CN106756381B - A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation - Google Patents
A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation Download PDFInfo
- Publication number
- CN106756381B CN106756381B CN201611099866.8A CN201611099866A CN106756381B CN 106756381 B CN106756381 B CN 106756381B CN 201611099866 A CN201611099866 A CN 201611099866A CN 106756381 B CN106756381 B CN 106756381B
- Authority
- CN
- China
- Prior art keywords
- liquid metal
- temperature
- alloy
- molten
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
Abstract
The invention discloses a kind of liquid metals that there is anti-molten characteristic to be used for 80 90 DEG C of heat dissipations.It is grouped as by the group of following weight percent：Eu：0.2‑0.4%,Bi:10‑20%,Sn:15‑30%,Gd:0.3‑0.9%,Zn:1 2%, surplus In.Mushy stage is presented in 80 90 DEG C of temperature ranges in the liquid metal of the present invention, has enough viscosity.After temperature is higher than 90 DEG C, occur instead to melt phenomenon and cure due to the increase of solid concentration.The heterogeneous alloy characteristic that anti-molten behavior is generated on the basis of ensureing the heat transfer property and thermodynamic property of existing liquid metal, after temperature is increased again is introduced into liquid metal design, and specifies the alloy component range for being suitble to radiate within the scope of 80 90 DEG C.After temperature is higher than 91 95 DEG C, alloy can occur instead to melt behavior instead due to the raising of solid concentration.It ensures that in the use process of computer chip side leakage will not occur for liquid metal, improves the safety of heat dissipation.
Description
Technical field
The present invention relates to technical field of alloy, specifically, being related to a kind of liquid metal formula.
Background technology
As contemporary electronic technology rapidly develops, the degree of integration and packing density of electronic component are continuously improved.
Provide it is powerful using function simultaneously, also result in increased dramatically for its operating power consumption and calorific value.High temperature will be to electronics member
Stability, reliability and the service life of device generate harmful influence.Thereby, it is ensured that heat energy caused by heating electronic component
Enough to be timely discharged, oneself is through an importance as microelectronic product system assembles.For degree of integration and packing density
All higher portable electronic product (such as laptop), heat dissipation even become the technical bottleneck problem of entire product.
There are pole fine irregularities injustice gaps between microelectronic material surface and radiator, if they are mounted directly
Together, the real contact area between them only has the 10% of foot of radiator area, remaining is the air gap.Because of air
It is the non-conductor of heat, the thermal contact resistance between electronic component and radiator will be caused very big, seriously hinder the conduction of heat,
Ultimately cause the inefficiency of radiator.Thermal interfacial material with high-termal conductivity can be filled to these full gaps, exclude it
In air, effective thermal conduction path is established between electronic component and radiator, thermal contact resistance can be greatly lowered, makes to dissipate
The effect of hot device is fully played.As microelectronic product is higher and higher to the requirement radiated safely, thermal interfacial material
Constantly developing.What is certain is that widely used heat-conducting silicone grease after a long time can since thermal conductivity is low for a long time
The shortcomings of aging occurs, using significantly being limited.
The characteristic that ideal thermal interfacial material should have is：(1) high-termal conductivity；(2) high-flexibility ensures in relatively low installation
Thermal interfacial material can most be fully filled the gap of contact surface under pressure condition, ensure between thermal interfacial material and contact surface
Thermal contact resistance very little；(3) simple installation and has dismoutability；(4) applicability is wide, can be used to fill small gap, can also fill
Big gap.In recent years, the liquid metal to attract attention extensively in the world is the novel thermal interfacial material for meeting these requirements, non-
Often it is suitably applied the field of radiating of high density high-power electronic component.Liquid metal has the natural spy of high heat-transfer performance
Property, liquid metal thermal interface material thermal conductivity are much better than traditional Silicon-oil-based boundary material, and performance advantage is apparent.Meanwhile liquid gold
Belong to thermal interfacial material physico-chemical property to stablize, it is nontoxic, it is not volatile, it is more suitable for the prolonged application that high temperature/high heat flow field closes.Liquid
State metal heat interface material because of its remarkable heat dissipation performance, high stability and excellent heat-resisting ability, without evaporation,
The characteristics such as nontoxic provide brand-new even ultimate solution, it is contemplated that will drive numerous emerging productions to a large amount of field of heat transfer
The fast development of industry, or even can worldwide guide and to form completely new high heat flux density electronics industry, industrial value is huge.
In the major application of the industries such as information communication, the advanced energy, opto-electronics, space application, sophisticated weapons system and power electronics
Value.
