CN113645817A - Circuit module with liquid cooling heat radiation structure and electronic equipment - Google Patents
Circuit module with liquid cooling heat radiation structure and electronic equipment Download PDFInfo
- Publication number
- CN113645817A CN113645817A CN202111073265.0A CN202111073265A CN113645817A CN 113645817 A CN113645817 A CN 113645817A CN 202111073265 A CN202111073265 A CN 202111073265A CN 113645817 A CN113645817 A CN 113645817A
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- heat dissipation
- circuit module
- cavity
- chamber
- housing
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- 239000007788 liquid Substances 0.000 title claims abstract description 10
- 238000001816 cooling Methods 0.000 title claims abstract description 9
- 230000005855 radiation Effects 0.000 title claims description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 175
- 239000002826 coolant Substances 0.000 claims abstract description 44
- 238000007789 sealing Methods 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 239000000110 cooling liquid Substances 0.000 claims description 9
- 239000012071 phase Substances 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The embodiment of the application discloses a circuit module with a liquid cooling heat dissipation structure and electronic equipment. The circuit module comprises a first heat dissipation shell, a second heat dissipation shell and a circuit module main body, at least part of the circuit module main body is located between the first heat dissipation shell and the second heat dissipation shell, a first cavity is formed between the circuit module main body and the first heat dissipation shell, a second cavity is formed between the circuit module main body and the second heat dissipation shell, a coolant is filled in the first cavity and/or the second cavity, and the first cavity is communicated with the second cavity. This application directly sets up first heat dissipation casing and second heat dissipation casing in the circuit module main part, so, first heat dissipation casing and second heat dissipation casing only need cover and establish part or whole circuit module main part and can reach the radiating effect, compare in the coolant liquid with whole equipment submergence in heat dissipation casing among the correlation technique, the size can set up less, is fit for applying to in the limited miniaturized electronic equipment in space.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a circuit module with a liquid cooling heat dissipation structure and electronic equipment.
Background
With the increasing demands of consumers on various electronic devices, the electronic devices are gradually developing towards small and portable. However, after the volume of the electronic device is reduced, the installation space for installing the electronic components in the electronic device is also reduced, so that the arrangement of the electronic components is more compact, heat dissipation is not facilitated, and the problem that the electronic components are burnt due to overhigh temperature is easily caused.
Disclosure of Invention
The application provides a circuit module with a liquid cooling heat dissipation structure and electronic equipment, which are used for solving the problem that electronic elements are not easy to dissipate heat and are easily burnt due to overhigh temperature after the volume of the electronic equipment is reduced in the related art.
In a first aspect, the present application provides a circuit module with a liquid cooling heat dissipation structure, including:
a first heat dissipation housing;
the second heat dissipation shell is arranged opposite to the first heat dissipation shell;
the circuit module comprises a circuit module main body, at least part of the circuit module main body is located between the first heat dissipation shell and the second heat dissipation shell, a first cavity is formed between the circuit module main body and the first heat dissipation shell, a second cavity is formed between the circuit module main body and the second heat dissipation shell, a coolant is filled in the first cavity and/or the second cavity, and the first cavity is communicated with the second cavity.
In a second aspect, the present application provides an electronic device including the above circuit module with a liquid-cooled heat dissipation structure.
