CN207441689U - Intelligent power module and air conditioner - Google Patents

Intelligent power module and air conditioner Download PDF

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Publication number
CN207441689U
CN207441689U CN201721666354.5U CN201721666354U CN207441689U CN 207441689 U CN207441689 U CN 207441689U CN 201721666354 U CN201721666354 U CN 201721666354U CN 207441689 U CN207441689 U CN 207441689U
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China
Prior art keywords
power module
substrate
intelligent power
layer
insulating layer
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Active
Application number
CN201721666354.5U
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Chinese (zh)
Inventor
李叶生
冯宇翔
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Midea Group Co Ltd
Wuhu Meizhi Air Conditioning Equipment Co Ltd
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Midea Group Co Ltd
Wuhu Meizhi Air Conditioning Equipment Co Ltd
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Priority to CN201721666354.5U priority Critical patent/CN207441689U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of intelligent power module and air conditioner, the intelligent power module includes substrate, insulating layer, wiring layer, power component, clad and graphene layer, the substrate has the first surface and second surface being oppositely arranged, the insulating layer is arranged on the first surface of the substrate, the wiring layer is formed at one side of the insulating layer away from the substrate, the power component is arranged on one side of the wiring layer away from the insulating layer, the cladding layer segment is coated on the outside of the intelligent power module, so that the second surface of the substrate is in exposed setting；The graphene layer sealing coats the second surface of the substrate.The intelligent power module that this patent proposes can improve the rate of heat exchange between substrate and external environment, so as to improve the heat dissipation performance of intelligent power module and service life.

