CN216849900U

CN216849900U - Ultrathin BT material packaging carrier plate

Info

Publication number: CN216849900U
Application number: CN202122935169.4U
Authority: CN
Inventors: 刘兴武; 邵胜修; 詹梦阳; 陈月莲
Original assignee: Dongguan Xinzhixin Precision Technology Co ltd
Current assignee: Dongguan Xinzhixin Precision Technology Co ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-06-28
Anticipated expiration: 2031-11-26

Abstract

The utility model discloses an ultrathin BT material packaging support plate which comprises a packaging substrate, wherein an anti-corrosion layer is arranged at the upper end of the packaging substrate, a heat absorption layer is arranged at the lower end of the packaging substrate, a heat dissipation layer is arranged at the lower end of the heat absorption layer, first rectangular through grooves are formed in the left part and the right part of the upper end of the packaging substrate, the two first rectangular through grooves extend to the lower end of the heat dissipation layer, two bilaterally-symmetrical second rectangular through grooves are formed in the front part and the rear part of the upper end of the packaging substrate, and the four second rectangular through grooves extend to the lower end of the heat dissipation layer. According to the ultrathin BT material packaging carrier plate, the heat absorption layer and the heat dissipation layer are arranged to be matched together, so that the heat dissipation speed of the packaging carrier plate is increased, the operation efficiency of the packaging carrier plate is increased, the corrosion resistance and the water resistance of the packaging carrier plate are improved by arranging the anti-corrosion layer, and the service life of the packaging carrier plate is prolonged.

Description

Ultrathin BT material packaging carrier plate

Technical Field

The utility model relates to the field of packaging carrier plates, in particular to an ultrathin BT material packaging carrier plate.

Background

The conventional wire bonding technique usually uses a lead frame as a carrier of the chip, and the lead frame cannot provide higher contact density with the gradual increase of the contact density of the chip, so that a package carrier with high contact density can be used to replace the lead frame, and the chip is packaged on the package carrier through conductive media such as metal wires or bumps.

The prior package carrier plate has the following disadvantages: 1. most of the existing package carrier plates are heat-dissipating by themselves, so that the heat-dissipating effect is single, the materials are simple, the heat-dissipating effect is not optimal, and the operation efficiency of the package carrier plate is reduced; 2. after the existing packaging carrier plate is used for a long time, the surface of the packaging carrier plate can be corroded by corrosive gas or liquid in the atmosphere, the packaging carrier plate can show a fault after being used for a period of time, once the fault caused by corrosion occurs, products with the same service life in the same environment enter a fault concentration outbreak period, and meanwhile, the influence of pollution on the packaging carrier plate is irreversible, so that great difficulty can be caused to maintenance, and even the products are scrapped.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an ultrathin BT material packaging carrier plate, which can effectively solve the problems in the background art.

In order to realize the purpose, the utility model adopts the technical scheme that:

the utility model provides an ultra-thin BT material encapsulation support plate, includes the encapsulation base plate, the upper end of encapsulation base plate is provided with anti-corrosion coating, the lower extreme of encapsulation base plate is provided with the heat-sink shell, the lower extreme of heat-sink shell is provided with the heat dissipation layer, first rectangle through groove has all been seted up to the upper end left part and the right part of encapsulation base plate, two first rectangle through groove all extends to the lower extreme of heat dissipation layer, two bilateral symmetry's second rectangle through groove has all been seted up to the upper end front portion and the upper end rear portion of encapsulation base plate, four the second rectangle through groove all extends to the lower extreme of heat dissipation layer, the upper end four corners of encapsulation base plate has seted up the mounting hole, four the mounting hole all extends to the lower extreme on heat dissipation layer.

Preferably, the anti-corrosion layer comprises a fluororesin waterproof coating, the lower end of the fluororesin waterproof coating is provided with an acid-resistant, heat-conductive and anti-corrosion coating, and the fluororesin waterproof coating is arranged at the upper end of the packaging substrate.

Preferably, the heat absorption layer comprises a heat conduction gel layer, a heat conduction insulation elastic rubber layer is arranged at the lower end of the heat conduction gel layer, and the heat conduction gel layer is arranged at the lower end of the packaging substrate.

Preferably, the heat dissipation layer comprises a heat dissipation metal sheet, and a radiation heat dissipation cooling coating is arranged at the lower end of the heat dissipation metal sheet.

Preferably, the thickness of the packaging substrate is 0.14 mm.

Preferably, the heat dissipation metal sheet is arranged at the lower end of the heat conduction and insulation elastic rubber layer.