The circuit module and the electronic equipment with the liquid cooling heat dissipation structure have the advantages that the two heat dissipation shells are arranged, the circuit module main body is arranged between the first heat dissipation shell and the second heat dissipation shell, and the coolant is introduced into the first cavity and the second cavity formed by the circuit module main body and the first heat dissipation shell and the second heat dissipation shell, so that the heat generated by the circuit module main body can be brought to the first heat dissipation shell and the second heat dissipation shell through the coolant to be dissipated, and the circuit module main body is cooled. This application can promote the radiating efficiency of circuit module main part through setting up two heat dissipation casings and two cavities, avoids appearing the problem that electronic component burns out because of the high temperature. In addition, this application directly sets up first heat dissipation casing and second heat dissipation casing in the circuit module main part, so, first heat dissipation casing and second heat dissipation casing only need cover establish some or all circuit module main parts can, compare in the cooling liquid with whole electronic equipment submergence in heat dissipation casing among the correlation technique, the size can set up less, is fit for applying to in the limited miniaturized electronic equipment in space.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a perspective view of a first circuit module provided in an embodiment of the present application;
fig. 2 is a perspective exploded view of the circuit module shown in fig. 1;
FIG. 3 is a cross-sectional view of the circuit module shown in FIG. 1;
FIG. 4 is a cross-sectional view of a second circuit module provided by an embodiment of the present application;
FIG. 5 is a cross-sectional view of a third circuit module provided by an embodiment of the present application;
fig. 6 is a first cross-sectional view of a sealing plug and a portion of a first heat dissipation housing in a circuit module according to an embodiment of the present application;
fig. 7 is a second cross-sectional view of a sealing plug and a portion of a first heat dissipation housing in a circuit module according to an embodiment of the present application;
fig. 8 is a perspective view of a fourth circuit module according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.
In a first aspect, please refer to fig. 1, an embodiment of the present application provides a circuit module 100 with a liquid-cooled heat dissipation structure, and specifically, the circuit module 100 may include a circuit module main body 110 and a heat dissipation structure 120. The circuit module body 110 may be wholly or partially located in the heat dissipation structure 120, so that the portion of the circuit module body 110 located in the heat dissipation structure 120 may dissipate heat through the heat dissipation structure 120.
Referring to fig. 2, the circuit module body 110 may be a device including an electronic component 112. The electronic component 112 may be a chip, a resistor, a capacitor, or the like. Since the circuit module main body 110 has a smaller size than the entire electronic device, the size of the heat dissipation structure 120 for partially or entirely dissipating heat from the circuit module main body 110 can be set smaller, and the heat dissipation structure is suitable for use in a miniaturized electronic device.
When the circuit module main body 110 is entirely located in the heat dissipation structure 120, heat dissipation of the entire circuit module main body 110 can be achieved through the heat dissipation structure 120. When the circuit module body 110 is partially disposed in the heat dissipation structure 120, the size of the heat dissipation structure 120 can be reduced compared to the case where the circuit module body 110 is entirely disposed in the heat dissipation structure 120, so as to achieve a miniaturized design of the circuit module 100. Preferably, when the circuit module main body 110 is partially located in the heat dissipation structure 120, a portion of the circuit module main body 110 that is easy to generate heat can be located in the heat dissipation structure 120, so as to dissipate heat of the circuit module main body 110 in a targeted manner, thereby preventing the electronic component 112 from being burned due to high temperature.
In an exemplary embodiment, the heat dissipation structure 120 may include a first heat dissipation housing 121 and a second heat dissipation housing 122 disposed opposite to the first heat dissipation housing 121, and at least a portion of the circuit module body 110 may be located between the first heat dissipation housing 121 and the second heat dissipation housing 122. Referring to fig. 3, a first chamber 123 is formed between the circuit module body 110 and the first heat dissipation housing 121, a second chamber 124 is formed between the circuit module body and the second heat dissipation housing 122, and the first chamber 123 and/or the second chamber 124 may be filled with a coolant. In this way, the heat generated by the circuit module main body 110 can be carried to the first heat dissipation housing 121 and the second heat dissipation housing 122 via the coolant to be dissipated, so as to cool the circuit module main body 110. By providing two heat dissipation housings and two chambers, the heat dissipation efficiency of the circuit module body 110 can be improved, and the problem of burning of the electronic component 112 due to an excessive temperature can be avoided. In addition, the first heat dissipation case 121 and the second heat dissipation case 122 are directly disposed on the circuit module main body 110, so that the first heat dissipation case 121 and the second heat dissipation case 122 only need to cover part or all of the circuit module main body 110, and compared with the cooling liquid in the related art in which the whole electronic device is immersed in the heat dissipation case, the size of the cooling liquid is smaller, and the cooling liquid is suitable for being applied to a miniaturized electronic device with limited space.