Description

Intelligent power module and air conditioner
Technical field
The utility model is related to field of electronic devices, more particularly to a kind of intelligent power module and air conditioner.
Background technology
Intelligent power module (Intelligent Power Module, IPM) is a kind of by power electronics and integrated circuit The power drive class product that technology combines.Intelligent power module integrates device for power switching and high-voltage driving circuit, And interior keep the fault detection circuits such as overvoltage, overcurrent and overheat.On the one hand intelligent power module receives the control letter of MCU Number, on the other hand driving subsequent conditioning circuit work sends the state detection signal of system back to MCU.Compared with traditional discrete scheme, intelligence Energy power module wins increasing market with advantages such as its high integration, high reliability, is particularly suitable for driving motor Frequency converter and various inverters are frequency control, metallurgical machinery, electric propulsion, servo-drive, a kind of ideal of frequency-conversion domestic electric appliances Power electronic devices.
Intelligent power module can be generally operated in severe operating mode, such as the outdoor unit of full DC frequency converting air-conditioner, in high temperature In the state of, can raise the intelligent power module internal temperature.As depicted in figs. 1 and 2, existing intelligent power module 10' is mostly total incapsulation structure, is fully sealed since intelligent power module 10' is wrapped by a layer 500', clad 500' is by resin Material is made, and thermal conductivity is poor, and heat localization is easily generated inside intelligent power module 10'.In order to promote intelligent power module 10' Heat dissipation, existing intelligent power module 10' mainly has following three kinds of improved procedures, as shown in figure 3, the first improved procedure is The problem of setting radiator 800 on intelligent power module 10', this mode, is increased the volume of intelligent power module 10' And so that cost is higher；As shown in figure 4, second of improved procedure is that total incapsulation structure is improved to half encapsulating structure, this side The problem of formula, is that substrate 100' is easily corroded exposed to outer by water, soda acid, this causes intelligent power module 10''s to use the longevity Life declines to a great extent；As shown in figure 5, the third improved procedure adds radiator on the intelligent power module 10' of half encapsulating structure 800, it is big, of high cost that this has again resulted in intelligent power module 10' volumes.
Utility model content
The main purpose of the utility model is to propose a kind of intelligent power module, it is intended to improve the heat dissipation of intelligent power module Performance and used life, and reduce the volume of intelligent power module.
To achieve the above object, the utility model proposes intelligent power module include substrate, the substrate has opposite The first surface and second surface of setting；Insulating layer, arranged on the first surface of the substrate；Wiring layer is formed at the insulation One side of the layer away from the substrate；Power component, arranged on one side of the wiring layer away from the insulating layer；Clad, part The outside of the intelligent power module is coated on, so that the second surface of the substrate is in exposed setting；And graphene layer, it is close Package covers the second surface of the substrate.
Preferably, the graphene layer has the binding face for fitting in the second surface, and the area of the binding face is big In or equal to the second surface area.
Preferably, the scope of the thickness of the graphene layer is 100 μm to 500 μm.
Preferably, the insulating layer includes epoxy resin layer and the heat conductive insulating being filled in the epoxy resin layer Grain.
Preferably, the substrate is aluminium sheet or aluminium alloy base plate, and the scope of the thickness of the substrate is 1mm to 2mm.
Preferably, the intelligent power module further includes the first cooling fin, and first cooling fin is mounted on the power Between element and the wiring layer.
Preferably, first cooling fin includes substrate metal layer and arranged on substrate metal layer two opposite sides surface Graphite ene coatings.
Preferably, the intelligent power module further includes the second cooling fin, and second cooling fin is mounted on the power Side surface of the element away from the wiring layer.
Preferably, the outer surface of second cooling fin away from the power component is in exposed setting.
The utility model also proposes a kind of air conditioner, and the air conditioner includes intelligent power module, the intelligent power mould Block includes：
Substrate, the substrate have the first surface and second surface being oppositely arranged；Insulating layer, arranged on the of the substrate One surface；Wiring layer is formed at one side of the insulating layer away from the substrate；Power component, it is separate arranged on the wiring layer The one side of the insulating layer；Clad is partly coated on the outside of the intelligent power module, so that the second table of the substrate Face is in exposed setting；And graphene layer, sealing coat the second surface of the substrate.
The utility model proposes intelligent power module by the way that intelligent power module is arranged to half encapsulating structure, and in base The exposed second surface of plate be equipped with graphene layer, due to graphene layer have high thermal conductivity, can improve substrate with Rate of heat exchange between external environment, and then the rate of heat dispation of power component is improved, therefore, the intelligent power module that this patent proposes With high heat dissipation performance, radiator need not be set, the volume of intelligent power module can be reduced；Further, since graphene The stability of layer is high, therefore substrate can be realized and protected, and improves substrate heatproof, corrosion resistance, and then can improve intelligence The service life of power module.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.
Fig. 1 is the top view of existing intelligent power module；
Fig. 2 is sectional views of the Fig. 1 along II-II directions；
Fig. 3 is the heat dissipation path schematic diagram of Fig. 1 intelligent power module；
Fig. 4 is the sectional view of another existing intelligent power module；
