US20120312507A1 - Thin heat pipe structure and manufacturing method thereof - Google Patents

Thin heat pipe structure and manufacturing method thereof Download PDF

Info

Publication number
US20120312507A1
US20120312507A1 US13/154,690 US201113154690A US2012312507A1 US 20120312507 A1 US20120312507 A1 US 20120312507A1 US 201113154690 A US201113154690 A US 201113154690A US 2012312507 A1 US2012312507 A1 US 2012312507A1
Authority
US
United States
Prior art keywords
tubular body
heat pipe
pipe structure
thin heat
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/154,690
Inventor
Hsiu-Wei Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/154,690 priority Critical patent/US20120312507A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YANG, HSIU-WEI
Publication of US20120312507A1 publication Critical patent/US20120312507A1/en
Priority to US14/184,301 priority patent/US9802240B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/06Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00Making other particular articles
    • B21D53/02Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Definitions

  • the conventional technique has the following shortcomings:
  • a primary object of the present invention is to provide a thin heat pipe structure, which is able to transfer heat in both axial direction and radial direction.
  • FIG. 3 is a perspective assembled sectional view of a second embodiment of the thin heat pipe structure of the present invention.
  • FIG. 11 is a flow chart of a first embodiment of the manufacturing method for the thin heat pipe structure of the present invention.
  • FIG. 3 is a perspective assembled sectional view of a second embodiment of the thin heat pipe structure of the present invention.
  • the second embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
  • the second embodiment is only different from the first embodiment in that the surfaces of the first and second channels 1111 a, 1111 b have sintered powder 5 .
  • the sintered powder 5 can be copper powder or aluminum powder. In this embodiment, the sintered powder 5 is, but not limited to, copper powder.
  • FIG. 4 is a sectional view of a third embodiment of the thin heat pipe structure of the present invention.
  • the third embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter.
  • the third embodiment is only different from the first embodiment in that the first channels 1111 a extend in an arcuate form and the second channels 1111 b also extend in an arcuate form.
  • the first and second channels 1111 a, 1111 b intersect each other at at least one intersection section 1111 c.
  • the vapor working fluid 13 b goes to the heat dissipation side 11 d and is cooled and condensed into the liquid working fluid 13 a.
  • the liquid working fluid 13 a then flows along the first and second channels 1111 a, 1111 b back to the heat absorption side 11 c for next vapor/liquid cycle.
  • the thin heat pipe structure of the present invention is able to transfer heat both axially and radially. Therefore, the thin heat pipe structure of the present invention has very good heat transfer performance in both axial direction and radial direction by large heat transfer area.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to a thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. Multiple intersecting channels are formed on an inner wall face of the tubular body to increase vapor/liquid diffusion efficiency. The mesh body is attached to the inner wall face of the tubular body. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction.
  • 2. Description of the Related Art
  • A heat pipe has heat conductivity several times to several tens times that of copper, aluminum or the like. Therefore, the heat pipe has excellent performance and serves as a cooling component applied to various electronic devices. As to the configuration, the conventional heat pipes can be classified into heat pipes in the form of circular tubes and heat pipes in the form of flat plates. For cooling an electronic component such as a CPU, preferably a flat-plate heat pipe is used in view of easy installation and larger contact area. To catch up the trend toward miniaturization of cooling mechanism, the heat pipe has become thinner and thinner in adaptation to the cooling mechanism.
  • The heat pipe is formed with an internal space as a flow path for the working fluid contained in the heat pipe. The working fluid is converted between liquid phase and vapor phase through evaporation and condensation and is transferable within the heat pipe for transferring heat. The heat pipe is formed with sealed voids in which the working fluid is contained. The working fluid is phase-changeable and transferable to transfer heat.
  • The heat pipe is used as a heat conduction member. The heat pipe is fitted through a radiating fin assembly. The working fluid with low boiling point is filled in the heat pipe. The working fluid absorbs heat from a heat-generating electronic component (at the evaporation end) and evaporates into vapor. The vapor goes to the radiating fin assembly and transfers the heat to the radiating fin assembly (at the condensation end). A cooling fan then carries away the heat to dissipate the heat generated by the electronic component.
