TWI672478B - Loop type uniform temperature plate - Google Patents

Abstract

A circuit-type temperature-equalizing plate includes: a plate that is recessed to form a space; a cover plate that is disposed on the seat plate and closes the space so that the space forms an evaporation cavity, a vapor passage, a condensation passage, and A liquid passage, one end of the vapor passage is connected to the evaporation cavity, and the other end is connected to the condensation passage. The condensation passage is connected to the liquid passage, and the liquid passage is further connected to the evaporation cavity. A capillary material is provided. In the evaporation cavity, and not occupying the evaporation cavity, leaving an evaporation space in the evaporation cavity, and allowing the evaporation space to communicate with the vapor channel, and the capillary material partly corresponds to the end of the liquid channel; A space partition is provided in the evaporation chamber to separate the evaporation space from the liquid channel; and a working fluid is filled in the evaporation chamber.

Description

Loop type temperature plate

The invention relates to a temperature equalizing plate (Vapor Chamber), in particular to a loop type temperature equalizing plate.

In the known temperature equalizing plate technology, for example, Taiwan Patent No. I592623, a temperature equalizing plate is disclosed, which is provided with a two-layer capillary structure between the upper and lower metal plates, and is filled with an operating fluid and a supporting structure. (Support column). This technique can constitute a working temperature equalizing plate.

In order to reduce the thickness of the temperature equalizing plate, Taiwan Patent No. I598554 discloses a thin type temperature equalizing plate, which is mainly provided with only one layer of capillary structure between the upper and lower metal plates, and a plurality of through holes are provided in the capillary structure to make the hollow. Columns are worn. Due to the low internal space height of this type of thin temperature equalizing plate, only one layer of capillary structure is provided. In addition to providing the effect of absorbing liquid action, it also reduces the height occupation rate of the internal space, thereby making the overall uniform The thickness of the temperature plate is reduced to form a truly thin uniform temperature plate.

The foregoing prior art is limited by the concept of a conventional temperature equalizing plate and must include at least one layer of capillary structure, so the thickness cannot be reduced anymore. The inventor of this case believes that the capillary layer in the isothermal plate should have the possibility of being adjusted, and it is possible to make part of the interior position without the capillary layer on the upper and lower metal plates, thereby further reducing the thickness of the isothermal plate.

The main purpose of the present invention is to provide a circuit-type temperature equalizing plate, which has a return path for the working fluid to change from a vapor state to a liquid state. No capillary layer can be provided on this return path to further reduce the average temperature. Plate thickness requirements.

In order to achieve the above-mentioned object, the present invention provides a circuit-type temperature-equalizing plate, comprising: a plate, recessed to form a space; a cover plate, covering the seat plate, and closing the space so that the space forms an evaporation cavity, A vapor passage, a condensation passage, and a liquid passage. One end of the vapor passage is connected to the evaporation chamber, and the other end is connected to the condensation passage. The condensation passage is connected to the liquid passage, and the liquid passage is further connected to the vapor passage. Evaporation cavity; a capillary material provided in the evaporation cavity, and not occupying the evaporation cavity, leaving an evaporation space in the evaporation cavity, and allowing the evaporation space to communicate with the vapor channel, and the capillary material is partially corresponding At the end of the liquid channel; a space partition is provided in the evaporation cavity to separate the evaporation space from the liquid channel; and an operating fluid is filled in the evaporation cavity.

Thereby, the return path formed by the vapor passage, the condensation passage and the liquid passage of the present invention is integrally formed between the seat plate and the cover body, and a capillary layer may not be provided on this return path and the working fluid may still be allowed. From the vapor state to the liquid state and returning to the evaporation chamber, since no capillary layer is required, the thickness requirement of the temperature equalizing plate can be further reduced in this part of the return path.

In order to explain the technical features of the present invention in detail, the following preferred embodiments are described in conjunction with the drawings as follows, wherein:

As shown in FIG. 1 to FIG. 4, the present invention proposes a circuit-type temperature equalizing plate 10 described by the first preferred embodiment, which is mainly composed of a seat plate 11, a cover plate 21, a capillary material 26, and a space partition. 27 and a fluid, consisting of:

The seat plate 11 is recessed to form a space 12.