Fig. 5 is the heat dissipation path schematic diagram of another existing intelligent power module；
Fig. 6 is the sectional view of one embodiment of the utility model intelligent power module；
Fig. 7 is the heat dissipation path schematic diagram of Fig. 6 intelligent power module；
Fig. 8 is the sectional view of another embodiment of the utility model intelligent power module；
Drawing reference numeral explanation：
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that described embodiment is only the part of the embodiment rather than whole of the utility model Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise Lower all other embodiments obtained, shall fall within the protection scope of the present invention.
If it is to be appreciated that related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding, Afterwards ...), then directionality instruction be only used for explain it is opposite between each component under a certain particular pose (as shown in drawings) Position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.
It if, should " first ", " the in addition, relate to the description of " first ", " second " etc. in the utility model embodiment Two " etc. description is only used for description purpose, and it is not intended that instruction or implying its relative importance or implicit indicating meaning The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can express or implicitly include at least one A this feature.In addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill Personnel can be implemented as basis, and this technical side is will be understood that when the combination appearance of technical solution is conflicting or can not realize The combination of case is not present, also not within the protection domain of the requires of the utility model.
The utility model proposes a kind of intelligent power module, perfect heat-dissipating, the service life of the intelligent power module is long, It is small.
In the utility model embodiment, as shown in Figure 6 and Figure 7, which includes：Substrate 100, insulation Layer 200, wiring layer 300, power component 400, clad 500 and graphene layer 600, the substrate 100 have what is be oppositely arranged First surface and second surface, the insulating layer 200 are arranged on the first surface of the substrate 100, and the wiring layer 300 is formed at One side of the insulating layer 200 away from the substrate 100, the power component 400 are arranged on the wiring layer 300 away from described exhausted The one side of edge layer 200,500 part of clad is coated on the outside of the intelligent power module 10, so that the substrate 100 Second surface be in exposed setting；The sealing of graphene layer 600 coats the second surface of the substrate 100.
The utility model proposes intelligent power module 10 mainly obtain it is following three aspect advantageous effect.
First, the perfect heat-dissipating of intelligent power module 10.Since the second surface of substrate 100 is in exposed setting, It can avoid clad 500 that heat is hindered outwards to transfer, therefore the heat dissipation performance of intelligent power module 10 can be improved.In addition, The second surface of substrate 100 is equipped with graphene layer 600, and the thermal conductivity of graphene is up to 5000W/mK, theoretical specific surface area Up to 2630m2/ g, therefore, graphene layer 600 can greatly improve the heat-sinking capability of substrate 100, so as to improve intelligent work( The heat dissipation performance of rate module 10.
Second, the service life of intelligent power module 10 is long.Graphene has higher stability, therefore graphene layer 600 can realize the protection to aluminum substrate 100, avoid aluminum substrate 100 in by environment steam and soda acid corroded, so as to protect Shield intelligent power module 10 exempts from reliability and service life affected by environment, and then improving intelligent power module 10.
3rd, intelligent power module 10 it is small.Due to the clad 500 for the intelligent power module 10 that this patent proposes Part cladding substrate 100, the exposed part of substrate 100 are equipped with the graphene layer 600 of high heat conduction, therefore the intelligent power of this patent Module 10 has preferable heat dissipation performance, in this way, can not have to set radiator 800, and then can reduce intelligent power module 10 volume, the use for facilitating intelligent power module 10 and the cost for reducing intelligent power module 10.
As shown in fig. 6, the wiring layer 300 of intelligent power module 10 is equipped with power component 400 and non-power element 700, The heat that the power component 400 generates is far above the heat that non-power element 700 generates, in this way, uneven hot spot can be generated, Cause heat accumulation phenomenon, reduce the thermal reliability of intelligent power module 10.The intelligent power module 10 that this patent proposes is in substrate 100 exposed outer surfaces are equipped with graphene layer 600, therefore, between graphene layer 600 and substrate 100 can form quick dissipate The passage of heat, and then the heat of power component 400 can be improved to the rate of external diffusion, it avoids generating heat accumulation phenomenon, therefore, originally The intelligent power module 10 that patent proposes has high thermal reliability.
Specifically, the intelligent power module 10 in the present embodiment is to be integrated with PFC (PFC) functions and inversion The intelligent power module 10 of function, the power component 400 include PFC element 410 and inversion element 420, power Factor correcting element includes：Silicon carbide MOSFET (sic filed effect pipe) and carborundum SBD (two poles of silicon carbide Schottky barrier Pipe)；Inversion element includes silicon carbide MOSFET and carborundum SBD.
Further, Fig. 7 is refer to, in order to enable the heat of substrate 100 is fully conducted to graphene layer 600, this is specially The area of the graphene layer 600 for the intelligent power module 10 that profit proposes is greater than or equal to the area of substrate 100.
Specifically, the graphene layer 600 has the binding face for fitting in 100 second surface of substrate, real in this patent one It applies in example, the area of the binding face and the area equation of second surface, the two are bonded completely；In another embodiment of this patent In, the area of the binding face is more than the area of the second surface, and specifically, the clad 500, which has, is located at the base Plate 100 is peripheral and the mounting surface concordant with the second surface, the binding face of the graphene layer 600 extend to the installation Face.In this way, the heat dissipation area of substrate 100 reaches maximum, so that power component 400 is transferred to the heat of substrate 100 Graphene layer 600 is fully transferred to, therefore the heat dissipation performance of intelligent power module 10 can be improved.
