CN218353007U - Radiator and communication equipment - Google Patents

Abstract

The utility model relates to the field of communication technology, a radiator and communication equipment are provided, above-mentioned radiator includes: the heat dissipation plate is internally provided with a heat dissipation pipeline, the inner wall of the heat dissipation pipeline is provided with a capillary structure, and a heat dissipation medium is filled in the heat dissipation pipeline; the heat dissipation pipeline comprises an evaporation pipeline, a condensation pipeline and a connecting pipeline, the evaporation pipeline and the condensation pipeline are arranged oppositely, one end of the connecting pipeline is communicated with the evaporation pipeline, and the other end of the connecting pipeline is communicated with the condensation pipeline. The utility model discloses a radiator and communication equipment can further promote the radiating efficiency when realizing the lightweight.

Description

Radiator and communication equipment

Technical Field

The utility model relates to the field of communication technology, especially, relate to a radiator and communication equipment.

Background

A heat sink is usually disposed on a communication device in a base station to reduce the heat generation of the base station, and the conventional heat sink generally improves the heat dissipation efficiency by changing the geometric parameters of the heat dissipation fins. However, when the geometric parameters of the heat dissipation fins are optimized to a certain degree, the heat dissipation capability of the heat dissipation fins cannot be significantly improved due to marginal effect. In addition, the increase of the geometric parameters of the radiating fins can increase the volume and the weight of the radiator, and the requirement on the lightweight design of the radiator cannot be met. Therefore, the existing radiator can not improve the radiating efficiency while considering the light weight design.

SUMMERY OF THE UTILITY MODEL

The utility model provides a radiator and communication equipment for solve current radiator and can't promote the problem of radiating efficiency when taking into account the lightweight design.

The utility model provides a radiator, include: the heat dissipation plate is internally provided with a heat dissipation pipeline, the inner wall of the heat dissipation pipeline is provided with a capillary structure, and a heat dissipation medium is filled in the heat dissipation pipeline;

the heat dissipation pipeline includes evaporating pipe, condensation duct and connecting tube, evaporating pipe with condensation duct sets up relatively, the connecting tube one end with evaporating pipe communicates, the connecting tube the other end with condensation duct communicates.

According to the utility model provides a pair of radiator, the heating panel includes first heating panel and second heating panel, first heating panel with at least one of second heating panel is constructed with the bellying, the bellying is equipped with the inner chamber, the inner chamber forms the heat dissipation pipeline.

According to the utility model provides a pair of radiator, the evaporating pipe with the parallel and dislocation set of condensation duct, the connecting tube is many, many the connecting tube is followed the evaporating pipe with the extending direction of condensation duct is interval arrangement in proper order.

According to the utility model provides a radiator, the capillary structure includes first slot, second slot and third slot;

a plurality of sections of first grooves which are arranged at intervals are arranged in the evaporation pipeline, a plurality of sections of second grooves which are arranged at intervals are arranged in the condensation pipeline, and a third groove is arranged in each connecting pipeline;

the third grooves in the connecting pipeline are communicated with the first grooves in the evaporation pipelines and the second grooves in the condensation pipelines which are respectively positioned at two opposite sides of the third grooves in the connecting pipeline in a one-to-one correspondence mode.

According to the utility model provides a pair of radiator, the condensation duct is many, many the condensation duct is followed evaporation duct's extending direction is interval arrangement in proper order, evaporation duct and many condensation duct dislocation set, the connecting tube is many, many the connecting tube is followed evaporation duct's extending direction is interval arrangement in proper order, condensation duct with the connecting tube one-to-one.

According to the utility model provides a radiator, the capillary structure includes first slot, second slot and third slot;

the evaporation pipeline is provided with a plurality of sections of first grooves arranged at intervals, each groove is arranged in the condensation pipeline, the second grooves and each groove are arranged in the connecting pipeline, the third grooves are arranged in the evaporation pipeline, and the first grooves in the evaporation pipeline are communicated with the second grooves in the condensation pipeline in a one-to-one correspondence manner.

According to the utility model provides a pair of radiator, the heat dissipation pipeline is a plurality of, and every the heat dissipation pipeline is the loop configuration spare.

