CN107052308B - A kind of liquid metal thermal interface material that foam copper is compound - Google Patents
A kind of liquid metal thermal interface material that foam copper is compound Download PDFInfo
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- CN107052308B CN107052308B CN201710155366.XA CN201710155366A CN107052308B CN 107052308 B CN107052308 B CN 107052308B CN 201710155366 A CN201710155366 A CN 201710155366A CN 107052308 B CN107052308 B CN 107052308B
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- foam copper
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- interface material
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Abstract
The invention discloses a kind of liquid metal thermal interface materials that foam copper is compound, it is made of liquid metal thermal interface material and foam copper, the liquid metal thermal interface material is grouped as by the group of following weight percent: Zn:2.0-8.0%, Sb:1.0-4.0%, Sn:5.0-12.0%, Ag:0.3-0.8%, Ce:0.1-0.2%, Ru:0.02-0.04%, surplus In.Since the vesicular texture of foam copper makes liquid metal side leakage phenomenon obtain effective control.By the hole size further combined with liquid metal fusing point and foam copper, the phenomenon that can fully and completely preventing liquid metal side leakage.It is provided for the large-scale business application of liquid metal thermal interface material and has used a kind of effective solution scheme.
Description
Technical field
The present invention relates to liquid metals, specifically, being related to a kind of liquid metal thermal interface material that foam copper is compound.
Background technique
It is well known that IGBT device is inputted with it, resistance value is high, switching speed is fast, on state voltage is low, blocking voltage is high, bears
The features such as electric current is big, it has also become the mainstream device of current power semiconductor development, be widely applied to various alternating current generators,
In the power electronic circuit of the fields such as frequency converter, Switching Power Supply, lighting circuit, Traction Drive.When IGBT device work, generation
Heat can be such that chip temperature rises rapidly more than maximum allowable IGBT junction temperature.Therefore, the performance of IGBT will substantially reduce, and cannot
Steady operation causes performance to decline or fail.In recent years due to the further development of IGBT technology, relevant extreme environment
High efficiency and heat radiation technology has become heat management engineer and scientist and all thirsts for the key technical problem solved.
Complete IGBT module includes IGBT device, radiator, Hot-air fan and four part of heat-conducting medium composition, wherein
IGBT device itself and heat-conducting medium play a decisive role to heat dissipation performance.Contact surface between heater and radiator has microcosmic
On hole, centre is filled with air.Because air is bad heat conductor, the hot interface resistance between heater and radiator is non-
Chang great seriously hinders heat transfer, eventually leads to low heat emission efficiency.Thermal interfacial material with high thermal conductivity coefficient can fill this
Gap on seeing slightly, helps to establish effective thermal conduction path, to substantially reduce hot interface resistance.Thus it is anticipated that
Thermal interfacial material with high heat-transfer performance can be widely used in IGBT industry.
Ideal thermal interfacial material should have following physics and chemical characteristic: (1) high thermal conductivity coefficient is effectively scattered to guarantee
Heat；(2) good mobility is come the minim gap effectively filled up between hot generating body and radiator；(3) only in low-pressure installation
Special flexibility.Silicone grease is conventionally used for the thermal interfacial material of the heat transfer of electronic device, but the very low (~ 1- of heat transfer coefficient
2W/m.k).Moreover, due to the evaporation and oxidation of organic principle, silicone grease can become fragile and aging after being on active service for a long time.Phase
Than for, the liquid metal occurred in recent years is other than with high heating conduction, due also to extremely low vapour pressure and antioxygen
The property changed, is in pyramidal top in field of radiating, especially suitable for high density high-power electronic component.
Liquid metal is a kind of low-melting alloy, has high thermal conductivity (~ 20-85W/m.K) near its fusing point.It is based on
Locating states of matter, liquid metal can be divided into three classes under use condition: (1) pure liquid liquid metal, fusing point can be reduced to about 2 DEG C
Left and right.This kind of liquid metal can be used as the cooling medium in heat-dissipating pipe under electromagnetic pump driving to improve radiating efficiency.(2) cream
Shape liquid metal can keep solid-liquid state since fusing point is up to 50 DEG C within the scope of very wide temperature.Such liquid
Metal can be used as silica gel substitution thermal interfacial material.(3) foil-like liquid metal, fusing point can be at 60-180 ° when being used as thermal interfacial material
C.These three liquid metals be it is nontoxic, there is stable physical/chemical, be suitble to prolonged application under extreme conditions.
In particular, foil-like liquid metal is due to its flexible mounting characteristics it is anticipated that obtaining the application of maximum-norm in the production line.
When liquid metal is used for thermal interfacial material, it is primarily present two problems:
(1) the side leakage problem of liquid metal:
The content of liquid phase sharply increases as the temperature rises.This feature makes liquid metal as thermal interfacial material
Amplification is very big as the temperature increases for mobility, can when liquid metal is used as thermal interfacial material there is a phenomenon where side leakage,
And then since the electric conductivity of liquid metal leads to the short circuit of circuit board.The method of liquid metal thermal interface material side leakage is solved, is led to
The liquid metal thermal interface material problem that viscosity declines as the temperature rises can often be reduced by the design of material composition.