  • The heat pipe is manufactured in such a manner that metal powder is filled into a hollow tubular body and sintered to form a capillary structure layer on the inner wall face of the tubular body. Then the tubular body is vacuumed and filled with the working fluid and then sealed. On the demand of the electronic equipment for slim configuration, the heat pipe must be made with a thin configuration.
  • A heat spreader works in the same principle as the heat pipe. The working fluid is converted between liquid phase and vapor phase through evaporation and condensation for transferring heat. The heat spreader is only different from the heat pipe in that the heat pipe mainly transfers heat in axial direction, while the heat spreader transfers heat face to face by large area. In adaptation to the current thin electronic equipment, the heat pipe or heat spreader must be manufactured with a thin configuration.
  • In the conventional technique, the heat pipe is pressed into a flat-plate form. Before flattening the heat pipe, the powder is first filled into the heat pipe and then sintered. Then the working fluid is filled into the heat pipe. Finally, the heat pipe is sealed. Alternatively, the tubular body of the heat pipe is first pressed and flattened and then the powder is filled into the tubular body and sintered. However, the internal chamber of the tubular body is extremely narrow. Therefore, it is quite hard to fill the powder into the tubular body. Moreover, the capillary structure in the heat pipe needs to provide capillary attraction for transferring the working fluid on one hand and support the tubular body on the other hand. The support effect is quite limited in such a narrow space.
  • Furthermore, the vapor passageways in the heat pipe are so narrow that an effective vapor/liquid circulation can be hardly achieved. Therefore, the conventional thin heat pipe and the manufacturing method thereof have many defects.
  • The most serious problem existing in the conventional technique is that although the thin heat pipe has larger heat absorption area and heat dissipation area, the heat pipe can only transfer heat in axial direction, while failing to transfer heat in radial direction. According to the above, the conventional technique has the following shortcomings:
    • 1. It is hard to process and manufacture the thin heat pipe.
    • 2. The capillary structure in the heat pipe is subject to damage.
    • 3. The manufacturing cost is higher.
    • 4. The conventional thin heat pipe cannot transfer heat in radial direction.
    SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a thin heat pipe structure, which is able to transfer heat in both axial direction and radial direction.
  • A further object of the present invention is to provide a manufacturing method for a thin heat pipe structure.
  • To achieve the above and other objects, the thin heat pipe structure of the present invention includes a tubular body and a mesh body. The tubular body has a chamber. An inner wall face of the chamber is formed with at least one first channel and at least one second channel. The first and second channels extend to intersect each other. The mesh body has multiple meshes and is attached to the inner wall face of the chamber.
  • The manufacturing method for the thin heat pipe structure of the present invention includes steps of: preparing a hollow tubular body and a mesh body; forming at least one first channel and at least one second channel on an inner wall face of the tubular body; attaching the mesh body to the inner wall face of the tubular body; pressing the tubular body into a flat state; vacuuming the tubular body and filling working fluid into the tubular body; and sealing the tubular body.
  • The thin heat pipe structure is able to transfer heat in both axial direction and radial direction so that the heat transfer efficiency is greatly increased. By means of the manufacturing method, the heat pipe can be slimmed.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1 is a perspective exploded view of a first embodiment of the thin heat pipe structure of the present invention;
  • FIG. 1 a is an enlarged view of a part of FIG. 1;
  • FIG. 2 is a perspective assembled view of the first embodiment of the thin heat pipe structure of the present invention;
  • FIG. 2 a is an enlarged view of a part of FIG. 2;
  • FIG. 3 is a perspective assembled sectional view of a second embodiment of the thin heat pipe structure of the present invention;
  • FIG. 4 is a sectional view of a third embodiment of the thin heat pipe structure of the present invention;
  • FIG. 5 is a sectional view of a fourth embodiment of the thin heat pipe structure of the present invention;
  • FIG. 6 is a sectional view of a fifth embodiment of the thin heat pipe structure of the present invention;
  • FIG. 7 shows an application of the thin heat pipe structure of the present invention;
  • FIG. 8 is a sectional view taken along line A-A of FIG. 7;
  • FIG. 9 shows another application of the thin heat pipe structure of the present invention;
  • FIG. 10 is a sectional view taken along line B-B of FIG. 9;
  • FIG. 11 is a flow chart of a first embodiment of the manufacturing method for the thin heat pipe structure of the present invention;
  • FIG. 12 shows a processing step of the manufacturing method for the thin heat pipe structure of the present invention;
  • FIG. 13 also shows the processing step of the manufacturing method for the thin heat pipe structure of the present invention; and