According to the utility model provides a heat sink, the capillary structure includes first slot, second slot and third slot;

the evaporation pipeline is internally provided with the first groove, the condensation pipeline is internally provided with the second groove, the connecting pipeline is internally provided with the third groove, the first groove in the evaporation pipeline, the third groove in the connecting pipeline and the second groove in the condensation pipeline are connected into an annular shape.

According to the utility model provides a heat sink, the capillary structure includes first slot, second slot and third slot;

the evaporation pipeline is internally provided with the first groove, the condensation pipeline is internally provided with the second groove, the connecting pipeline is internally provided with the third groove, the evaporation pipeline is internally provided with the first groove, the connecting pipeline is internally provided with the third groove and the condensation pipeline is internally provided with the second groove, the second groove is communicated with the third groove, and the third groove is integrally formed.

The utility model also provides a communication equipment, include: the radiator is described above.

The utility model provides a radiator and communication equipment, heating panel are close to communication equipment and arrange, and under the condition that communication equipment moved a period, the heat transfer that communication equipment produced to the heating panel, the heat dissipation working medium in the evaporating pipeline can absorb the heat evaporation and become gaseous to flow to the condensing pipeline and condense liquefaction in the condensing pipeline through the connecting tube. Because evaporation end liquid evaporation runs off, the condensation end liquid will flow back under the capillary action of capillary structure and supply to the evaporation end, form phase change heat transfer circulation to the realization can further promote the radiating efficiency when realizing the lightweight to communication equipment's heat dissipation.

Drawings

In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is one of schematic structural diagrams of a heat sink provided by the present invention;

FIG. 2 is an enlarged schematic view at A in FIG. 1;

fig. 3 is a schematic structural diagram of a capillary structure provided by the present invention;

FIG. 4 is an enlarged schematic view at B in FIG. 3;

FIG. 5 is an enlarged schematic view at C of FIG. 3;

fig. 6 is a schematic structural diagram of a heat dissipation pipeline provided by the present invention;

FIG. 7 is a second schematic view of the heat dissipation pipeline of the present invention

FIG. 8 is a third schematic view of the heat dissipation pipeline according to the present invention

FIG. 9 is a schematic diagram of a heat sink corresponding to the heat dissipation circuit of FIG. 8;

FIG. 10 is a partial schematic view of FIG. 9;

fig. 11 is a second schematic structural view of a heat sink according to the present invention;

FIG. 12 is an enlarged partial schematic view of FIG. 11;

fig. 13 is a third schematic structural view of a heat sink according to the present invention;

FIG. 14 is an enlarged partial schematic view of FIG. 13;

fig. 15 is a fourth schematic structural view of the heat sink provided by the present invention;

FIG. 16 is an enlarged partial schematic view of FIG. 15;

fig. 17 is a schematic structural diagram of a communication device provided by the present invention;

fig. 18 is a second schematic structural diagram of the communication device according to the present invention.

Reference numerals:

100. a heat sink;

1. an evaporation pipe; 2. a condensing duct; 3. connecting a pipeline; 4. a first heat dissipation plate; 5. a capillary structure; 51. a first trench; 52. a third trench; 53. a second trench; 6. a second heat dissipation plate;

200. a substrate.

Detailed Description

To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

The features of the terms first and second in the description and in the claims of the present invention may explicitly or implicitly include one or more of these features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the related art, a printed circuit board and a main heating device thereof in a communication device are attached to a heat conducting substrate (hereinafter referred to as a substrate) of a housing through a heat conducting interface material, and meanwhile, heat dissipation fins arranged in an array are vertically connected to the outer surface of the substrate. When the communication equipment runs, heat is conducted to the base plate through the heat-conducting interface material by the heat source, then conducted to the radiating fins by the base plate, and finally dissipated through air convection heat on the surfaces of the radiating fins.

The existing heat dissipation technical scheme is that an aluminum alloy with a high heat conductivity coefficient is generally utilized to process a case and heat dissipation fins thereof so as to realize high heat conduction performance, but because the thickness of the heat dissipation fins cannot be too thick (due to the requirements of weight, arrangement distance and quantity of the heat dissipation fins and the like), the transverse heat conduction capability in a plane is weak slightly, so that the temperature distribution has a gradient positively correlated with the plane size, namely the temperature near a heat source is high, the temperature far away from the heat source is low, and the heat source is not beneficial to cooling.