Liquid metal be used for thermal interfacial material when, lean on be present at room temperature solid alloy setting at use temperature
Become the liquid with certain fluidity or solidliquid mixture to fill the gap between heater and radiator.Thus temperature
It just has begun to melt when such alloy melting point or fusing point is within the scope of certain, be more than the range, liquid gold
Belong to and existing with complete liquid.Presently, the problem that liquid metal is used for industrial quarters is liquid metal in temperature in use
Under mobility and temperature increase again after mobility aggravation problem.Since liquid metal has conductive characteristic, liquid metal
It can lead to the short circuit of peripheral circuits from side leakage near hot interface.Thus, when the temperature increases, the possibility of side leakage is bigger.At present
Liquid metal in the market is in the operating condition liquid, and side leakage problem is always the difficulty for inhibiting it to industrialize large-scale application
Topic.A kind of liquid metal can be found, there is solid-liquid two-phase state at service temperatures（Such as fusing and work under 80-90 degree
The liquid metal of work）, subsequent temperature raising after (91-95 degree) instead can occur solidification or solid concentration continue increase and
Solidification, is the new hot spot that liquid metal is related to.The phenomenon that this raising with temperature solidifies again after first melting is referred to as anti-
Pre-arcing characterisitics.The development and industrialization of such novel liquid metal can overcome existing liquid metal in temperature after of continuing rising completely
Mobility increases the problem of simultaneously side leakage after temperature so that liquid metal is further widened in the application surface of field of radiating.
Invention content
It is an object of the invention to overcome the deficiencies of the prior art and provide one kind, and there is anti-molten characteristic to be dissipated for 80-90 DEG C
The liquid metal of heat.
To achieve the goals above, the present invention adopts the following technical scheme that：
A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation, is grouped as by the group of following weight percent：
Eu：0.2-0.4%, Bi: 10-20%, Sn: 15-30%, Gd: 0.3-0.9%, Zn:1-2%, surplus In.
The design of alloy melting point and Multi-Component Phase Diagram are closely related.The phasor of n member alloy systems is tieed up for n, wherein monophase field, and two
Phase region ..., n phase regions all have n dimensions.Suitable alloying component is thus selected to make the alloy that there is high stream at a temperature of setting
The solid-liquid state of dynamic property has higher solid concentration after temperature continues heating into other phase sections.This design makes
Obtaining such alloy has anti-melting point character, as long as temperature is fixed as electronic device optimum working temperature range, in radiation processes
Middle temperature continues liquid metal after increasing can be cured instead, realize anti-molten feature.
Compared with prior art, the present invention has the advantages that：
（1）Mushy stage is presented in 80-90 DEG C of temperature range in the liquid metal of the present invention, has enough viscosity.Work as temperature
After degree is higher than 91-95 DEG C, occur instead to melt phenomenon and cure due to the increase of solid concentration.
（2）On the basis of ensureing the heat transfer property and thermodynamic property of existing liquid metal, produced after temperature is increased again
The heterogeneous alloy characteristic of raw anti-molten behavior is introduced into liquid metal design, and is specified and be suitble to radiate within the scope of 80-90 DEG C
Alloy component range.After temperature is higher than 91-95 DEG C, alloy can occur instead to melt row instead due to the raising of solid concentration
For.Ensure that in the use process of computer chip side leakage will not occur for liquid metal, to improve the safety of heat dissipation.
（3）The liquid metal not only has anti-molten behavior, but also processing smelting process is simple, and production cost is low.And have
Satisfactory heat transfer property and thermal stability, are convenient for industrialization large-scale production and practical application.
Specific implementation mode
Embodiment 1
It is a kind of for 80-90 DEG C of heat dissipation and with the liquid metal of anti-molten characteristic, by weight percentage, the alloy at
It is divided into：Eu：0.2%, Bi: 12.5%, Sn: 23%, Gd: 0.4%, Zn:1.3%, surplus In.Take the conjunction of ingredient as above
Gold is homogenized 10 minutes after 420 DEG C melt in vacuum induction melting furnace in graphite crucible, and using electromagnetic agitation.Then it adopts
It is cast with graphite jig, and casting is rolled down to the foil that thickness is 0.05mm or so.Mushy stage is presented at 82 DEG C or so for the alloy,
With enough viscosity.After temperature is higher than 91 DEG C, occur instead to melt phenomenon and cure due to the increase of solid concentration.
Embodiment 2
It is a kind of for 80-90 DEG C of heat dissipation and with the liquid metal of anti-molten characteristic, by weight percentage, the alloy at
It is divided into：Eu：0.3%, Bi: 14.5%, Sn: 27%, Gd: 0.8%, Zn:1.9%, surplus In.Take the conjunction of ingredient as above
Gold is homogenized 10 minutes after 440 DEG C melt in vacuum induction melting furnace in graphite crucible, and using electromagnetic agitation.Then it adopts
It is cast with graphite jig, and casting is rolled down to the foil that thickness is 0.05mm or so.Mushy stage is presented at 85 DEG C or so for the alloy,
With enough viscosity.After temperature is higher than 94 DEG C, occur instead to melt phenomenon and cure due to the increase of solid concentration.
