CN211701111U - High-temperature-resistant distribution box with isolation charged body - Google Patents
High-temperature-resistant distribution box with isolation charged body Download PDFInfo
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- CN211701111U CN211701111U CN201922341760.XU CN201922341760U CN211701111U CN 211701111 U CN211701111 U CN 211701111U CN 201922341760 U CN201922341760 U CN 201922341760U CN 211701111 U CN211701111 U CN 211701111U
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Abstract
The utility model relates to a block terminal technical field provides a take high temperature resistant block terminal of isolated electric body for under the high temperature environment. The utility model discloses take high temperature resistant block terminal of electrified body of isolation passes through to install high temperature resistant epoxy insulation board layer on the box of block terminal, install electronic device on high temperature resistant epoxy insulation board layer, high temperature resistant epoxy insulation board layer has played the insulation isolation effect between electronic device and box, when the box outside produces high temperature, box and electronic device can receive high temperature radiation sometimes, high temperature resistant epoxy insulation board layer can prevent that electronic device from being destroyed and leading to the box electrified, prevent because the electrified incident that produces of box.
Description
Technical Field
The utility model relates to a block terminal technical field specifically relates to a take high temperature resistant block terminal of isolated electric body for under high temperature environment.
Background
When traditional block terminal received the outside high temperature radiation of box, box and electron device were heated up by high temperature radiation, and under the high temperature condition, electron device was caused the box electrified by high temperature radiation melting, and the electrified box causes the incident easily.
Disclosure of Invention
The embodiment of the utility model provides a take high temperature resistant block terminal of the electrified body of isolation uses high temperature resistant epoxy insulation board layer to insulate isolation with box and electron device, can prevent that the box is electrified. The specific technical scheme is as follows:
the high-temperature resistant distribution box with the isolation electrified body comprises a box body which can be sealed and an electronic device; the box body is provided with a high-temperature-resistant epoxy resin insulation board layer; the electronic device is arranged on the high-temperature-resistant epoxy resin insulation board layer.
Furthermore, the box body comprises a box wall, a box door and an inner container interlayer arranged in the box wall, and the inner container interlayer divides the interior of the box wall into an inner container cavity and an inner container outer cavity; the liner interlayer comprises a liner door body and a liner door frame, the liner door frame is arranged on the tank wall, and the liner door body is arranged on the liner door frame in an openable manner; and the inner container door body is provided with a window hole, and the high-temperature-resistant epoxy resin insulation board layer is embedded in the window hole and is fixedly connected with the inner container door body.
Further, a heat insulation plate layer is installed on the inner side of the box door.
Furthermore, a first heat insulation sealing ring is arranged on the edge of the inner side of the box door; and a second heat insulation sealing ring is arranged at the upper end of the box wall.
Furthermore, the edge of the inner side of the upper end of the box wall is provided with an annular groove, the second heat-insulating sealing ring is arranged in the annular groove, and the upper end face of the second heat-insulating sealing ring is higher than the upper end face of the box wall.
Furthermore, the first heat-insulating sealing ring and the second heat-insulating sealing ring are hollow, and sawtooth-shaped protrusions are arranged on the non-connecting end face.
Further, when the box door is closed, the second heat insulation sealing ring is embedded in the inner side of the first heat insulation sealing ring, and the heat insulation plate layer is embedded in the inner side of the second heat insulation sealing ring.
Furthermore, a temperature sensor is installed on the inner container door body, a microcontroller is installed on the container wall, the temperature sensor and the microcontroller are located in the inner container outer cavity, and the microcontroller is electrically connected with the temperature sensor.
Furthermore, a semiconductor refrigeration piece is installed on the inner container door body, the cold end of the semiconductor refrigeration piece is in contact with the inner container door body, the semiconductor refrigeration piece is located in the inner container outer cavity, and the semiconductor refrigeration piece is electrically connected with the microcontroller.
Furthermore, a heat radiating fin is installed on the hot end of the semiconductor refrigerating fin, a heat radiating fan is installed on the heat radiating fin, and the heat radiating fan is electrically connected with the microcontroller.