  • FIG. 14 is a flow chart of a third embodiment of the manufacturing method for the thin heat pipe structure of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 1, 1 a, 2 and 2 a. FIG. 1 is a perspective exploded view of a first embodiment of the thin heat pipe structure of the present invention. FIG. 1 a is an enlarged view of a part of FIG. 1. FIG. 2 is a perspective assembled view of the first embodiment of the thin heat pipe structure of the present invention. FIG. 2 a is an enlarged view of a part of FIG. 2. The thin heat pipe structure 1 includes a tubular body 11 and a mesh body 12.
  • The tubular body 11 has a chamber 111 and a working fluid 13 (as shown in FIG. 8). An inner wall face 1111 of the chamber 111 is formed with at least one first channel 1111 a and at least one second channel 1111 b. The first and second channels 1111 a, 1111 b extend to intersect each other.
  • The mesh body 12 has multiple meshes 121. The mesh body 12 is attached to the inner wall face 1111 of the chamber 111.
  • The tubular body 11 further has a first closed end 112 and a second closed end 113 in communication with the chamber 111.
  • Please refer to FIG. 3, which is a perspective assembled sectional view of a second embodiment of the thin heat pipe structure of the present invention. The second embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The second embodiment is only different from the first embodiment in that the surfaces of the first and second channels 1111 a, 1111 b have sintered powder 5. The sintered powder 5 can be copper powder or aluminum powder. In this embodiment, the sintered powder 5 is, but not limited to, copper powder.
  • Please refer to FIG. 4, which is a sectional view of a third embodiment of the thin heat pipe structure of the present invention. The third embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The third embodiment is only different from the first embodiment in that the first channels 1111 a extend in an arcuate form and the second channels 1111 b also extend in an arcuate form. The first and second channels 1111 a, 1111 b intersect each other at at least one intersection section 1111 c.
  • Please refer to FIG. 5, which is a sectional view of a fourth embodiment of the thin heat pipe structure of the present invention. The fourth embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fourth embodiment is only different from the first embodiment in that the first channels 1111 a extend in a spiral form and the second channels 1111 b also extend in a spiral form. The first and second channels 1111 a, 1111 b intersect each other at at least one intersection section 1111 c.
  • Please refer to FIG. 6, which is a sectional view of a fifth embodiment of the thin heat pipe structure of the present invention. The fifth embodiment is substantially identical to the first embodiment in structure and thus will not be repeatedly described hereinafter. The fifth embodiment is only different from the first embodiment in that the first and second channels 1111 a, 1111 b are only formed in positions adjacent to the first and second closed ends 112, 113 of the tubular body 11.
  • Please refer to FIGS. 7 and 8. FIG. 7 shows an application of the thin heat pipe structure of the present invention. FIG. 8 is a sectional view taken along line A-A of FIG. 7. The tubular body 11 has a heat absorption end 11 a and a heat dissipation end 11 b. The heat absorption end 11 a is in contact with at least one heat source 3, while the heat dissipation end 11 b is in contact with at least one heat dissipation member 4. In this embodiment, the heat dissipation member 4 is, but not limited to, a heat sink. When the heat source 3 generates heat, the heat absorption end 11 a absorbs the heat to make the liquid working fluid 13 a evaporate into the vapor working fluid 13 b. The vapor working fluid 13 b goes through the voids in the mesh body 12 toward the heat dissipation end 11 b. Then the vapor working fluid 13 b is cooled and condensed into the liquid working fluid 13 a. The liquid working fluid 13 a then axially and radially flows along and spreads through the first and second channels 1111 a, 1111 b of the inner wall face 1111 of the chamber 111 back to the heat absorption end 11 a.
  • Please refer to FIGS. 9 and 10. FIG. 9 shows another application of the thin heat pipe structure of the present invention. FIG. 10 is a sectional view taken along line B-B of FIG. 9. One side of the heat absorption end 11 a is in contact with the heat source 3 and defined as a heat absorption side 11 c, while the other side of the heat absorption end 11 a opposite to the heat absorption side 11 c is defined as a heat dissipation side 11 d. The heat dissipation member 4 is disposed on the heat dissipation side 11 d. When the heat source 3 generates heat, the heat absorption side 11 c absorbs the heat to make the liquid working fluid 13 a evaporate into the vapor working fluid 13 b. The vapor working fluid 13 b goes to the heat dissipation side 11 d and is cooled and condensed into the liquid working fluid 13 a. The liquid working fluid 13 a then flows along the first and second channels 1111 a, 1111 b back to the heat absorption side 11 c for next vapor/liquid cycle.