In order to improve the heat conduction performance of the radiating fins, some equipment also adopts the radiating fins with the communicated pipelines, and the radiating fins are integrally hot-rolled and locally bundled by a pair of attached aluminum plates, and then are subjected to a blowing process to form the integral plate-shaped radiating fins with the pipelines locally, which are hereinafter referred to as blowing plates. The finished product pipeline is filled with working medium and is integrally sealed, and two-phase flow and latent heat absorption and release are generated by phase change of the working medium in the pipeline at a heat source and a condensation position during working, so that the integral heat transfer capacity is enhanced.

However, the working medium gas-state and liquid-state two-phase fluid in the blown plate shares a set of pipelines to mutually influence, the influence of the filling rate of the working medium, the gravity, the heat source distribution and the pipeline layout is large, the phase change heat transfer efficiency is unstable, and the situation that the overall heat conduction temperature equalization performance is inferior to that of a pure aluminum alloy radiating fin can occur.

In order to solve the above problem, as shown in fig. 1 and fig. 2, the heat sink of the embodiment of the present invention includes: the heat dissipation plate is internally provided with a heat dissipation pipeline which is of a closed structure, the inner wall of the heat dissipation pipeline is provided with a capillary structure 5, and a heat dissipation medium is filled in the heat dissipation pipeline.

Wherein, the heat dissipation pipeline includes evaporating pipe 1, condensing pipe 2 and connecting tube 3, and evaporating pipe 1 and condensing pipe 2 set up relatively, and connecting tube 3's one end and evaporating pipe 1 intercommunication, connecting tube 3's the other end and condensing pipe 2 intercommunication.

Specifically, evaporating pipe 1 and condensing pipe 2 all extend along the length direction of heating panel and form, and evaporating pipe 1 is close to the marginal position setting of heating panel, and connecting tube 3 extends along the width direction of heating panel and forms, and evaporating pipe 1 links together through connecting tube 3 with condensing pipe 2, and connecting tube 3's quantity can be selected according to operating condition, does not do the specific limit here.

It should be noted that the inner walls of the evaporation pipeline 1, the condensation pipeline 2 and the connection pipeline 3 are all provided with the capillary structure 5, and the capillary structure 5 of the evaporation pipeline 1, the capillary structure 5 of the condensation pipeline 2 and the capillary structure 5 of the connection pipeline 3 need to be communicated.

The embodiment of the utility model provides an in, the heating panel is close to communication equipment and arranges, and under communication equipment operation a period's the condition, heat transfer to the heating panel that communication equipment produced, the heat dissipation working medium in the evaporating pipe 1 can absorb the heat evaporation and become gaseous to flow condensing pipe 2 and in condensing pipe 2 condensation liquefaction through connecting tube 3. Because the evaporation end liquid is evaporated and lost, the condensation end liquid flows back and is supplemented to the evaporation end under the action of the capillary force of the capillary structure 5 to form phase change heat exchange circulation, and therefore heat dissipation of the communication equipment is achieved. The utility model discloses radiator can further promote the radiating efficiency when realizing the lightweight.

In an alternative embodiment, as shown in fig. 2, the heat dissipation plate comprises a first heat dissipation plate 4 and a second heat dissipation plate 6, at least one of the first heat dissipation plate 4 and the second heat dissipation plate 6 is configured with a protrusion, the protrusion is provided with an inner cavity, and the inner cavity forms a heat dissipation pipeline.

The first heat dissipation plate 4 and the second heat dissipation plate 6 may be metal plates, for example, the first heat dissipation plate 4 and the second heat dissipation plate 6 may be made of aluminum alloy, and the thicknesses of the first heat dissipation plate 4 and the second heat dissipation plate 6 are required to ensure that heat dissipation pipelines can be formed, for example, the thicknesses of the first heat dissipation plate 4 and the second heat dissipation plate 6 may be 0.5-2 mm.

Specifically, the first heat dissipation plate 4 and the second heat dissipation plate 6 are tightly attached to each other, and in the case where the first heat dissipation plate 4 is configured with a protrusion, the first heat dissipation plate 4 and the second heat dissipation plate 6 are welded and fused into a single-layer plate structure within a certain width range of the edge of the protrusion, so that a closed cavity structure is formed integrally. The welding can also be performed on other positions, for example, the bonding surface with a certain width of the outline of the heat dissipation pipeline area is welded to enhance the tightness of the pipeline.