The utility model discloses take high temperature resistant block terminal of electrified body of isolation passes through to install high temperature resistant epoxy insulation board layer on the box of block terminal, install electronic device on high temperature resistant epoxy insulation board layer, high temperature resistant epoxy insulation board layer has played the insulation isolation effect between electronic device and box, when the box outside produces high temperature, box and electronic device can receive high temperature radiation sometimes, high temperature resistant epoxy insulation board layer can prevent that electronic device from being destroyed and leading to the box electrified, prevent because the electrified incident that produces of box.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is the utility model discloses the embodiment takes the structure chart of the high temperature resistant block terminal of the electrified body of isolation.
Fig. 2 is the embodiment of the utility model discloses heat dissipation part structure graph in the high temperature resistant block terminal of electrified body of area isolation.
Wherein, 10-box wall; 11-a second heat-insulating sealing ring; 12-an annular groove; 20-a box door; 21-a heat insulation slab layer; 22-a first heat-insulating sealing ring; 31-inner container door body; 32-inner container door frame; 4-high temperature resistant epoxy resin insulation board layer; 5-a semiconductor heat sink; 61-a base plate; 62-fins; 7-a heat dissipation fan; 8-temperature sensor.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The terms "first" or "second", etc. are used merely to distinguish the same type of component or device, and do not represent limitations.
As shown in fig. 1, the high temperature resistant distribution box with an isolated charged body according to the embodiment of the present invention includes a closable box body and an electronic device; a high-temperature-resistant epoxy resin insulation board layer 4 is arranged on the box body; the electronic device is mounted on the high temperature resistant epoxy resin insulation board layer 4.
The box body comprises a box wall 10, a box door 20 and an inner container interlayer arranged in the box wall 10, wherein the inner container interlayer divides the interior of the box body into an inner container cavity and an inner container outer cavity; the liner interlayer comprises a liner door body 31 and a liner door frame 32, the liner door frame 32 is arranged on the box body, and the liner door body 31 is arranged on the liner door frame in an openable manner; the inner container door body 31 is provided with a window hole, and the high temperature resistant epoxy resin insulation board layer 4 is embedded in the window hole and fixedly connected with the inner container door body 31.
Wherein the electronic device can be located in or outside the inner container cavity, for example, a button or an indicator light in the electronic device can be located outside the inner container cavity.
Wherein, the inner container door body 31 can be provided with a mounting hole for mounting an electronic device; the inner container door body 31 can be embedded in the inner container door body 31 to be limited; the inner container door 31 may be provided with a rotary lock to be locked to the inner container door frame 32.
The window hole and the high-temperature-resistant epoxy resin insulation board layer 4 are rectangular, the longitudinal section of the high-temperature insulation board 4 is T-shaped, the middle part of the high-temperature insulation board is embedded into the window hole, and the edge of the high-temperature-resistant epoxy resin insulation board layer is fixed on the inner side of the liner door body 31 through screws; the high-temperature-resistant epoxy resin insulation board layer 4 can be made of epoxy resin, and has low heat conduction, high temperature resistance and good insulation.
Wherein, the inner side of the box door 20 is provided with a heat insulation board layer 21, and the heat insulation board layer 21 can be made of high temperature resistant silicon adhesive tape and polyimide composite fiber. A first heat insulation sealing ring 22 is arranged at the edge of the inner side of the box door 20, and a second heat insulation sealing ring 11 is arranged at the upper end of the box wall 10; an annular groove 12 is formed in the edge of the inner side of the upper end of the box wall 10, a second heat-insulating sealing ring 11 is installed in the annular groove 12, and the upper end face of the second heat-insulating sealing ring 11 is higher than the upper end face of the box wall 10; the first heat-insulating sealing ring 22 and the second heat-insulating sealing ring 11 are hollow, the non-connecting end surface is provided with a sawtooth-shaped bulge, and the sealing degree of the sealing rings and the box body can be improved due to the hollow structure and the sawtooth-shaped bulge; the first thermal insulation sealing ring 22 and the second thermal insulation sealing ring are both made of silica gel, and the silica gel is soft in material, good in sealing performance and capable of resisting high temperature of 280 ℃.