  • The thin heat pipe structure 1 of the present invention not only is able to transfer heat axially, but also is able to transfer heat radially. Moreover, the mesh body 12 serves to increase strength of the thin heat pipe structure 1. Please refer to FIGS. 11, 12 and 13. FIG. 11 is a flow chart of a first embodiment of the manufacturing method for the thin heat pipe structure of the present invention. FIG. 12 shows a processing step of the manufacturing method for the thin heat pipe structure of the present invention. FIG. 13 shows another processing step of the manufacturing method for the thin heat pipe structure of the present invention. Also referring to FIGS. 1, 2, 4 and 5, the manufacturing method for the thin heat pipe structure of the present invention includes steps of:
    • S1: preparing a hollow tubular body and a mesh body, a hollow tubular body 11 and a mesh body 12 being prepared, the hollow tubular body 11 and the mesh body 12 being made of a metal material with good heat conductivity, such as copper material or aluminum material, in this embodiment, the metal material is, but not limited to, copper material;
    • S2: forming at least one first channel and at least one second channel on an inner wall face of the tubular body, at least one first channel 1111 a and at least one second channel 1111 b being formed on the surface of the internal chamber 111 of the tubular body 11 by means of mechanical processing (such as turning), the first and second channels 1111 a, 1111 b extending in a linear form (as shown in FIG. 1) or in an arcuate form (as shown in FIG. 4) or in a spiral form (as shown in FIG. 5);
    • S3: attaching the mesh body to the inner wall face of the tubular body, the mesh body 12 being placed into the chamber 111 of the tubular body 11 and snugly attached to the inner wall face 1111 of the chamber 111 of the tubular body 11 to cover the first and second channels 1111 a, 1111 b;
    • S4: pressing the tubular body into a flat state, the tubular body 11 being placed onto a press machine 2 and pressed into a flat state by means of pressing;
    • S5: vacuuming the tubular body and filling working fluid into the tubular body, the chamber 111 of the flattened tubular body 11 being vacuumed and filled with the working fluid 13; and
    • S6: sealing the tubular body, the open end of the tubular body 11, which is vacuumed and filled with the working fluid 13 being sealed.
  • Please further refer to FIG. 11, which is a flow chart of a second embodiment of the manufacturing method for the thin heat pipe structure of the present invention. Also referring to FIGS. 1 and 2, the manufacturing method for the thin heat pipe structure of the present invention includes steps of:
    • S1: preparing a hollow tubular body and a mesh body;
    • S2: forming at least one first channel and at least one second channel on an inner wall face of the tubular body;
    • S3: attaching the mesh body to the inner wall face of the tubular body;
    • S4: pressing the tubular body into a flat state;
    • S5: vacuuming the tubular body and filling working fluid into the tubular body; and
    • S6: sealing the tubular body.
  • The second embodiment of the manufacturing method for the thin heat pipe structure of the present invention is substantially identical to the first embodiment and thus will not be repeatedly described hereinafter. The second embodiment is only different from the first embodiment in that in step S2, at least one first channel 1111 a and at least one second channel 1111 b are formed on the inner wall face 1111 of the internal chamber 111 of the tubular body 11 by means of milling.
  • Please further refer to FIG. 14, which is a flow chart of a third embodiment of the manufacturing method for the thin heat pipe structure of the present invention. Also referring to FIGS. 1 and 2, the manufacturing method for the thin heat pipe structure of the present invention includes steps of:
    • S1: preparing a hollow tubular body and a mesh body;
    • S2: forming at least one first channel and at least one second channel on an inner wall face of the tubular body;
    • S3: attaching the mesh body to the inner wall face of the tubular body;
    • S4: pressing the tubular body into a flat state;
    • S7: heat-treating the tubular body;
    • S5: vacuuming the tubular body and filling working fluid into the tubular body; and
    • S6: sealing the tubular body.
  • The third embodiment of the manufacturing method for the thin heat pipe structure of the present invention is substantially identical to the first embodiment and thus will not be repeatedly described hereinafter. The third embodiment is only different from the first embodiment in that the third embodiment further includes a step S7 of heat-treating the tubular body between step S4 and step S5. The hollow tubular body 11 and the mesh body 12 disposed in the tubular body 11 are heated by means of heat treatment. In this embodiment, the heat treatment is, but not limited to, diffusion bonding. The mesh body 12 can be more securely attached to and connected with the tubular body 11 by means of diffusion bonding to enhance heat conduction efficiency.
  • The thin heat pipe structure of the present invention is able to transfer heat both axially and radially. Therefore, the thin heat pipe structure of the present invention has very good heat transfer performance in both axial direction and radial direction by large heat transfer area.
  • The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.