In some exemplary aspects, the first chamber 123 may be in communication with the second chamber 124. The first chamber 123 is communicated with the second chamber 124, so that the coolant can flow through the first chamber 123 and the second chamber 124, and thus, the heat generated at one side of the circuit module main body 110 can be brought to the other side of the circuit module main body 110 through the coolant, the communication holes 1114 of the first chamber 123 and the second chamber 124, and further, the heat dissipation performance of the heat dissipation shells at two sides can be better exerted, and the heat dissipation efficiency is improved. Compared with a structure with a fixed form such as a heat conducting pad, the cooling liquid has stronger permeability, and the contact area with the circuit module main body 110 is larger, so that the heat conducting effect is better.
It should be noted that "and/or" describes the association relationship of the associated object, and indicates that three relationships may exist; e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. As described above, the filling of the first chamber 123 and/or the second chamber 124 with the coolant includes three cases in which the first chamber 123 is filled with the coolant, the second chamber 124 is filled with the coolant, and the first chamber 123 and the second chamber 124 are both filled with the coolant. Since the first chamber 123 is communicated with the second chamber 124, the coolant can flow through both the first chamber 123 and the second chamber 124, and therefore, the coolant filled in the first chamber 123 may be: the coolant may be entirely located in the first chamber 123 in a state that the amount of the coolant does not exceed the capacity of the first chamber 123; the coolant filled in the second chamber 124 may be: the coolant may be entirely within the second chamber 124 under certain conditions, i.e., the amount of coolant does not exceed the capacity of the second chamber 124; the first chamber 123 and the second chamber 124 are filled with coolant, and the coolant may be: the first chamber 123 and the second chamber 124 are filled with coolant in any state.
Preferably, the first cavity 123 and the second cavity 124 may be filled with a coolant, so that a portion of the circuit module body 110 located in the heat dissipation structure 120 can be immersed in the coolant all the time, and the heat dissipation effect is improved.
In some exemplary aspects, the circuit module body 110 may further include a circuit board 111, and the electronic component 112 may be electrically connected to the circuit board 111. At least a portion of the circuit board 111 may be located between the first heat dissipation housing 121 and the second heat dissipation housing 122, and a first chamber 123 is formed between the circuit board and the first heat dissipation housing 121, and a second chamber 124 is formed between the circuit board and the second heat dissipation housing 122. The electronic component 112 may be located within the first chamber 123 and/or the second chamber 124 and submerged in the cooling fluid. In use, heat on the circuit module body 110 mainly comes from the electronic component 112 (e.g., a chip, etc.), and therefore, the electronic component 112, which is easy to generate heat, can be disposed in the first cavity 123 and/or the second cavity 124, so that the heat dissipation structure 120 can better exert heat dissipation performance.
The circuit board 111 is substantially a thin plate structure. The circuit board 111 may include a first portion 1111 located between the first heat dissipation case 121 and the second heat dissipation case 122, and the first portion 1111 may have a first surface 1112 facing the first heat dissipation case 121 and a second surface 1113 facing the second heat dissipation case 122.
The first surface 1112 and/or the second surface 1113 may be provided with electronic components 112.
To enable communication between the first chamber 123 and the second chamber 124, in an exemplary aspect, the first portion 1111 may be provided with at least one through hole 1114 that penetrates the first surface 1112 and the second surface 1113, and the first chamber 123 and the second chamber 124 may communicate via the through hole 1114. In this way, the through hole 1114 may be disposed at a position corresponding to the electronic component 112 on the first portion 1111, so that the cooling liquid can absorb and dissipate heat at the electronic component 112 in time.
The number of the through holes 1114 on the first portion 1111 may be one or more. Preferably, the number of the through holes 1114 on the first portion 1111 may be plural, so as to make the circulation of the cooling liquid between the first chamber 123 and the second chamber 124 smoother. When the number of the through holes 1114 is plural on the first portion 1111, the plural through holes 1114 may be uniformly distributed on the first portion 1111 in some exemplary aspects. In other exemplary aspects, the plurality of through holes 1114 may be spaced around the periphery of the electronic component 112 that is susceptible to heat generation. Therefore, the cooling liquid can be timely conducted to the heat dissipation shell to be dissipated after absorbing the heat at the electronic component 112, so as to better prevent the electronic component 112 from being burnt out due to high temperature.