The heat insulation plate layer 21 is used for preventing heat of the box door 20 from radiating to the interior of the box wall 10, the first heat insulation sealing ring 22 and the second heat insulation sealing ring are used for improving the sealing performance between the box door 20 and the box wall 10, and the heat outside the box body is prevented from entering the interior of the box wall 10 through a gap between the box door 20 and the box wall 10.
When the box door 20 is closed, the second heat-insulating sealing ring 11 is embedded in the inner side of the first heat-insulating sealing ring 22, and the heat-insulating plate layer 21 is embedded in the inner side of the second heat-insulating sealing ring 11; the embedded design makes compact structure, can improve sealed and thermal-insulated effect.
In one embodiment, as shown in fig. 2, the temperature sensor 8 is mounted on the inner container door body 31, the microcontroller is mounted on the container wall 20, the temperature sensor 8 and the microcontroller are located in the outer cavity of the inner container, and the microcontroller is electrically connected with the temperature sensor 8. The semiconductor refrigerating sheet 5 is arranged on the inner container door body 31, the cold end of the semiconductor refrigerating sheet 5 is in contact with the inner container door body 31, the semiconductor refrigerating sheet 5 is positioned in the outer cavity of the inner container, and the semiconductor refrigerating sheet 5 is electrically connected with the microcontroller; the heat end of the semiconductor refrigerating sheet 5 is provided with a heat radiating sheet, the heat radiating sheet is provided with a heat radiating fan 7, and the heat radiating fan 7 is electrically connected with the microcontroller.
The temperature sensor 8 is used for detecting the temperature of the inner container door body 31, and the temperature sensor 8 can use a thermocouple and can be bonded with the inner container door body 31 through a bonding agent; the semiconductor refrigeration sheet 5 is used for cooling and radiating the inner container door body 31 through a cold end and can be bonded with the inner container door body 31 through a binder; the radiating fins are used for radiating the hot end of the semiconductor refrigerating fin 5, and the radiating fan 7 is used for cooling the radiating fins; heat-conducting silicone grease is coated between the semiconductor refrigerating sheet 5 and the inner container door body 31 and between the semiconductor refrigerating sheet 5 and the radiating fins, so that the heat-conducting property is improved.
The radiating fin comprises a base plate 61 and fins 62 fixed on the upper portion of the base plate, wherein the base plate 61 and the fins 62 are integrally formed and are made of aluminum alloy; the heat dissipation fan 7 is positioned at the upper part of the bottom plate 61, the fins 62 are distributed around the heat dissipation fan 7, the fins 62 comprise a plurality of sheet-shaped convex structures in the vertical direction, and the air channel directions formed among the plurality of sheet-shaped convex structures can be set to be the same and not communicated with the heat dissipation fan, or can be set to be different, so that the air channel is communicated with the heat dissipation fan 7; the heat dissipation fan 7 comprises a motor, fan blades and a frame, corresponding mounting holes are formed in the frame and the bottom plate 61, and the heat dissipation fan 7 is fixed to the bottom plate 61 through screws in the mounting holes.
Wherein, semiconductor refrigeration piece 5, temperature-sensing ware 8 and microcontroller can be when the inner bag chamber heaies up and surpasss reasonable scope, and the electron device of avoiding the inner bag intracavity receives high temperature destruction through cooling down for inner bag door body 31 fast to the inner bag intracavity. The microcontroller can read the temperature value of the temperature sensor 8; the microcontroller can preset a temperature value through a compiler, and can control whether the semiconductor refrigeration piece 5 is started to work or not and simultaneously start the heat dissipation fan 7 to work by comparing the read temperature value with the set temperature value. For example, when the read temperature value is greater than the set temperature value, the microcontroller controls the semiconductor refrigeration sheet 5 and the heat dissipation fan 7 to start, so as to cool the inner container door body 31; when the temperature of the inner container door body 31 is reduced to a set range, the semiconductor refrigeration sheet 5 and the heat radiation fan 7 are closed. The microcontroller may refer to a printed circuit board integrated with a processor, a memory, an auxiliary integrated circuit chip, and auxiliary electronic components; the printed circuit board is provided with different types of interfaces for the communication connection or the electric connection of the microcontroller and other devices, such as an IC bus interface, a serial bus interface and a parallel bus interface.