Claims (12)

1. A thin heat pipe structure comprising:
a tubular body having a chamber and a working fluid, an inner wall face of the chamber being formed with at least one first channel and at least one second channel, the first and second channels extending to intersect each other; and
a mesh body having multiple meshes, the mesh body being attached to the inner wall face of the chamber.
2. The thin heat pipe structure as claimed in claim 1, wherein surfaces of the first and second channels having sintered powder.
3. The thin heat pipe structure as claimed in claim 2, wherein the sintered powder is selected from a group consisting of copper powder and aluminum powder.
4. The thin heat pipe structure as claimed in claim 1, wherein the tubular body has a first closed end and a second closed end in communication with the chamber.
5. The thin heat pipe structure as claimed in claim 1, wherein the first channel extends in an arcuate form and the second channel also extends in an arcuate form, the first and second channels intersecting each other at at least one intersection section.
6. The thin heat pipe structure as claimed in claim 1, wherein the first channel extends in a spiral form and the second channel also extends in a spiral form, the first and second channels intersecting each other at at least one intersection section.
7. The thin heat pipe structure as claimed in claim 4, wherein first and second channels are only formed in positions adjacent to the first and second closed ends of the tubular body.
8. A manufacturing method for a thin heat pipe structure, comprising steps of:
preparing a hollow tubular body and a mesh body;
forming at least one first channel and at least one second channel on an inner wall face of the tubular body;
attaching the mesh body to the inner wall face of the tubular body;
pressing the tubular body into a flat state;
vacuuming the tubular body and filling working fluid into the tubular body; and
sealing the tubular body.
9. The manufacturing method for the thin heat pipe structure as claimed in claim 8, further comprising a step of heat-treating the tubular body after the step of pressing the tubular body into the flat state, the tubular body and the mesh body disposed in the tubular body being heated by means of heat treatment after pressed into the flat state.
10. The manufacturing method for the thin heat pipe structure as claimed in claim 9, wherein the heat treatment is diffusion bonding.
11. The manufacturing method for the thin heat pipe structure as claimed in claim 8, wherein in the step of pressing the tubular body into the flat state, the tubular body is flattened by means of pressing.
12. The manufacturing method for the thin heat pipe structure as claimed in claim 8, wherein in the step of forming at least one first channel and at least one second channel on the inner wall face of the tubular body, the first and second channels are formed by means of turning or milling.
US13/154,690 2011-06-07 2011-06-07 Thin heat pipe structure and manufacturing method thereof Abandoned US20120312507A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/154,690 US20120312507A1 (en) 2011-06-07 2011-06-07 Thin heat pipe structure and manufacturing method thereof
US14/184,301 US9802240B2 (en) 2011-06-07 2014-02-19 Thin heat pipe structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/154,690 US20120312507A1 (en) 2011-06-07 2011-06-07 Thin heat pipe structure and manufacturing method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/184,301 Division US9802240B2 (en) 2011-06-07 2014-02-19 Thin heat pipe structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
US20120312507A1 true US20120312507A1 (en) 2012-12-13