The cover plate 21 is disposed on the seat plate 11 and closes the space 12 so that the space 12 forms an evaporation cavity 121, a vapor passage 122, a condensation passage 123, and a liquid passage 124. One end of the vapor passage 122 The evaporation chamber 121 is communicated, and the other end is connected to the condensation channel 123. The condensation channel 123 is connected to the liquid channel 124, and the liquid channel 124 is connected to the evaporation chamber 121. Accordingly, the vapor passage 122, the condensation passage 123, and the liquid passage 124 form a loop with respect to the evaporation chamber 121.

The capillary material 26 is disposed in the evaporation cavity 121, and does not occupy the evaporation cavity 121 but retains an evaporation space 128 in the evaporation cavity 121. The evaporation space 128 communicates with the vapor passage 122. In addition, the capillary material is also partially adjacent to the end of the liquid passage 124. In this embodiment, the capillary material 26 can be selected from the capillary structure of copper powder sintering, and has a plate shape. The capillary material 26 is sintered on the seat plate 11 and is located at the bottom of the evaporation cavity 121. The evaporation space 128 is located between the capillary material 26 and Between the cover plate 21, the capillary material 26 has a plurality of supporting blocks 261, which are in contact with the capillary material 26 and the cover plate 21. The plurality of support blocks 261 may be the same material as the capillary material 26 and sintered integrally in actual implementation, or may be a solid metal block (such as a copper block). In this embodiment, the same support material (ie, copper powder) is sintered integrally. Shape as an example. The support blocks 261 of the present invention may not be provided under certain conditions. For example, when there is no support requirement and there is no problem with the return of the working fluid in the capillary material 26, the support blocks may not be provided and still work normally. .

The space partition 27 is disposed in the evaporation cavity 121 and separates the evaporation space 128 from the liquid passage 124. In this embodiment, the space divider 27 is a capillary material, and is the same material as the capillary material 26 and is integrally formed. The space divider 27 extends from the capillary material 26 to the cover plate 21 and abuts the cover plate. 21, and extends into the liquid passage 124 by a predetermined length, whereby the evaporation space 128 can be completely separated from the liquid passage 124.

The working fluid is filled in the evaporation chamber 121 and adsorbed by the capillary material 26, and pure water can be used in practice. Because the adsorbed liquid is difficult to show, and the working fluid is also a well-known component in the industry, it is not shown in the figure.

The structure of the first embodiment has been described above, and the use state of the first embodiment is described next.

As shown in FIG. 5, before use, the present invention is used to place the base plate 11 on a heat-dissipating object (such as a central processing unit CPU of a computer, not shown), so that the evaporation chamber 121 is located correspondingly. A heat-dissipating unit 100 is disposed on the object to be dissipated, and at a position of the seat plate 11 corresponding to the condensation channel 123. The heat-dissipating unit 100 is composed of a plurality of fins in this embodiment.

In use, as shown in FIG. 5, the thermal energy of the object to be radiated will be transferred to the evaporation chamber 121, and the working fluid adsorbed by the capillary material 26 inside the evaporation chamber 121 will evaporate into a vaporous working fluid and be dispersed. In the steam space, it enters the gas passage 122 again, and then reaches the condensation passage 123. Then, with the effect that the heat energy is taken away from the air by the heat radiating unit 100, the temperature of the condensation passage 123 is lower than the temperature of the evaporation chamber 121, which will cause the vaporous working fluid flowing to the condensation passage 123 to condense due to cooling. The liquid working fluid in the form of a droplet is adhered to a wall surface in the condensation channel 123. As more and more condensed liquid actuating liquids are formed, the droplet-shaped liquid actuating liquids are becoming larger and larger, and finally a liquid bomb 29 is formed which occupies the cross section of the condensation channel 123. With the effect of the gaseous actuating liquid continuously entering from the gas channel 122 to the condensation channel 123, a pressure difference naturally forms and pushes the liquid bomb 29 from the condensation channel 123 to the liquid channel 124, and finally flows to the evaporation chamber 121 Inside, it is again adsorbed by the space partition 27 and flows back to the capillary material 26. In this way, the thermal energy of the object to be dissipated can be continuously extracted, and a good heat dissipation effect can be achieved.

As can be seen from the above, in the first embodiment, the evaporation chamber 121 and the return path (consisting of the vapor passage 122, the condensation passage 123, and the liquid passage 124) are integrally formed, and are located on the cover plate 21 and the seat. The space enclosed by the plate 11 is therefore an integral structure. No capillary layer can be provided on this return path, and the working fluid can still be changed from vapor to liquid and return to the evaporation chamber 121. Since no capillary layer is required, the portion of this return path can be further reduced. Temperature plate thickness requirements.

Please refer to FIG. 6 to FIG. 7 again. The second preferred embodiment of the present invention provides a circuit-type temperature equalizing plate 30, which is basically the same as the first embodiment disclosed above, except that:

The seat plate 31 has a two-channel partition 34 (a partition is taken as an example during implementation) and is located in the liquid channel 324. In addition, the two-channel partition 34 also extends from the liquid channel 324 to the condensation channel 323. Inside. Thereby, the two-channel divider 34 divides the liquid channel 324 together with the condensation channel 323 into three liquid bomb channels 341 penetrating the liquid channel 324 and the condensation channel 323. The caliber of each liquid bomb channel 341 is smaller than that of the vapor The caliber of the body channel 322. The design of this channel divider 34 can form a small-diameter liquid bomb channel 341, which makes it easier for the droplet-shaped working fluid condensed in the condensation channel 323 to become a liquid bomb 49 (shown in the cross section of each liquid bomb channel 341) (Figure 7).

In addition, in the second embodiment, the space partition 47 does not protrude into the liquid passage 324 as in the first embodiment described above, but is a solid metal that abuts the capillary material 46 and the cover plate 41 up and down. And separate the evaporation space 328 from the liquid channel 324.

It should be added that the number of channel dividers 34 is not limited to two, only one may be, or more than two may be used, that is, the number may be determined according to actual needs.

The rest of the structure and the effects that can be achieved in this second embodiment are the same as those in the first embodiment, and will not be described again.

Please refer to FIG. 8 to FIG. 9 again. The present invention proposes a third preferred embodiment of the loop type temperature equalizing plate 50, which is mainly the same as the second embodiment disclosed above, except that:

The capillary material 66 further extends to a predetermined length in the liquid channel 524, and the space partition 67 is located in the liquid channel, and is located above the portion of the capillary material 66 extending into the liquid channel 524, and The cross section is filled with the liquid passage 524, but does not block the portion of the capillary material 66 protruding into the liquid passage 524.

In addition, the two-channel separator 54 further extends into the vapor channel 522. This arrangement still allows the vapor-phase working fluid to enter the vapor channel 522 from the evaporation space 528 without being hindered.

Thereby, the space partition 67 can still achieve the effect of separating the evaporation space 528 from the liquid channel 524, and the capillary material 66 can absorb the liquid channel 524 by extending into the portion of the liquid channel 524 Liquid working fluid.

The rest of the structure and the effects that can be achieved in the third embodiment are the same as those in the second embodiment, and will not be described again.

10‧‧‧Circular type temperature equalizing plate

11‧‧‧ seat board

12‧‧‧ space

121‧‧‧ evaporation chamber

122‧‧‧Vapor channel

123‧‧‧Condensation channel

124‧‧‧Liquid channel

128‧‧‧ evaporation space

21‧‧‧ Cover

26‧‧‧ Wool

261‧‧‧Support block

27‧‧‧space divider

29‧‧‧ liquid bomb

30‧‧‧Circular type temperature equalizing plate

31‧‧‧ seat plate

322‧‧‧Vapor channel

323‧‧‧Condensation channel

324‧‧‧Liquid channel

328‧‧‧ evaporation space

34‧‧‧Aisle divider

341‧‧‧ liquid bomb channel

41‧‧‧ Cover

46‧‧‧ Wool

47‧‧‧space divider

49‧‧‧ liquid bomb

50‧‧‧Circular type temperature equalizing plate

522‧‧‧Vapor channel

524‧‧‧Liquid channel

528‧‧‧ evaporation space

54‧‧‧Aisle divider

66‧‧‧ Wool

67‧‧‧space divider

100‧‧‧ cooling unit

FIG. 1 is a perspective view of a first preferred embodiment of the present invention. Figure 2 is an exploded view of the first preferred embodiment of the present invention. FIG. 3 is a top view of some components of the first preferred embodiment of the present invention, showing a top view of the bottom plate. Fig. 4 is a sectional view taken along the line 4-4 in Fig. 1. FIG. 5 is a use state diagram of the first preferred embodiment of the present invention, showing a state where a liquid bomb is formed during use. FIG. 6 is an exploded view of the second preferred embodiment of the present invention. FIG. 7 is a top view of some components of the second preferred embodiment of the present invention, showing the top view of the bottom plate. FIG. 8 is an exploded view of the third preferred embodiment of the present invention. FIG. 9 is a top view of some components of the third preferred embodiment of the present invention, and shows the top view of the bottom plate.

Claims (11)

A circuit-type temperature-equalizing plate includes: a plate that is recessed to form a space; a cover plate that is disposed on the seat plate and closes the space so that the space forms an evaporation cavity, a vapor passage, a condensation passage, and A liquid passage, one end of the vapor passage is connected to the evaporation cavity, and the other end is connected to the condensation passage, the condensation passage is connected to the liquid passage, and the liquid passage is further connected to the evaporation cavity; a capillary material, set In the evaporation cavity, and not occupying the evaporation cavity, leaving an evaporation space in the evaporation cavity, and allowing the evaporation space to communicate with the vapor channel, and the capillary material partly corresponds to the end of the liquid channel; A space partition is provided in the evaporation chamber to separate the evaporation space from the liquid channel; and a working fluid is filled in the evaporation chamber. The circuit-type temperature-equalizing plate according to item 1 of the scope of patent application, wherein the seat plate has at least one channel partition and is located in the liquid channel, and partitions the liquid channel into a plurality of liquid bomb channels. The circuit-type temperature equalizing plate according to item 2 of the scope of patent application, wherein the at least one channel divider extends from the liquid channel into the condensation channel. The loop-type temperature equalizing plate according to item 3 of the patent application scope, wherein the at least one channel partition is extended from the liquid channel to the condensation channel and the vapor channel. According to the loop type temperature equalizing plate of the scope of the patent application, the caliber of each liquid bomb passage is smaller than the caliber of the gas passage. According to the loop type temperature equalizing plate of the scope of application for patent, the space partition is made of capillary material and is integrally formed with the capillary material, and the space partition is extended from the capillary material to the cover plate and abuts against the The cover plate extends into the liquid passage for a predetermined length. The loop-type temperature equalizing plate according to item 1 of the scope of patent application, wherein: the capillary material is sintered on the seat plate and is located at the bottom of the evaporation cavity; the evaporation space is located between the capillary material and the cover plate; The plurality of supporting blocks are in contact with the capillary material and the cover plate. The circuit-type temperature equalizing plate according to item 7 of the scope of patent application, wherein the plurality of supporting blocks are made of the same material as the capillary material and are integrally formed. The loop type temperature equalizing plate according to item 7 of the scope of patent application, wherein: the plurality of supporting blocks are solid metal blocks. The circuit-type temperature equalizing plate according to item 1 of the scope of patent application, wherein: the space divider is solid metal, and it abuts against the capillary material and the cover plate. According to the loop type temperature equalizing plate of the scope of application for patent, the capillary material extends to a predetermined length in the liquid channel.