Further, it is contemplated that the thickness of 10 each several part of intelligent power module to the heat-sinking capability of intelligent power module 10 all Have an impact, in order to while 100 intensity of substrate is ensured, additionally it is possible to which there is higher heat dissipation performance, the thickness of the substrate 100 Scope for 1mm to 2mm, specifically, the material of the aluminum substrate 100 is aluminum or aluminum alloy；In order to ensure 600 energy of graphene layer It is enough fully to play its excellent heat dissipation performance and the barrier propterty to substrate 100, the scope of the thickness of the graphene layer 600 For 100 μm to 500 μm.
Specifically, in this patent first embodiment, intelligent power module 10 is half encapsulating structure, i.e. clad 500 Substrate 100 is covered in subpackage, so that the second surface of substrate 100 is in exposed setting；Wherein substrate 100 is aluminium alloy plate, and thickness is 1.5mm；Graphene layer 600 is grown in 100 surface of aluminum substrate using the method for chemical vapor deposition, and thickness is 200 μm.
In this patent second embodiment, intelligent power module 10 is half encapsulating structure, i.e. 500 part of clad cladding base Plate 100, so that the second surface of substrate 100 is in exposed setting；Wherein substrate 100 be aluminium alloy plate, thickness 1.2mm, graphite Alkene layer 600 is grown in 100 surface of aluminum substrate using the method for chemical vapor deposition, and thickness is 400 μm.
In this patent 3rd embodiment, intelligent power module 10 is half encapsulating structure, i.e. 500 part of clad cladding base Plate 100, so that the second surface of substrate 100 is in exposed setting；Wherein substrate 100 be aluminium alloy plate, thickness 1.0mm, graphite Alkene layer 600 is grown in 100 surface of aluminum substrate using the method for spraying, and thickness is 400 μm.
Further, in order to reduce the thermal resistance of insulating layer 200, the thermal conductivity of insulating layer 200, one embodiment of this patent are improved In, the insulating layer 200 includes epoxy resin layer and the heat conductive insulating particle being filled in the epoxy resin layer.
Specifically, in the present embodiment, the material of the heat conductive insulating particle is aluminium oxide ceramics (Al2O3), aluminium oxide ceramics material Expect, for insulating materials and with higher thermal conductivity, to so, it is possible to reduce the thermal resistance of insulating layer 200, so as to improve intelligent power The heat dissipation performance of module 1010.The design of right this patent is without being limited thereto, and in other embodiment, the heat conductive insulating particle may be used also Think magnesia ceramics particle (MgO), zinc oxide ceramics particle (ZnO), nickel oxide ceramic particle (NiO), aluminium nitride ceramics Grain (AlN), silicon nitride ceramics (Si3N4) silicon carbide ceramics particle (SiC), the one or more in boron nitride ceramic particles (BN).
Further, Fig. 8 is refer to, in order to improve the heat dissipation of power component 400, the intelligent power module that this patent proposes 10 further include the first cooling fin 910.Specifically, first cooling fin 910 is mounted on the power component 400 and the wiring Between layer 300.First cooling fin 910 is made of the higher material of thermal conductivity, so, it is possible to promote the heat of power component 400 It outwards transfers, the power component 400 for avoiding caloric value big generates uneven hot spot, so as to eliminate heat accumulation phenomenon so that intelligence Power module 10 has high heat dissipation performance and thermal reliability.
Specifically, in the present embodiment, first cooling fin 910 includes substrate metal layer and arranged on the substrate metal layer The graphite ene coatings on two opposite sides surface, graphene have higher thermal conductivity and specific surface area, therefore can realize power member The rapid cooling of part 400.
It should be noted that the cooling fin that this patent proposes is by substrate metal layer and graphite ene coatings two parts structure Into, wherein, the main function of substrate metal layer is to provide support carrier, and graphite ene coatings are coated on substrate metal layer, in this way, The ratio of briquetting of the first cooling fin 910 can be improved.Substrate metal layer is usually made of the higher metal of thermal conductivity, such as copper, aluminium Deng.
Further, the intelligent power module 10 further includes the second cooling fin 920, and second cooling fin 920 mounts Deviate from the side surface of the wiring layer 300 in the power component 400, in this way, the two sides of power component 400 is all pasted with heat dissipation Piece, therefore the heat of power component 400 is enabled to quickly to external diffusion, so as to improve the heat dissipation performance of intelligent power module 10 And thermal reliability.
Specifically, the structure identical with the first cooling fin 910 may be employed in second cooling fin 920, can also be by copper Piece or aluminium flake are made.As a kind of preferred embodiment, the outside wall surface of the second cooling fin 920 away from power component 400 is in exposed It sets, in this way, the heat of power component 400 can further be promoted outwards to transfer.
The utility model also proposes a kind of air conditioner, which includes intelligent power module, the intelligent power module Concrete structure is with reference to above-described embodiment, since the air conditioner that this patent proposes employs whole technical sides of above-mentioned all embodiments Case, therefore all advantageous effects at least caused by the technical solution with above-described embodiment, this is no longer going to repeat them.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention, It is every under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes It changes or directly/is used in other related technical areas indirectly and is included in the scope of patent protection of the utility model.