The following describes how the first heat sink 4 is configured as a convex portion.

The first heat dissipation plate 4 is formed with a plurality of elongated protrusions by a stamping process or a hydraulic process, and the corresponding opposite surfaces of the protrusions form an inner cavity. Wherein the height of the projections may be 2 to 4 times the height of the first heat dissipation plate 4.

The following is a detailed description of how the evaporation pipe 1, the condensation pipe 2, and the connection pipe 3 are formed.

The first heat dissipation plate 4 comprises at least two vertical protrusions (an evaporation pipeline 1 and a condensation pipeline 2), and a plurality of transverse protrusions (connecting pipelines 3) are connected between the vertical protrusions. After the first heat dissipation plate 4 and the second heat dissipation plate 6 are attached, the inner surface of the convex area naturally forms a hollow pipeline. Generally, a vertical pipe is processed near the edge of the first heat dissipation plate 4 to serve as the evaporation pipe 1.

It should be noted that a certain amount of phase change heat transfer working medium is filled in the heat dissipation pipeline, and the phase change heat transfer working medium is kept in a negative pressure state relative to the standard atmospheric pressure at normal temperature and working temperature, and the non-welded parts of the first heat dissipation plate 4 and the second heat dissipation plate 6 are tightly attached due to the internal and external pressure difference, so that the integrity of the wall surface of the heat dissipation pipeline and the heat transfer of the contact surface between the first heat dissipation plate 4 and the second heat dissipation plate 6 are ensured.

In an alternative embodiment, in the case where the first heat dissipation plate 4 is configured with the first convex portion and the second heat dissipation plate 6 is configured with the second convex portion, the convex direction of the first convex portion and the convex direction of the second convex portion are opposite, and a heat dissipation pipeline is formed between the inner wall of the first convex portion and the inner wall of the second convex portion.

Note that, the first heat dissipation plate 4 is formed with a plurality of elongated protrusions by a process such as stamping or hydraulic pressing in advance, the second heat dissipation plate 6 is formed with a plurality of elongated protrusions by a process such as stamping or hydraulic pressing in advance, and the inner surfaces of the protrusion areas of the first heat dissipation plate 4 and the second heat dissipation plate 6 naturally form hollow pipes after the two plates are attached to each other.

The embodiment of the utility model provides an in, form the heat dissipation pipeline between the inner wall of first bellying and the inner wall of second bellying, can promote the ability that holds the heat dissipation medium of heat dissipation pipeline to promote the radiating efficiency.

In an alternative embodiment, as shown in fig. 1, the evaporation pipeline 1 and the condensation pipeline 2 are arranged in parallel and in a staggered manner, the number of the connecting pipelines 3 is multiple, and the multiple connecting pipelines 3 are sequentially arranged at intervals along the extending direction of the evaporation pipeline 1 and the condensation pipeline 2.

The staggered arrangement of the evaporation pipeline 1 and the condensation pipeline 2 means that the starting ends of the evaporation pipeline 1 and the condensation pipeline 2 are not arranged in a flush manner, for example, in the case that the lengths of the evaporation pipeline 1 and the condensation pipeline 2 are equal, the starting ends of the evaporation pipeline 1 and the condensation pipeline 2 are not arranged in a flush manner, and the tail ends of the evaporation pipeline 1 and the condensation pipeline 2 are not arranged in a flush manner.

It should be noted that the heat dissipation pipeline includes a vertical evaporation pipeline 1 near the left edge of the heat dissipation plate, a condensation pipeline 2 near the right edge of the heat dissipation plate, and a plurality of transverse connection pipelines 3 connecting the evaporation pipeline 1 and the condensation pipeline 2. The number of the transverse connecting pipelines 3 is positively correlated with the overall height of the heat dissipation plate, namely, the whole connecting pipelines 3 are uniformly laid in the area range of the heat dissipation plate.

It should be noted in particular that, in order to facilitate the liquid return, the transverse connecting duct 3 is disposed obliquely with respect to the evaporating duct 1 and the condensing duct 2, and, in order to increase the liquid return speed, the height of the end of the connecting duct 3 connected to the condensing duct 2 is greater than the height of the end of the connecting duct 3 connected to the evaporating duct 1.

In an alternative embodiment, as shown in fig. 3, 4 and 5, the capillary structure 5 comprises a first groove 51, a second groove 53 and a third groove 52.

The groove is formed in a substantially semicircular or U-shaped form, thereby facilitating the processing and relieving the stress concentration at the bottom of the groove.

For example, in the case where the groove is U-shaped, the groove depth may be set to 0.5 to 1.5mm and the groove width may be set to 0.3 to 1.0mm.

Be equipped with the first slot 51 that the multistage interval set up in the evaporating pipe 1, be equipped with the second slot 53 that the multistage interval set up in the condensing pipe 2, all be equipped with third slot 52 in every connecting tube 3.

The third grooves 52 in the connecting duct 3 communicate with the first grooves 51 in the evaporation duct 1 and the second grooves 53 in the condensation duct 2 on opposite sides thereof, respectively, in a one-to-one correspondence.

A plurality of sections of first grooves 51 are arranged in the evaporation pipeline 1, the plurality of sections of first grooves 51 are not communicated with each other, the plurality of sections of first grooves 51 are sequentially arranged at intervals along the length direction of the evaporation pipeline 1, and the extension direction of the first grooves 51 is consistent with the length direction of the evaporation pipeline 1; a plurality of sections of second grooves 53 are formed in the condensation pipeline 2, the plurality of sections of second grooves 53 are not communicated with each other, the plurality of sections of second grooves 53 are sequentially arranged at intervals along the length direction of the condensation pipeline 2, and the extending direction of the second grooves 53 is consistent with the length direction of the condensation pipeline 2; the connecting pipe 3 is provided with a third groove 52 therein, the extending direction of the third groove 52 is the same as the length direction of the connecting pipe 3, and the length of the third groove 52 is the same as the length of the connecting pipe 3.

It should be noted that the third grooves 52 are in one-to-one correspondence with the first grooves 51 and the second grooves 53 respectively located on two opposite sides of the third grooves, and the overall capillary structure is "S" shaped.

It should be noted that, under certain requirements or limitations, the capillary structure 5 of the inner wall of the heat dissipation pipeline in the embodiment of the present invention may be replaced by other structural forms that utilize the surface tension effect to transfer fluid. Such as porous media implemented with metal powder sintered or other process materials, and woven cotton-like structures from threads, etc.

In an alternative embodiment, as shown in fig. 11, in order to enhance uniform backflow of the condensed liquid working medium, the number of the condensation pipes 2 is multiple, the multiple condensation pipes 2 are sequentially arranged at intervals along the extending direction of the evaporation pipe 1, the evaporation pipe 1 and the multiple condensation pipes 2 are arranged in a staggered manner, the number of the connection pipes 3 is multiple, the multiple connection pipes 3 are sequentially arranged at intervals along the extending direction of the evaporation pipe 1, and the condensation pipes 2 correspond to the connection pipes 3 one to one.

It should be noted that, a plurality of condensing pipes 2 are arranged at intervals in sequence along the extending direction of the evaporating pipe 1, and the length direction of each condensing pipe 2 is the same as the length direction of the evaporating pipe 1, the tail end of each condensing pipe 2 is communicated with the evaporating pipe 1 through a connecting pipe 3, and the number of the connecting pipes 3 is the same as the number of the condensing pipes 2.

In an alternative embodiment, as shown in fig. 12, the capillary structure 5 comprises a first groove 51, a second groove 53 and a third groove 52.

Evaporating pipe 1 is equipped with the first slot 51 that the multistage interval set up, all is equipped with second slot 53 in every condensing pipe 2, all is equipped with third slot 52 in every connecting tube 3, and first slot 51 in the evaporating pipe 1 communicates through the third slot 52 in the connecting tube 3 and the second slot 53 one-to-one in the condensing pipe 2.

A plurality of sections of first grooves 51 are arranged in the evaporation pipeline 1, the plurality of sections of first grooves 51 are not communicated with each other, the plurality of sections of first grooves 51 are sequentially arranged at intervals along the length direction of the evaporation pipeline 1, and the extension direction of the first grooves 51 is consistent with the length direction of the evaporation pipeline 1; a second groove 53 is arranged in each condensation pipeline 2, and the extending direction of the second groove 53 is consistent with the length direction of the condensation pipeline 2; the connecting pipe 3 is provided with a third groove 52 therein, the extending direction of the third groove 52 is the same as the length direction of the connecting pipe 3, and the length of the third groove 52 is the same as the length of the connecting pipe 3.

It should be noted that the grooves in the evaporation pipe 1 are in one-to-one correspondence with the grooves in the condensation pipe 2 through the grooves in the connection pipe 3, and in this case, a plurality of S-shaped capillary structures are included.

In an alternative embodiment, as shown in fig. 13, in order to further improve the heat-conducting and temperature-equalizing performance of the heat-dissipating plate in the left-right direction, the application of a wider heat-dissipating plate is satisfied. The heat dissipation pipeline is a plurality of, and every heat dissipation pipeline is the annular structure spare.

For the purpose of description, the heat dissipation pipeline comprises an evaporation pipeline 1, a condensation pipeline 2 and two connecting pipelines 3, the evaporation pipeline 1 and the condensation pipeline 2 are arranged in parallel and in a staggered manner, one connecting pipeline 3 is connected with the starting end of the evaporation pipeline 1 and the starting end of the condensation pipeline 2, and the other connecting pipeline 3 is connected with the tail end of the evaporation pipeline 1 and the tail end of the condensation pipeline 2

Wherein, the staggered arrangement of the evaporation pipeline 1 and the condensation pipeline 2 refers to the arrangement that the starting ends of the evaporation pipeline 1 and the condensation pipeline 2 are not flush, for example, under the condition that the lengths of the evaporation pipeline 1 and the condensation pipeline 2 are equal, the starting ends of the evaporation pipeline 1 and the condensation pipeline 2 are not flush, the tail ends of the evaporation pipeline 1 and the condensation pipeline 2 are not flush, the position of the condensation pipeline 2 on the heat dissipation plate at the moment is higher than the position of the evaporation pipeline 1 on the heat dissipation plate, and the two connecting pipelines 3 are both obliquely arranged.

In an alternative embodiment, as shown in fig. 14, the capillary structure 5 comprises a first groove 51, a second groove 53 and a third groove 52.

A first groove 51 is formed in the evaporation pipeline 1, a second groove 53 is formed in the condensation pipeline 2, a third groove 52 is formed in the connecting pipeline 3, and the first groove 51 in the evaporation pipeline 1, the third groove 52 in the connecting pipeline 3 and the second groove 53 in the condensation pipeline 2 are connected in an annular shape.

A first groove 51 is arranged in the evaporation pipeline 1, and the extending direction of the first groove 51 is consistent with the length direction of the evaporation pipeline 1; a second groove 53 is arranged in the condensation pipeline 2, and the extending direction of the second groove 53 is consistent with the length direction of the condensation pipeline 2; the connecting pipe 3 is provided with a third groove 52 therein, the extending direction of the third groove 52 is the same as the length direction of the connecting pipe 3, and the length of the third groove 52 is the same as the length of the connecting pipe 3.

It should be noted that the grooves in the evaporation pipeline 1 are correspondingly communicated with the grooves in the condensation pipeline 2 one by one through the grooves in the connection pipeline 3, at this time, a "back" shaped capillary structure 5 can be formed, and the "back" shaped capillary structure 5 can be integrally formed.

Particularly, the filling of the heat dissipation working medium in the heat dissipation pipeline can adopt that a thin tube is respectively processed and connected to a main injection tube, the thin tube is flattened and welded to be closed after the heat dissipation working medium is filled once, and then the injection tube is cut off so as to keep the rectangular outline of the finished heat radiator.

In an alternative embodiment, as shown in fig. 6, 7 and 8, in the case that the heat dissipation plates include the first heat dissipation plate 4 and the second heat dissipation plate 6, the first groove 51 corresponding to the evaporation pipe 1, the second groove 53 corresponding to the condensation pipe 2 and the third groove 52 corresponding to the connection pipe 3 are provided in the first heat dissipation plate 4 or the second heat dissipation plate 6, or the first groove 51, the second groove 53 and the third groove 52 are provided in each of the first heat dissipation plate 4 or the second heat dissipation plate 6, which can be freely selected according to different requirements of heat conduction performance and cost, and thus, an optimal matching can be achieved.