It should be understood that the fixed connection between the structures in the embodiments of the present invention may refer to welding, bolt, or screw connection; the connection between the pipes may be referred to as communication; the connection between the appliances may refer to an electrical connection. The present invention is not limited to the precise arrangements described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (9)
1. A high-temperature resistant distribution box with an isolation electrified body is characterized by comprising a box body capable of being sealed and an electronic device; the box body is provided with a high-temperature-resistant epoxy resin insulation board layer; the electronic device is arranged on the high-temperature-resistant epoxy resin insulation board layer; the box body comprises a box wall, a box door and an inner container interlayer arranged in the box wall, wherein the inner container interlayer divides the interior of the box wall into an inner container cavity and an inner container outer cavity; the liner interlayer comprises a liner door body and a liner door frame, the liner door frame is arranged on the tank wall, and the liner door body is arranged on the liner door frame in an openable manner; and the inner container door body is provided with a window hole, and the high-temperature-resistant epoxy resin insulation board layer is embedded in the window hole and is fixedly connected with the inner container door body.
2. The high-temperature-resistant distribution box with the isolated electrified body according to claim 1, wherein a heat insulation plate layer is mounted on the inner side of the box door.
3. The high-temperature-resistant distribution box with the isolated electrified body according to claim 2, wherein a first heat-insulating sealing ring is arranged on the edge of the inner side of the box door; and a second heat insulation sealing ring is arranged at the upper end of the box wall.
4. The high-temperature-resistant distribution box with the isolated electrified body as claimed in claim 3, wherein an annular groove is formed in the inner side edge of the upper end of the box wall, the second thermal-insulation sealing ring is mounted in the annular groove, and the upper end face of the second thermal-insulation sealing ring is higher than the upper end face of the box wall.
5. The high-temperature-resistant distribution box with the isolated charged bodies according to claim 4, wherein the first and second thermal-insulation sealing rings are hollow inside, and the non-connection end face is provided with saw-toothed protrusions.
6. The high-temperature-resistant distribution box with the isolated electrified body according to claim 5, wherein when the box door is closed, the second thermal-insulation sealing ring is embedded in the inner side of the first thermal-insulation sealing ring, and the thermal-insulation plate layer is embedded in the inner side of the second thermal-insulation sealing ring.
7. The high-temperature-resistant distribution box with the isolated charged body according to claim 6, wherein a temperature sensor is mounted on the inner container door body, a microcontroller is mounted on the box wall, the temperature sensor and the microcontroller are located in an outer cavity of the inner container, and the microcontroller is electrically connected with the temperature sensor.
8. The high-temperature-resistant distribution box with the isolated charged body according to claim 7, wherein a semiconductor refrigeration piece is installed on the inner container door body, the cold end of the semiconductor refrigeration piece is in contact with the inner container door body, the semiconductor refrigeration piece is located in the outer cavity of the inner container, and the semiconductor refrigeration piece is electrically connected with the microcontroller.
9. The high-temperature-resistant distribution box with the isolated charged body according to claim 8, wherein a heat sink is mounted on the hot end of the semiconductor refrigeration sheet, a heat dissipation fan is mounted on the heat sink, and the heat dissipation fan is electrically connected with the microcontroller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922341760.XU CN211701111U (en) | 2019-12-23 | 2019-12-23 | High-temperature-resistant distribution box with isolation charged body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922341760.XU CN211701111U (en) | 2019-12-23 | 2019-12-23 | High-temperature-resistant distribution box with isolation charged body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211701111U true CN211701111U (en) | 2020-10-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922341760.XU Active CN211701111U (en) | 2019-12-23 | 2019-12-23 | High-temperature-resistant distribution box with isolation charged body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211701111U (en) |
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2019
- 2019-12-23 CN CN201922341760.XU patent/CN211701111U/en active Active
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