CN106957980B - With the liquid metal thermal interface material from gain performance - Google Patents

With the liquid metal thermal interface material from gain performance Download PDF

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CN106957980B
CN106957980B CN201710155270.3A CN201710155270A CN106957980B CN 106957980 B CN106957980 B CN 106957980B CN 201710155270 A CN201710155270 A CN 201710155270A CN 106957980 B CN106957980 B CN 106957980B
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liquid metal
interface material
phase particle
thermal interface
thickness
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CN106957980A (en
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刘亚军
曹贺全
曹帅
郭强
吴智鑫
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Ningbo Shinri Branch Metal Materials Co Ltd
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Abstract

The invention discloses with the liquid metal thermal interface material from gain performance, for three-decker, middle layer is made of the component of following weight percent:Zn:1.0‑4.0%,Bi:2.0‑6.0%,Sn:10.0‑40.0%,Au:0.3‑0.8%,V:0.1 0.2%, surplus In;In addition to having alloying component as above, further include Second Phase Particle upper and lower two layers, the Second Phase Particle is Cu, Ti, Mo, W and O N, S, p-shaped into compound.Products obtained therefrom can maintain solid-state, and then effectively fill heater and the micro-void on radiator surface while liquid metal heat interface material high thermal conductivity (20 85W/m.K) is maintained under the normal working condition of thermal interfacial material.Ensureing that it is solid that liquid metal works in, fundamentally preventing the generation of side leakage.