Claims (10)

1. a kind of intelligent power module, which is characterized in that including：
Substrate, the substrate have the first surface and second surface being oppositely arranged；
Insulating layer, arranged on the first surface of the substrate；
Wiring layer is formed at one side of the insulating layer away from the substrate；
Power component, arranged on one side of the wiring layer away from the insulating layer；
Clad, is partly coated on the outside of the intelligent power module, and makes the second surface of the substrate in exposed setting； And
Graphene layer, sealing coat the second surface of the substrate.
2. intelligent power module as described in claim 1, which is characterized in that the graphene layer, which has, fits in described second The binding face on surface, the area of the binding face are greater than or equal to the area of the second surface.
3. intelligent power module as claimed in claim 2, which is characterized in that the area of the binding face is more than second table The area in face, the clad, which has, is located at the substrate peripheral and the mounting surface concordant with the second surface, the graphite The binding face of alkene layer extends to the mounting surface.
4. the intelligent power module as described in any one in claims 1 to 3, which is characterized in that the thickness of the graphene layer The scope of degree is 100 μm to 500 μm.
5. intelligent power module as described in claim 1, which is characterized in that the insulating layer includes epoxy resin layer and filling Heat conductive insulating particle in the epoxy resin layer.
6. intelligent power module as described in claim 1, which is characterized in that the substrate be aluminium sheet or aluminium alloy base plate, institute The scope for stating the thickness of substrate is 1mm to 2mm.
7. intelligent power module as described in claim 1, which is characterized in that the intelligent power module further includes the first heat dissipation Piece, first cooling fin are mounted between the power component and the wiring layer.
8. intelligent power module as claimed in claim 7, which is characterized in that first cooling fin include substrate metal layer and Graphite ene coatings arranged on substrate metal layer two opposite sides surface.
9. the intelligent power module as described in any one in claims 1 to 3 and 5 to 8, which is characterized in that the intelligence Power module further includes the second cooling fin, and second cooling fin is mounted on side table of the power component away from the wiring layer Face.
10. a kind of air conditioner, which is characterized in that the air conditioner includes intelligence as in one of claimed in any of claims 1 to 9 Power module.
CN201721666354.5U 2017-12-04 2017-12-04 Intelligent power module and air conditioner Active CN207441689U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721666354.5U CN207441689U (en) 2017-12-04 2017-12-04 Intelligent power module and air conditioner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721666354.5U CN207441689U (en) 2017-12-04 2017-12-04 Intelligent power module and air conditioner

Publications (1)

Publication Number Publication Date
CN207441689U true CN207441689U (en) 2018-06-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721666354.5U Active CN207441689U (en) 2017-12-04 2017-12-04 Intelligent power module and air conditioner

Country Status (1)

Country Link
CN (1) CN207441689U (en)

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