Family

ID=47292143

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/154,690 Abandoned US20120312507A1 (en) 2011-06-07 2011-06-07 Thin heat pipe structure and manufacturing method thereof
US14/184,301 Active 2033-07-22 US9802240B2 (en) 2011-06-07 2014-02-19 Thin heat pipe structure and manufacturing method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/184,301 Active 2033-07-22 US9802240B2 (en) 2011-06-07 2014-02-19 Thin heat pipe structure and manufacturing method thereof

Country Status (1)

Country Link
US (2) US20120312507A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110277311A1 (en) * 2010-05-15 2011-11-17 Zhongshan Weiqiang Technology Co., Ltd. Vapor chamber manufacturing method
US20140174704A1 (en) * 2012-12-20 2014-06-26 Asia Vital Components Co., Ltd. Heat dissipation device
US20160091258A1 (en) * 2014-09-30 2016-03-31 Fujikura Ltd. Heat pipe
US20160131437A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Thin heat pipe structure
US20160131436A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Heat pipe structure
US10203169B2 (en) 2017-06-12 2019-02-12 Microsoft Technology Licensing, Llc Thermal management devices, systems and methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489777A (en) * 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US6997245B2 (en) * 2002-08-28 2006-02-14 Thermal Corp. Vapor chamber with sintered grooved wick
US20060144565A1 (en) * 2004-12-30 2006-07-06 Delta Electronics, Inc. Heat dissipation devices and fabrication methods thereof
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665573A (en) * 1970-05-18 1972-05-30 Atomic Energy Commission Method of fabricating a heat pipe
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
TW407455B (en) * 1997-12-09 2000-10-01 Diamond Electric Mfg Heat pipe and its processing method
TWI284190B (en) * 2004-11-11 2007-07-21 Taiwan Microloops Corp Bendable heat spreader with metallic screens based micro-structure and method for fabricating same
TWI285251B (en) * 2005-09-15 2007-08-11 Univ Tsinghua Flat-plate heat pipe containing channels
CN101055158A (en) * 2006-04-14 2007-10-17 富准精密工业(深圳)有限公司 Heat pipe
CN100529641C (en) * 2006-05-19 2009-08-19 富准精密工业(深圳)有限公司 Composite hot pipe and its production
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same
US20090166004A1 (en) * 2007-12-29 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat pipe
TW201100736A (en) * 2009-06-17 2011-01-01 Yeh Chiang Technology Corp Superthin heat pipe
CN201532142U (en) * 2009-10-30 2010-07-21 昆山巨仲电子有限公司 Flat heat pipe with hooked capillary structure
CN102469744A (en) * 2010-11-09 2012-05-23 富准精密工业(深圳)有限公司 Flat plate type heat pipe
US20120175084A1 (en) * 2011-01-09 2012-07-12 Chin-Hsing Horng Heat pipe with a radial flow shunt design
TW201423017A (en) * 2012-12-04 2014-06-16 Asia Vital Components Co Ltd Manufacturing method of thin heat pipe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489777A (en) * 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US6997245B2 (en) * 2002-08-28 2006-02-14 Thermal Corp. Vapor chamber with sintered grooved wick
US20060144565A1 (en) * 2004-12-30 2006-07-06 Delta Electronics, Inc. Heat dissipation devices and fabrication methods thereof
US7293601B2 (en) * 2005-06-15 2007-11-13 Top Way Thermal Management Co., Ltd. Thermoduct