In some exemplary aspects, a protective layer may be disposed on an inner wall surface of the through hole 1114. The protective layer prevents the coolant from eroding the inner wall surface of the through hole 1114, thereby prolonging the service life of the circuit board 111.
To achieve the communication between the first chamber 123 and the second chamber 124, in another exemplary scheme, referring to fig. 4, the first portion 1111 may have a side surface 1115 connected between the first surface 1112 and the second surface 1113, the side surface 1115 may have a gap with an inner wall surface of the first heat dissipation housing 121 and/or an inner wall surface of the second heat dissipation housing 122, and the first chamber 123 and the second chamber 124 may communicate through the gap. Therefore, the integrity of the first part 1111 of the circuit board 111 can be ensured, and the molding is convenient.
Referring to fig. 2 again, the first heat dissipation housing 121 may include a first bottom plate 1211 and a first peripheral side plate 1212, the first peripheral side plate 1212 may be connected to the first bottom plate 1211, and the first peripheral side plate 1212 has a first end surface 1213 facing away from the first bottom plate 1211. The second heat dissipation housing 122 may include a second bottom plate 1221 and a second peripheral side plate 1222, the second peripheral side plate 1222 may connect the second bottom plate 1221, and the second peripheral side plate 1222 has a second end face 1223 facing away from the second bottom plate 1221.
In some exemplary schemes, referring to fig. 3 again, the first heat dissipation housing 121 may be entirely located at a side where the first surface 1112 of the first portion 1111 of the circuit board 111 is located, and the first end surface 1213 of the first heat dissipation housing 121 is attached to the first surface 1112. The second heat dissipation housing 122 may be integrally disposed on a side where the second surface 1113 of the first portion 1111 is located, and the second end surface 1223 of the second heat dissipation housing 122 is attached to the second surface 1113. Thus, the requirement on the assembly precision of the circuit module 100 is low, which is beneficial to improving the assembly efficiency of the circuit module 100. In this embodiment, to communicate the first chamber 123 and the second chamber 124, a through hole 1114 may be formed in the first portion 1111.
In still other exemplary embodiments, referring to fig. 4 again, the first end surface 1213 of the first heat dissipation housing 121 may be attached to the second end surface 1223 of the second heat dissipation housing 122, and the first end surface 1213 and/or the second end surface 1223 may be provided with a notch a, through which the first portion 1111 may extend into between the first heat dissipation housing 121 and the second heat dissipation housing 122. The degree of the first part 1111 extending into the space between the first heat dissipation shell 121 and the second heat dissipation shell 122 can be flexibly adjusted according to the actual use condition, and the use prospect is wider. In this embodiment, the through hole 1114 may be disposed on the first portion 1111 to communicate with the first chamber 123 and the second chamber 124, and the side surface 1115 of the first portion 1111 may be spaced from the inner wall surface of the first heat dissipation housing 121 and/or the inner wall surface of the second heat dissipation housing 122 to communicate with the first chamber 123 and the second chamber 124. It should be noted that when the first portion 1111 can be adjusted to extend into the space between the first heat dissipation case 121 and the second heat dissipation case 122, a sealing member may be disposed between the first heat dissipation case 121 and the first portion 1111, and between the second heat dissipation case 122 and the first portion 1111.
In other exemplary schemes, referring to fig. 5, the first end surface 1213 of the first heat dissipation housing 121 may be attached to the second end surface 1223 of the second heat dissipation housing 122, at this time, the first portion 1111 may be completely located between the first heat dissipation housing 121 and the second heat dissipation housing 122, and the side surface 1115 of the first portion 1111 may be attached to the inner wall surface of the first heat dissipation housing 121 and/or the inner wall surface of the second heat dissipation housing 122. Therefore, the first end surface 1213 and the second end surface 1223 only need to be connected during assembly, and the assembly is convenient. In this embodiment, to communicate the first chamber 123 and the second chamber 124, a through hole 1114 may be formed in the first portion 1111.