Description

With the liquid metal thermal interface material from gain performance
Technical field
The present invention relates to liquid metal material, specifically, being related to the liquid metal thermal interface material from gain performance Material.
Background technology
It is well known that IGBT device is inputted with it, resistance value is high, switching speed is fast, on state voltage is low, blocking voltage is high, bears The features such as electric current is big, it has also become the mainstream device of current power semiconductor development, be widely applied to various alternating current generators, In the power electronic circuit of the fields such as frequency converter, Switching Power Supply, lighting circuit, Traction Drive.When IGBT device works, generation Heat can make chip temperature be increased beyond maximum allowable IGBT junction temperatures rapidly.Therefore, the performance of IGBT will substantially reduce, and cannot Steady operation leads to hydraulic performance decline or failure.In recent years due to the further development of IGBT technologies, relevant extreme environment High efficiency and heat radiation technology has become heat management engineer and scientist and all thirsts for the key technical problem solved.
Complete IGBT module includes IGBT device, radiator, Hot-air fan and four part of heat-conducting medium composition, wherein IGBT device in itself plays a decisive role to heat dissipation performance with heat-conducting medium.Contact surface between heater and radiator has microcosmic On hole, centre is filled with air.Because air is bad heat conductor, the hot interface resistance between heater and radiator is non- Chang great seriously hinders heat transfer, eventually leads to low heat emission efficiency.Thermal interfacial material with high thermal conductivity coefficient can fill this Gap on seeing slightly, helps to establish effective thermal conduction path, so as to substantially reduce hot interface resistance.Thus it is anticipated that Thermal interfacial material with high heat-transfer performance can be widely used in IGBT industries.
Ideal thermal interfacial material should have following physics and chemical characteristic:(1)High thermal conductivity coefficient is effectively scattered to ensure Heat;(2)Good mobility effectively fills up the minim gap between hot generating body and radiator;(3)It is only in low-pressure installation Special flexibility.Silicone grease is conventionally used for the thermal interfacial material of the heat transfer of electronic device, but the very low (~ 1- of heat transfer coefficient 2W/m.k).Moreover, after being on active service for a long time, due to the evaporation and oxidation of organic principle, silicone grease can become fragile and aging.Phase Than for, the liquid metal occurred in recent years is other than with high heat conductivility, due also to extremely low vapour pressure and antioxygen The property changed, is in pyramidal top, especially suitable for high density high-power electronic component in field of radiating.
Liquid metal is a kind of low-melting alloy, has high thermal conductivity near its fusing point(~ 20-85W/m.K).It is based on Residing states of matter, liquid metal can be divided into three classes under use condition:(1)Pure liquid liquid metal, fusing point can be reduced to about 2 DEG C Left and right.This kind of liquid metal can improve radiating efficiency under electromagnetic pump driving as the cooling medium in heat-dissipating pipe.(2)Cream Shape liquid metal can keep solid-liquid state since fusing point is up to 50 DEG C within the scope of very wide temperature.Such liquid Metal can be used as silica gel to substitute thermal interfacial material.(3)Foil-like liquid metal, fusing point can be at 60-180 ° during as thermal interfacial material C.These three liquid metals are nontoxic, have stable physical/chemical, are suitble to prolonged application under extreme conditions. Particularly, foil-like liquid metal due to its flexible mounting characteristics it is anticipated that obtaining the application of maximum-norm in the production line.
When liquid metal is used for thermal interfacial material, what is leaned on is solid alloy to be presented at room temperature in setting at use temperature Become the liquid with certain fluidity or solidliquid mixture to fill the gap between heater and radiator.At present and Speech, liquid metal are that the content with the raising liquid phase of temperature drastically increases for one urgent problem to be solved of thermal interfacial material Add.This feature causes liquid metal, and as the mobility of thermal interfacial material, amplification is very big as the temperature increases, can be in liquid The phenomenon that side leakage occurs when metal is used as thermal interfacial material, and then since the electric conductivity of liquid metal leads to the short of circuit board Road.The method of liquid metal thermal interface material side leakage is solved, can liquid metal be reduced by the design of alloy material ingredient The problem that thermal interfacial material declines with the raising viscosity of temperature.
Invention content
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of liquid metal thermals having from gain performance Boundary material.The present invention increases liquid metal thermal interface material by the modified method of liquid metal thermal interface material surface composition Expect the ability of anti-side leakage, used on a large scale in field of radiating to reach liquid metal thermal interface material.
The present invention adopts the following technical scheme that:
A kind of liquid metal thermal interface material having from gain performance, is three-decker, middle layer is by following weight hundred The component composition of score:Zn:1.0-4.0%, Bi: 2.0-6.0%, Sn: 10.0-40.0%, Au: 0.3-0.8%, V: 0.1-0.2%, surplus In;In addition to having alloying component as above, Second Phase Particle, second phase are further included upper and lower two layers Particle is Cu, Ti, Mo, W and O N, S, p-shaped into compound.
It is described to have the second phase two layers up and down in the above-mentioned liquid metal thermal interface material for having from gain performance The thickness of grain accounts for the 5% of overall thickness, and Second Phase Particle is 5-15% in the volume fraction of place layer.
The above-mentioned preparation method with the liquid metal thermal interface material from gain performance includes the following steps:(a) it will close The induction melting furnace that gold is put into argon gas protection in proportion carries out melting, and using graphite crucible, 10 minutes are kept the temperature at 400-450 DEG C, After fully alloy melt is stirred evenly using electromagnetic agitation, pour into graphite jig and cast;(b) by liquid metal spindle Cold rolling is carried out, the drafts of every time rolling is 20-30%, is cold rolled to 0.15mm;(c) Second Phase Particle is utilized into alcohol and sweet After oil carries out ultrasonic disperse, two surfaces of liquid metal foil that thickness is 0.15mm are sprayed to;After vaporized alcohol is complete, carry out cold Thickness is rolled for 0.05mm;Before packaging and storage, the glycerine on surface is removed with distilled water.