Compared with the prior art, the utility model has the following beneficial effects:

1. the ultrathin material packaging carrier plate improves the heat dissipation speed of the packaging carrier plate by arranging the heat absorption layer and the heat dissipation layer to be matched together, the heat conduction gel layer has the advantages of weather resistance, high and low temperature resistance, good insulation property and the like, meanwhile, the plasticity is strong, the filling of uneven interfaces can be met, the heat transfer requirements under various applications can be met, the ultrathin material packaging carrier plate is soft, has better surface affinity, can be compressed to a very low thickness, the heat transfer efficiency is obviously improved, the heat conduction gel layer can quickly transfer heat to the heat conduction insulation elastic rubber layer and has the characteristics of good heat conduction and high insulation property, then the heat conduction insulation elastic rubber layer quickly transfers the heat to the heat dissipation metal sheet, the heat dissipation metal sheet dissipates the heat, and the radiation heat dissipation cooling coating is an energy-saving coating which reduces infrared wave sections and improves the infrared radiation frequency at the same temperature of an object, the heat exchange rate can be improved, the heat dissipation efficiency of the heat dissipation metal sheet is further improved, and the operation efficiency of the packaging carrier plate is improved;

2. According to the ultrathin material packaging support plate, the corrosion resistance and the water resistance of the packaging support plate are improved by arranging the anti-corrosion layer, the fluororesin waterproof coating has good waterproof and moistureproof performances, the thickness of the fluororesin waterproof coating is one micron, an extremely thin net is formed on the surface of the packaging substrate, the surface energy of the packaging substrate is effectively reduced, the normal electric conduction of a connector and the heat dissipation of the packaging substrate are not influenced, the waterproof, acid-resistant, heat-conducting and anti-corrosion coating has excellent acid resistance, the surface of the waterproof, acid-resistant and heat-conducting and anti-corrosion coating is not dusted, and the waterproof, acid-resistant and heat-conducting and anti-corrosion coating has hydrophobic and self-cleaning properties, so that the heat exchange quantity of a heat exchanger is improved again, the heat exchange rate is improved, the corrosion resistance is improved, and the service life of the packaging support plate is prolonged.

Drawings

Fig. 1 is a schematic view of an overall structure of an ultra-thin BT material package carrier according to the present invention;

fig. 2 is a schematic diagram illustrating an overall structure of an anti-corrosion layer of an ultra-thin BT material packaging carrier according to the present invention;

fig. 3 is a schematic view of an overall structure of a heat absorbing layer of an ultra-thin BT material package carrier according to the present invention;

fig. 4 is a schematic view of an overall structure of a heat dissipation layer of an ultra-thin BT material package carrier according to the present invention.

In the figure: 1. a package substrate; 2. an anti-corrosion layer; 3. mounting holes; 4. a first rectangular through slot; 5. a heat absorbing layer; 6. a heat dissipation layer; 7. a second rectangular through slot; 21. a fluororesin waterproof coating; 22. acid-resistant heat-conducting anticorrosive coatings; 51. a thermally conductive gel layer; 52. a heat-conducting insulating elastic rubber layer; 61. a heat dissipating metal sheet; 62. A radiation heat dissipation cooling coating.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further explained by combining the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

As shown in fig. 1-4, an ultra-thin BT material packaging carrier plate comprises a packaging substrate 1, an anti-corrosion layer 2 is arranged at the upper end of the packaging substrate 1, a heat-absorbing layer 5 is arranged at the lower end of the packaging substrate 1, a heat-dissipating layer 6 is arranged at the lower end of the heat-absorbing layer 5, first rectangular through grooves 4 are formed in the left portion and the right portion of the upper end of the packaging substrate 1, the two first rectangular through grooves 4 extend to the lower end of the heat-dissipating layer 6, two bilaterally symmetrical second rectangular through grooves 7 are formed in the front portion and the rear portion of the upper end of the packaging substrate 1, the four second rectangular through grooves 7 extend to the lower end of the heat-dissipating layer 6, mounting holes 3 are formed in four corners of the upper end of the packaging substrate 1, and the four mounting holes 3 extend to the lower end of the heat-dissipating layer 6.

The anti-corrosion layer 2 comprises a fluororesin waterproof coating 21, an acid-resistant heat-conducting anti-corrosion coating 22 is arranged at the lower end of the fluororesin waterproof coating 21, the fluororesin waterproof coating 21 is arranged at the upper end of the packaging substrate 1, the anti-corrosion layer 2 improves the corrosion resistance and the waterproofness of the packaging substrate, and the thickness of the fluororesin waterproof coating 21 is one micron.

The heat absorbing layer 5 comprises a heat conducting gel layer 51, the lower end of the heat conducting gel layer 51 is provided with a heat conducting insulating elastic rubber layer 52, the heat conducting gel layer 51 is arranged at the lower end of the packaging substrate 1, the heat conducting insulating elastic rubber layer 52 adopts a silicon rubber base material, ceramic particles such as boron nitride, aluminum oxide and the like are used as filling agents, the heat dissipation layer 6 comprises a heat dissipation metal sheet 61, the lower end of the heat dissipation metal sheet 61 is provided with a radiation heat dissipation cooling coating 62, the heat absorbing layer 5 and the heat dissipation layer 6 are jointly matched to improve the heat dissipation speed of the packaging carrier plate, the thickness of the packaging substrate 1 is 0.14mm, the heat dissipation metal sheet 61 is arranged at the lower end of the heat conducting insulating elastic rubber layer 52, the heat conducting gel layer 51 can be compressed to 0.1mm, the heat conducting insulating elastic rubber layer 52 adopts a silicon rubber base material and boron nitride, ceramic particles such as alumina and the like are used as a filling agent, so that the heat conduction effect is very good, and the thermal impedance is lower than that of other heat conduction materials under the same condition.

It should be noted that, the utility model is an ultra-thin BT material packaging carrier plate, when in use, a chip is packaged above a packaging substrate 1, the heat dissipation speed of the packaging carrier plate is improved by arranging the heat absorbing layer 5 and the heat dissipation layer 6 to cooperate together, the heat conducting gel layer 51 has the advantages of weather resistance, high and low temperature resistance, good insulation property and the like, meanwhile, the plasticity is strong, the filling of uneven interfaces can be met, the heat transfer requirements under various applications can be met, the BT material packaging carrier plate is soft and has better surface affinity, the BT material packaging carrier plate can be compressed to a very low thickness, the heat transfer efficiency is obviously improved, the BT material packaging carrier plate can be compressed to 0.1mm at least, the heat conducting gel layer 51 can rapidly transfer heat to the heat conducting insulating elastic rubber layer 52, the heat conducting insulating elastic rubber layer 52 adopts a silicon rubber substrate, ceramic particles such as boron nitride and aluminum oxide are used as fillers, the heat conducting effect is very good, and the thermal impedance is smaller than other heat conducting materials under the same conditions, the heat-conducting elastic rubber layer 52 can quickly transfer heat to the heat-radiating metal sheet 61, the heat is then radiated out by the heat-radiating metal sheet 61, the radiation heat-radiating temperature-reducing coating 62 is an energy-saving coating which can reduce infrared wave bands and improve infrared radiation frequency at the same temperature of an object, the heat exchange rate can be improved by 10 percent, the corrosion resistance and the water resistance of the packaging carrier plate are improved by arranging the anti-corrosion layer 2, the fluororesin waterproof coating 21 has good waterproof and moisture-proof performance, the thickness of the fluororesin waterproof coating is one micron, an extremely thin net is formed on the surface of the packaging substrate 1, the surface energy of the packaging substrate 1 is effectively reduced, the normal electric conduction of a connector and the heat radiation of the packaging substrate 1 are not influenced, the waterproof heat-conducting acid-resistant anticorrosive coating 22 has excellent acid resistance, and the surface of the waterproof heat-conducting acid-resistant anticorrosive coating 22 does not hang ash, hydrophobic self-cleaning property is achieved, and therefore the heat exchange quantity of the heat exchanger is improved again.

The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, and such changes and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an ultra-thin BT material encapsulation support plate, includes package substrate (1), its characterized in that: the packaging structure is characterized in that an anti-corrosion layer (2) is arranged at the upper end of the packaging substrate (1), a heat absorbing layer (5) is arranged at the lower end of the packaging substrate (1), a heat dissipation layer (6) is arranged at the lower end of the heat absorbing layer (5), a first rectangular through groove (4) is formed in the left portion and the right portion of the upper end of the packaging substrate (1), two first rectangular through grooves (4) extend to the lower end of the heat dissipation layer (6), two second rectangular through grooves (7) which are bilaterally symmetrical are formed in the front portion and the rear portion of the upper end of the packaging substrate (1), four second rectangular through grooves (7) extend to the lower end of the heat dissipation layer (6), mounting holes (3) are formed in four corners of the upper end of the packaging substrate (1), and four mounting holes (3) extend to the lower end of the heat dissipation layer (6).

2. The ultra-thin BT material package carrier of claim 1, wherein: the anti-corrosion layer (2) comprises a fluororesin waterproof coating (21), an acid-resistant heat-conducting anti-corrosion coating (22) is arranged at the lower end of the fluororesin waterproof coating (21), and the fluororesin waterproof coating (21) is arranged at the upper end of the packaging substrate (1).

3. The ultra-thin BT material package carrier of claim 2, wherein: the heat absorption layer (5) comprises a heat conduction gel layer (51), a heat conduction insulation elastic rubber layer (52) is arranged at the lower end of the heat conduction gel layer (51), and the heat conduction gel layer (51) is arranged at the lower end of the packaging substrate (1).

4. The ultra-thin BT material package carrier of claim 3, wherein: the heat dissipation layer (6) comprises a heat dissipation metal sheet (61), and a radiation heat dissipation cooling coating (62) is arranged at the lower end of the heat dissipation metal sheet (61).

5. The ultra-thin BT material package carrier of claim 4, wherein: the thickness of the packaging substrate (1) is 0.14 mm.

6. The ultra-thin BT material package carrier of claim 5, wherein: the heat dissipation metal sheet (61) is arranged at the lower end of the heat conduction and insulation elastic rubber layer (52).