It is understood that the distance between the first bottom 1211 and the first surface 1112 in the direction perpendicular to the first surface 1112 only needs to be larger than the height dimension of the electronic component 112 on the first surface 1112, so that the miniaturized design of the first heat dissipation housing 121 can be realized. Similarly, the distance between the second base 1221 and the second surface 1113 in the direction perpendicular to the second surface 1113 only needs to be larger than the height dimension of the electronic component 112 on the second surface 1113, so that the miniaturized design of the second heat dissipation housing 122 can be realized. When the electronic component 112 is not disposed on the first surface 1112, it is only necessary to ensure that a gap exists between the first bottom 1211 and the first surface 1112. When no electronic component 112 is disposed on the second surface 1113, it is only necessary to ensure a gap between the second base plate 1221 and the second surface 1113.
Referring to fig. 2 again, at least one of the connection between the first heat dissipation housing 121 and the circuit module main body 110, the connection between the second heat dissipation housing 122 and the circuit module main body 110, and the connection between the first heat dissipation housing 121 and the second heat dissipation housing 122 may be provided with a sealing member 130, so as to improve the sealing performance of the circuit module 100. The sealing member 130 may include a plurality of sub-sealing members 131 to achieve a layer-by-layer sealing effect. Specifically, when the sealing member 130 includes a plurality of sub-sealing members 131, the outer diameters of the plurality of sub-sealing members 131 may gradually increase from the inside to the outside.
The first heat dissipation case 121 and the circuit module body 110, the second heat dissipation case 122 and the circuit module body 110, and the first heat dissipation case 121 and the second heat dissipation case 122 may be connected by a connector. Wherein the connecting member may comprise a screw or the like.
In some exemplary aspects, the circuit board 111 may include only the first portion 1111, as may be incorporated with fig. 5. In other exemplary embodiments, referring to fig. 3 again, the circuit board 111 may further include a second portion 1116 connected to the first portion 1111 in addition to the first portion 1111, and the second portion 1116 may be located outside the first heat dissipation housing 121 and outside the second heat dissipation housing 122. The second portion 1116 is provided to facilitate wiring, maintenance, etc. of the circuit board 111 to external devices. Electronic components 112 may also be disposed on the second portion 1116.
In some exemplary aspects, in conjunction with fig. 2 and 3, the first and/or second heat dissipation housings 121 and 122 may be provided with injection holes b through which the coolant may enter the first and/or second chambers 123 and 124. By providing the injection hole b, the circuit module 100 can be injected with the coolant through the injection hole b after the assembly is completed, and compared with the injection of the coolant before the assembly is completed, the waste of the coolant caused by scattering can be avoided. To prevent the coolant from being scattered, the circuit module 100 may further include a sealing plug 140 disposed at the injection hole b. The sealing plug 140 and the injection hole b may be detachably connected, so that the coolant may be injected into the cavity by opening the sealing plug 140, and then the sealing plug 140 may be mounted to the injection hole b to achieve a sealing effect.
In an exemplary aspect, at least a portion of the coolant may be converted from a liquid phase to a gas phase by the heat generated from the circuit module body 110, and the gas phase of the coolant may be converted from the gas phase to the liquid phase after the heat is dissipated through the first heat dissipation case 121 and/or the second heat dissipation case 122. The coolant absorbs heat and carries heat after gasification, and the gasified coolant flows more flexibly, so that the coolant can reach the heat dissipation shell more quickly and the heat is dissipated out through the heat dissipation shell.
When the coolant is converted into gas and liquid, the gas pressure in the first chamber 123 and/or the second chamber 124 may change, and in order to avoid the damage to the circuit module 100 caused by too high gas pressure, the sealing plug 140 may be an elastic sealing plug 140. Thus, when the pressure rises, the plug 140 can deform so that gas can escape to maintain equilibrium.
In some exemplary embodiments, the sealing plug 140 may be made of a material having elasticity. In this manner, the production of the sealing plug 140 is facilitated. Referring to fig. 6, when the sealing plug 140 is made of an elastic material as a whole, the injection hole b may include a first hole section b1 and a second hole section b2 from inside to outside, a radial dimension of the first hole section b1 may be larger than a radial dimension of the second hole section b2, the sealing plug 140 may include a first structure section 141, a second structure section 142 and a third structure section 143 connected in sequence, the first structure section 141 may be located at the first hole section b1, and the radial dimension of the first structure section 141 may be larger than the radial dimension of the second hole section b 2. The second structure section 142 may be located at the second hole section b 2. The third structural section 143 may be located on a side of the first bore section b1 remote from the second bore section b2, and the radial dimension of the third structural section 143 may be greater than the radial dimension of the second bore section b 2. Thus, the sealing plug 140 is more firmly fixed in the injection hole b and is not easily detached.
In other exemplary aspects, referring to fig. 7, the sealing plug 140 may include a support portion 144 and an elastic portion 145. Because the molding material requirement of the supporting portion 144 is low, the supporting portion can be made of a low-cost material, so that the manufacturing cost of the sealing plug 140 can be reduced.
Specifically, the elastic portion 145 may be disposed at a local position of the supporting portion 144, and the elastic portion 145 may also wrap the supporting portion 144. When the elastic part 145 is disposed only at a partial position of the support part 144, referring to fig. 7, one end of the support part 144 may be located at the injection hole b, the other end may be located outside the first heat dissipation case 121 and/or the second heat dissipation case 122, and the elastic part 145 may connect a portion of the support part 144 located inside the injection hole b and abut against an inner wall surface of the injection hole b. Thus, the size of the elastic part 145 can be reduced, facilitating the connection of the elastic part 145 and the supporting part 144. The elastic portion 145 may be an annular structure, and the elastic portion 145 may be sleeved on the periphery of the supporting portion 144. To improve the sealing performance of the circuit module 100, the sealing plug 140 may include a plurality of elastic parts 145, and the plurality of elastic parts 145 may be spaced apart along the extending direction of the supporting part 144. When the elastic part 145 wraps the support part 144, the whole outer part of the sealing plug 140 has elasticity, so that when the sealing plug 140 is installed in the injection hole b, the whole outer part can be elastically deformed, thereby realizing close fit with the inner wall surface of the injection hole b, and reducing the requirement on the processing precision of the sealing plug 140.
The outer surface of the first heat dissipation case 121 and/or the outer surface of the second heat dissipation case 122 may be large enough to achieve condensation of the coolant and complete the entire circulation of the coolant within the circuit module 100 using air cooling.
In order to make the outer surface of the first heat dissipation case 121 sufficiently large, the outer surface of the first heat dissipation case 121 may include a wavy surface, a serrated surface, and the like. In order to facilitate the processing and molding of the first heat dissipation housing 121, the outer surface of the first heat dissipation housing 121 may also be a regular plane, and in this case, referring to fig. 8, the circuit module 100 may further include at least one fin 150 mounted on the outer surface of the first heat dissipation housing 121, so that the fin 150 can increase the surface area of the first heat dissipation housing 121.
Similarly, in order to make the outer surface of the second heat dissipation case 122 sufficiently large, the outer surface of the second heat dissipation case 122 may include a wavy surface, a serrated surface, and the like. In order to facilitate the machining and molding of the first heat dissipation housing, the outer surface of the second heat dissipation housing 122 may also be a regular plane, and in this case, the circuit module 100 may further include at least one fin 150 mounted on the outer surface of the second heat dissipation housing 122, so that the fin 150 may increase the surface area of the second heat dissipation housing 122.
In a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes the circuit module 100 with the liquid-cooled heat dissipation structure, and has the characteristics of good heat dissipation performance, and thin and light weight. The electronic device may include a small electronic device such as a customer premises equipment, a mobile phone, and the like. Of course, the electronic device may include a large-sized electronic device such as a computer and a display device; the embodiments of the present application do not limit this.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.
Claims (11)
1. The utility model provides a circuit module with liquid cooling heat radiation structure which characterized in that includes:
a first heat dissipation housing;
the second heat dissipation shell is arranged opposite to the first heat dissipation shell;
the circuit module comprises a circuit module main body, at least part of the circuit module main body is located between the first heat dissipation shell and the second heat dissipation shell, a first cavity is formed between the circuit module main body and the first heat dissipation shell, a second cavity is formed between the circuit module main body and the second heat dissipation shell, a coolant is filled in the first cavity and/or the second cavity, and the first cavity is communicated with the second cavity.
