en) * 2009-02-26 2010-08-26 Furui Precise Component (Kunshan) Co., Ltd. Flat heat pipe
US20130037244A1 (en) * 2009-02-26 2013-02-14 Sheng-Lin Wu Flat heat pipe
US20100266864A1 (en) * 2009-04-16 2010-10-21 Yeh-Chiang Technology Corp. Ultra-thin heat pipe
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
US20110296811A1 (en) * 2010-06-03 2011-12-08 Rolls-Royce Plc Heat transfer arrangement for fluid-washed surfaces
US8915058B2 (en) * 2010-06-03 2014-12-23 Rolls-Royce Plc Heat transfer arrangement for fluid-washed surfaces
US9603233B2 (en) 2010-11-11 2017-03-21 Schlumberger Technology Corporation Particle accelerator with a heat pipe supporting components of a high voltage power supply
US20130233519A1 (en) * 2012-03-09 2013-09-12 Foxconn Technology Co., Ltd. Flat heat pipe
US10538345B2 (en) 2012-11-20 2020-01-21 Lockheed Martin Corporation Heat pipe with axial wick
US11745901B2 (en) 2012-11-20 2023-09-05 Lockheed Martin Corporation Heat pipe with axial wick
US9315280B2 (en) * 2012-11-20 2016-04-19 Lockheed Martin Corporation Heat pipe with axial wick
US20140138059A1 (en) * 2012-11-20 2014-05-22 Lockheed Martin Corporation Heat pipe with axial wick
US20140150997A1 (en) * 2012-11-30 2014-06-05 Industrial Technology Research Institute Heat pipe and processing method thereof
US20140166245A1 (en) * 2012-12-14 2014-06-19 Foxconn Technology Co., Ltd. Flat heat spreader and method for manufacturing the same
US20140166244A1 (en) * 2012-12-17 2014-06-19 Foxconn Technology Co., Ltd. Flat heat pipe and method for manufacturing the same
US9404392B2 (en) * 2012-12-21 2016-08-02 Elwha Llc Heat engine system
US20140174086A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat engine system
US20140174085A1 (en) * 2012-12-21 2014-06-26 Elwha LLC. Heat engine
WO2014099806A1 (en) * 2012-12-21 2014-06-26 Elwha Llc Heat pipe
US9752832B2 (en) 2012-12-21 2017-09-05 Elwha Llc Heat pipe
US10358945B2 (en) * 2012-12-21 2019-07-23 Elwha Llc Heat engine system
US20140290914A1 (en) * 2013-03-26 2014-10-02 Asustek Computer Inc. Heat pipe structure
US10337730B2 (en) * 2013-09-05 2019-07-02 Pro-Iroda Industries, Inc. Wick of flame device
US20160010927A1 (en) * 2014-07-14 2016-01-14 Fujikura Ltd. Heat transport device
EP3319096A1 (en) * 2016-11-07 2018-05-09 Premo, S.L. A compact magnetic power unit
JP2018179403A (en) * 2017-04-12 2018-11-15 古河電気工業株式会社 Heat pipe
JP6302116B1 (en) * 2017-04-12 2018-03-28 古河電気工業株式会社 heat pipe
US11828539B2 (en) 2017-04-12 2023-11-28 Furukawa Electric Co., Ltd. Heat pipe
US11415373B2 (en) 2017-04-12 2022-08-16 Furukawa Electric Co., Ltd. Heat pipe
US20230087840A1 (en) * 2018-07-18 2023-03-23 Aavid Thermal Corp. Heat pipes having wick structures with variable permeability
WO2020252555A1 (en) * 2019-06-17 2020-12-24 Huawei Technologies Co., Ltd Heat transfer device and method for manufacturing such a heat transfer device
WO2022097417A1 (en) * 2020-11-04 2022-05-12 株式会社村田製作所 Heat spreading device
US11725884B2 (en) * 2020-12-15 2023-08-15 Champ Tech Optical (Foshan) Corporation Heat pipe, method for manufacturing the same, and device
US20220187025A1 (en) * 2020-12-15 2022-06-16 Champ Tech Optical (Foshan) Corporation Heat pipe, method for manufacturing the same, and device
US20230332842A1 (en) * 2020-12-15 2023-10-19 Champ Tech Optical (Foshan) Corporation Heat pipe and device
US20220266772A1 (en) * 2021-02-19 2022-08-25 Volvo Truck Corporation Noise shield arrangement comprising a thermally conductive element
CN115348805A (en) * 2022-08-16 2022-11-15 昆明理工大学 Gradual-change type liquid absorption core flat micro heat pipe and preparation method thereof

Also Published As

Publication number Publication date
CN100480612C (en) 2009-04-22
CN101063597A (en) 2007-10-31

Similar Documents

Publication Publication Date Title
US20070251673A1 (en) Heat pipe with non-metallic type wick structure
US20070240858A1 (en) Heat pipe with composite capillary wick structure
US20070246194A1 (en) Heat pipe with composite capillary wick structure
US20070240855A1 (en) Heat pipe with composite capillary wick structure
US7520315B2 (en) Heat pipe with capillary wick
US20060207750A1 (en) Heat pipe with composite capillary wick structure
US7594537B2 (en) Heat pipe with capillary wick
US7445039B2 (en) Heat pipe with multiple vapor-passages
US7866373B2 (en) Heat pipe with multiple wicks
US20070107878A1 (en) Heat pipe with a tube therein
US7802362B2 (en) Method of making heat pipe having composite capillary wick
US7845394B2 (en) Heat pipe with composite wick structure
US7866374B2 (en) Heat pipe with capillary wick
US7472479B2 (en) Heat pipe and method of producing the same
US20070267178A1 (en) Heat pipe
US20090020269A1 (en) Heat pipe with composite wick structure
US20070240856A1 (en) Heat pipe
US20060162907A1 (en) Heat pipe with sintered powder wick
US20080078530A1 (en) Loop heat pipe with flexible artery mesh
US20190154353A1 (en) Heat pipe having a wick with a hybrid profile
Egbo A review of the thermal performance of vapor chambers and heat sinks: Critical heat flux, thermal resistances, and surface temperatures
US20090166004A1 (en) Heat pipe
EP2713132A1 (en) A vapor-based heat transfer apparatus
US8622117B2 (en) Heat pipe including a main wick structure and at least one auxiliary wick structure
US20070089864A1 (en) Heat pipe with composite wick structure

Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOU, CHUEN-SHU;TUNG, CHAO-NIEN;LIU, TAY-JIAN;REEL/FRAME:018165/0859

Effective date: 20060815

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION