CN219497639U

CN219497639U - Solid-state relay mounting structure capable of improving heat dissipation performance

Info

Publication number: CN219497639U
Application number: CN202320568257.1U
Authority: CN
Inventors: 陈斌
Original assignee: Wuxi Niobic Electronics Co ltd
Current assignee: Wuxi Niobic Electronics Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-08-08
Anticipated expiration: 2033-03-21

Abstract

The utility model discloses a solid state relay mounting structure for improving heat dissipation performance, which comprises a solid state relay body, a heat conducting silica gel layer, a heat insulation shell, a semiconductor refrigerating sheet, a metal radiator and a fan, wherein the heat conducting silica gel layer is coated on each outer surface of the solid state relay body, the solid state relay body coated with the heat conducting silica gel layer is packaged in the heat insulation shell, the cold end of the semiconductor refrigerating sheet is tightly attached to the heat conducting silica gel layer, and the heat dissipation substrate is tightly attached to the hot end of the semiconductor refrigerating sheet. The utility model can ensure that the solid-state relay body always works in a low-temperature environment, can effectively avoid overheat of the electronic module, and solves the technical problem of poor heat dissipation effect of the existing solid-state relay mounting structure.

Description

Solid-state relay mounting structure capable of improving heat dissipation performance

Technical Field

The utility model relates to the technical field of solid-state relay structures, in particular to a solid-state relay mounting structure capable of improving heat dissipation performance.

Background

The solid-state relay refers to a non-contact switch, and the solid-state relay has the characteristics of low noise, short switching time, strong load capacity and the like, and has the functions of isolating a control end from a load end.

The load capacity of the solid-state relay is greatly influenced by the ambient temperature and the self temperature in the use process, good heat dissipation conditions are required to be ensured, and the heat dissipation effect of the improved structure of the traditional solid-state relay is poor, so that the heat dissipation problem of the solid-state relay puzzles the application range of the solid-state relay.

Therefore, how to improve the heat dissipation performance of the solid state relay is a technical problem to be solved.

Disclosure of Invention

The embodiment of the utility model provides a solid-state relay mounting structure capable of improving heat dissipation performance, which is used for effectively dissipating heat and cooling a solid-state relay body.

In order to achieve the above object, an embodiment of the present utility model provides a solid state relay mounting structure for improving heat dissipation performance, comprising a solid state relay body, a heat conductive silica gel layer, a heat insulation housing, a semiconductor cooling sheet, a metal radiator and a fan,

the heat-conducting silica gel layer is coated on each outer surface of the solid state relay body, the solid state relay body coated with the heat-conducting silica gel layer is packaged in the heat-insulating shell,

the heat insulation shell is provided with a abdication hole for installing a semiconductor refrigeration piece, the cold end of the semiconductor refrigeration piece is tightly attached with a heat-conducting silica gel layer,

the metal radiator comprises a radiating substrate and a plurality of radiating fins arranged on the radiating substrate, wherein the radiating substrate is fixedly arranged outside the heat insulation shell, and the radiating substrate is tightly attached to the hot end of the semiconductor refrigerating sheet.

The heat generated by the electronic module of the solid-state relay body is rapidly led out through the heat-conducting silica gel layer, the heat-conducting silica gel layer is refrigerated by the semiconductor refrigerating sheet, the heat-insulating shell can well isolate heat exchange of the internal space and the external space, so that a lower temperature environment is always kept in the heat-insulating shell, and the heat generated by the semiconductor refrigerating sheet is led out by the metal radiator. Therefore, the utility model can ensure that the solid-state relay body always works in a low-temperature environment, can effectively avoid overheat of the electronic module, and solves the technical problem of poor heat dissipation effect of the existing solid-state relay mounting structure.

Further, the heat insulation shell comprises a lower shell with an upper opening and a cover body for sealing the upper opening.

Further, the heat-conducting silica gel layer and the heat-insulating shell are respectively provided with a yielding hole for the control terminal of the solid-state relay body to penetrate out, and the control terminal is used for being connected with a direct-current control circuit.

Preferably, the metal radiator is provided with a fan for guiding the gas contacted by the metal radiator. The fan guides the air flow through the inside of the metal radiator, thereby increasing the heat radiation efficiency. Further preferably, the rotation axis of the fan is parallel to the heat dissipation fins.

Preferably, the heat-conducting silica gel layer is filled with phase change material particles. The short-time quick heating heat of the electronic module can be absorbed through the phase change material particles, and the risk that heat cannot be quickly discharged to damage equipment due to short-time quick heating is avoided.