2. The circuit module of claim 1, wherein the circuit module body comprises:
the circuit board is at least partially positioned between the first heat dissipation shell and the second heat dissipation shell, a first cavity is formed between the circuit board and the first heat dissipation shell, and a second cavity is formed between the circuit board and the second heat dissipation shell;
at least one electronic component, the electronic component is located in the first cavity and/or the second cavity, the electronic component is electrically connected with the circuit board, and the electronic component is immersed in the cooling liquid.
3. The circuit module of claim 2, wherein the circuit board includes a first portion between the first heat dissipation housing and the second heat dissipation housing, the first portion having a first surface facing the first heat dissipation housing and a second surface facing the second heat dissipation housing, the first surface and/or the second surface having the electronic component disposed thereon.
4. The circuit module of claim 3,
the first portion is provided with at least one through hole penetrating the first surface and the second surface, and the first chamber and the second chamber are communicated through the through hole; and/or
The first portion further has a side surface connected between the first surface and the second surface, the side surface having a gap with an inner wall surface of the first heat dissipation housing and/or an inner wall surface of the second heat dissipation housing, the first chamber and the second chamber communicating via the gap.
5. The circuit module of claim 2, wherein the circuit board includes a first portion located between the first heat dissipation housing and the second heat dissipation housing, and a second portion located outside the first heat dissipation housing and outside the second heat dissipation housing, the second portion being connected to the first portion.
6. The circuit module according to claim 1, wherein the first and/or second heat dissipation housing is provided with an injection hole through which the coolant enters the first and/or second chamber, and the circuit module further comprises a sealing plug provided at the injection hole.
7. The circuit module according to claim 6, wherein the heat generated by the circuit module main body causes at least a portion of the coolant to change from a liquid phase to a gas phase, and the gas phase of the coolant is changed from the gas phase to the liquid phase after being radiated through the first and/or second heat radiating housings.
8. The circuit module of claim 7 wherein said sealing plug is a resilient sealing plug.
9. The circuit module of claim 1, further comprising:
at least one fin mounted to an outer surface of the first heat dissipation housing and/or an outer surface of the second heat dissipation housing.
10. An electronic device comprising the circuit module with a liquid-cooled heat dissipation structure of any one of claims 1 to 9.
11. The electronic device of claim 10, wherein the electronic device comprises a customer premises equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111073265.0A CN113645817A (en) | 2021-09-14 | 2021-09-14 | Circuit module with liquid cooling heat radiation structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111073265.0A CN113645817A (en) | 2021-09-14 | 2021-09-14 | Circuit module with liquid cooling heat radiation structure and electronic equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159051A (en) * | 2010-02-12 | 2011-08-17 | 台达电子工业股份有限公司 | Modular heat-radiating device |
| CN105025691A (en) * | 2015-08-10 | 2015-11-04 | 苏州大景能源科技有限公司 | Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof |
| JP3206206U (en) * | 2016-06-02 | 2016-09-01 | 泰碩電子股▲分▼有限公司 | Vapor chamber with gas-liquid separation structure |
| CN213426737U (en) * | 2020-09-16 | 2021-06-11 | 建准电机工业股份有限公司 | Liquid cooling heat abstractor and have this liquid cooling heat abstractor's liquid cooling system |
-
2021
- 2021-09-14 CN CN202111073265.0A patent/CN113645817A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159051A (en) * | 2010-02-12 | 2011-08-17 | 台达电子工业股份有限公司 | Modular heat-radiating device |
| CN105025691A (en) * | 2015-08-10 | 2015-11-04 | 苏州大景能源科技有限公司 | Electronic device and heat radiation device utilizing liquid cooling heat radiation and cooling method thereof |
| JP3206206U (en) * | 2016-06-02 | 2016-09-01 | 泰碩電子股▲分▼有限公司 | Vapor chamber with gas-liquid separation structure |
| CN213426737U (en) * | 2020-09-16 | 2021-06-11 | 建准电机工业股份有限公司 | Liquid cooling heat abstractor and have this liquid cooling heat abstractor's liquid cooling system |
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