There are thermal conductivity factor height near surface for liquid metal thermal interface material, heat the second small phase compound particle, Particle size is at 20-80 microns.The fusing point of liquid metal is designed on the temperature of radiating element working condition, thus in the temperature Under degree, liquid metal thermal interface material can not melt.But since the thermal capacitance of compound particle is smaller, work as unit When hot-fluid flows through compound particle, the temperature for causing compound particle is higher than the temperature of liquid metal around, so as to cause The local softening of liquid metal or even local liquid near surface.And the liquid metal of middle section is also maintained at the shape of solid State.
Compared with prior art, the present invention has the advantages that:
(1)It is excellent by that will have on the basis of the excellent heat dissipation property for ensureing existing liquid metal thermal interface material Thermal conductivity factor, the low Second Phase Particle of thermal capacitance imported into liquid metal thermal interface material surface, this designing scheme can cause Since the thermal capacitance of compound particle is smaller, when unit hot-fluid flows through compound particle, the temperature ratio of compound particle is caused The temperature of surrounding liquid metal is high, so as to lead to the local softening of liquid metal or even local liquid near surface.In and Between the liquid metal of part be also maintained at the state of solid.
(2)It is to prepare to have from the liquid thermal interfacial material of gain performance by the second phase of high heat conduction and liquid metal are compound It innovates greatly in liquid metal field one.Products obtained therefrom is maintaining the same of liquid metal heat interface material high thermal conductivity (20-85W/m.K) When, solid-state can be maintained under the normal working condition of thermal interfacial material, but near interface is since temperature raises in the second phase Particle nearby melts, and then effectively fill heater and the micro-void on radiator surface.Ensureing liquid metal work Make in it is solid in the case of, fundamentally prevented the generation of side leakage.
(3)The novel liquid metal thermal interfacial material not only perfect heat-dissipating, but also processing smelting process is simple, is produced into This is low, convenient for industrialization large-scale production and practical application
Specific embodiment
Embodiment 1:
One kind is for 80 DEG C of heat dissipations and with liquid metal composite heat interfacial material structure, by weight percentage, the conjunction Gold ingredient be:Zn:2.1%, Bi: 2.4%, Sn: 10.5%, Au: 0.3%, V:0.1%, surplus In.Take as above into The alloy divided utilizes electromagnetic agitation equal after 420 DEG C melt in the vacuum induction melting furnace of argon gas protection in graphite crucible It homogenizes 10 minutes.Then the liquid metal of fusing is cast into graphite jig.Liquid metal spindle is subjected to cold rolling, every time is rolled The drafts of system is 25%, is cold rolled to 0.15mm.Selection Second Phase Particle is the compound that Cu, Ti and N are formed, and particle size exists 25 microns.The layer thickness for having particle accounts for the 10% of overall thickness, i.e., upper and lower two parts account for the 5% of overall thickness respectively.Second phase Grain is 5% in the volume fraction of place layer.After Second Phase Particle is carried out ultrasonic disperse using alcohol+(2.5%) glycerine, spray to Thickness is two surfaces of liquid metal foil of 0.15mm.After vaporized alcohol is complete, be cold rolled to thickness as 0.05mm.It is packing Before storage, the glycerine on surface is removed with distilled water.The thermal conductivity of the thermal interfacial material is 56W/m.K, and the fusing point of liquid metal exists 85 DEG C or so, suitable for being used as the thermal interfacial material to radiate under the conditions of 80 DEG C.
Embodiment 2:
One kind is for 120 DEG C of heat dissipations and with liquid metal composite heat interfacial material structure, by weight percentage, the conjunction Gold ingredient be:Zn:3.1%, Bi: 2.8%, Sn: 16.4%, Au: 0.4%, V:0.1%, surplus In.Take as above into The alloy divided utilizes electromagnetic agitation equal after 420 DEG C melt in the vacuum induction melting furnace of argon gas protection in graphite crucible It homogenizes 10 minutes.Then the liquid metal of fusing is cast into graphite jig.Liquid metal spindle is subjected to cold rolling, every time is rolled The drafts of system is 20%, is cold rolled to 0.15mm.Selection Second Phase Particle is the compound that Cu, Mo and O are formed, and particle size exists 30 microns.The layer thickness for having particle accounts for the 10% of overall thickness, i.e., upper and lower two parts account for the 5% of overall thickness respectively.Second phase Grain is 8% in the volume fraction of place layer.After Second Phase Particle is carried out ultrasonic disperse using alcohol+(2.5%) glycerine, spray to Thickness is two surfaces of liquid metal foil of 0.15mm.After vaporized alcohol is complete, be cold rolled to thickness as 0.05mm.It is packing Before storage, the glycerine on surface is removed with distilled water.The thermal conductivity of the thermal interfacial material is 48W/m.K, and the fusing point of liquid metal exists 132 DEG C or so, suitable for being used as the thermal interfacial material to radiate under the conditions of 120 DEG C.
Embodiment 3:
One kind is for 160 DEG C of heat dissipations and with liquid metal composite heat interfacial material structure, by weight percentage, the conjunction Gold ingredient be: Zn:3.8%, Bi: 5.2%, Sn: 35.6%, Au: 0.4%, V:0.1%, surplus In.Take as above into The alloy divided utilizes electromagnetic agitation equal after 420 degree melt in the vacuum induction melting furnace of argon gas protection in graphite crucible It homogenizes 10 minutes.Then the liquid metal of fusing is cast into graphite jig.Liquid metal spindle is subjected to cold rolling, every time is rolled The drafts of system is 25%, is cold rolled to 0.15mm.Selection Second Phase Particle is the compound that Cu, W and N are formed, and particle size exists 30 microns.The layer thickness for having particle accounts for the 10% of overall thickness, i.e., upper and lower two parts account for the 5% of overall thickness respectively.Second phase Grain is 5% in the volume fraction of place layer.After Second Phase Particle is carried out ultrasonic disperse using alcohol+(2.5%) glycerine, spray to Thickness is two surfaces of liquid metal foil of 0.15mm.After vaporized alcohol is complete, be cold rolled to thickness as 0.05mm.It is packing Before storage, the glycerine on surface is removed with distilled water.The thermal conductivity of the thermal interfacial material is 49W/m.K, and the fusing point of liquid metal exists 172 DEG C or so, suitable for being used as the thermal interfacial material to radiate under the conditions of 160 DEG C.

Claims (3)

1. a kind of liquid metal thermal interface material having from gain performance, it is characterised in that for three-decker, middle layer is by such as The component composition of lower weight percent:Zn:1.0-4.0%, Bi: 2.0-6.0%, Sn: 10.0-40.0%, Au: 0.3- 0.8%, V:0.1-0.2%, surplus In;In addition to having alloying component as above, Second Phase Particle is further included upper and lower two layers.Institute Second Phase Particle is stated as Cu, Ti, Mo, the compound that W and O N are formed.
2. the liquid metal thermal interface material as described in claim 1 having from gain performance, it is characterised in that above and below described Two layers of the thickness for having Second Phase Particle accounts for the 5% of overall thickness, and Second Phase Particle is 5-15% in the volume fraction of place layer.
3. the preparation method with the liquid metal thermal interface material from gain performance described in claim 1 includes following step Suddenly:(a) induction melting furnace that alloy is put into argon gas protection in proportion carries out melting, using graphite crucible, in 400-450 DEG C of guarantor Temperature 10 minutes, after fully alloy melt is stirred evenly using electromagnetic agitation, is poured into graphite jig and cast;(b) by liquid State metal spindle carries out cold rolling, and the drafts of every time rolling is 20-30%, is cold rolled to 0.15mm;(c) by Second Phase Particle profit After carrying out ultrasonic disperse with alcohol and glycerine, two surfaces of liquid metal foil that thickness is 0.15mm are sprayed to;Treat vaporized alcohol After complete, be cold rolled to thickness as 0.05mm;Before packaging and storage, the glycerine on surface is removed with distilled water.
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