Embodiment 3
It is a kind of for 80-90 DEG C of heat dissipation and with the liquid metal of anti-molten characteristic, by weight percentage, the alloy at
It is divided into：Eu：0.3%, Bi: 10.6%, Sn: 13.4%, Gd: 0.3%, Zn:1.6%, surplus In.Take ingredient as above
Alloy is homogenized 10 minutes after 430 DEG C melt in vacuum induction melting furnace in graphite crucible, and using electromagnetic agitation.Then
It is cast using graphite jig, and casting is rolled down to the foil that thickness is 0.05mm or so.The alloy is in 87 DEG C of temperature ranges
Existing mushy stage, has enough viscosity.When temperature higher than after 93 DEG C, occurring instead to melt phenomenon due to the increase of solid concentration and
Solidification.
Claims (1)
1. a kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation, it is characterised in that by following weight percent
Group is grouped as：Eu：0.2-0.4%, Bi: 10-20%, Sn: 15-30%, Gd: 0.3-0.9%, Zn:1-2%, surplus are
In。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099866.8A CN106756381B (en) | 2016-12-05 | 2016-12-05 | A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099866.8A CN106756381B (en) | 2016-12-05 | 2016-12-05 | A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106756381A CN106756381A (en) | 2017-05-31 |
| CN106756381B true CN106756381B (en) | 2018-08-31 |
Family
ID=58883947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611099866.8A Active CN106756381B (en) | 2016-12-05 | 2016-12-05 | A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106756381B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006112015A1 (en) * | 2005-04-14 | 2006-10-26 | Senju Metal Industry Co., Ltd | Alloy for fusible plug and fusible plug |
| CN101197230B (en) * | 2006-12-05 | 2011-11-16 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
| CN103740996B (en) * | 2013-12-04 | 2016-03-09 | 曹帅 | A kind of Three-phase liquid metal material and preparation method thereof |
-
2016
- 2016-12-05 CN CN201611099866.8A patent/CN106756381B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106756381A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106884107B (en) | A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof | |
| CN106929733B (en) | A kind of compound liquid metal thermal interface material of foamed aluminium | |
| CN107053786B (en) | With the liquid metal thermal interface material from molten characteristic | |
| CN104031600B (en) | A kind of heat-conducting metal glue of insulation and manufacture method thereof | |
| CN105349866A (en) | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy | |
| CN103740997B (en) | A kind of heterogeneous liquid metal heat interface material containing zinc and preparation method thereof | |
| CN104218010B (en) | A kind of metal heat interface material | |
| CN107052308B (en) | A kind of liquid metal thermal interface material that foam copper is compound | |
| CN104032199A (en) | Low-melting-point liquid metal and preparation method and application thereof | |
| CN103740995A (en) | Gallium-based liquid alloy material and preparation method thereof | |
| CN112366192B (en) | Electronic component heat abstractor based on electric field regulation and control solid-liquid phase change | |
| WO2015024354A1 (en) | Low-melting-point metal thermal grease, preparation method therefor, and application thereof | |
| CN110273081A (en) | A kind of Cu-Fe-Ti electrical conductivity alloy and preparation method thereof | |
| CN104263994A (en) | Graphene alloy composite thermal conductive material and preparation method thereof | |
| CN106756382B (en) | A kind of liquid metal that there is anti-molten characteristic to be used for 54-61 DEG C of heat dissipation | |
| CN106856180B (en) | A method of welding IGBT module | |
| CN208848885U (en) | A kind of New IGBT module copper soleplate structure | |
| CN106756381B (en) | A kind of liquid metal that there is anti-molten characteristic to be used for 80-90 DEG C of heat dissipation | |
| CN105400497A (en) | All-metal heat conducting paste and preparation method thereof | |
| CN104911441B (en) | Low-melting metal and preparation method thereof | |
| CN104726070A (en) | Composite phase change material for LED thermal interface and preparation method thereof | |
| CN102676957B (en) | Anti-corrosion aluminum alloy for complex heat conduction system and production method thereof | |
| CN106957980B (en) | With the liquid metal thermal interface material from gain performance | |
| CN103659042B (en) | Durable intermediate-temperature lead-free soldering tin bar and preparing method thereof | |
| CN209794770U (en) | Low-melting-point alloy composite heat conduction material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210826 Address after: 315048 first floor of plant, No. 1299, Juxian Road, high tech Zone, Ningbo, Zhejiang Patentee after: Ningbo Syrnma Metal Materials Co.,Ltd. Address before: 510000 room 202a, information Avenue (Building B, R & D building), Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee before: FOSHAN XINRUI KECHUANG METAL MATERIAL Co.,Ltd. |