For example, the capillary structure 5 is provided to the second heat dissipation plate 6 in the case where the first heat dissipation plate 4 is provided with the convex portions, or the capillary structure 5 is provided to the first heat dissipation plate 4 and the second heat dissipation plate 6 in the case where both the first heat dissipation plate 4 and the second heat dissipation plate 6 are provided with the convex portions.

In an alternative embodiment, as shown in fig. 9 and 10, in the case that the evaporation pipeline 1 and the condensation pipeline 2 are arranged in parallel and in a staggered manner, the connection pipeline 3 is provided with a plurality of connection pipelines 3, and the plurality of connection pipelines 3 are sequentially arranged at intervals along the extending direction of the evaporation pipeline 1 and the condensation pipeline 2, the first heat dissipation plate 4 and the second heat dissipation plate 6 are both provided with protrusions, and the capillary structures 5 are arranged on the first heat dissipation plate 4 and the second heat dissipation plate 6.

In an alternative embodiment, as shown in fig. 15 and 16, the capillary structure 5 comprises a first groove 51, a second groove 53 and a third groove 52.

Be equipped with first slot 51 in the evaporating pipe 1, be equipped with second slot 53 in the condensing pipe 2, be equipped with third slot 52 in the connecting tube 3, first slot 51 in the evaporating pipe 1, third slot 52 in the connecting tube 3 and the second slot 53 in the condensing pipe 2 intercommunication and integrated into one piece.

It should be noted that, in order to further reduce the processing cost, one of the first heat dissipation plate 4 and the second heat dissipation plate 6 is configured as a flat plate structure, and the other of the first heat dissipation plate 4 and the second heat dissipation plate 6 is configured with a protrusion, for example, parallel grooves covering the entire surface are processed at one time on the surface of the first heat dissipation plate 4 in a flat plate shape by an extrusion profile manner, and a layer of material is removed by machining in the peripheral area to be welded to form a smooth plane. Correspondingly, the second heat dissipation plate 6 is punched to form all pipelines and a periphery welding plane, and finally the first heat dissipation plate 4 and the second heat dissipation plate 6 are aligned, attached and welded on the periphery to form the radiator with the closed pipelines and the whole layer of backflow grooves inside.

The utility model discloses the radiator, in the aspect of the performance, similar with conventional heat pipe theory of operation, the working medium that dispels the heat in the during operation heat dissipation pipeline is being close to the slightly high regional heat absorption evaporation of heat source temperature, keep away from the slightly low temperature region condensation end liquefaction of heat source temperature and release heat, because evaporating end and condensation end pressure differential, gaseous state working medium will flow the condensing end by the evaporating end, liquefied working medium flows back fast again to the evaporating end under the capillary force effect of pipe wall slot, so the reciprocal realization high efficiency of circulation is passed heat, the heat conductivility of its pipeline will be equivalent to the heat pipe. Because the plurality of groups of radiating pipelines are arranged in the radiator, the integral heat conduction and temperature uniformity performance of the radiator is greatly improved compared with that of a common aluminum plate radiating fin or a blowing plate, and the temperature uniformity performance of the radiator is about 5 times or more than that of a pure aluminum alloy flat radiating fin with the same thickness through the optimized selection of the radiating pipelines and the grooves.

The utility model discloses the radiator, in the aspect of material and manufacturing process, can adopt conventional heat radiation materials such as aluminum alloy and conventional panel beating processing technology. In addition, compared with a blown plate, the whole hot rolling and local printing of a rolling inhibitor are not needed in the processing, the blowing process is not needed, and only the groove is processed and then the protrusion is formed according to the stamping process and welded and sealed (the groove in the first heat dissipation plate 4 and the second heat dissipation plate 6 can be preferably subjected to hydraulic and other flexible stamping). Because the non-welding areas of the upper plate and the lower plate under the action of negative pressure are tightly attached under the action of external atmospheric pressure, the pipeline shape and the contact heat conduction between the upper plate and the lower plate are maintained.

In addition, the embodiment of the present invention further provides a communication device, as shown in fig. 17 and fig. 18, the communication device includes the above-mentioned heat sink 100.

Specifically, the communication device may include an AAU (Active Antenna Unit), and since the AAU is generally installed on an upper portion of a tower or a floor outer wall, the heat sink 100 may be disposed on the AAU to dissipate heat of the AAU by conducting heat of the AAU through the substrate 200, with high heat dissipation efficiency and small volume and weight. Furthermore, the communication device provided with the heat sink 100 can also be used in a 5G base station, and the problem of large heat generation of the 5G base station can be effectively solved.

It should be noted that the heat sink 100 is disposed on the substrate 200, and the heat sink 100 includes a plurality of heat dissipation plates, for example, the plurality of heat dissipation plates are vertically arranged on the substrate 200; or, the heat dissipation plates are divided into two symmetrical left and right groups, and each group of heat dissipation plates are inclined at the same certain angle and are mounted on the substrate 200, so as to achieve different heat convection effects.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (10)

1. A heat sink, comprising: the heat dissipation plate is internally provided with a heat dissipation pipeline, the inner wall of the heat dissipation pipeline is provided with a capillary structure, and a heat dissipation medium is filled in the heat dissipation pipeline;

the heat dissipation pipeline comprises an evaporation pipeline, a condensation pipeline and a connecting pipeline, the evaporation pipeline and the condensation pipeline are arranged oppositely, one end of the connecting pipeline is communicated with the evaporation pipeline, and the other end of the connecting pipeline is communicated with the condensation pipeline.

2. The heat sink of claim 1, wherein the heat sink comprises a first heat sink and a second heat sink, at least one of the first heat sink and the second heat sink configured with a raised portion, the raised portion having an interior cavity, the interior cavity forming the heat sink conduit.

3. The heat sink as claimed in claim 1, wherein the evaporation pipe and the condensation pipe are disposed in parallel and in a staggered manner, the connection pipes are disposed in a plurality of spaced manner in sequence along the extension direction of the evaporation pipe and the condensation pipe.

4. The heat sink of claim 3, wherein the capillary structure comprises a first groove, a second groove, and a third groove;

a plurality of sections of first grooves which are arranged at intervals are arranged in the evaporation pipeline, a plurality of sections of second grooves which are arranged at intervals are arranged in the condensation pipeline, and a third groove is arranged in each connecting pipeline;

the third grooves in the connecting pipeline are communicated with the first grooves in the evaporation pipelines and the second grooves in the condensation pipelines which are respectively positioned at two opposite sides of the third grooves in the connecting pipeline in a one-to-one correspondence manner.

5. The heat sink according to claim 1, wherein the number of the condensation pipes is plural, the plural condensation pipes are sequentially spaced along an extending direction of the evaporation pipe, the evaporation pipe and the plural condensation pipes are arranged in a staggered manner, the number of the connection pipes is plural, the plural connection pipes are sequentially spaced along the extending direction of the evaporation pipe, and the condensation pipes and the connection pipes are in one-to-one correspondence.

6. The heat sink of claim 5, wherein the capillary structure comprises a first groove, a second groove, and a third groove;

the evaporation pipeline is provided with a plurality of sections of first grooves arranged at intervals, each condensation pipeline is internally provided with a second groove, each connecting pipeline is internally provided with a third groove, and the first grooves in the evaporation pipeline are communicated with the second grooves in the condensation pipeline in a one-to-one correspondence manner.

7. The heat sink according to claim 1, wherein the heat dissipating pipe is plural, and each of the heat dissipating pipes is an annular structural member.

8. The heat sink of claim 7, wherein the capillary structure comprises a first groove, a second groove, and a third groove;

the evaporation pipeline is internally provided with the first groove, the condensation pipeline is internally provided with the second groove, the connecting pipeline is internally provided with the third groove, the first groove in the evaporation pipeline, the third groove in the connecting pipeline and the second groove in the condensation pipeline are connected into an annular shape.

9. The heat sink of claim 3, 5 or 7, wherein the capillary structure comprises a first groove, a second groove and a third groove;

the evaporation pipeline is internally provided with the first groove, the condensation pipeline is internally provided with the second groove, the connecting pipeline is internally provided with the third groove, the evaporation pipeline is internally provided with the first groove, the connecting pipeline is internally provided with the third groove and the condensation pipeline is internally provided with the second groove, the second groove is communicated with the third groove, and the third groove is integrally formed.

10. A communication device, comprising: the heat sink of any one of claims 1 to 9.

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