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110277311A1 (en) * 2010-05-15 2011-11-17 Zhongshan Weiqiang Technology Co., Ltd. Vapor chamber manufacturing method
US8590154B2 (en) * 2010-05-15 2013-11-26 Zhongshan Weiqiang Technology Co. Vapor chamber manufacturing method
US20140174704A1 (en) * 2012-12-20 2014-06-26 Asia Vital Components Co., Ltd. Heat dissipation device
US20160091258A1 (en) * 2014-09-30 2016-03-31 Fujikura Ltd. Heat pipe
US20160131437A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Thin heat pipe structure
US20160131436A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Heat pipe structure
US10082340B2 (en) * 2014-11-12 2018-09-25 Asia Vital Components Co., Ltd. Heat pipe structure
US10203169B2 (en) 2017-06-12 2019-02-12 Microsoft Technology Licensing, Llc Thermal management devices, systems and methods

Also Published As

Publication number Publication date
US20140165401A1 (en) 2014-06-19
US9802240B2 (en) 2017-10-31

Similar Documents

Publication Publication Date Title
US9802240B2 (en) Thin heat pipe structure and manufacturing method thereof
US9506699B2 (en) Heat pipe structure
US20120305223A1 (en) Thin heat pipe structure and manufacturing method thereof
TWI407071B (en) Thin heat pipe structure and manufacturing method thereof
US20110005727A1 (en) Thermal module and manufacturing method thereof
US20100139893A1 (en) Heat spreader with vapor chamber
US20130213612A1 (en) Heat pipe heat dissipation structure
US9102020B2 (en) Manufacturing method of thin heat pipe
TW201423023A (en) Flat heat pipe and method of manufacturing the same
TW201425855A (en) Heat pipe and method for manufacturing the same
US20100243207A1 (en) Thermal module
CN204388671U (en) A kind of NEW TYPE OF COMPOSITE capillary wick plume
US20070102143A1 (en) Heat dissipation module and heat pipe thereof
WO2013085465A1 (en) Apparatus for heat dissipation and a method for fabricating the apparatus
JP3175221U (en) Heat pipe structure
TW201104201A (en) Heat dissipation device and manufacturing method thereof
US20130213609A1 (en) Heat pipe structure
US11874067B2 (en) Heat dissipation unit with axial capillary structure
US20120037344A1 (en) Flat heat pipe having swirl core
US20140338194A1 (en) Heat dissipation device and manufacturing method thereof
US9476652B2 (en) Thin heat pipe structure having enlarged condensing section
US20150122460A1 (en) Heat pipe structure
US20130126133A1 (en) Heat pipe structure
US9421648B2 (en) Manufacturing method of heat pipe structure
TWI541486B (en) Heat pipe structure and manufacturing method thereof

Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, HSIU-WEI;REEL/FRAME:026401/0279

Effective date: 20110526

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION