CN209763252U

CN209763252U - Heat transfer structure

Info

Publication number: CN209763252U
Application number: CN201822193921.0U
Authority: CN
Inventors: 王飞; 孙学栋
Original assignee: Shenzhen Graphene-Land Legend Technology Co Ltd
Current assignee: Shenzhen Graphene-Land Legend Technology Co Ltd
Priority date: 2018-12-25
Filing date: 2018-12-25
Publication date: 2019-12-10
Anticipated expiration: 2028-12-25

Abstract

The utility model belongs to the technical field of temperature regulation structure, especially, relate to a heat transfer structure, heat transfer structure includes: a cryogenic part; a high temperature member having a heat emitting end; the heat conducting film comprises a first end and a second end, the heat conducting film is flexible and can be bent, the first end is connected with the low-temperature part, and the second end is connected with the heating end, so that heat transfer is realized between the high-temperature part and the low-temperature part through the heat conducting film to transfer heat. The utility model discloses a heat transfer structure is connected through the heat conduction membrane between high temperature spare and the low temperature spare, can realize thermal high-efficient transmission between high temperature spare and the low temperature spare, reaches the purpose to the temperature regulation and the control of high temperature spare or low temperature spare, because the heat conduction membrane can be buckled at will and warp, and the heat conduction membrane can be tailor according to actual installation environment, can be applicable to various different installation environments, and occupation space is little, with low costs itself.

Description

heat transfer structure

Technical Field

The utility model belongs to the technical field of the temperature regulation structure, especially, relate to a heat transfer structure.

Background

In life and production, many devices and places need to be subjected to temperature regulation and control, and the temperature regulation is realized through heat transmission between a terminal and a cold and heat source, so that the efficiency of heat transmission is a key factor of the temperature regulation effect. In the existing heat transfer structure, the medium for transferring heat is usually water or metal, and the use of the medium has high requirements on the structure and installation and also needs a lot of space. For example, in a heating device, heat is transferred by water, the scheme usually needs to design a complicated water pipeline, various measures are adopted to prevent the pipeline from being corroded, burst or leaked, the cost and the construction difficulty are high, and the water temperature is up to 100 ℃, so that the heat transfer efficiency is limited.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat transfer structure aims at solving the heat transfer structure installation difficulty among the prior art, occupation space is big, with high costs and the relatively poor technical problem of radiating efficiency.

in order to achieve the above object, the utility model adopts the following technical scheme: a heat transfer structure comprising:

A cryogenic part;

A high temperature member having a heat emitting end;

The heat conduction membrane comprises a first end and a second end, the heat conduction membrane is flexible and can be bent, the first end is connected with the low-temperature part, and the second end is connected with the heating end, so that heat transfer is achieved between the high-temperature part and the low-temperature part through the heat conduction membrane to dissipate heat.

Further, the high-temperature part is a chip, the first end is connected to the top surface of the chip, and the second end is connected with the low-temperature part.

Further, the low-temperature part is a refrigerator with a refrigerating function.

Furthermore, the low-temperature part and the heat conduction film are both provided with a plurality of parts, and the high-temperature part transfers heat to the corresponding low-temperature part through each heat conduction film.

Further, the low-temperature part is a heat dissipation part with a heat dissipation structure.

Further, the low temperature part is a metal heat dissipation part.

Furthermore, the heat conduction membrane is provided with a plurality of layers, the plurality of layers of heat conduction membranes are sequentially stacked, and the first end of each layer of heat conduction membrane is respectively connected with the low-temperature part.

Further, a protective layer is coated outside the heat conduction film.

Further, the protective layer is a thermal insulation layer or an insulating layer.

Further, the heat conduction membrane is one of a graphite membrane, an artificial graphite membrane or a graphene heat conduction membrane.

the utility model has the advantages that: the utility model discloses a heat transfer structure is connected through the heat conduction membrane between high temperature spare and the low temperature spare, can realize thermal high-efficient transmission between high temperature spare and the low temperature spare, reaches the purpose to the temperature regulation and the control of high temperature spare or low temperature spare, because the heat conduction membrane can be buckled at will and warp, and the heat conduction membrane can be tailor according to actual installation environment, can be applicable to various different installation environments, and occupation space is little, with low costs itself.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a heat transfer structure provided in an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a heat transfer structure according to an exemplary embodiment;

FIG. 3 is a schematic top view of the heat transfer structure shown in FIG. 2 before the heat conductive film is bent;

FIG. 4 is a schematic diagram of a heat transfer structure according to an embodiment;

Fig. 5 is a schematic cross-sectional view of the thermally conductive film near the first end in the heat transfer structure of fig. 4.

Wherein, in the figures, the respective reference numerals:

100-low-temperature part 110-cold end 120-hot end

130-metal radiating fin 140-metal connecting piece 200-high temperature piece

300-thermally conductive film 310-first end 320-second end

330-connecting part 331-first segment 332-second segment

400-terminal equipment 410-housing 411-opening

500 — wall.

Detailed Description

reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

As shown in fig. 1, fig. 2 and fig. 4, the heat transfer structure provided by the embodiment of the present invention can be applied to an electronic device or an indoor heating system, and includes a low temperature member 100, a high temperature member 200 and a heat conductive film 300. The high-temperature part 200 is provided with a heating end, when the high-temperature part 200 works, the temperature of the high-temperature part 200 is higher than that of the low-temperature part 100, namely, the temperature difference exists between the high-temperature part and the low-temperature part, the high-temperature part 200 can be an active heating part, and the low-temperature part 100 can be an active refrigerating part; the heat conduction membrane 300 includes first end 310 and second end 320, the heat conduction membrane 300 has flexibility and can buckle, the first end 310 of heat conduction membrane 300 is connected with low temperature 100, the second end 320 is connected with the end that generates heat of high temperature 200, so, can realize heat transfer through heat conduction membrane 300 between high temperature 200 and the low temperature 100, high temperature 200 accessible heat conduction membrane 300 transmits heat for low temperature 100 with heat fast, make high temperature 200 rapid cooling, or make low temperature 100 rapid heating up.

The heat transfer structure that this embodiment provided, connect through heat conduction membrane 300 between high temperature 200 and the low temperature 100, can realize thermal high-efficient transmission between high temperature 200 and the low temperature 100, reach the purpose to the temperature regulation and the control of high temperature 200 or low temperature 100, because heat conduction membrane 300 can buckle at will and warp, and heat conduction membrane 300 can tailor according to actual installation environment, can be applicable to various different installation environments, and occupation space is little, with low costs itself.

In one embodiment, the thermal conductive film 300 includes one or more of a graphite film, an artificial graphite film, or a graphene thermal conductive film. In an embodiment, the thermal conductive film 300 is a graphene thermal conductive film, which has excellent thermal conductive performance, the thermal conductivity in the plane direction is above 1000W/(m · K), heat can be quickly conducted in the plane direction, and the temperature of a hot spot can be dispersed in an electronic product, and the temperature of the hot spot can be reduced. The density of the thermally conductive film 300 may be 1-2.5g/cm³The thickness of the thermally conductive film 300 can be set in the range of 5-300um, for example, 5um, 10um, 20um, 30um, 50um, 70um, 100um, 120um, 150um, 180um, 220um, 250um, 260um, 280um, 290um, 300um, etc.

In one embodiment, the second end 320 of the thermal film 300 is bonded to the heat-generating end of the high-temperature part 200 by a thermal conductive adhesive, or the second end 320 of the thermal film 300 is bonded to the heat-generating end of the high-temperature part 200 by a thermal conductive adhesive; the first end 310 of the thermal conductive film 300 is fixed to the low-temperature member 100 by thermal conductive adhesive, and heat transfer between the high-temperature member 200 and the low-temperature member 100 is achieved through the thermal conductive film 300. It is understood that the connection between the thermal membrane 300 and the high-temperature member 200 and the low-temperature member 100 can also be fixed by a mechanical structure.

as shown in fig. 1, the thermal conductive film 300 may be a rectangular thermal conductive film, i.e., the first end 310 and the second end 320 have the same width; as shown in fig. 2 and 3, the outline of the thermal conductive film 300 may have a shape with a variable width, for example, the width of the first end 310 is smaller than that of the second end 320, and the contact area of the second end 320 with the low temperature member 100 is larger than that of the first end 310 with the heat-emitting end; the entire thermal conductive film 300 may have other shapes, for example, the area between the first end 310 and the second end 320 is formed with a corner, that is, the first end 310 and the second end 320 are not in the same extending direction, the thermal conductive film 300 having this shape can adapt to the actual use environment, and in addition, the thermal conductive film 300 itself has a certain flexibility and can be distorted and deformed, so that the thermal conductive film 300 can be smoothly installed and connected between the high temperature member 200 and the low temperature member 100 under the condition that the positions of the high temperature member 200 and the low temperature member 100 are not easily changed or are misaligned or the gap between the high temperature member 200 and the low temperature member 100 is small, and the applicability of the thermal conductive film 300 is greatly improved.

In one embodiment, the heat transfer structure is applied to the terminal device 400. The high-temperature part 200 is a chip disposed in the housing 410 of the terminal device 400, the first end 310 of the thermal conductive film 300 is connected to the top surface of the chip, and the second end 320 penetrates through the housing 410 of the terminal device 400 to be connected to the low-temperature part 100. An opening 411 for the heat conducting film 300 to pass through is formed in one side of the housing 410, the second end 320 of the heat conducting film 300 extends into the housing 410 from the opening 411 and is attached and fixed on the top surface of the chip, and the attachment contact area of the second end 320 and the chip is equal to or approximately equal to the area of the top surface of the chip. Since the thermal conductive film 300 has low thermal conductivity in the normal direction, heat is not substantially conducted to other electronic components in the terminal device 400, and safety and reliability are achieved. An insulating layer for insulation may be further disposed outside the thermal conductive film 300 to insulate the thermal conductive film 300 from other electronic components in the terminal device 400.

The housing 410 may be a shielding box for preventing interference of an external electromagnetic field, and since the heat-conducting film 300 is flat, the second end 320 of the heat-conducting film 300 can be inserted into the shielding box for installation only by forming the smaller opening 411, which has a very small influence on the performance and the service life of the terminal device 400.

As shown in fig. 2 and 3, in an embodiment, the thermal membrane 300 further includes a connecting portion 330 connected between the first end 310 and the second end 320, the connecting portion 330 includes a first section 331 and a second section 332, an extending direction of the first section 331 forms an included angle with an extending direction of the second section 332, the first section 331 is connected with the first end 310, the second section 332 is connected with the second end 320, and a gap is formed between the second section 332 and the first end 310. In one embodiment, the extending direction of the first segment 331 is perpendicular to the extending direction of the second segment 332, the attaching surface of the low temperature component 100 and the first end 310 is a first attaching surface, and the attaching surface of the high temperature component 200 and the second end 320 is a second attaching surface, so that the heat conducting film 300 is suitable for the case where the first attaching surface and the second attaching surface are perpendicular and the gap between the low temperature component 100 and the high temperature component 200 is small. It can be understood that the heat-conducting film can be cut into a proper shape according to the actual installation environment.

The area of the end face of the first end 310 is set to be larger than that of the end face of the second end 320, the gap between the second section 332 and the first end 310 can be set according to the actual installation environment, and the included angle between the first section 331 and the second section 332 of the connecting part 330 can also be set according to the actual use environment. That is to say, the connecting portion 330 can be specifically set according to the positions where the high-temperature part 200 and the low-temperature part 100 are placed, the ease of movement and the characteristics of the placement of the high-temperature part 200 and the low-temperature part 100, during actual operation, the size of the connecting portion 330 suitable for the installation and use environment and the overall dimension of the whole heat conducting film 300 can be designed firstly, one piece with a preset shape is cut out from one large heat conducting film, the piece is taken out, and the first end 310 and the second end 320 are respectively attached and fixed on the low-temperature part 100 and the high-temperature part 200 through heat conducting silica gel, the heat transfer structure is very flexible in design, the parts are convenient to install, the heat transfer structure can be suitable for use in different environments, high heat transfer efficiency is achieved, and the temperature of.

As shown in fig. 2, in one embodiment, cryogenic member 100 is a refrigerator having a refrigeration function, such as a semiconductor refrigerator. The semiconductor refrigerator uses a conductor to connect two different metals, and is connected with direct current, and utilizes the Peltier effect (also called thermal-electric effect), and the temperature of one junction is reduced, and the temperature of another junction is raised, so that in order to obtain larger Peltier effect, it can use an N-type semiconductor and a P-type semiconductor to replace metal, and after the power supply is connected, the vicinity of upper junction can produce electron hole pair, and its internal energy is reduced, and its temperature is reduced, and is called cold end 110, and its another end can increase internal energy and raise temperature due to the recombination of electron hole pair, and is called hot end 120. The first end 310 of the heat-conducting film 300 is attached to the cold end 110, the temperature of the cold end 110 can be adjusted to-20 ℃, the refrigerating capacity can be adjusted, the temperature difference between the refrigerator and the high-temperature part 200 can be maintained, the process of conducting heat by the heat-conducting film 300 is prolonged, and accurate control of heat dissipation is facilitated. The semiconductor refrigerator also has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and is reliable in work, simple and convenient to operate and suitable for environments with small use space.

In one embodiment, as shown in fig. 4, the heat transfer structure is applied to an indoor heating system, i.e. the high temperature component 200 is installed indoors, such as on a wall 500, and the low temperature component 100 may be a metal heat sink provided with a plurality of metal heat sinks 130. In other embodiments, the heat transfer structure is applied to a heating system, that is, a plurality of low-temperature members 100 and heat conducting films 300 are provided, and the high-temperature member 200 transfers heat to the corresponding low-temperature member 100 through each heat conducting film 300, for example, one end of the heat conducting film 300 is connected to a boiler, and the other end is connected to a radiator at a user side, and heat generated by the boiler is transferred to the radiator at each user side through the heat conducting film 300, so as to realize heating, and the heat conducting film 300 is coated with a heat insulating layer to prevent heat from dissipating.

In one embodiment, the low temperature component 100 is a heat sink having a heat dissipation structure, such as a metal heat sink. In one embodiment, the metal heat sink has a plurality of metal heat sinks, and the metal heat sinks 130 are arranged side by side with a plurality of metal heat sinks 130 at intervals, for example, two rows of metal heat sinks 130 are arranged, and the two rows of metal heat sinks 130 are connected by a metal connecting member 140, so that the two rows of metal heat sinks 130 are separated. The metal heat sink 130 is made of metal or alloy, such as aluminum, magnesium, copper or iron, or alloy thereof. In other embodiments, any heat dissipation member having a heat dissipation structure may be used for the low temperature component 100, and the material is not limited to a metal material.

in one embodiment, the thermal conductive film 300 may be a single-layer structure or a multi-layer structure, i.e., a single-layer film or a multi-layer film structure may be used. Its thickness can set up 10 ~ 100um within range when adopting single-layer structure, if 10um, 20um, 30um, 50um, 70um, 80um, 90um, 100um etc. its thickness can set up 10 ~ 300 within range when adopting the structure of multilayer film. When the multi-layer structure is adopted, the first ends 310 of the heat-conducting films are respectively connected with the low-temperature member 100, so that the heat-conducting films can respectively and rapidly transfer heat.

In one embodiment, the thermal conductive film 300 is a multi-layer structure, that is, the multiple layers of thermal conductive films 300 are sequentially stacked and disposed in a multi-layer structure, so as to increase the heat flux transferred between the low temperature member 100 and the high temperature member 200. The single-layer heat-conducting film 300 is one of a graphite film, an artificial graphite film, or a graphene heat-conducting film, for example, the single-layer heat-conducting film 300 is a graphene heat-conducting film. In one embodiment, the thermal conductive film 300 has a three-layer structure, three single-layer graphene thermal conductive films are stacked sequentially from top to bottom, and the layers of films are bonded and fixed together by a thermal conductive adhesive or are formed into a relatively fixed structure by hot pressing. In another embodiment, as shown in fig. 5, the thermal conductive film 300 has an eight-layer structure, and includes multiple graphite films stacked in sequence from top to bottom, i.e., a graphite film is used as a single-layer thermal conductive film.

in one embodiment, the thermal film 300 is covered with a protective layer to protect the thermal film 300 from mechanical damage or chemical attack, and also to provide insulation and/or thermal isolation. The protective layer can be a plastic film coated on the periphery of the heat conducting film 300, the thickness of the plastic film can be 0.5-20 microns, and the structure is light and thin. The protective layer can adopt high temperature resistant polyester film (PET membrane), and the PET membrane has good heat-resisting, cold resistance and good oil resistance, can play effectual guard action to heat-conducting film 300, and then improves heat-conducting film 300's life, and simultaneously, the PET membrane still has good toughness and resistant buckling nature, can be suitable for the use of various application environment.

when the heat transfer structure is applied to a heating system, the protective layer can also be an insulating layer for preventing heat loss, for example, the protective layer adopts an insulating foam layer.

In one embodiment, the thermal conductive film 300 is a multi-layer structure, and the thermal conductive film 300 is covered by a protective layer (not shown), and the first ends 310 of the thermal conductive films 300 are respectively connected to the low temperature component 100. Compared with an indoor heating system adopting water for heat dissipation, the indoor heating system adopting the heat transfer structure has obvious advantages, firstly, a heat transfer passage formed by the heat conduction film 300 is unidirectional, the structure is simpler, the water system needs to be connected into a circulating pipeline and also needs to provide a pressure pump, secondly, the rising temperature of the heat conduction film 300 can be higher than 100 ℃, the temperature difference between the metal radiating fin 130 and a heating source is larger, the heat conduction efficiency is improved, and the temperature of the water system is lower than 100 ℃, so the heating system adopting the heat transfer structure has the heating effect and the safety superior to the heating effect of the water system.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A heat transfer structure characterized by: the method comprises the following steps:

A cryogenic part;

A high temperature member having a heat emitting end;

The heat conduction membrane comprises a first end and a second end, the heat conduction membrane is flexible and can be bent, the first end is connected with the low-temperature part, and the second end is connected with the heating end, so that heat transfer is realized between the high-temperature part and the low-temperature part through the heat conduction membrane.

2. The heat transfer structure according to claim 1, wherein: the high-temperature part is a chip, the first end is connected to the top surface of the chip, and the second end is connected with the low-temperature part.

3. The heat transfer structure according to claim 2, wherein: the low-temperature part is a refrigerator with a refrigerating function.

4. The heat transfer structure according to claim 1, wherein: the low-temperature part and the heat conduction film are both provided with a plurality of parts, and the high-temperature part transfers heat to the corresponding low-temperature part through the heat conduction films.

5. The heat transfer structure according to claim 1, wherein: the low-temperature part is a heat dissipation part with a heat dissipation structure.

6. The heat transfer structure according to claim 5, wherein: the low-temperature part is a metal heat dissipation part.

7. The heat transfer structure according to any one of claims 1 to 6, wherein: the heat conduction membrane is provided with the multilayer, and the multilayer heat conduction membrane is in proper order range upon range of the setting, each layer the first end of heat conduction membrane respectively with low temperature spare is connected.

8. The heat transfer structure according to any one of claims 1 to 6, wherein: the heat conduction film is coated with a protective layer.

9. The heat transfer structure of claim 8, wherein: the protective layer is a heat insulating layer or an insulating layer.

10. The heat transfer structure according to any one of claims 1 to 6, wherein: the heat conduction membrane is one of a graphite membrane, an artificial graphite membrane or a graphene heat conduction membrane.