One or more technical solutions in the embodiments of the present utility model at least have the following technical effects or advantages:

the solid state relay body cooling device is simple in structure and high in practicability, and can effectively cool and dissipate heat of the solid state relay body, so that the service life of the solid state relay body is prolonged.

Drawings

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

fig. 3 is a schematic top view of the present utility model with the cover removed.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 and 2, the embodiment of the utility model provides a solid state relay mounting structure for improving heat dissipation performance, which comprises a solid state relay body 1, a heat conducting silica gel layer 2, a heat insulation shell 3, a semiconductor refrigerating sheet 4, a metal radiator 5 and a fan 6,

the heat conduction silica gel layer 2 is coated on each outer surface of the solid state relay body 1, the solid state relay body 1 coated with the heat conduction silica gel layer 2 is packaged in the heat insulation shell 3,

the heat insulation shell 3 is provided with a yielding hole for installing the semiconductor refrigeration piece 4, the cold end of the semiconductor refrigeration piece 4 is tightly attached with the heat-conducting silica gel layer 2,

the metal radiator 5 comprises a radiating substrate 7 and a plurality of radiating fins 8 arranged on the radiating substrate 7, the radiating substrate 7 is fixedly arranged outside the heat insulation shell 3, and the radiating substrate 7 is tightly attached to the hot end of the semiconductor refrigerating sheet 4.

The heat generated by the electronic module of the solid-state relay body 1 is rapidly led out through the heat-conducting silica gel layer 2, the heat-conducting silica gel layer 2 is refrigerated by the semiconductor refrigerating sheet 4, the heat-insulating shell 3 can well isolate heat exchange between the inner space and the outer space, so that a lower temperature environment is always kept in the heat-insulating shell 3, and the heat generated by the semiconductor refrigerating sheet 4 is led out by the metal radiator 5. Therefore, the utility model can ensure that the solid-state relay body 1 always works in a low-temperature environment, can effectively avoid overheat of the electronic module, and solves the technical problem of poor heat dissipation effect of the existing solid-state relay mounting structure.

Further, as shown in fig. 1 and 3, the heat insulating housing 3 includes a lower housing 10 having an upper opening and a cover 11 for covering the upper opening.

Further, the heat-conducting silica gel layer 2 and the heat-insulating shell 3 are respectively provided with a yielding hole for the control terminal 9 of the solid-state relay body 1 to penetrate, and the control terminal 9 is used for connecting a direct-current control circuit.

Preferably, the metal radiator 5 is provided with a fan 6 for guiding the gas contacting with the metal radiator 5. The fan 6 guides the air flow through the inside of the metal radiator 5, thereby increasing the heat radiation efficiency. Further preferably, the rotation axis of the fan 6 is parallel to the heat dissipation fins 8.

Preferably, the heat-conducting silica gel layer 2 is filled with phase change material particles 12. The short-time rapid heating heat of the electronic module can be absorbed through the phase change material particles 12, and the risk that the short-time rapid heating causes heat to be unable to be rapidly discharged to damage equipment is avoided.

It should be noted that the above-mentioned embodiments illustrate rather than limit the utility model, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" or "comprises" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The use of the words first, second, third, etc. do not denote any order, and the words may be interpreted as names.

All of the features disclosed in this specification, except mutually exclusive features, may be combined in any manner.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. That is, each feature is one example only of a generic series of equivalent or similar features, unless expressly stated otherwise.

The utility model is not limited to the specific embodiments described above. The utility model extends to any novel one, or any novel combination, of the features disclosed in this specification, as well as to any novel one, or any novel combination, of the steps of the method or process disclosed.

Claims

1. A solid state relay installation structure for improving heat dissipation performance is characterized by comprising a solid state relay body, a heat conducting silica gel layer, a heat insulation shell, a semiconductor refrigerating sheet, a metal radiator and a fan,

2. The solid state relay mounting structure of claim 1, wherein the heat insulating housing comprises a lower housing having an upper opening and a cover closing the upper opening.

3. The solid state relay mounting structure of claim 1, wherein the heat conducting silica gel layer and the heat insulating shell are provided with a yielding hole for a control terminal of the solid state relay body to pass through, and the control terminal is used for connecting a direct current control circuit.

4. The solid state relay mounting structure of claim 1, wherein the metal heat sink is provided with a fan for guiding the gas contacting the metal heat sink.

5. The solid state relay mounting structure of claim 4 wherein the fan axis of rotation is parallel to the fins.

6. The solid state relay mounting structure of claim 1, wherein the thermally conductive silica gel layer is filled with particles of phase change material.