(2) heat transfer property can be further improved:
Current liquid metal thermal interface material, heat transfer coefficient mainly maintain 20-85W/m.K.In dissipating-heat environment day
Today that beneficial harsh microelectric technique rapidly develops, the heat transfer coefficient for further increasing liquid metal thermal interface material is liquid
One important development direction of metal field.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide the liquid metal thermal interface materials for foam copper
Material.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of liquid metal thermal interface material that foam copper is compound, is made of liquid metal thermal interface material and foam copper,
The liquid metal thermal interface material is grouped as by the group of following weight percent: Zn:2.0-8.0%, Sb:1.0-4.0%,
Sn:5.0-12.0%, Ag:0.3-0.8%, Ce:0.1-0.2%, Ru:0.02-0.04%, surplus In.
The preparation method of the compound liquid metal thermal interface material of above-mentioned foam copper, includes the following steps: that (a) presses alloy
According to required ingredient with postponing, the induction melting furnace for being put into argon gas protection carries out melting, using graphite crucible；In 400-450
DEG C heat preservation 10 minutes using electromagnetic agitation sufficiently by alloy melt after mixing evenly, pour into foam copper and carry out under gravity
Casting；(b) obtained casting ingot is subjected to cold rolling, the drafts rolled per pass is 20-30%, and overall thickness is after rolling
0.05mm。
The above-mentioned preferred compactness control of foam copper is in 10-35%.
Liquid metal thermal interface material provided by the invention has following two key properties: (a) more due to foam copper
Cavernous structure makes liquid metal side leakage phenomenon obtain effective control.By further combined with liquid metal fusing point and foam
The hole size of copper, the phenomenon that can fully and completely preventing liquid metal side leakage.It is extensive for liquid metal thermal interface material
Business application offer used a kind of effective solution scheme.(b) since the thermal conductivity of copper is in 380 W/m.K or more.Pass through tune
The compactness (control is in 10-35%) of whole copper, effectively can be increased to 90- for the thermal conductivity of liquid metal thermal interface material
120W/m.K.For extreme environment is extensive and effectively radiates and provides the heat sink conception in heat dissipation pyramid top.Liquid
Melting point metal and fusion range can be customized greatly to optimize liquid metal conduct according to the demand and characteristic of heat dissipation system
The heat dissipation performance of thermal interfacial material composite construction.
Compared with prior art, the invention has the following beneficial effects:
(1) on the basis of guaranteeing the excellent heat dissipation property of existing liquid metal thermal interface material, in order to prevent liquid completely
State metal heat interface material carries out liquid metal thermal interface material and foam copper compound to prepare foam there is a phenomenon where side leakage
The compound liquid metal thermal interface material of copper.Since the vesicular texture of foam copper has liquid metal side leakage phenomenon
The control of effect.By the hole size further combined with liquid metal fusing point and foam copper, it can fully and completely prevent liquid
The phenomenon that metal side leakage.It is provided for the large-scale business application of liquid metal thermal interface material and has used a kind of effective solution side
Case.
(2) since the thermal conductivity of copper is in 380 W/m.K or more.It, can by adjusting the compactness (control is in 10-35%) of copper
The thermal conductivity of liquid metal thermal interface material is effectively increased to 90-120W/m.K.For extreme environment is extensive and has
The heat dissipation of effect ground provides the heat sink conception in heat dissipation pyramid top.
(3) the novel liquid metal thermal interfacial material not only perfect heat-dissipating, and it is simple to process smelting process, is produced into
This is low, is convenient for industrialization large-scale production and practical application.
Detailed description of the invention
Fig. 1 is the outside drawing of foam copper.
Fig. 2 is the composite construction schematic diagram of the foam copper after casting liquid metal.Wherein white line part is copper,
Black portions are liquid metal.
Specific embodiment
Embodiment 1
A kind of liquid metal thermal interface material for radiating for 80 DEG C and having composite foam copper.By weight percentage, Zn:
2.4%, Sb:1.6%, Sn:5.7%, Ag:0.4%, Ce:0.1%, Ru:0.02%, surplus In.Take ingredient as above
Alloy is homogenized after 420 DEG C melt in graphite crucible in the vacuum induction melting furnace of argon gas protection, and using electromagnetic agitation
10 minutes.Then the liquid metal of fusing is cast into the casting carried out under gravity in foam copper, the compactness of foam copper
Control is 22%.Obtained casting ingot is subjected to cold rolling, the drafts rolled per pass is 25%.Overall thickness is after rolling
0.05mm.In the present embodiment, the fusing point of liquid metal is 85 DEG C.The thermal conductivity of the thermal interfacial material is 95W/m.K, suitable for being used as
The thermal interfacial material to radiate under the conditions of 80 DEG C.
Embodiment 2
A kind of liquid metal thermal interface material for radiating for 120 DEG C and having composite foam copper.By weight percentage,
Zn:6.3%, Sb:2.4%, Sn:8.6%, Ag:0.6%, Ce:0.1%, Ru:0.02%, surplus In.Take as above at
The alloy divided utilizes electromagnetic agitation equal after 420 DEG C melt in graphite crucible in the vacuum induction melting furnace of argon gas protection
It homogenizes 10 minutes.Then by the liquid metal of fusing be cast into foam copper carry out gravity under casting, foam copper it is close
Solidity is controlled 26%.Obtained casting ingot is subjected to cold rolling, the drafts rolled per pass is 25%.Overall thickness is after rolling
0.05mm.In the present embodiment, the fusing point of liquid metal is 128 DEG C.The thermal conductivity of the thermal interfacial material is 93W/m.K, is suitable for using
The thermal interfacial material to radiate under the conditions of doing 120 DEG C.
Embodiment 3
A kind of liquid metal thermal interface material for radiating for 180 DEG C and having composite foam copper.By weight percentage,
Zn:7.9%, Sb:3.8%, Sn:10.6%, Ag:0.6%, Ce:0.2%, Ru:0.03%, surplus In.Take as above at
The alloy divided utilizes electromagnetic agitation equal after 420 DEG C melt in graphite crucible in the vacuum induction melting furnace of argon gas protection
It homogenizes 10 minutes.Then by the liquid metal of fusing be cast into foam copper carry out gravity under casting, foam copper it is close
Solidity is controlled 28%.Obtained casting ingot is subjected to cold rolling, the drafts rolled per pass is 25%.Overall thickness is after rolling
0.05mm.In the present embodiment, the fusing point of liquid metal is 186 DEG C.The thermal conductivity of the thermal interfacial material is 87W/m.K, is suitable for using
The thermal interfacial material to radiate under the conditions of doing 180 DEG C.
Claims (1)
1. a kind of liquid metal thermal interface material that foam copper is compound, it is characterised in that by liquid metal thermal interface material and foam
Copper is at the liquid metal thermal interface material is grouped as by the group of following weight percent: Zn:2.0-8.0%, Sb:1.0-
4.0%, Sn:5.0-12.0%, Ag:0.3-0.8%, Ce:0.1-0.2%, Ru:0.02-0.04%, surplus In；Preparation
Method includes the following steps: that (a) matches alloy according to required ingredient and postpones that the induction melting furnace for being put into argon gas protection carries out
Melting, using graphite crucible；400-450 DEG C keep the temperature 10 minutes using electromagnetic agitation sufficiently by alloy melt after mixing evenly,
The casting carried out under gravity is poured into foam copper；(b) obtained casting ingot is subjected to cold rolling, the drafts rolled per pass
For 20-30%, overall thickness is 0.05mm after rolling；The foam copper compactness control is in 10-35%.
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| CN201710155366.XA CN107052308B (en) | 2017-03-16 | 2017-03-16 | A kind of liquid metal thermal interface material that foam copper is compound |
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| CN107052308A CN107052308A (en) | 2017-08-18 |
| CN107052308B true CN107052308B (en) | 2019-02-26 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108251072B (en) * | 2018-03-05 | 2020-08-25 | 北京科技大学 | Preparation method of liquid metal composite phase-change material |
| CN109957696A (en) * | 2019-04-01 | 2019-07-02 | 杭州辰卓科技有限公司 | A kind of liquid metal thermal interface material of 50-80 degree heat dissipation and side leakage free |
| CN113201660B (en) * | 2021-04-28 | 2021-11-23 | 东北大学 | Nano porous copper liquid metal composite thermal interface material and preparation method thereof |
| CN114479773A (en) * | 2021-12-31 | 2022-05-13 | 江阴镓力材料科技有限公司 | Composite thermal interface material composed of foam metal and liquid metal |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1526029A (en) * | 2001-05-24 | 2004-09-01 | 弗莱氏金属公司 | Thermal interface material and heat sink configuration |
| CN105838333A (en) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | Phase change alloy thermal interface composite material and preparation method thereof |
| CN106929733A (en) * | 2017-03-16 | 2017-07-07 | 宁波新瑞清科金属材料有限公司 | A kind of compound liquid metal thermal interface material of foamed aluminium |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI344196B (en) * | 2006-11-15 | 2011-06-21 | Ind Tech Res Inst | Melting temperature adjustable metal thermal interface materials and use thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1526029A (en) * | 2001-05-24 | 2004-09-01 | 弗莱氏金属公司 | Thermal interface material and heat sink configuration |
| CN1825576A (en) * | 2001-05-24 | 2006-08-30 | 弗莱氏金属公司 | Thermal interface material and heat sink configuration |
| CN105838333A (en) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | Phase change alloy thermal interface composite material and preparation method thereof |
| CN106929733A (en) * | 2017-03-16 | 2017-07-07 | 宁波新瑞清科金属材料有限公司 | A kind of compound liquid metal thermal interface material of foamed aluminium |
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